CN118476156A - 复合基板的制造方法 - Google Patents

复合基板的制造方法 Download PDF

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Publication number
CN118476156A
CN118476156A CN202280085524.8A CN202280085524A CN118476156A CN 118476156 A CN118476156 A CN 118476156A CN 202280085524 A CN202280085524 A CN 202280085524A CN 118476156 A CN118476156 A CN 118476156A
Authority
CN
China
Prior art keywords
layer
substrate
piezoelectric
bonding
composite substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280085524.8A
Other languages
English (en)
Chinese (zh)
Inventor
山寺乔纮
饭田烈
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Insulators Ltd
Original Assignee
NGK Insulators Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Insulators Ltd filed Critical NGK Insulators Ltd
Publication of CN118476156A publication Critical patent/CN118476156A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/25—Constructional features of resonators using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • H03H3/10—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves for obtaining desired frequency or temperature coefficient
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F01—MACHINES OR ENGINES IN GENERAL; ENGINE PLANTS IN GENERAL; STEAM ENGINES
    • F01D—NON-POSITIVE DISPLACEMENT MACHINES OR ENGINES, e.g. STEAM TURBINES
    • F01D11/00—Preventing or minimising internal leakage of working-fluid, e.g. between stages
    • F01D11/08—Preventing or minimising internal leakage of working-fluid, e.g. between stages for sealing space between rotor blade tips and stator
    • F01D11/14—Adjusting or regulating tip-clearance, i.e. distance between rotor-blade tips and stator casing
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
    • H10N30/085—Shaping or machining of piezoelectric or electrostrictive bodies by machining
    • H10N30/086—Shaping or machining of piezoelectric or electrostrictive bodies by machining by polishing or grinding
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F05—INDEXING SCHEMES RELATING TO ENGINES OR PUMPS IN VARIOUS SUBCLASSES OF CLASSES F01-F04
    • F05D—INDEXING SCHEME FOR ASPECTS RELATING TO NON-POSITIVE-DISPLACEMENT MACHINES OR ENGINES, GAS-TURBINES OR JET-PROPULSION PLANTS
    • F05D2240/00—Components
    • F05D2240/55—Seals
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02559—Characteristics of substrate, e.g. cutting angles of lithium niobate or lithium-tantalate substrates
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02574—Characteristics of substrate, e.g. cutting angles of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Turbine Rotor Nozzle Sealing (AREA)
CN202280085524.8A 2022-01-17 2022-08-05 复合基板的制造方法 Pending CN118476156A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022-005286 2022-01-17
JP2022005286 2022-01-17
PCT/JP2022/030156 WO2023135844A1 (ja) 2022-01-17 2022-08-05 複合基板の製造方法

Publications (1)

Publication Number Publication Date
CN118476156A true CN118476156A (zh) 2024-08-09

Family

ID=87278749

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280085524.8A Pending CN118476156A (zh) 2022-01-17 2022-08-05 复合基板的制造方法

Country Status (6)

Country Link
US (2) US20250035006A1 (https=)
JP (1) JP7678902B2 (https=)
KR (1) KR102916188B1 (https=)
CN (1) CN118476156A (https=)
DE (1) DE112022005215T5 (https=)
WO (1) WO2023135844A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026048189A1 (ja) * 2024-08-27 2026-03-05 日本碍子株式会社 複合基板の製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6023089Y2 (ja) 1979-09-22 1985-07-09 宇部興産株式会社 竪型射出装置
JP4170617B2 (ja) * 2001-11-29 2008-10-22 信越化学工業株式会社 酸化物単結晶ウエーハ及びその製造方法並びに評価方法
DE102006003850B4 (de) * 2006-01-26 2015-02-05 Epcos Ag Elektroakustisches Bauelement
CN203014754U (zh) 2010-06-15 2013-06-19 日本碍子株式会社 复合基板
JP5650553B2 (ja) 2011-02-04 2015-01-07 太陽誘電株式会社 弾性波デバイスの製造方法
JP6247054B2 (ja) * 2013-09-02 2017-12-13 日本碍子株式会社 弾性波デバイス及びその製法
JP6166170B2 (ja) 2013-12-16 2017-07-19 日本碍子株式会社 複合基板及びその製法
US10523178B2 (en) 2015-08-25 2019-12-31 Avago Technologies International Sales Pte. Limited Surface acoustic wave (SAW) resonator
JP2020057952A (ja) * 2018-10-03 2020-04-09 新日本無線株式会社 弾性表面波装置およびその製造方法
JP7075529B1 (ja) 2021-06-11 2022-05-25 日本碍子株式会社 複合基板および複合基板の製造方法

Also Published As

Publication number Publication date
KR20240108517A (ko) 2024-07-09
KR102916188B1 (ko) 2026-01-21
JP7678902B2 (ja) 2025-05-16
JPWO2023135844A1 (https=) 2023-07-20
US20240322777A1 (en) 2024-09-26
US20250035006A1 (en) 2025-01-30
WO2023135844A1 (ja) 2023-07-20
DE112022005215T5 (de) 2024-08-14

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