JPWO2024070518A1 - - Google Patents

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Publication number
JPWO2024070518A1
JPWO2024070518A1 JP2024549941A JP2024549941A JPWO2024070518A1 JP WO2024070518 A1 JPWO2024070518 A1 JP WO2024070518A1 JP 2024549941 A JP2024549941 A JP 2024549941A JP 2024549941 A JP2024549941 A JP 2024549941A JP WO2024070518 A1 JPWO2024070518 A1 JP WO2024070518A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2024549941A
Other languages
Japanese (ja)
Other versions
JPWO2024070518A5 (https=
JP7747227B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2024070518A1 publication Critical patent/JPWO2024070518A1/ja
Publication of JPWO2024070518A5 publication Critical patent/JPWO2024070518A5/ja
Application granted granted Critical
Publication of JP7747227B2 publication Critical patent/JP7747227B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0283—Stretchable printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09236—Parallel layout

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
JP2024549941A 2022-09-30 2023-09-04 配線基板 Active JP7747227B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202263411770P 2022-09-30 2022-09-30
US63/411,770 2022-09-30
PCT/JP2023/032240 WO2024070518A1 (ja) 2022-09-30 2023-09-04 配線基板

Publications (3)

Publication Number Publication Date
JPWO2024070518A1 true JPWO2024070518A1 (https=) 2024-04-04
JPWO2024070518A5 JPWO2024070518A5 (https=) 2025-05-13
JP7747227B2 JP7747227B2 (ja) 2025-10-01

Family

ID=90477330

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024549941A Active JP7747227B2 (ja) 2022-09-30 2023-09-04 配線基板

Country Status (3)

Country Link
US (1) US20250227846A1 (https=)
JP (1) JP7747227B2 (https=)
WO (1) WO2024070518A1 (https=)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000049423A (ja) * 1998-07-30 2000-02-18 Sony Chem Corp フレキシブル基板
JP2001111209A (ja) * 1999-07-30 2001-04-20 Denso Corp プリント配線板の接続方法および接続構造
JP2001223465A (ja) * 1999-11-30 2001-08-17 Denso Corp プリント配線基板の接続方法及び接続構造
JP2002050863A (ja) * 2000-08-04 2002-02-15 Denso Corp プリント配線基板の接続方法
JP2004247403A (ja) * 2003-02-12 2004-09-02 Denso Wave Inc 半田付け装置、半田付け方法、基板接続装置及び基板接続方法
JP2004311578A (ja) * 2003-04-03 2004-11-04 Fujikura Ltd プリント配線基板の接合方法並びに複合プリント配線基板
JP2005045066A (ja) * 2003-07-23 2005-02-17 Matsushita Electric Ind Co Ltd 電気的接続構造およびその製造方法
JP2015023059A (ja) * 2013-07-16 2015-02-02 住友電工プリントサーキット株式会社 フレキシブルプリント配線板の接続構造、フレキシブルプリント配線板及びその製造方法
JP2017195230A (ja) * 2016-04-18 2017-10-26 日本メクトロン株式会社 伸縮性配線基板、及び、伸縮性配線基板の製造方法

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000049423A (ja) * 1998-07-30 2000-02-18 Sony Chem Corp フレキシブル基板
JP2001111209A (ja) * 1999-07-30 2001-04-20 Denso Corp プリント配線板の接続方法および接続構造
JP2001223465A (ja) * 1999-11-30 2001-08-17 Denso Corp プリント配線基板の接続方法及び接続構造
JP2002050863A (ja) * 2000-08-04 2002-02-15 Denso Corp プリント配線基板の接続方法
JP2004247403A (ja) * 2003-02-12 2004-09-02 Denso Wave Inc 半田付け装置、半田付け方法、基板接続装置及び基板接続方法
JP2004311578A (ja) * 2003-04-03 2004-11-04 Fujikura Ltd プリント配線基板の接合方法並びに複合プリント配線基板
JP2005045066A (ja) * 2003-07-23 2005-02-17 Matsushita Electric Ind Co Ltd 電気的接続構造およびその製造方法
JP2015023059A (ja) * 2013-07-16 2015-02-02 住友電工プリントサーキット株式会社 フレキシブルプリント配線板の接続構造、フレキシブルプリント配線板及びその製造方法
JP2017195230A (ja) * 2016-04-18 2017-10-26 日本メクトロン株式会社 伸縮性配線基板、及び、伸縮性配線基板の製造方法

Also Published As

Publication number Publication date
WO2024070518A1 (ja) 2024-04-04
US20250227846A1 (en) 2025-07-10
JP7747227B2 (ja) 2025-10-01

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