TW202341322A - 用於半導體製造裝置之溫度調節裝置、及半導體製造系統 - Google Patents

用於半導體製造裝置之溫度調節裝置、及半導體製造系統 Download PDF

Info

Publication number
TW202341322A
TW202341322A TW112111457A TW112111457A TW202341322A TW 202341322 A TW202341322 A TW 202341322A TW 112111457 A TW112111457 A TW 112111457A TW 112111457 A TW112111457 A TW 112111457A TW 202341322 A TW202341322 A TW 202341322A
Authority
TW
Taiwan
Prior art keywords
heating
cooling
temperature
liquid
semiconductor manufacturing
Prior art date
Application number
TW112111457A
Other languages
English (en)
Chinese (zh)
Inventor
福住幸大
新田慎一
国保典男
Original Assignee
日商荏原冷熱系統股份有限公司
日商Ｃｋｄ股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商荏原冷熱系統股份有限公司, 日商Ｃｋｄ股份有限公司 filed Critical 日商荏原冷熱系統股份有限公司
Publication of TW202341322A publication Critical patent/TW202341322A/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D17/00—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces
    • F25D17/02—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating liquids, e.g. brine
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/01—Control of temperature without auxiliary power
    • G05D23/13—Control of temperature without auxiliary power by varying the mixing ratio of two fluids having different temperatures
    • G05D23/1306—Control of temperature without auxiliary power by varying the mixing ratio of two fluids having different temperatures for liquids
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/01—Control of temperature without auxiliary power
    • G05D23/13—Control of temperature without auxiliary power by varying the mixing ratio of two fluids having different temperatures
    • G05D23/1306—Control of temperature without auxiliary power by varying the mixing ratio of two fluids having different temperatures for liquids
    • G05D23/1313—Control of temperature without auxiliary power by varying the mixing ratio of two fluids having different temperatures for liquids without temperature sensing element
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Mechanical Engineering (AREA)
  • Combustion & Propulsion (AREA)
  • Chemical & Material Sciences (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Control Of Temperature (AREA)
  • Chemical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
TW112111457A 2022-03-31 2023-03-27 用於半導體製造裝置之溫度調節裝置、及半導體製造系統 TW202341322A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-058188 2022-03-31
JP2022058188A JP7707119B2 (ja) 2022-03-31 2022-03-31 半導体製造装置のための温度調節装置、および半導体製造システム

Publications (1)

Publication Number Publication Date
TW202341322A true TW202341322A (zh) 2023-10-16

Family

ID=88193509

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112111457A TW202341322A (zh) 2022-03-31 2023-03-27 用於半導體製造裝置之溫度調節裝置、及半導體製造系統

Country Status (5)

Country Link
US (1) US20230317482A1 (https=)
JP (1) JP7707119B2 (https=)
KR (1) KR20230141544A (https=)
CN (1) CN116895557A (https=)
TW (1) TW202341322A (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN121816269A (zh) 2023-09-14 2026-04-07 佳能株式会社 打印设备
JP2025081992A (ja) * 2023-11-16 2025-05-28 株式会社荏原製作所 熱媒体供給装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3485538B2 (ja) * 2000-10-30 2004-01-13 株式会社日立製作所 プラズマ処理装置
JP2005197471A (ja) * 2004-01-07 2005-07-21 Tokyo Electron Ltd 基板処理装置及び温度調節方法
JP5172615B2 (ja) 2008-11-12 2013-03-27 Ｃｋｄ株式会社 温度制御装置
US8580693B2 (en) * 2010-08-27 2013-11-12 Applied Materials, Inc. Temperature enhanced electrostatic chucking in plasma processing apparatus
JP5993111B2 (ja) * 2010-09-24 2016-09-14 東京エレクトロン株式会社 温度制御システム
JP5912439B2 (ja) * 2011-11-15 2016-04-27 東京エレクトロン株式会社 温度制御システム、半導体製造装置及び温度制御方法
JP7339135B2 (ja) * 2019-11-20 2023-09-05 Ckd株式会社 温度制御システム

Also Published As

Publication number Publication date
US20230317482A1 (en) 2023-10-05
JP7707119B2 (ja) 2025-07-14
JP2023149554A (ja) 2023-10-13
KR20230141544A (ko) 2023-10-10
CN116895557A (zh) 2023-10-17

Similar Documents

Publication Publication Date Title
JP6063895B2 (ja) 半導体製造設備のための温度制御システム
TW202341322A (zh) 用於半導體製造裝置之溫度調節裝置、及半導體製造系統
JP7353923B2 (ja) 温度制御システム、及び統合温度制御システム
JP4916349B2 (ja) 精密空気温度制御装置
US12479271B2 (en) Control system for thermal management and distribution
WO2025001558A1 (zh) 一种温控系统
CN110993539A (zh) 温控装置及半导体加工设备
JP4093821B2 (ja) 連結型冷温水装置
CN103294086A (zh) 一种恒温液循环装置及温控方法
JP5313848B2 (ja) 送水圧力制御システムおよび方法
CN208886990U (zh) 一种冷冻水恒温装置
KR20020066358A (ko) 반도체 제조 장치에 사용되는 다채널 온도 조절 장치
US20230017834A1 (en) Subfab area installation apparatus
CN116608576A (zh) 一种高精密温控系统
CN219955771U (zh) 一种冷却水调节系统
TW202603886A (zh) 熱介質供給裝置
JP4006324B2 (ja) 流体冷却装置
JP2020106235A (ja) 冷却システム及び冷却方法
JP2025081992A (ja) 熱媒体供給装置
WO2025177873A1 (ja) 温度制御システム
CN116518485A (zh) 一种空调及其双向调温节能系统
CN119584480A (zh) 冷却系统、冷却方法及数据中心
TW202601321A (zh) 溫度控制系統
CN116538604A (zh) 一种空调及其调温系统
JP2025081093A (ja) 熱媒体供給装置