JP7518782B2 - 計測装置、リソグラフィ装置、および物品の製造方法 - Google Patents

計測装置、リソグラフィ装置、および物品の製造方法 Download PDF

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Publication number
JP7518782B2
JP7518782B2 JP2021025523A JP2021025523A JP7518782B2 JP 7518782 B2 JP7518782 B2 JP 7518782B2 JP 2021025523 A JP2021025523 A JP 2021025523A JP 2021025523 A JP2021025523 A JP 2021025523A JP 7518782 B2 JP7518782 B2 JP 7518782B2
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Japan
Prior art keywords
measurement
distance
test object
mold
substrate
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Active
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JP2021025523A
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English (en)
Japanese (ja)
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JP2022127394A (ja
JP2022127394A5 (https=
Inventor
正 服部
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
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Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2021025523A priority Critical patent/JP7518782B2/ja
Priority to TW111103268A priority patent/TWI859503B/zh
Priority to US17/671,661 priority patent/US12585202B2/en
Priority to KR1020220021184A priority patent/KR102932934B1/ko
Publication of JP2022127394A publication Critical patent/JP2022127394A/ja
Publication of JP2022127394A5 publication Critical patent/JP2022127394A5/ja
Application granted granted Critical
Publication of JP7518782B2 publication Critical patent/JP7518782B2/ja
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7042—Alignment for lithographic apparatus using patterning methods other than those involving the exposure to radiation, e.g. by stamping or imprinting
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/026—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness by measuring distance between sensor and object
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2021025523A 2021-02-19 2021-02-19 計測装置、リソグラフィ装置、および物品の製造方法 Active JP7518782B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2021025523A JP7518782B2 (ja) 2021-02-19 2021-02-19 計測装置、リソグラフィ装置、および物品の製造方法
TW111103268A TWI859503B (zh) 2021-02-19 2022-01-26 測量設備、微影設備及物品製造方法
US17/671,661 US12585202B2 (en) 2021-02-19 2022-02-15 Measurement apparatus, lithography apparatus, and method of manufacturing article
KR1020220021184A KR102932934B1 (ko) 2021-02-19 2022-02-18 계측 장치, 리소그래피 장치, 및 물품의 제조 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021025523A JP7518782B2 (ja) 2021-02-19 2021-02-19 計測装置、リソグラフィ装置、および物品の製造方法

Publications (3)

Publication Number Publication Date
JP2022127394A JP2022127394A (ja) 2022-08-31
JP2022127394A5 JP2022127394A5 (https=) 2023-12-04
JP7518782B2 true JP7518782B2 (ja) 2024-07-18

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JP2021025523A Active JP7518782B2 (ja) 2021-02-19 2021-02-19 計測装置、リソグラフィ装置、および物品の製造方法

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Country Link
US (1) US12585202B2 (https=)
JP (1) JP7518782B2 (https=)
KR (1) KR102932934B1 (https=)
TW (1) TWI859503B (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025021731A (ja) * 2023-08-01 2025-02-14 キヤノン株式会社 インプリント装置及び物品の製造方法
JP2025110705A (ja) * 2024-01-16 2025-07-29 株式会社ニューフレアテクノロジー 荷電粒子ビーム描画の偏向位置調整方法及び荷電粒子ビーム描画方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003524152A (ja) 1999-08-27 2003-08-12 ザイゴ コーポレイション 偏光保存光学系を利用する干渉計
JP2014235154A (ja) 2013-06-05 2014-12-15 日本電信電話株式会社 光軸調整装置及びその工程
JP2020122680A (ja) 2019-01-29 2020-08-13 大塚電子株式会社 光学測定システムおよび光学測定方法

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Publication number Priority date Publication date Assignee Title
US6687013B2 (en) * 2000-03-28 2004-02-03 Hitachi, Ltd. Laser interferometer displacement measuring system, exposure apparatus, and electron beam lithography apparatus
US7227612B2 (en) * 2004-09-10 2007-06-05 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2006250826A (ja) 2005-03-11 2006-09-21 Yamagata Prefecture 計測素子、加工装置および計測方法、屈折率の計測素子
JP2007234685A (ja) 2006-02-28 2007-09-13 Canon Inc 測定装置、当該測定装置を有する露光装置及びデバイス製造方法
JP4494438B2 (ja) * 2007-06-15 2010-06-30 株式会社オプセル レーザ走査干渉計
JP2010014536A (ja) 2008-07-03 2010-01-21 Yamagata Prefecture 加工装置に搭載される被測定物の計測方法および計測装置
US8120781B2 (en) 2008-11-26 2012-02-21 Zygo Corporation Interferometric systems and methods featuring spectral analysis of unevenly sampled data
JP5602538B2 (ja) 2010-03-03 2014-10-08 キヤノン株式会社 光波干渉計測装置
US10124410B2 (en) * 2010-09-25 2018-11-13 Ipg Photonics Corporation Methods and systems for coherent imaging and feedback control for modification of materials
US9223227B2 (en) * 2011-02-11 2015-12-29 Asml Netherlands B.V. Inspection apparatus and method, lithographic apparatus, lithographic processing cell and device manufacturing method
WO2012117614A1 (ja) 2011-03-03 2012-09-07 三洋電機株式会社 情報取得装置及びその情報取得装置を有する物体検出装置
HK1225513A1 (zh) * 2014-01-16 2017-09-08 株式会社尼康 曝光装置及曝光方法、以及器件制造方法
JP6655888B2 (ja) 2014-08-20 2020-03-04 キヤノン株式会社 計測装置、計測方法、および物品の製造方法
WO2016030227A1 (en) * 2014-08-29 2016-03-03 Asml Netherlands B.V. Method for controlling a distance between two objects, inspection apparatus and method
CN107430352B (zh) 2015-03-25 2020-01-21 Asml荷兰有限公司 量测方法、量测设备和器件制造方法
KR20180058005A (ko) * 2016-11-23 2018-05-31 삼성전자주식회사 광학 검사 장치와 방법, 및 그 검사 장치를 이용한 반도체 소자 제조방법
KR101898217B1 (ko) * 2016-12-29 2018-09-12 엘지디스플레이 주식회사 검사장비 및 이를 이용한 검사방법
JP6285597B1 (ja) * 2017-06-05 2018-02-28 大塚電子株式会社 光学測定装置および光学測定方法
JP6919458B2 (ja) 2017-09-26 2021-08-18 オムロン株式会社 変位計測装置、計測システム、および変位計測方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003524152A (ja) 1999-08-27 2003-08-12 ザイゴ コーポレイション 偏光保存光学系を利用する干渉計
JP2014235154A (ja) 2013-06-05 2014-12-15 日本電信電話株式会社 光軸調整装置及びその工程
JP2020122680A (ja) 2019-01-29 2020-08-13 大塚電子株式会社 光学測定システムおよび光学測定方法

Also Published As

Publication number Publication date
KR20220118942A (ko) 2022-08-26
US20220269186A1 (en) 2022-08-25
KR102932934B1 (ko) 2026-03-03
US12585202B2 (en) 2026-03-24
JP2022127394A (ja) 2022-08-31
TW202234032A (zh) 2022-09-01
TWI859503B (zh) 2024-10-21

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