TWI868569B - 電子零件及其製造方法 - Google Patents

電子零件及其製造方法 Download PDF

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Publication number
TWI868569B
TWI868569B TW112102962A TW112102962A TWI868569B TW I868569 B TWI868569 B TW I868569B TW 112102962 A TW112102962 A TW 112102962A TW 112102962 A TW112102962 A TW 112102962A TW I868569 B TWI868569 B TW I868569B
Authority
TW
Taiwan
Prior art keywords
layer
electrode layer
hole
electronic component
substrate
Prior art date
Application number
TW112102962A
Other languages
English (en)
Chinese (zh)
Other versions
TW202335003A (zh
Inventor
櫻井敦
Original Assignee
日商村田製作所股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商村田製作所股份有限公司 filed Critical 日商村田製作所股份有限公司
Publication of TW202335003A publication Critical patent/TW202335003A/zh
Application granted granted Critical
Publication of TWI868569B publication Critical patent/TWI868569B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09545—Plated through-holes or blind vias without lands

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
TW112102962A 2022-02-17 2023-01-30 電子零件及其製造方法 TWI868569B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-023242 2022-02-17
JP2022023242 2022-02-17

Publications (2)

Publication Number Publication Date
TW202335003A TW202335003A (zh) 2023-09-01
TWI868569B true TWI868569B (zh) 2025-01-01

Family

ID=87578525

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112102962A TWI868569B (zh) 2022-02-17 2023-01-30 電子零件及其製造方法

Country Status (5)

Country Link
US (1) US20240349426A1 (https=)
JP (1) JP7655443B2 (https=)
CN (1) CN118542079A (https=)
TW (1) TWI868569B (https=)
WO (1) WO2023157676A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW511440B (en) * 2001-06-01 2002-11-21 Phoenix Prec Technology Corp Manufacturing process of laminated multi-layer circuit board embedded with film-type resistors

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1095117A (en) 1963-12-26 1967-12-13 Matsushita Electric Industrial Co Ltd Method of making printed circuit board
US3506482A (en) 1967-04-25 1970-04-14 Matsushita Electric Industrial Co Ltd Method of making printed circuits
JP2010123830A (ja) * 2008-11-21 2010-06-03 Panasonic Corp プリント配線板とその製造方法
JP5779123B2 (ja) * 2012-03-05 2015-09-16 富士フイルム株式会社 パターン形成方法及びパターン形成基板の製造方法
JP5489305B2 (ja) * 2012-06-27 2014-05-14 石原ケミカル株式会社 回路基板及び導電膜形成方法
JP6400503B2 (ja) 2015-02-19 2018-10-03 住友電工プリントサーキット株式会社 プリント配線板用基材及びプリント配線板
JP6788974B2 (ja) * 2016-02-02 2020-11-25 株式会社村田製作所 電子部品
JP2018029139A (ja) * 2016-08-18 2018-02-22 住友電気工業株式会社 プリント配線板用基板及びプリント配線板用基板の製造方法
JP2019075456A (ja) * 2017-10-16 2019-05-16 住友電気工業株式会社 プリント配線板用基材及びプリント配線板

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW511440B (en) * 2001-06-01 2002-11-21 Phoenix Prec Technology Corp Manufacturing process of laminated multi-layer circuit board embedded with film-type resistors

Also Published As

Publication number Publication date
CN118542079A (zh) 2024-08-23
WO2023157676A1 (ja) 2023-08-24
TW202335003A (zh) 2023-09-01
US20240349426A1 (en) 2024-10-17
JPWO2023157676A1 (https=) 2023-08-24
JP7655443B2 (ja) 2025-04-02

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