JP7700383B2 - スパッタリングターゲットおよびその製造方法 - Google Patents

スパッタリングターゲットおよびその製造方法 Download PDF

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Publication number
JP7700383B2
JP7700383B2 JP2024538502A JP2024538502A JP7700383B2 JP 7700383 B2 JP7700383 B2 JP 7700383B2 JP 2024538502 A JP2024538502 A JP 2024538502A JP 2024538502 A JP2024538502 A JP 2024538502A JP 7700383 B2 JP7700383 B2 JP 7700383B2
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Prior art keywords
precious metal
powder
alloy powder
particle size
sputtering target
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JP2024538502A
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Japanese (ja)
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JPWO2024177123A1 (https=
Inventor
さおり 木村
寿恵 近藤
達也 仲沢
晃平 小川
啓介 前藤
留夢 堀川
登士 山田
浩史 宮本
真彦 武原
拓也 細井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Kikinzoku Kogyo KK
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Tanaka Kikinzoku Kogyo KK
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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/07—Metallic powder characterised by particles having a nanoscale microstructure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B22F1/107—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material containing organic material comprising solvents, e.g. for slip casting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/14—Treatment of metallic powder
    • B22F1/142—Thermal or thermo-mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/14—Treatment of metallic powder
    • B22F1/145—Chemical treatment, e.g. passivation or decarburisation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/20—Direct sintering or melting
    • B22F10/28—Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/30—Process control
    • B22F10/34—Process control of powder characteristics, e.g. density, oxidation or flowability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/02—Compacting only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/10—Sintering only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/10—Sintering only
    • B22F3/1003—Use of special medium during sintering, e.g. sintering aid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/02—Making metallic powder or suspensions thereof using physical processes
    • B22F9/04—Making metallic powder or suspensions thereof using physical processes starting from solid material, e.g. by crushing, grinding or milling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/16—Making metallic powder or suspensions thereof using chemical processes
    • B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
    • B22F9/20—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from solid metal compounds
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/04—Making non-ferrous alloys by powder metallurgy
    • C22C1/0466—Alloys based on noble metals
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C30/00—Alloys containing less than 50% by weight of each constituent
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/02—Compacting only
    • B22F2003/023—Lubricant mixed with the metal powder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2301/00—Metallic composition of the powder or its coating
    • B22F2301/25—Noble metals, i.e. Ag Au, Ir, Os, Pd, Pt, Rh, Ru
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2304/00—Physical aspects of the powder
    • B22F2304/05—Submicron size particles
    • B22F2304/054—Particle size between 1 and 100 nm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y35/00—Methods or apparatus for measurement or analysis of nanostructures
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Nanotechnology (AREA)
  • Automation & Control Theory (AREA)
  • Plasma & Fusion (AREA)
  • Powder Metallurgy (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Physical Vapour Deposition (AREA)
JP2024538502A 2023-02-22 2024-02-21 スパッタリングターゲットおよびその製造方法 Active JP7700383B2 (ja)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2023026471A JP7300565B1 (ja) 2023-02-22 2023-02-22 貴金属合金粉末およびその製造方法
JP2023106367 2023-06-28
JP2023106369 2023-06-28
JP2023106369 2023-06-28
JP2023106367 2023-06-28
PCT/JP2024/006398 WO2024177123A1 (ja) 2023-02-22 2024-02-21 スパッタリングターゲットおよびその製造方法

Publications (2)

Publication Number Publication Date
JPWO2024177123A1 JPWO2024177123A1 (https=) 2024-08-29
JP7700383B2 true JP7700383B2 (ja) 2025-06-30

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ID=92500900

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JP2024538502A Active JP7700383B2 (ja) 2023-02-22 2024-02-21 スパッタリングターゲットおよびその製造方法
JP2024549751A Active JP7797678B2 (ja) 2023-02-22 2024-02-21 成形体、焼成体、およびそれらの製造方法

Family Applications After (1)

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JP2024549751A Active JP7797678B2 (ja) 2023-02-22 2024-02-21 成形体、焼成体、およびそれらの製造方法

Country Status (6)

Country Link
EP (2) EP4671408A1 (https=)
JP (2) JP7700383B2 (https=)
KR (2) KR20250138766A (https=)
CN (2) CN120530223A (https=)
TW (1) TW202438698A (https=)
WO (2) WO2024177122A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040025986A1 (en) 2002-08-08 2004-02-12 Perry Andrew C. Controlled-grain-precious metal sputter targets
WO2005056851A1 (ja) 2003-12-10 2005-06-23 Tanaka Kikinzoku Kogyo K.K. 反射率維持特性に優れた銀合金
WO2021020377A1 (ja) 2019-07-29 2021-02-04 国立大学法人京都大学 合金ナノ粒子、合金ナノ粒子の集合体、触媒および合金ナノ粒子の製造方法
WO2021112004A1 (ja) 2019-12-02 2021-06-10 三菱マテリアル株式会社 Ａｇ合金スパッタリングターゲット

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3191434B2 (ja) 1992-08-12 2001-07-23 三菱マテリアル株式会社 銀および銅を含む貴金属混合粉末の焼結方法
JPH08325602A (ja) * 1995-05-31 1996-12-10 Tanaka Kikinzoku Internatl Kk 高結晶パラジウム粉末及び高結晶銀パラジウム合金粉末の製造方法
JPH10102105A (ja) * 1996-09-25 1998-04-21 Taiheiyo Kinzoku Kk 金属微粉末の製造方法
JPH10102106A (ja) * 1996-09-30 1998-04-21 Tanaka Kikinzoku Kogyo Kk ロジウム粉末の製造方法
JP4007702B2 (ja) 1998-10-05 2007-11-14 株式会社フルヤ金属 薄膜形成用スパッタリングターゲット材およびそれを用いて形成されて成る薄膜、および光学記録媒体
JP4616033B2 (ja) 2005-02-21 2011-01-19 株式会社フルヤ金属 スパークプラグ用電極チップ
JP6108064B2 (ja) 2012-08-24 2017-04-05 三菱マテリアル株式会社 磁気記録媒体膜形成用スパッタリングターゲットおよびその製造方法
JP6311912B2 (ja) 2012-10-17 2018-04-18 三菱マテリアル株式会社 Ｃｕ−Ｇａ二元系スパッタリングターゲット及びその製造方法
GB201702902D0 (en) * 2017-02-23 2017-04-12 Univ Swansea First hexangonal close packed high-entropy alloy with outstanding stability under extreme conditionsand high electrocatalytic activity for methanoloxidation
KR20230118986A (ko) * 2020-12-15 2023-08-14 유니버시티 오브 매릴랜드, 칼리지 파크 다중-원소 화합물 나노입자, 시스템 및 이의 제조 및사용 방법
JP7854354B2 (ja) 2022-07-12 2026-05-01 田中貴金属工業株式会社 Ｃｏ－Ｃｒ－Ｐｔ－酸化物系スパッタリングターゲット
JP7300565B1 (ja) * 2023-02-22 2023-06-29 田中貴金属工業株式会社 貴金属合金粉末およびその製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040025986A1 (en) 2002-08-08 2004-02-12 Perry Andrew C. Controlled-grain-precious metal sputter targets
WO2005056851A1 (ja) 2003-12-10 2005-06-23 Tanaka Kikinzoku Kogyo K.K. 反射率維持特性に優れた銀合金
WO2021020377A1 (ja) 2019-07-29 2021-02-04 国立大学法人京都大学 合金ナノ粒子、合金ナノ粒子の集合体、触媒および合金ナノ粒子の製造方法
WO2021112004A1 (ja) 2019-12-02 2021-06-10 三菱マテリアル株式会社 Ａｇ合金スパッタリングターゲット

Also Published As

Publication number Publication date
JPWO2024177123A1 (https=) 2024-08-29
CN120529978A (zh) 2025-08-22
EP4671408A1 (en) 2025-12-31
TW202440249A (zh) 2024-10-16
WO2024177123A1 (ja) 2024-08-29
WO2024177122A1 (ja) 2024-08-29
JP7797678B2 (ja) 2026-01-13
CN120530223A (zh) 2025-08-22
JPWO2024177122A1 (https=) 2024-08-29
KR20250137170A (ko) 2025-09-17
TW202438698A (zh) 2024-10-01
KR20250138766A (ko) 2025-09-22
EP4670870A1 (en) 2025-12-31

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