JP7477055B2 - 封止用樹脂組成物および半導体装置 - Google Patents

封止用樹脂組成物および半導体装置 Download PDF

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Publication number
JP7477055B2
JP7477055B2 JP2023551185A JP2023551185A JP7477055B2 JP 7477055 B2 JP7477055 B2 JP 7477055B2 JP 2023551185 A JP2023551185 A JP 2023551185A JP 2023551185 A JP2023551185 A JP 2023551185A JP 7477055 B2 JP7477055 B2 JP 7477055B2
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resin composition
phenol
epoxy resins
encapsulating resin
type epoxy
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Japanese (ja)
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JPWO2023162975A5 (https=
JPWO2023162975A1 (https=
Inventor
正寛 岩井
祐介 田中
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Sumitomo Bakelite Co Ltd
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Sumitomo Bakelite Co Ltd
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Publication of JPWO2023162975A1 publication Critical patent/JPWO2023162975A1/ja
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Priority to JP2024059374A priority Critical patent/JP2024094333A/ja
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/688—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2023551185A 2022-02-28 2023-02-21 封止用樹脂組成物および半導体装置 Active JP7477055B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024059374A JP2024094333A (ja) 2022-02-28 2024-04-02 封止用樹脂組成物および半導体装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022029262 2022-02-28
JP2022029262 2022-02-28
PCT/JP2023/006237 WO2023162975A1 (ja) 2022-02-28 2023-02-21 封止用樹脂組成物および半導体装置

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JP2024059374A Division JP2024094333A (ja) 2022-02-28 2024-04-02 封止用樹脂組成物および半導体装置

Publications (3)

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JPWO2023162975A1 JPWO2023162975A1 (https=) 2023-08-31
JPWO2023162975A5 JPWO2023162975A5 (https=) 2024-01-31
JP7477055B2 true JP7477055B2 (ja) 2024-05-01

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JP2023551185A Active JP7477055B2 (ja) 2022-02-28 2023-02-21 封止用樹脂組成物および半導体装置
JP2024059374A Pending JP2024094333A (ja) 2022-02-28 2024-04-02 封止用樹脂組成物および半導体装置

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Country Link
EP (1) EP4488314A4 (https=)
JP (2) JP7477055B2 (https=)
KR (1) KR20240154052A (https=)
CN (1) CN118742588A (https=)
TW (1) TW202344551A (https=)
WO (1) WO2023162975A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7835721B2 (ja) * 2023-12-06 2026-03-25 日本化薬株式会社 硬化性樹脂組成物およびその硬化物
WO2026023033A1 (ja) * 2024-07-25 2026-01-29 株式会社レゾナック 硬化性組成物及び電子部品装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007002070A (ja) 2005-06-22 2007-01-11 Bridgestone Corp ゴム組成物およびそれを用いた空気入りタイヤ
JP2009046576A (ja) 2007-08-20 2009-03-05 Sumitomo Rubber Ind Ltd ブレーカーエッジカバリング用ゴム組成物およびそれを用いたブレーカーエッジカバリングを有するタイヤ
JP2014141688A (ja) 2014-05-15 2014-08-07 Nippon Kayaku Co Ltd フェノール樹脂、エポキシ樹脂、エポキシ樹脂組成物、およびその硬化物
JP2014201639A (ja) 2013-04-03 2014-10-27 日本化薬株式会社 エポキシ樹脂組成物及びその硬化物
JP2019147921A (ja) 2018-02-28 2019-09-05 住友ベークライト株式会社 バイオマス変性フェノール樹脂組成物および構造体

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5437929B2 (ja) * 2010-06-24 2014-03-12 パナソニック株式会社 エポキシ樹脂組成物とそれを用いた成形品
KR101508080B1 (ko) 2010-09-02 2015-04-07 스미또모 베이크라이트 가부시키가이샤 로터에 사용하는 고정용 수지 조성물
KR101905605B1 (ko) 2010-11-10 2018-10-08 그린 케미칼즈 가부시키가이샤 코리네형 세균 형질 전환체 및 그것을 사용하는 페놀의 제조 방법
EP3130664B1 (en) 2014-04-08 2025-05-21 Green Chemicals Co., Ltd. Coryneform bacterium transformant and method for producing 4-hydroxybenzoic acid or a salt thereof
US10079188B2 (en) 2015-03-05 2018-09-18 Sumitomo Bakelite Co., Ltd. Resin composition for encapsulating, manufacturing method of on-vehicle electronic control unit, and on-vehicle electronic control unit
JP6561129B2 (ja) 2015-09-29 2019-08-14 日立オートモティブシステムズ株式会社 電子制御装置またはその製造方法
JP6660070B2 (ja) * 2016-06-06 2020-03-04 日本化薬株式会社 エポキシ樹脂、エポキシ樹脂組成物及びその硬化物
JP2019077769A (ja) * 2017-10-24 2019-05-23 株式会社デンソー エポキシ樹脂組成物、樹脂硬化物、電子デバイス及びエポキシ樹脂組成物の製造方法
JP7302166B2 (ja) 2018-12-10 2023-07-04 住友ベークライト株式会社 ステータコア絶縁用樹脂組成物
JP2022029262A (ja) 2020-08-04 2022-02-17 コニカミノルタ株式会社 画像処理装置、画像処理方法、画像処理プログラム、および学習装置
CN113402848B (zh) * 2021-06-30 2022-05-17 四川大学 用于强韧化环氧树脂的生物基纳米组装固化剂及制备方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007002070A (ja) 2005-06-22 2007-01-11 Bridgestone Corp ゴム組成物およびそれを用いた空気入りタイヤ
JP2009046576A (ja) 2007-08-20 2009-03-05 Sumitomo Rubber Ind Ltd ブレーカーエッジカバリング用ゴム組成物およびそれを用いたブレーカーエッジカバリングを有するタイヤ
JP2014201639A (ja) 2013-04-03 2014-10-27 日本化薬株式会社 エポキシ樹脂組成物及びその硬化物
JP2014141688A (ja) 2014-05-15 2014-08-07 Nippon Kayaku Co Ltd フェノール樹脂、エポキシ樹脂、エポキシ樹脂組成物、およびその硬化物
JP2019147921A (ja) 2018-02-28 2019-09-05 住友ベークライト株式会社 バイオマス変性フェノール樹脂組成物および構造体

Also Published As

Publication number Publication date
JP2024094333A (ja) 2024-07-09
TW202344551A (zh) 2023-11-16
WO2023162975A1 (ja) 2023-08-31
KR20240154052A (ko) 2024-10-24
EP4488314A1 (en) 2025-01-08
JPWO2023162975A1 (https=) 2023-08-31
CN118742588A (zh) 2024-10-01
EP4488314A4 (en) 2026-03-04

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