JPWO2024070592A1 - - Google Patents

Info

Publication number
JPWO2024070592A1
JPWO2024070592A1 JP2024549983A JP2024549983A JPWO2024070592A1 JP WO2024070592 A1 JPWO2024070592 A1 JP WO2024070592A1 JP 2024549983 A JP2024549983 A JP 2024549983A JP 2024549983 A JP2024549983 A JP 2024549983A JP WO2024070592 A1 JPWO2024070592 A1 JP WO2024070592A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2024549983A
Other languages
Japanese (ja)
Other versions
JPWO2024070592A5 (https=
JP7718604B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2024070592A1 publication Critical patent/JPWO2024070592A1/ja
Publication of JPWO2024070592A5 publication Critical patent/JPWO2024070592A5/ja
Application granted granted Critical
Publication of JP7718604B2 publication Critical patent/JP7718604B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/61—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to flexible printed circuits, flat or ribbon cables or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/401—Package configurations characterised by multiple insulating or insulated package substrates, interposers or RDLs

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP2024549983A 2022-09-28 2023-09-08 伸縮性デバイス Active JP7718604B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022155142 2022-09-28
JP2022155142 2022-09-28
PCT/JP2023/032850 WO2024070592A1 (ja) 2022-09-28 2023-09-08 伸縮性デバイス

Publications (3)

Publication Number Publication Date
JPWO2024070592A1 true JPWO2024070592A1 (https=) 2024-04-04
JPWO2024070592A5 JPWO2024070592A5 (https=) 2025-03-21
JP7718604B2 JP7718604B2 (ja) 2025-08-05

Family

ID=90477361

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024549983A Active JP7718604B2 (ja) 2022-09-28 2023-09-08 伸縮性デバイス

Country Status (3)

Country Link
US (1) US20250210505A1 (https=)
JP (1) JP7718604B2 (https=)
WO (1) WO2024070592A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026034591A1 (ja) * 2024-08-08 2026-02-12 株式会社村田製作所 伸縮性デバイス

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007088055A (ja) * 2005-09-20 2007-04-05 Sumitomo Electric Ind Ltd フレキシブルプリント配線板およびその製造方法
WO2013105402A1 (ja) * 2012-01-13 2013-07-18 東海ゴム工業株式会社 配線体接続構造体
US20140328030A1 (en) * 2013-05-03 2014-11-06 Rolls-Royce Plc Electrical harness connector
JP2017069530A (ja) * 2015-10-01 2017-04-06 日本メクトロン株式会社 伸縮性配線基板および伸縮性配線基板の製造方法
JP2017195230A (ja) * 2016-04-18 2017-10-26 日本メクトロン株式会社 伸縮性配線基板、及び、伸縮性配線基板の製造方法
JP2018056321A (ja) * 2016-09-28 2018-04-05 日本メクトロン株式会社 伸縮性配線基板及び伸縮性配線基板の製造方法
WO2019093069A1 (ja) * 2017-11-07 2019-05-16 大日本印刷株式会社 伸縮性回路基板および物品

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007088055A (ja) * 2005-09-20 2007-04-05 Sumitomo Electric Ind Ltd フレキシブルプリント配線板およびその製造方法
WO2013105402A1 (ja) * 2012-01-13 2013-07-18 東海ゴム工業株式会社 配線体接続構造体
US20140328030A1 (en) * 2013-05-03 2014-11-06 Rolls-Royce Plc Electrical harness connector
JP2017069530A (ja) * 2015-10-01 2017-04-06 日本メクトロン株式会社 伸縮性配線基板および伸縮性配線基板の製造方法
JP2017195230A (ja) * 2016-04-18 2017-10-26 日本メクトロン株式会社 伸縮性配線基板、及び、伸縮性配線基板の製造方法
JP2018056321A (ja) * 2016-09-28 2018-04-05 日本メクトロン株式会社 伸縮性配線基板及び伸縮性配線基板の製造方法
WO2019093069A1 (ja) * 2017-11-07 2019-05-16 大日本印刷株式会社 伸縮性回路基板および物品

Also Published As

Publication number Publication date
US20250210505A1 (en) 2025-06-26
WO2024070592A1 (ja) 2024-04-04
JP7718604B2 (ja) 2025-08-05

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