JP7508770B2 - 積層セラミックコンデンサ内部電極用の導電性ペースト組成物およびその製造方法、並びに、導電性ペースト - Google Patents

積層セラミックコンデンサ内部電極用の導電性ペースト組成物およびその製造方法、並びに、導電性ペースト Download PDF

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Publication number
JP7508770B2
JP7508770B2 JP2019199060A JP2019199060A JP7508770B2 JP 7508770 B2 JP7508770 B2 JP 7508770B2 JP 2019199060 A JP2019199060 A JP 2019199060A JP 2019199060 A JP2019199060 A JP 2019199060A JP 7508770 B2 JP7508770 B2 JP 7508770B2
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Prior art keywords
powder
conductive
average particle
ceramic powder
conductive paste
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JP2019199060A
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Japanese (ja)
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JP2021072223A (ja
JP2021072223A5 (https=
Inventor
匡邦 納谷
孝典 科野
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Sumitomo Metal Mining Co Ltd
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Sumitomo Metal Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Sumitomo Metal Mining Co Ltd filed Critical Sumitomo Metal Mining Co Ltd
Priority to JP2019199060A priority Critical patent/JP7508770B2/ja
Priority to KR1020227016143A priority patent/KR102808151B1/ko
Priority to CN202080076238.6A priority patent/CN114641835B/zh
Priority to PCT/JP2020/024666 priority patent/WO2021084790A1/ja
Priority to TW109135250A priority patent/TWI870478B/zh
Publication of JP2021072223A publication Critical patent/JP2021072223A/ja
Publication of JP2021072223A5 publication Critical patent/JP2021072223A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/14—Conductive material dispersed in non-conductive inorganic material
    • H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0036—Details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/008—Selection of materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials Engineering (AREA)
  • Ceramic Capacitors (AREA)
  • Conductive Materials (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
JP2019199060A 2019-10-31 2019-10-31 積層セラミックコンデンサ内部電極用の導電性ペースト組成物およびその製造方法、並びに、導電性ペースト Active JP7508770B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2019199060A JP7508770B2 (ja) 2019-10-31 2019-10-31 積層セラミックコンデンサ内部電極用の導電性ペースト組成物およびその製造方法、並びに、導電性ペースト
KR1020227016143A KR102808151B1 (ko) 2019-10-31 2020-06-23 적층 세라믹 콘덴서 내부 전극용의 도전성 페이스트 조성물 및 그의 제조 방법, 그리고 도전성 페이스트
CN202080076238.6A CN114641835B (zh) 2019-10-31 2020-06-23 层叠陶瓷电容器内部电极用导电膏组合物及其制造方法以及导电膏
PCT/JP2020/024666 WO2021084790A1 (ja) 2019-10-31 2020-06-23 積層セラミックコンデンサ内部電極用の導電性ペースト組成物およびその製造方法、並びに、導電性ペースト
TW109135250A TWI870478B (zh) 2019-10-31 2020-10-13 積層陶瓷電容器內部電極用的導電膏組成物、其製造方法及導電膏

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019199060A JP7508770B2 (ja) 2019-10-31 2019-10-31 積層セラミックコンデンサ内部電極用の導電性ペースト組成物およびその製造方法、並びに、導電性ペースト

Publications (3)

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JP2021072223A JP2021072223A (ja) 2021-05-06
JP2021072223A5 JP2021072223A5 (https=) 2022-10-31
JP7508770B2 true JP7508770B2 (ja) 2024-07-02

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JP2019199060A Active JP7508770B2 (ja) 2019-10-31 2019-10-31 積層セラミックコンデンサ内部電極用の導電性ペースト組成物およびその製造方法、並びに、導電性ペースト

Country Status (5)

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JP (1) JP7508770B2 (https=)
KR (1) KR102808151B1 (https=)
CN (1) CN114641835B (https=)
TW (1) TWI870478B (https=)
WO (1) WO2021084790A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7416021B2 (ja) * 2021-06-16 2024-01-17 株式会社村田製作所 積層セラミック電子部品
JP7517260B2 (ja) * 2021-06-16 2024-07-17 株式会社村田製作所 積層セラミック電子部品
JP2023144805A (ja) * 2022-03-28 2023-10-11 住友金属鉱山株式会社 評価装置、評価システム、評価方法、及びプログラム
JP2023144806A (ja) * 2022-03-28 2023-10-11 住友金属鉱山株式会社 評価装置、評価システム、評価方法、及びプログラム
WO2026005017A1 (ja) * 2024-06-28 2026-01-02 住友金属鉱山株式会社 導電性ペーストの乾燥膜

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007220551A (ja) 2006-02-17 2007-08-30 Tdk Corp 導電体ペーストおよび電子部品
JP2010087434A (ja) 2008-10-02 2010-04-15 Sumitomo Metal Mining Co Ltd 導電性ペースト、並びにこの導電性ペーストを用いた乾燥膜及び積層セラミックコンデンサ
JP2010153486A (ja) 2008-12-24 2010-07-08 Tdk Corp 電子部品
WO2017150438A1 (ja) 2016-02-29 2017-09-08 住友金属鉱山株式会社 導電性ペースト、電子部品及び積層セラミックコンデンサ

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5730308A (en) 1980-07-29 1982-02-18 Tdk Electronics Co Ltd Electrode pasge for porcelain capacitor
JP6447903B2 (ja) 2014-07-31 2019-01-09 住友金属鉱山株式会社 積層セラミック電子部品用導電性ペーストの製造方法及びこの導電性ペーストを用いた積層セラミック電子部品の製造方法、並びにこの方法による積層セラミックコンデンサの製造方法
JP7131955B2 (ja) * 2017-08-08 2022-09-06 太陽誘電株式会社 積層セラミックコンデンサおよびその製造方法
KR102587765B1 (ko) * 2017-08-10 2023-10-12 다이요 유덴 가부시키가이샤 적층 세라믹 콘덴서 및 그 제조 방법

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007220551A (ja) 2006-02-17 2007-08-30 Tdk Corp 導電体ペーストおよび電子部品
JP2010087434A (ja) 2008-10-02 2010-04-15 Sumitomo Metal Mining Co Ltd 導電性ペースト、並びにこの導電性ペーストを用いた乾燥膜及び積層セラミックコンデンサ
JP2010153486A (ja) 2008-12-24 2010-07-08 Tdk Corp 電子部品
WO2017150438A1 (ja) 2016-02-29 2017-09-08 住友金属鉱山株式会社 導電性ペースト、電子部品及び積層セラミックコンデンサ

Also Published As

Publication number Publication date
KR102808151B1 (ko) 2025-05-16
JP2021072223A (ja) 2021-05-06
KR20220086611A (ko) 2022-06-23
CN114641835B (zh) 2025-02-25
TW202119441A (zh) 2021-05-16
TWI870478B (zh) 2025-01-21
CN114641835A (zh) 2022-06-17
WO2021084790A1 (ja) 2021-05-06

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