TW202233705A - 樹脂組成物 - Google Patents

樹脂組成物 Download PDF

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Publication number
TW202233705A
TW202233705A TW110142075A TW110142075A TW202233705A TW 202233705 A TW202233705 A TW 202233705A TW 110142075 A TW110142075 A TW 110142075A TW 110142075 A TW110142075 A TW 110142075A TW 202233705 A TW202233705 A TW 202233705A
Authority
TW
Taiwan
Prior art keywords
resin composition
resin
mass
component
group
Prior art date
Application number
TW110142075A
Other languages
English (en)
Chinese (zh)
Inventor
川合賢司
Original Assignee
日商味之素股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商味之素股份有限公司 filed Critical 日商味之素股份有限公司
Publication of TW202233705A publication Critical patent/TW202233705A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F257/00—Macromolecular compounds obtained by polymerising monomers on to polymers of aromatic monomers as defined in group C08F12/00
    • C08F257/02—Macromolecular compounds obtained by polymerising monomers on to polymers of aromatic monomers as defined in group C08F12/00 on to polymers of styrene or alkyl-substituted styrenes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Laminated Bodies (AREA)
TW110142075A 2020-11-12 2021-11-11 樹脂組成物 TW202233705A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-189016 2020-11-12
JP2020189016 2020-11-12

Publications (1)

Publication Number Publication Date
TW202233705A true TW202233705A (zh) 2022-09-01

Family

ID=81602440

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110142075A TW202233705A (zh) 2020-11-12 2021-11-11 樹脂組成物

Country Status (3)

Country Link
JP (1) JP7593411B2 (https=)
TW (1) TW202233705A (https=)
WO (1) WO2022102756A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023015005A (ja) * 2021-07-19 2023-01-31 日本化薬株式会社 硬化性樹脂組成物、プリプレグおよびその硬化物
TW202342605A (zh) * 2022-03-11 2023-11-01 日商三菱瓦斯化學股份有限公司 樹脂組成物、硬化物、預浸體、覆金屬箔疊層板、樹脂複合片、印刷配線板、及半導體裝置
JP2023180707A (ja) * 2022-06-10 2023-12-21 株式会社レゾナック 樹脂組成物、硬化物、シート、積層体、及びプリント配線板
WO2025115428A1 (ja) * 2023-11-29 2025-06-05 パナソニックＩｐマネジメント株式会社 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及び配線板
WO2025163931A1 (ja) * 2024-01-31 2025-08-07 株式会社レゾナック 樹脂フィルム、プリント配線板及び半導体パッケージ
WO2026023557A1 (ja) * 2024-07-25 2026-01-29 富士フイルム株式会社 樹脂組成物、硬化物、積層体、硬化物の製造方法、積層体の製造方法、半導体デバイスの製造方法、半導体デバイス、及び、樹脂

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3617725B2 (ja) * 1995-06-06 2005-02-09 株式会社東芝 樹脂組成物および樹脂封止型半導体装置
CN1236000C (zh) * 2000-05-18 2006-01-11 国家淀粉及化学投资控股公司 可固化的电子给体化合物
JP2016164257A (ja) * 2016-02-19 2016-09-08 日立化成株式会社 熱硬化性樹脂組成物およびそれを用いた半導体装置
JP6848215B2 (ja) * 2016-06-02 2021-03-24 昭和電工マテリアルズ株式会社 熱硬化性樹脂組成物、プリプレグ、積層板及びプリント配線板
WO2019138992A1 (ja) * 2018-01-09 2019-07-18 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、金属箔張積層板、樹脂複合シート、及びプリント配線板
CN112334513B (zh) * 2018-09-12 2023-08-08 日本化药株式会社 马来酰亚胺树脂、硬化性树脂组合物及其硬化物
KR102761584B1 (ko) * 2018-09-12 2025-02-03 니폰 가야꾸 가부시끼가이샤 말레이미드 수지, 경화성 수지 조성물 및 그 경화물
JP7057310B2 (ja) * 2019-03-22 2022-04-19 日立建機株式会社 作業機械
CN113748149B (zh) * 2019-04-26 2024-05-24 Dic株式会社 固化性树脂组合物
CN113767117B (zh) * 2019-04-26 2023-08-15 Dic株式会社 固化性树脂组合物
JP7570241B2 (ja) * 2020-01-21 2024-10-21 日本化薬株式会社 硬化性樹脂組成物およびその硬化物
WO2021182360A1 (ja) * 2020-03-11 2021-09-16 日本化薬株式会社 マレイミド樹脂およびその製造方法、マレイミド溶液、並びに、硬化性樹脂組成物およびその硬化物
WO2022054303A1 (ja) * 2020-09-11 2022-03-17 パナソニックＩｐマネジメント株式会社 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及び配線板

Also Published As

Publication number Publication date
JPWO2022102756A1 (https=) 2022-05-19
WO2022102756A1 (ja) 2022-05-19
JP7593411B2 (ja) 2024-12-03

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