CN118542079A - 电子部件、以及电子部件的制造方法 - Google Patents

电子部件、以及电子部件的制造方法 Download PDF

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Publication number
CN118542079A
CN118542079A CN202380016615.0A CN202380016615A CN118542079A CN 118542079 A CN118542079 A CN 118542079A CN 202380016615 A CN202380016615 A CN 202380016615A CN 118542079 A CN118542079 A CN 118542079A
Authority
CN
China
Prior art keywords
layer
electrode layer
via hole
electronic component
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380016615.0A
Other languages
English (en)
Chinese (zh)
Inventor
樱井敦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of CN118542079A publication Critical patent/CN118542079A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09545—Plated through-holes or blind vias without lands

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
CN202380016615.0A 2022-02-17 2023-02-03 电子部件、以及电子部件的制造方法 Pending CN118542079A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022-023242 2022-02-17
JP2022023242 2022-02-17
PCT/JP2023/003593 WO2023157676A1 (ja) 2022-02-17 2023-02-03 電子部品及びその製造方法

Publications (1)

Publication Number Publication Date
CN118542079A true CN118542079A (zh) 2024-08-23

Family

ID=87578525

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380016615.0A Pending CN118542079A (zh) 2022-02-17 2023-02-03 电子部件、以及电子部件的制造方法

Country Status (5)

Country Link
US (1) US20240349426A1 (https=)
JP (1) JP7655443B2 (https=)
CN (1) CN118542079A (https=)
TW (1) TWI868569B (https=)
WO (1) WO2023157676A1 (https=)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1095117A (en) 1963-12-26 1967-12-13 Matsushita Electric Industrial Co Ltd Method of making printed circuit board
US3506482A (en) 1967-04-25 1970-04-14 Matsushita Electric Industrial Co Ltd Method of making printed circuits
TW511440B (en) * 2001-06-01 2002-11-21 Phoenix Prec Technology Corp Manufacturing process of laminated multi-layer circuit board embedded with film-type resistors
JP2010123830A (ja) * 2008-11-21 2010-06-03 Panasonic Corp プリント配線板とその製造方法
JP5779123B2 (ja) * 2012-03-05 2015-09-16 富士フイルム株式会社 パターン形成方法及びパターン形成基板の製造方法
JP5489305B2 (ja) * 2012-06-27 2014-05-14 石原ケミカル株式会社 回路基板及び導電膜形成方法
JP6400503B2 (ja) 2015-02-19 2018-10-03 住友電工プリントサーキット株式会社 プリント配線板用基材及びプリント配線板
JP6788974B2 (ja) * 2016-02-02 2020-11-25 株式会社村田製作所 電子部品
JP2018029139A (ja) * 2016-08-18 2018-02-22 住友電気工業株式会社 プリント配線板用基板及びプリント配線板用基板の製造方法
JP2019075456A (ja) * 2017-10-16 2019-05-16 住友電気工業株式会社 プリント配線板用基材及びプリント配線板

Also Published As

Publication number Publication date
WO2023157676A1 (ja) 2023-08-24
TW202335003A (zh) 2023-09-01
US20240349426A1 (en) 2024-10-17
TWI868569B (zh) 2025-01-01
JPWO2023157676A1 (https=) 2023-08-24
JP7655443B2 (ja) 2025-04-02

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