JP7707119B2 - 半導体製造装置のための温度調節装置、および半導体製造システム - Google Patents

半導体製造装置のための温度調節装置、および半導体製造システム Download PDF

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Publication number
JP7707119B2
JP7707119B2 JP2022058188A JP2022058188A JP7707119B2 JP 7707119 B2 JP7707119 B2 JP 7707119B2 JP 2022058188 A JP2022058188 A JP 2022058188A JP 2022058188 A JP2022058188 A JP 2022058188A JP 7707119 B2 JP7707119 B2 JP 7707119B2
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Japan
Prior art keywords
heating
cooling
liquid
temperature
semiconductor manufacturing
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JP2022058188A
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English (en)
Japanese (ja)
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JP2023149554A5 (https=
JP2023149554A (ja
Inventor
幸大 福住
慎一 新田
典男 国保
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
CKD Corp
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Ebara Corp
CKD Corp
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Filing date
Publication date
Application filed by Ebara Corp, CKD Corp filed Critical Ebara Corp
Priority to JP2022058188A priority Critical patent/JP7707119B2/ja
Priority to CN202310296058.4A priority patent/CN116895557A/zh
Priority to US18/189,639 priority patent/US20230317482A1/en
Priority to TW112111457A priority patent/TW202341322A/zh
Priority to KR1020230039647A priority patent/KR20230141544A/ko
Publication of JP2023149554A publication Critical patent/JP2023149554A/ja
Publication of JP2023149554A5 publication Critical patent/JP2023149554A5/ja
Application granted granted Critical
Publication of JP7707119B2 publication Critical patent/JP7707119B2/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D17/00—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces
    • F25D17/02—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating liquids, e.g. brine
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/01—Control of temperature without auxiliary power
    • G05D23/13—Control of temperature without auxiliary power by varying the mixing ratio of two fluids having different temperatures
    • G05D23/1306—Control of temperature without auxiliary power by varying the mixing ratio of two fluids having different temperatures for liquids
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/01—Control of temperature without auxiliary power
    • G05D23/13—Control of temperature without auxiliary power by varying the mixing ratio of two fluids having different temperatures
    • G05D23/1306—Control of temperature without auxiliary power by varying the mixing ratio of two fluids having different temperatures for liquids
    • G05D23/1313—Control of temperature without auxiliary power by varying the mixing ratio of two fluids having different temperatures for liquids without temperature sensing element
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Mechanical Engineering (AREA)
  • Combustion & Propulsion (AREA)
  • Chemical & Material Sciences (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Control Of Temperature (AREA)
  • Chemical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2022058188A 2022-03-31 2022-03-31 半導体製造装置のための温度調節装置、および半導体製造システム Active JP7707119B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2022058188A JP7707119B2 (ja) 2022-03-31 2022-03-31 半導体製造装置のための温度調節装置、および半導体製造システム
CN202310296058.4A CN116895557A (zh) 2022-03-31 2023-03-24 半导体制造装置用的温度调节装置和半导体制造系统
US18/189,639 US20230317482A1 (en) 2022-03-31 2023-03-24 Temperature regulating apparatus for semiconductor-device manufacturing equipment, and semiconductor-device manufacturing system
TW112111457A TW202341322A (zh) 2022-03-31 2023-03-27 用於半導體製造裝置之溫度調節裝置、及半導體製造系統
KR1020230039647A KR20230141544A (ko) 2022-03-31 2023-03-27 반도체 제조 장치를 위한 온도 조절 장치, 및 반도체 제조 시스템

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2022058188A JP7707119B2 (ja) 2022-03-31 2022-03-31 半導体製造装置のための温度調節装置、および半導体製造システム

Publications (3)

Publication Number Publication Date
JP2023149554A JP2023149554A (ja) 2023-10-13
JP2023149554A5 JP2023149554A5 (https=) 2024-10-15
JP7707119B2 true JP7707119B2 (ja) 2025-07-14

Family

ID=88193509

Family Applications (1)

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JP2022058188A Active JP7707119B2 (ja) 2022-03-31 2022-03-31 半導体製造装置のための温度調節装置、および半導体製造システム

Country Status (5)

Country Link
US (1) US20230317482A1 (https=)
JP (1) JP7707119B2 (https=)
KR (1) KR20230141544A (https=)
CN (1) CN116895557A (https=)
TW (1) TW202341322A (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN121816269A (zh) 2023-09-14 2026-04-07 佳能株式会社 打印设备
JP2025081992A (ja) * 2023-11-16 2025-05-28 株式会社荏原製作所 熱媒体供給装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002141287A (ja) 2000-10-30 2002-05-17 Hitachi Ltd プラズマ処理装置
JP2005197471A (ja) 2004-01-07 2005-07-21 Tokyo Electron Ltd 基板処理装置及び温度調節方法
US20120052690A1 (en) 2010-08-27 2012-03-01 Applied Materials, Inc. Temperature enhanced electrostatic chucking in plasma processing apparatus
JP2013105359A (ja) 2011-11-15 2013-05-30 Tokyo Electron Ltd 温度制御システム、半導体製造装置及び温度制御方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5172615B2 (ja) 2008-11-12 2013-03-27 Ｃｋｄ株式会社 温度制御装置
JP5993111B2 (ja) * 2010-09-24 2016-09-14 東京エレクトロン株式会社 温度制御システム
JP7339135B2 (ja) * 2019-11-20 2023-09-05 Ckd株式会社 温度制御システム

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002141287A (ja) 2000-10-30 2002-05-17 Hitachi Ltd プラズマ処理装置
JP2005197471A (ja) 2004-01-07 2005-07-21 Tokyo Electron Ltd 基板処理装置及び温度調節方法
US20120052690A1 (en) 2010-08-27 2012-03-01 Applied Materials, Inc. Temperature enhanced electrostatic chucking in plasma processing apparatus
JP2013105359A (ja) 2011-11-15 2013-05-30 Tokyo Electron Ltd 温度制御システム、半導体製造装置及び温度制御方法

Also Published As

Publication number Publication date
US20230317482A1 (en) 2023-10-05
TW202341322A (zh) 2023-10-16
JP2023149554A (ja) 2023-10-13
KR20230141544A (ko) 2023-10-10
CN116895557A (zh) 2023-10-17

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