JP7678902B2 - 複合基板の製造方法 - Google Patents

複合基板の製造方法 Download PDF

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Publication number
JP7678902B2
JP7678902B2 JP2023573827A JP2023573827A JP7678902B2 JP 7678902 B2 JP7678902 B2 JP 7678902B2 JP 2023573827 A JP2023573827 A JP 2023573827A JP 2023573827 A JP2023573827 A JP 2023573827A JP 7678902 B2 JP7678902 B2 JP 7678902B2
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Japan
Prior art keywords
layer
substrate
piezoelectric
bonding
composite substrate
Prior art date
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JP2023573827A
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English (en)
Japanese (ja)
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JPWO2023135844A1 (https=
JPWO2023135844A5 (https=
Inventor
喬紘 山寺
烈 飯田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Insulators Ltd
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NGK Insulators Ltd
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Publication date
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Publication of JPWO2023135844A1 publication Critical patent/JPWO2023135844A1/ja
Publication of JPWO2023135844A5 publication Critical patent/JPWO2023135844A5/ja
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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • H03H3/10—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves for obtaining desired frequency or temperature coefficient
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F01—MACHINES OR ENGINES IN GENERAL; ENGINE PLANTS IN GENERAL; STEAM ENGINES
    • F01D—NON-POSITIVE DISPLACEMENT MACHINES OR ENGINES, e.g. STEAM TURBINES
    • F01D11/00—Preventing or minimising internal leakage of working-fluid, e.g. between stages
    • F01D11/08—Preventing or minimising internal leakage of working-fluid, e.g. between stages for sealing space between rotor blade tips and stator
    • F01D11/14—Adjusting or regulating tip-clearance, i.e. distance between rotor-blade tips and stator casing
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/25—Constructional features of resonators using surface acoustic waves
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
    • H10N30/085—Shaping or machining of piezoelectric or electrostrictive bodies by machining
    • H10N30/086—Shaping or machining of piezoelectric or electrostrictive bodies by machining by polishing or grinding
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F05—INDEXING SCHEMES RELATING TO ENGINES OR PUMPS IN VARIOUS SUBCLASSES OF CLASSES F01-F04
    • F05D—INDEXING SCHEME FOR ASPECTS RELATING TO NON-POSITIVE-DISPLACEMENT MACHINES OR ENGINES, GAS-TURBINES OR JET-PROPULSION PLANTS
    • F05D2240/00—Components
    • F05D2240/55—Seals
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02559—Characteristics of substrate, e.g. cutting angles of lithium niobate or lithium-tantalate substrates
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02574—Characteristics of substrate, e.g. cutting angles of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate

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  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Turbine Rotor Nozzle Sealing (AREA)
JP2023573827A 2022-01-17 2022-08-05 複合基板の製造方法 Active JP7678902B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022005286 2022-01-17
JP2022005286 2022-01-17
PCT/JP2022/030156 WO2023135844A1 (ja) 2022-01-17 2022-08-05 複合基板の製造方法

Publications (3)

Publication Number Publication Date
JPWO2023135844A1 JPWO2023135844A1 (https=) 2023-07-20
JPWO2023135844A5 JPWO2023135844A5 (https=) 2024-08-01
JP7678902B2 true JP7678902B2 (ja) 2025-05-16

Family

ID=87278749

Family Applications (1)

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JP2023573827A Active JP7678902B2 (ja) 2022-01-17 2022-08-05 複合基板の製造方法

Country Status (6)

Country Link
US (2) US20250035006A1 (https=)
JP (1) JP7678902B2 (https=)
KR (1) KR102916188B1 (https=)
CN (1) CN118476156A (https=)
DE (1) DE112022005215T5 (https=)
WO (1) WO2023135844A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026048189A1 (ja) * 2024-08-27 2026-03-05 日本碍子株式会社 複合基板の製造方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003165795A (ja) 2001-11-29 2003-06-10 Shin Etsu Chem Co Ltd 酸化物単結晶ウエーハ及びその製造方法並びに評価方法
JP2009524955A (ja) 2006-01-26 2009-07-02 エプコス アクチエンゲゼルシャフト 電子音響部材
JP3184763U (ja) 2010-06-15 2013-07-18 日本碍子株式会社 複合基板
JP2015050653A (ja) 2013-09-02 2015-03-16 日本碍子株式会社 弾性波デバイス用複合基板、その製法及び弾性波デバイス
US20170063333A1 (en) 2015-08-25 2017-03-02 Avago Technologies General Ip (Singapore) Pte. Ltd. Surface acoustic wave (saw) resonator
JP2020057952A (ja) 2018-10-03 2020-04-09 新日本無線株式会社 弾性表面波装置およびその製造方法
JP2022189405A (ja) 2021-06-11 2022-12-22 日本碍子株式会社 複合基板および複合基板の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6023089Y2 (ja) 1979-09-22 1985-07-09 宇部興産株式会社 竪型射出装置
JP5650553B2 (ja) 2011-02-04 2015-01-07 太陽誘電株式会社 弾性波デバイスの製造方法
JP6166170B2 (ja) 2013-12-16 2017-07-19 日本碍子株式会社 複合基板及びその製法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003165795A (ja) 2001-11-29 2003-06-10 Shin Etsu Chem Co Ltd 酸化物単結晶ウエーハ及びその製造方法並びに評価方法
JP2009524955A (ja) 2006-01-26 2009-07-02 エプコス アクチエンゲゼルシャフト 電子音響部材
JP3184763U (ja) 2010-06-15 2013-07-18 日本碍子株式会社 複合基板
JP2015050653A (ja) 2013-09-02 2015-03-16 日本碍子株式会社 弾性波デバイス用複合基板、その製法及び弾性波デバイス
US20170063333A1 (en) 2015-08-25 2017-03-02 Avago Technologies General Ip (Singapore) Pte. Ltd. Surface acoustic wave (saw) resonator
JP2020057952A (ja) 2018-10-03 2020-04-09 新日本無線株式会社 弾性表面波装置およびその製造方法
JP2022189405A (ja) 2021-06-11 2022-12-22 日本碍子株式会社 複合基板および複合基板の製造方法

Also Published As

Publication number Publication date
KR20240108517A (ko) 2024-07-09
KR102916188B1 (ko) 2026-01-21
JPWO2023135844A1 (https=) 2023-07-20
CN118476156A (zh) 2024-08-09
US20240322777A1 (en) 2024-09-26
US20250035006A1 (en) 2025-01-30
WO2023135844A1 (ja) 2023-07-20
DE112022005215T5 (de) 2024-08-14

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