KR102916188B1 - 복합 기판의 제조 방법 - Google Patents

복합 기판의 제조 방법

Info

Publication number
KR102916188B1
KR102916188B1 KR1020247020774A KR20247020774A KR102916188B1 KR 102916188 B1 KR102916188 B1 KR 102916188B1 KR 1020247020774 A KR1020247020774 A KR 1020247020774A KR 20247020774 A KR20247020774 A KR 20247020774A KR 102916188 B1 KR102916188 B1 KR 102916188B1
Authority
KR
South Korea
Prior art keywords
layer
substrate
piezoelectric
bonding
composite substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020247020774A
Other languages
English (en)
Korean (ko)
Other versions
KR20240108517A (ko
Inventor
다카히로 야마데라
츠요시 이이다
Original Assignee
엔지케이 인슐레이터 엘티디
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엔지케이 인슐레이터 엘티디 filed Critical 엔지케이 인슐레이터 엘티디
Publication of KR20240108517A publication Critical patent/KR20240108517A/ko
Application granted granted Critical
Publication of KR102916188B1 publication Critical patent/KR102916188B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • H03H3/10—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves for obtaining desired frequency or temperature coefficient
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F01—MACHINES OR ENGINES IN GENERAL; ENGINE PLANTS IN GENERAL; STEAM ENGINES
    • F01D—NON-POSITIVE DISPLACEMENT MACHINES OR ENGINES, e.g. STEAM TURBINES
    • F01D11/00—Preventing or minimising internal leakage of working-fluid, e.g. between stages
    • F01D11/08—Preventing or minimising internal leakage of working-fluid, e.g. between stages for sealing space between rotor blade tips and stator
    • F01D11/14—Adjusting or regulating tip-clearance, i.e. distance between rotor-blade tips and stator casing
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02574—Characteristics of substrate, e.g. cutting angles of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/25—Constructional features of resonators using surface acoustic waves
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
    • H10N30/085—Shaping or machining of piezoelectric or electrostrictive bodies by machining
    • H10N30/086—Shaping or machining of piezoelectric or electrostrictive bodies by machining by polishing or grinding
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F05—INDEXING SCHEMES RELATING TO ENGINES OR PUMPS IN VARIOUS SUBCLASSES OF CLASSES F01-F04
    • F05D—INDEXING SCHEME FOR ASPECTS RELATING TO NON-POSITIVE-DISPLACEMENT MACHINES OR ENGINES, GAS-TURBINES OR JET-PROPULSION PLANTS
    • F05D2240/00—Components
    • F05D2240/55—Seals
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02559—Characteristics of substrate, e.g. cutting angles of lithium niobate or lithium-tantalate substrates

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Turbine Rotor Nozzle Sealing (AREA)
KR1020247020774A 2022-01-17 2022-08-05 복합 기판의 제조 방법 Active KR102916188B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2022-005286 2022-01-17
JP2022005286 2022-01-17
PCT/JP2022/030156 WO2023135844A1 (ja) 2022-01-17 2022-08-05 複合基板の製造方法

Publications (2)

Publication Number Publication Date
KR20240108517A KR20240108517A (ko) 2024-07-09
KR102916188B1 true KR102916188B1 (ko) 2026-01-21

Family

ID=87278749

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247020774A Active KR102916188B1 (ko) 2022-01-17 2022-08-05 복합 기판의 제조 방법

Country Status (6)

Country Link
US (2) US20250035006A1 (https=)
JP (1) JP7678902B2 (https=)
KR (1) KR102916188B1 (https=)
CN (1) CN118476156A (https=)
DE (1) DE112022005215T5 (https=)
WO (1) WO2023135844A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026048189A1 (ja) * 2024-08-27 2026-03-05 日本碍子株式会社 複合基板の製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015119219A (ja) 2013-12-16 2015-06-25 日本碍子株式会社 複合基板及びその製法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6023089Y2 (ja) 1979-09-22 1985-07-09 宇部興産株式会社 竪型射出装置
JP4170617B2 (ja) * 2001-11-29 2008-10-22 信越化学工業株式会社 酸化物単結晶ウエーハ及びその製造方法並びに評価方法
DE102006003850B4 (de) * 2006-01-26 2015-02-05 Epcos Ag Elektroakustisches Bauelement
CN203014754U (zh) 2010-06-15 2013-06-19 日本碍子株式会社 复合基板
JP5650553B2 (ja) 2011-02-04 2015-01-07 太陽誘電株式会社 弾性波デバイスの製造方法
JP6247054B2 (ja) * 2013-09-02 2017-12-13 日本碍子株式会社 弾性波デバイス及びその製法
US10523178B2 (en) 2015-08-25 2019-12-31 Avago Technologies International Sales Pte. Limited Surface acoustic wave (SAW) resonator
JP2020057952A (ja) * 2018-10-03 2020-04-09 新日本無線株式会社 弾性表面波装置およびその製造方法
JP7075529B1 (ja) 2021-06-11 2022-05-25 日本碍子株式会社 複合基板および複合基板の製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015119219A (ja) 2013-12-16 2015-06-25 日本碍子株式会社 複合基板及びその製法

Also Published As

Publication number Publication date
KR20240108517A (ko) 2024-07-09
JP7678902B2 (ja) 2025-05-16
JPWO2023135844A1 (https=) 2023-07-20
CN118476156A (zh) 2024-08-09
US20240322777A1 (en) 2024-09-26
US20250035006A1 (en) 2025-01-30
WO2023135844A1 (ja) 2023-07-20
DE112022005215T5 (de) 2024-08-14

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