JP7537525B2 - 絶縁樹脂組成物、硬化物、回転機用コイル、および回転機 - Google Patents

絶縁樹脂組成物、硬化物、回転機用コイル、および回転機 Download PDF

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JP7537525B2
JP7537525B2 JP2022577895A JP2022577895A JP7537525B2 JP 7537525 B2 JP7537525 B2 JP 7537525B2 JP 2022577895 A JP2022577895 A JP 2022577895A JP 2022577895 A JP2022577895 A JP 2022577895A JP 7537525 B2 JP7537525 B2 JP 7537525B2
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Prior art keywords
resin composition
insulating resin
curing
vinyl monomer
liquid paraffin
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JP2022577895A
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Japanese (ja)
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JPWO2022162805A1 (https=
Inventor
あずさ 大澤
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/01—Hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
    • F04C29/00—Component parts, details or accessories of pumps or pumping installations, not provided for in groups F04C18/00 - F04C28/00
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K15/00—Processes or apparatus specially adapted for manufacturing, assembling, maintaining or repairing of dynamo-electric machines
    • H02K15/12—Impregnating, moulding insulation, heating or drying of windings, stators, rotors or machines
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K3/00—Details of windings
    • H02K3/30—Windings characterised by the insulating material

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Organic Insulating Materials (AREA)
  • Cage And Drive Apparatuses For Elevators (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
JP2022577895A 2021-01-27 2021-01-27 絶縁樹脂組成物、硬化物、回転機用コイル、および回転機 Active JP7537525B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/002915 WO2022162805A1 (ja) 2021-01-27 2021-01-27 絶縁樹脂組成物、硬化物、回転機用コイル、および回転機

Publications (2)

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JPWO2022162805A1 JPWO2022162805A1 (https=) 2022-08-04
JP7537525B2 true JP7537525B2 (ja) 2024-08-21

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Country Link
JP (1) JP7537525B2 (https=)
CN (1) CN116648479B (https=)
WO (1) WO2022162805A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006330301A (ja) 2005-05-25 2006-12-07 Shin Etsu Chem Co Ltd 液晶表示素子用シール剤組成物
JP2008179796A (ja) 2006-12-26 2008-08-07 Mitsui Chemicals Inc （メタ）アクリロイル基およびグリシジル基を有する化合物、および当該化合物を含む重合性組成物
JP2015168775A (ja) 2014-03-07 2015-09-28 Dic株式会社 酸基含有（メタ）アクリレート樹脂、酸基含有（メタ）アクリレート樹脂の製造方法、硬化性樹脂材料、その硬化物、及びレジスト材料
JP6532537B2 (ja) 2015-10-08 2019-06-19 三菱電機株式会社 無溶剤型ワニス組成物、絶縁コイル及びその製造方法、回転機、並びに密閉型電動圧縮機

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53119949A (en) * 1977-03-29 1978-10-19 Hitachi Chem Co Ltd Thermoplastic resin composition
JPS568418A (en) * 1979-06-27 1981-01-28 Shinteesu Ab Unsaturated hardening polyester composition
JPH09239756A (ja) * 1996-03-11 1997-09-16 Inax Corp アクリル系人造大理石製品の成形法
CN101512421B (zh) * 2006-09-07 2011-05-11 三井化学株式会社 液晶密封剂、使用其的液晶显示面板的制造方法、以及液晶显示面板
WO2013054895A1 (ja) * 2011-10-14 2013-04-18 三菱レイヨン株式会社 樹脂組成物、金属基盤用プライマー、および積層体とその製造方法
WO2013146706A1 (ja) * 2012-03-30 2013-10-03 太陽ホールディングス株式会社 光硬化性熱硬化性組成物、その硬化物の製造方法、硬化物およびこれを有するプリント配線板
CN110050031B (zh) * 2016-12-07 2021-07-20 株式会社钟化 液态树脂组合物

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006330301A (ja) 2005-05-25 2006-12-07 Shin Etsu Chem Co Ltd 液晶表示素子用シール剤組成物
JP2008179796A (ja) 2006-12-26 2008-08-07 Mitsui Chemicals Inc （メタ）アクリロイル基およびグリシジル基を有する化合物、および当該化合物を含む重合性組成物
JP2015168775A (ja) 2014-03-07 2015-09-28 Dic株式会社 酸基含有（メタ）アクリレート樹脂、酸基含有（メタ）アクリレート樹脂の製造方法、硬化性樹脂材料、その硬化物、及びレジスト材料
JP6532537B2 (ja) 2015-10-08 2019-06-19 三菱電機株式会社 無溶剤型ワニス組成物、絶縁コイル及びその製造方法、回転機、並びに密閉型電動圧縮機

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CN116648479A (zh) 2023-08-25
JPWO2022162805A1 (https=) 2022-08-04
WO2022162805A1 (ja) 2022-08-04
CN116648479B (zh) 2026-04-21

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