JP7655443B2 - 電子部品及びその製造方法 - Google Patents

電子部品及びその製造方法 Download PDF

Info

Publication number
JP7655443B2
JP7655443B2 JP2024501290A JP2024501290A JP7655443B2 JP 7655443 B2 JP7655443 B2 JP 7655443B2 JP 2024501290 A JP2024501290 A JP 2024501290A JP 2024501290 A JP2024501290 A JP 2024501290A JP 7655443 B2 JP7655443 B2 JP 7655443B2
Authority
JP
Japan
Prior art keywords
layer
electrode layer
via hole
electronic component
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2024501290A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023157676A5 (https=
JPWO2023157676A1 (https=
Inventor
敦 櫻井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of JPWO2023157676A1 publication Critical patent/JPWO2023157676A1/ja
Publication of JPWO2023157676A5 publication Critical patent/JPWO2023157676A5/ja
Application granted granted Critical
Publication of JP7655443B2 publication Critical patent/JP7655443B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09545—Plated through-holes or blind vias without lands

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2024501290A 2022-02-17 2023-02-03 電子部品及びその製造方法 Active JP7655443B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022023242 2022-02-17
JP2022023242 2022-02-17
PCT/JP2023/003593 WO2023157676A1 (ja) 2022-02-17 2023-02-03 電子部品及びその製造方法

Publications (3)

Publication Number Publication Date
JPWO2023157676A1 JPWO2023157676A1 (https=) 2023-08-24
JPWO2023157676A5 JPWO2023157676A5 (https=) 2024-09-30
JP7655443B2 true JP7655443B2 (ja) 2025-04-02

Family

ID=87578525

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024501290A Active JP7655443B2 (ja) 2022-02-17 2023-02-03 電子部品及びその製造方法

Country Status (5)

Country Link
US (1) US20240349426A1 (https=)
JP (1) JP7655443B2 (https=)
CN (1) CN118542079A (https=)
TW (1) TWI868569B (https=)
WO (1) WO2023157676A1 (https=)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3391455A (en) 1963-12-26 1968-07-09 Matsushita Electric Industrial Co Ltd Method for making printed circuit boards
US3506482A (en) 1967-04-25 1970-04-14 Matsushita Electric Industrial Co Ltd Method of making printed circuits
JP2010123830A (ja) 2008-11-21 2010-06-03 Panasonic Corp プリント配線板とその製造方法
JP2013183155A (ja) 2012-03-05 2013-09-12 Fujifilm Corp パターン形成方法及びパターン形成基板の製造方法
JP2016152405A (ja) 2015-02-19 2016-08-22 住友電工プリントサーキット株式会社 プリント配線板用基材、プリント配線板及びプリント配線板用基材の製造方法
JP2017139294A (ja) 2016-02-02 2017-08-10 株式会社村田製作所 電子部品

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW511440B (en) * 2001-06-01 2002-11-21 Phoenix Prec Technology Corp Manufacturing process of laminated multi-layer circuit board embedded with film-type resistors
JP5489305B2 (ja) * 2012-06-27 2014-05-14 石原ケミカル株式会社 回路基板及び導電膜形成方法
JP2018029139A (ja) * 2016-08-18 2018-02-22 住友電気工業株式会社 プリント配線板用基板及びプリント配線板用基板の製造方法
JP2019075456A (ja) * 2017-10-16 2019-05-16 住友電気工業株式会社 プリント配線板用基材及びプリント配線板

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3391455A (en) 1963-12-26 1968-07-09 Matsushita Electric Industrial Co Ltd Method for making printed circuit boards
US3506482A (en) 1967-04-25 1970-04-14 Matsushita Electric Industrial Co Ltd Method of making printed circuits
JP2010123830A (ja) 2008-11-21 2010-06-03 Panasonic Corp プリント配線板とその製造方法
JP2013183155A (ja) 2012-03-05 2013-09-12 Fujifilm Corp パターン形成方法及びパターン形成基板の製造方法
JP2016152405A (ja) 2015-02-19 2016-08-22 住友電工プリントサーキット株式会社 プリント配線板用基材、プリント配線板及びプリント配線板用基材の製造方法
JP2017139294A (ja) 2016-02-02 2017-08-10 株式会社村田製作所 電子部品

Also Published As

Publication number Publication date
CN118542079A (zh) 2024-08-23
WO2023157676A1 (ja) 2023-08-24
TW202335003A (zh) 2023-09-01
US20240349426A1 (en) 2024-10-17
TWI868569B (zh) 2025-01-01
JPWO2023157676A1 (https=) 2023-08-24

Similar Documents

Publication Publication Date Title
CN1180666C (zh) 印刷线路板和制造印刷线路板的方法
US6768061B2 (en) Multilayer circuit board
CN1236659C (zh) 具有内置无源器件的印刷电路板及其制造方法和所用的基板
TW200305260A (en) Multi-layered semiconductor device and method of manufacturing same
MXPA02005828A (es) Placa de circuitos impresos y su metodo de manufactura.
US9107313B2 (en) Method of manufacturing a hybrid heat-radiating substrate
US8785255B2 (en) Substrate for mounting semiconductor, semiconductor device and method for manufacturing semiconductor device
JPH1145955A (ja) 素子内蔵多層配線基板およびその製造方法
CN1332598A (zh) 具有用于安装电子部件的空腔的印刷线路板及其制造方法
CN100435602C (zh) 电子部件的制造方法及电子部件
CN1705105A (zh) 电路装置及其制造方法
JP2010123830A (ja) プリント配線板とその製造方法
JP4508193B2 (ja) 実装基板、実装体とそれを用いた電子機器
JP2010123829A (ja) プリント配線板とその製造方法
JP7655443B2 (ja) 電子部品及びその製造方法
JP4839824B2 (ja) コンデンサ内蔵基板およびその製造方法
JP2017084962A (ja) 配線基板、半導体装置及び配線基板の製造方法
JP2015012286A (ja) 印刷回路基板及びその製造方法
US9659714B2 (en) Solid electrolytic capacitor including insulating substrate having recessed surface
JP2008098487A (ja) 固体電解コンデンサおよび固体電解コンデンサ内蔵基板と、それらの製造方法
JP6296274B2 (ja) 固体電解コンデンサ及びその製造方法
JP5303532B2 (ja) プリント配線板、その製造方法、多層プリント配線板、及びその製造方法
JP5718607B2 (ja) プリント配線板の製造方法、及び多層プリント配線板の製造方法
JP2006261167A (ja) 配線基板およびその製造方法
JP5430002B2 (ja) 配線基板およびその製造方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240729

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20240729

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20240729

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20240827

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20241022

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20250218

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20250303

R150 Certificate of patent or registration of utility model

Ref document number: 7655443

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150