JP7593411B2 - 樹脂組成物 - Google Patents

樹脂組成物 Download PDF

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Publication number
JP7593411B2
JP7593411B2 JP2022562210A JP2022562210A JP7593411B2 JP 7593411 B2 JP7593411 B2 JP 7593411B2 JP 2022562210 A JP2022562210 A JP 2022562210A JP 2022562210 A JP2022562210 A JP 2022562210A JP 7593411 B2 JP7593411 B2 JP 7593411B2
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Japan
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resin composition
mass
resin
component
group
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JP2022562210A
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Japanese (ja)
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JPWO2022102756A1 (https=
Inventor
賢司 川合
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Ajinomoto Co Inc
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Ajinomoto Co Inc
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Publication of JPWO2022102756A1 publication Critical patent/JPWO2022102756A1/ja
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F257/00—Macromolecular compounds obtained by polymerising monomers on to polymers of aromatic monomers as defined in group C08F12/00
    • C08F257/02—Macromolecular compounds obtained by polymerising monomers on to polymers of aromatic monomers as defined in group C08F12/00 on to polymers of styrene or alkyl-substituted styrenes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Laminated Bodies (AREA)
JP2022562210A 2020-11-12 2021-11-12 樹脂組成物 Active JP7593411B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020189016 2020-11-12
JP2020189016 2020-11-12
PCT/JP2021/041791 WO2022102756A1 (ja) 2020-11-12 2021-11-12 樹脂組成物

Publications (2)

Publication Number Publication Date
JPWO2022102756A1 JPWO2022102756A1 (https=) 2022-05-19
JP7593411B2 true JP7593411B2 (ja) 2024-12-03

Family

ID=81602440

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022562210A Active JP7593411B2 (ja) 2020-11-12 2021-11-12 樹脂組成物

Country Status (3)

Country Link
JP (1) JP7593411B2 (https=)
TW (1) TW202233705A (https=)
WO (1) WO2022102756A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023015005A (ja) * 2021-07-19 2023-01-31 日本化薬株式会社 硬化性樹脂組成物、プリプレグおよびその硬化物
TW202342605A (zh) * 2022-03-11 2023-11-01 日商三菱瓦斯化學股份有限公司 樹脂組成物、硬化物、預浸體、覆金屬箔疊層板、樹脂複合片、印刷配線板、及半導體裝置
JP2023180707A (ja) * 2022-06-10 2023-12-21 株式会社レゾナック 樹脂組成物、硬化物、シート、積層体、及びプリント配線板
WO2025115428A1 (ja) * 2023-11-29 2025-06-05 パナソニックＩｐマネジメント株式会社 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及び配線板
WO2025163931A1 (ja) * 2024-01-31 2025-08-07 株式会社レゾナック 樹脂フィルム、プリント配線板及び半導体パッケージ
WO2026023557A1 (ja) * 2024-07-25 2026-01-29 富士フイルム株式会社 樹脂組成物、硬化物、積層体、硬化物の製造方法、積層体の製造方法、半導体デバイスの製造方法、半導体デバイス、及び、樹脂

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002060364A (ja) 2000-05-18 2002-02-26 Natl Starch & Chem Investment Holding Corp 硬化性電子供与体化合物
JP2016164257A (ja) 2016-02-19 2016-09-08 日立化成株式会社 熱硬化性樹脂組成物およびそれを用いた半導体装置
WO2020054601A1 (ja) 2018-09-12 2020-03-19 日本化薬株式会社 マレイミド樹脂、硬化性樹脂組成物およびその硬化物
WO2020217675A1 (ja) 2019-04-26 2020-10-29 Dic株式会社 硬化性樹脂組成物
WO2020217676A1 (ja) 2019-04-26 2020-10-29 Dic株式会社 硬化性樹脂組成物
WO2022054303A1 (ja) 2020-09-11 2022-03-17 パナソニックＩｐマネジメント株式会社 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及び配線板

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3617725B2 (ja) * 1995-06-06 2005-02-09 株式会社東芝 樹脂組成物および樹脂封止型半導体装置
JP6848215B2 (ja) * 2016-06-02 2021-03-24 昭和電工マテリアルズ株式会社 熱硬化性樹脂組成物、プリプレグ、積層板及びプリント配線板
WO2019138992A1 (ja) * 2018-01-09 2019-07-18 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、金属箔張積層板、樹脂複合シート、及びプリント配線板
KR102761584B1 (ko) * 2018-09-12 2025-02-03 니폰 가야꾸 가부시끼가이샤 말레이미드 수지, 경화성 수지 조성물 및 그 경화물
JP7057310B2 (ja) * 2019-03-22 2022-04-19 日立建機株式会社 作業機械
JP7570241B2 (ja) * 2020-01-21 2024-10-21 日本化薬株式会社 硬化性樹脂組成物およびその硬化物
WO2021182360A1 (ja) * 2020-03-11 2021-09-16 日本化薬株式会社 マレイミド樹脂およびその製造方法、マレイミド溶液、並びに、硬化性樹脂組成物およびその硬化物

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002060364A (ja) 2000-05-18 2002-02-26 Natl Starch & Chem Investment Holding Corp 硬化性電子供与体化合物
JP2016164257A (ja) 2016-02-19 2016-09-08 日立化成株式会社 熱硬化性樹脂組成物およびそれを用いた半導体装置
WO2020054601A1 (ja) 2018-09-12 2020-03-19 日本化薬株式会社 マレイミド樹脂、硬化性樹脂組成物およびその硬化物
WO2020217675A1 (ja) 2019-04-26 2020-10-29 Dic株式会社 硬化性樹脂組成物
WO2020217676A1 (ja) 2019-04-26 2020-10-29 Dic株式会社 硬化性樹脂組成物
WO2022054303A1 (ja) 2020-09-11 2022-03-17 パナソニックＩｐマネジメント株式会社 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及び配線板

Also Published As

Publication number Publication date
JPWO2022102756A1 (https=) 2022-05-19
WO2022102756A1 (ja) 2022-05-19
TW202233705A (zh) 2022-09-01

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