JP7747227B2 - 配線基板 - Google Patents

配線基板

Info

Publication number
JP7747227B2
JP7747227B2 JP2024549941A JP2024549941A JP7747227B2 JP 7747227 B2 JP7747227 B2 JP 7747227B2 JP 2024549941 A JP2024549941 A JP 2024549941A JP 2024549941 A JP2024549941 A JP 2024549941A JP 7747227 B2 JP7747227 B2 JP 7747227B2
Authority
JP
Japan
Prior art keywords
substrate
wiring
main surface
wiring board
wirings
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2024549941A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024070518A5 (https=
JPWO2024070518A1 (https=
Inventor
康寛 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of JPWO2024070518A1 publication Critical patent/JPWO2024070518A1/ja
Publication of JPWO2024070518A5 publication Critical patent/JPWO2024070518A5/ja
Application granted granted Critical
Publication of JP7747227B2 publication Critical patent/JP7747227B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0283—Stretchable printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09236—Parallel layout

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
JP2024549941A 2022-09-30 2023-09-04 配線基板 Active JP7747227B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202263411770P 2022-09-30 2022-09-30
US63/411,770 2022-09-30
PCT/JP2023/032240 WO2024070518A1 (ja) 2022-09-30 2023-09-04 配線基板

Publications (3)

Publication Number Publication Date
JPWO2024070518A1 JPWO2024070518A1 (https=) 2024-04-04
JPWO2024070518A5 JPWO2024070518A5 (https=) 2025-05-13
JP7747227B2 true JP7747227B2 (ja) 2025-10-01

Family

ID=90477330

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024549941A Active JP7747227B2 (ja) 2022-09-30 2023-09-04 配線基板

Country Status (3)

Country Link
US (1) US20250227846A1 (https=)
JP (1) JP7747227B2 (https=)
WO (1) WO2024070518A1 (https=)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001111209A (ja) 1999-07-30 2001-04-20 Denso Corp プリント配線板の接続方法および接続構造
JP2001223465A (ja) 1999-11-30 2001-08-17 Denso Corp プリント配線基板の接続方法及び接続構造
JP2002050863A (ja) 2000-08-04 2002-02-15 Denso Corp プリント配線基板の接続方法
JP2004247403A (ja) 2003-02-12 2004-09-02 Denso Wave Inc 半田付け装置、半田付け方法、基板接続装置及び基板接続方法
JP2015023059A (ja) 2013-07-16 2015-02-02 住友電工プリントサーキット株式会社 フレキシブルプリント配線板の接続構造、フレキシブルプリント配線板及びその製造方法
JP2017195230A (ja) 2016-04-18 2017-10-26 日本メクトロン株式会社 伸縮性配線基板、及び、伸縮性配線基板の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000049423A (ja) * 1998-07-30 2000-02-18 Sony Chem Corp フレキシブル基板
JP2004311578A (ja) * 2003-04-03 2004-11-04 Fujikura Ltd プリント配線基板の接合方法並びに複合プリント配線基板
JP2005045066A (ja) * 2003-07-23 2005-02-17 Matsushita Electric Ind Co Ltd 電気的接続構造およびその製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001111209A (ja) 1999-07-30 2001-04-20 Denso Corp プリント配線板の接続方法および接続構造
JP2001223465A (ja) 1999-11-30 2001-08-17 Denso Corp プリント配線基板の接続方法及び接続構造
JP2002050863A (ja) 2000-08-04 2002-02-15 Denso Corp プリント配線基板の接続方法
JP2004247403A (ja) 2003-02-12 2004-09-02 Denso Wave Inc 半田付け装置、半田付け方法、基板接続装置及び基板接続方法
JP2015023059A (ja) 2013-07-16 2015-02-02 住友電工プリントサーキット株式会社 フレキシブルプリント配線板の接続構造、フレキシブルプリント配線板及びその製造方法
JP2017195230A (ja) 2016-04-18 2017-10-26 日本メクトロン株式会社 伸縮性配線基板、及び、伸縮性配線基板の製造方法

Also Published As

Publication number Publication date
WO2024070518A1 (ja) 2024-04-04
US20250227846A1 (en) 2025-07-10
JPWO2024070518A1 (https=) 2024-04-04

Similar Documents

Publication Publication Date Title
CN103534879B (zh) 配线体连接结构体
WO2009113202A1 (ja) フレキシブル配線板及びその製造方法
KR20100114111A (ko) 연성 인쇄 회로 기판의 접속 방법 및 이에 의해 얻어진 전자 소자
KR20080024081A (ko) 회로기판간 접속 구조체
JP5672091B2 (ja) 多層基板
JP7747227B2 (ja) 配線基板
US20210092832A1 (en) Circuit member joint structure and circuit member joining method
JP2013135172A (ja) プリント配線板及びプリント配線板の接続構造
JP7006802B2 (ja) 樹脂多層基板
CN212677468U (zh) 基板接合构造
JP7718604B2 (ja) 伸縮性デバイス
WO2018128157A1 (ja) 電子機器
WO2023171464A1 (ja) 伸縮性デバイス
JP5006162B2 (ja) 電気接続部材
JP2007258410A (ja) 配線基板接続構造体及びその製造方法
JP5679266B2 (ja) プリント配線板の接続構造、配線板接続体及び電子機器
US20230050989A1 (en) Signal transmission line
EP3819935A1 (en) Connecting structure including circuit body and conductive body
US20250203765A1 (en) Stretchable device
JP6460280B2 (ja) 部品実装基板
WO2025033274A1 (ja) 伸縮性デバイス
CN222282208U (zh) 传输线路及具备该传输线路的电子设备
JP3948250B2 (ja) プリント配線基板の接続方法
JP7820105B2 (ja) プリント基板
US11924980B2 (en) Method for manufacturing multilayer substrate and multilayer substrate

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20250306

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20250306

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20250306

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20250415

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20250523

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20250808

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20250819

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20250901

R150 Certificate of patent or registration of utility model

Ref document number: 7747227

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150