JP2023149554A5 - - Google Patents

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Publication number
JP2023149554A5
JP2023149554A5 JP2022058188A JP2022058188A JP2023149554A5 JP 2023149554 A5 JP2023149554 A5 JP 2023149554A5 JP 2022058188 A JP2022058188 A JP 2022058188A JP 2022058188 A JP2022058188 A JP 2022058188A JP 2023149554 A5 JP2023149554 A5 JP 2023149554A5
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JP
Japan
Prior art keywords
heating
cooling
temperature
liquid
semiconductor manufacturing
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Application number
JP2022058188A
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English (en)
Japanese (ja)
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JP7707119B2 (ja
JP2023149554A (ja
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Priority claimed from JP2022058188A external-priority patent/JP7707119B2/ja
Priority to JP2022058188A priority Critical patent/JP7707119B2/ja
Priority to CN202310296058.4A priority patent/CN116895557A/zh
Priority to US18/189,639 priority patent/US20230317482A1/en
Priority to KR1020230039647A priority patent/KR20230141544A/ko
Priority to TW112111457A priority patent/TW202341322A/zh
Publication of JP2023149554A publication Critical patent/JP2023149554A/ja
Publication of JP2023149554A5 publication Critical patent/JP2023149554A5/ja
Publication of JP7707119B2 publication Critical patent/JP7707119B2/ja
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JP2022058188A 2022-03-31 2022-03-31 半導体製造装置のための温度調節装置、および半導体製造システム Active JP7707119B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2022058188A JP7707119B2 (ja) 2022-03-31 2022-03-31 半導体製造装置のための温度調節装置、および半導体製造システム
CN202310296058.4A CN116895557A (zh) 2022-03-31 2023-03-24 半导体制造装置用的温度调节装置和半导体制造系统
US18/189,639 US20230317482A1 (en) 2022-03-31 2023-03-24 Temperature regulating apparatus for semiconductor-device manufacturing equipment, and semiconductor-device manufacturing system
TW112111457A TW202341322A (zh) 2022-03-31 2023-03-27 用於半導體製造裝置之溫度調節裝置、及半導體製造系統
KR1020230039647A KR20230141544A (ko) 2022-03-31 2023-03-27 반도체 제조 장치를 위한 온도 조절 장치, 및 반도체 제조 시스템

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2022058188A JP7707119B2 (ja) 2022-03-31 2022-03-31 半導体製造装置のための温度調節装置、および半導体製造システム

Publications (3)

Publication Number Publication Date
JP2023149554A JP2023149554A (ja) 2023-10-13
JP2023149554A5 true JP2023149554A5 (https=) 2024-10-15
JP7707119B2 JP7707119B2 (ja) 2025-07-14

Family

ID=88193509

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022058188A Active JP7707119B2 (ja) 2022-03-31 2022-03-31 半導体製造装置のための温度調節装置、および半導体製造システム

Country Status (5)

Country Link
US (1) US20230317482A1 (https=)
JP (1) JP7707119B2 (https=)
KR (1) KR20230141544A (https=)
CN (1) CN116895557A (https=)
TW (1) TW202341322A (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN121816269A (zh) 2023-09-14 2026-04-07 佳能株式会社 打印设备
JP2025081992A (ja) * 2023-11-16 2025-05-28 株式会社荏原製作所 熱媒体供給装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3485538B2 (ja) * 2000-10-30 2004-01-13 株式会社日立製作所 プラズマ処理装置
JP2005197471A (ja) * 2004-01-07 2005-07-21 Tokyo Electron Ltd 基板処理装置及び温度調節方法
JP5172615B2 (ja) 2008-11-12 2013-03-27 Ｃｋｄ株式会社 温度制御装置
US8580693B2 (en) * 2010-08-27 2013-11-12 Applied Materials, Inc. Temperature enhanced electrostatic chucking in plasma processing apparatus
JP5993111B2 (ja) * 2010-09-24 2016-09-14 東京エレクトロン株式会社 温度制御システム
JP5912439B2 (ja) * 2011-11-15 2016-04-27 東京エレクトロン株式会社 温度制御システム、半導体製造装置及び温度制御方法
JP7339135B2 (ja) * 2019-11-20 2023-09-05 Ckd株式会社 温度制御システム

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