JPWO2023157676A1 - - Google Patents

Info

Publication number
JPWO2023157676A1
JPWO2023157676A1 JP2024501290A JP2024501290A JPWO2023157676A1 JP WO2023157676 A1 JPWO2023157676 A1 JP WO2023157676A1 JP 2024501290 A JP2024501290 A JP 2024501290A JP 2024501290 A JP2024501290 A JP 2024501290A JP WO2023157676 A1 JPWO2023157676 A1 JP WO2023157676A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2024501290A
Other languages
Japanese (ja)
Other versions
JPWO2023157676A5 (https=
JP7655443B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023157676A1 publication Critical patent/JPWO2023157676A1/ja
Publication of JPWO2023157676A5 publication Critical patent/JPWO2023157676A5/ja
Application granted granted Critical
Publication of JP7655443B2 publication Critical patent/JP7655443B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09545—Plated through-holes or blind vias without lands

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2024501290A 2022-02-17 2023-02-03 電子部品及びその製造方法 Active JP7655443B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022023242 2022-02-17
JP2022023242 2022-02-17
PCT/JP2023/003593 WO2023157676A1 (ja) 2022-02-17 2023-02-03 電子部品及びその製造方法

Publications (3)

Publication Number Publication Date
JPWO2023157676A1 true JPWO2023157676A1 (https=) 2023-08-24
JPWO2023157676A5 JPWO2023157676A5 (https=) 2024-09-30
JP7655443B2 JP7655443B2 (ja) 2025-04-02

Family

ID=87578525

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024501290A Active JP7655443B2 (ja) 2022-02-17 2023-02-03 電子部品及びその製造方法

Country Status (5)

Country Link
US (1) US20240349426A1 (https=)
JP (1) JP7655443B2 (https=)
CN (1) CN118542079A (https=)
TW (1) TWI868569B (https=)
WO (1) WO2023157676A1 (https=)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3391455A (en) * 1963-12-26 1968-07-09 Matsushita Electric Industrial Co Ltd Method for making printed circuit boards
US3506482A (en) * 1967-04-25 1970-04-14 Matsushita Electric Industrial Co Ltd Method of making printed circuits
JP2010123830A (ja) * 2008-11-21 2010-06-03 Panasonic Corp プリント配線板とその製造方法
JP2013183155A (ja) * 2012-03-05 2013-09-12 Fujifilm Corp パターン形成方法及びパターン形成基板の製造方法
JP2014011199A (ja) * 2012-06-27 2014-01-20 Ishihara Chemical Co Ltd 回路基板、導電膜形成方法及び密着向上剤
JP2016152405A (ja) * 2015-02-19 2016-08-22 住友電工プリントサーキット株式会社 プリント配線板用基材、プリント配線板及びプリント配線板用基材の製造方法
JP2017139294A (ja) * 2016-02-02 2017-08-10 株式会社村田製作所 電子部品
JP2018029139A (ja) * 2016-08-18 2018-02-22 住友電気工業株式会社 プリント配線板用基板及びプリント配線板用基板の製造方法
JP2019075456A (ja) * 2017-10-16 2019-05-16 住友電気工業株式会社 プリント配線板用基材及びプリント配線板

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW511440B (en) * 2001-06-01 2002-11-21 Phoenix Prec Technology Corp Manufacturing process of laminated multi-layer circuit board embedded with film-type resistors

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3391455A (en) * 1963-12-26 1968-07-09 Matsushita Electric Industrial Co Ltd Method for making printed circuit boards
US3506482A (en) * 1967-04-25 1970-04-14 Matsushita Electric Industrial Co Ltd Method of making printed circuits
JP2010123830A (ja) * 2008-11-21 2010-06-03 Panasonic Corp プリント配線板とその製造方法
JP2013183155A (ja) * 2012-03-05 2013-09-12 Fujifilm Corp パターン形成方法及びパターン形成基板の製造方法
JP2014011199A (ja) * 2012-06-27 2014-01-20 Ishihara Chemical Co Ltd 回路基板、導電膜形成方法及び密着向上剤
JP2016152405A (ja) * 2015-02-19 2016-08-22 住友電工プリントサーキット株式会社 プリント配線板用基材、プリント配線板及びプリント配線板用基材の製造方法
JP2017139294A (ja) * 2016-02-02 2017-08-10 株式会社村田製作所 電子部品
JP2018029139A (ja) * 2016-08-18 2018-02-22 住友電気工業株式会社 プリント配線板用基板及びプリント配線板用基板の製造方法
JP2019075456A (ja) * 2017-10-16 2019-05-16 住友電気工業株式会社 プリント配線板用基材及びプリント配線板

Also Published As

Publication number Publication date
CN118542079A (zh) 2024-08-23
WO2023157676A1 (ja) 2023-08-24
TW202335003A (zh) 2023-09-01
US20240349426A1 (en) 2024-10-17
TWI868569B (zh) 2025-01-01
JP7655443B2 (ja) 2025-04-02

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