TW202344551A - 密封用樹脂組成物及半導體裝置 - Google Patents

密封用樹脂組成物及半導體裝置 Download PDF

Info

Publication number
TW202344551A
TW202344551A TW112106643A TW112106643A TW202344551A TW 202344551 A TW202344551 A TW 202344551A TW 112106643 A TW112106643 A TW 112106643A TW 112106643 A TW112106643 A TW 112106643A TW 202344551 A TW202344551 A TW 202344551A
Authority
TW
Taiwan
Prior art keywords
resin composition
sealing resin
phenol
sealing
epoxy resin
Prior art date
Application number
TW112106643A
Other languages
English (en)
Chinese (zh)
Inventor
岩井正寛
田中祐介
Original Assignee
日商住友電木股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商住友電木股份有限公司 filed Critical 日商住友電木股份有限公司
Publication of TW202344551A publication Critical patent/TW202344551A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/688—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW112106643A 2022-02-28 2023-02-23 密封用樹脂組成物及半導體裝置 TW202344551A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022029262 2022-02-28
JP2022-029262 2022-02-28

Publications (1)

Publication Number Publication Date
TW202344551A true TW202344551A (zh) 2023-11-16

Family

ID=87765911

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112106643A TW202344551A (zh) 2022-02-28 2023-02-23 密封用樹脂組成物及半導體裝置

Country Status (6)

Country Link
EP (1) EP4488314A4 (https=)
JP (2) JP7477055B2 (https=)
KR (1) KR20240154052A (https=)
CN (1) CN118742588A (https=)
TW (1) TW202344551A (https=)
WO (1) WO2023162975A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7835721B2 (ja) * 2023-12-06 2026-03-25 日本化薬株式会社 硬化性樹脂組成物およびその硬化物
WO2026023033A1 (ja) * 2024-07-25 2026-01-29 株式会社レゾナック 硬化性組成物及び電子部品装置

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007002070A (ja) 2005-06-22 2007-01-11 Bridgestone Corp ゴム組成物およびそれを用いた空気入りタイヤ
JP2009046576A (ja) 2007-08-20 2009-03-05 Sumitomo Rubber Ind Ltd ブレーカーエッジカバリング用ゴム組成物およびそれを用いたブレーカーエッジカバリングを有するタイヤ
JP5437929B2 (ja) * 2010-06-24 2014-03-12 パナソニック株式会社 エポキシ樹脂組成物とそれを用いた成形品
EP3859944B1 (en) 2010-09-02 2023-06-28 Sumitomo Bakelite Co., Ltd. Fixing resin composition for use in rotor
CN103228784B (zh) 2010-11-10 2020-02-28 绿色化学品株式会社 棒状细菌转化体及使用该转化体的苯酚的制造方法
JP6091295B2 (ja) * 2013-04-03 2017-03-08 日本化薬株式会社 エポキシ樹脂組成物及びその硬化物
EP3130664B1 (en) 2014-04-08 2025-05-21 Green Chemicals Co., Ltd. Coryneform bacterium transformant and method for producing 4-hydroxybenzoic acid or a salt thereof
JP2014141688A (ja) * 2014-05-15 2014-08-07 Nippon Kayaku Co Ltd フェノール樹脂、エポキシ樹脂、エポキシ樹脂組成物、およびその硬化物
BR112017014323B1 (pt) 2015-03-05 2022-11-01 Sumitomo Bakelite Co., Ltd Composição de resina para vedação, método para produzir unidade de controle eletrônico montada em veículo e unidade de controle eletrônico montada em veículo
EP3358919B1 (en) 2015-09-29 2022-07-20 Hitachi Astemo, Ltd. Electronic control device and manufacturing method for same
JP6660070B2 (ja) * 2016-06-06 2020-03-04 日本化薬株式会社 エポキシ樹脂、エポキシ樹脂組成物及びその硬化物
JP2019077769A (ja) * 2017-10-24 2019-05-23 株式会社デンソー エポキシ樹脂組成物、樹脂硬化物、電子デバイス及びエポキシ樹脂組成物の製造方法
JP2019147921A (ja) 2018-02-28 2019-09-05 住友ベークライト株式会社 バイオマス変性フェノール樹脂組成物および構造体
JP7302166B2 (ja) 2018-12-10 2023-07-04 住友ベークライト株式会社 ステータコア絶縁用樹脂組成物
JP2022029262A (ja) 2020-08-04 2022-02-17 コニカミノルタ株式会社 画像処理装置、画像処理方法、画像処理プログラム、および学習装置
CN113402848B (zh) * 2021-06-30 2022-05-17 四川大学 用于强韧化环氧树脂的生物基纳米组装固化剂及制备方法

Also Published As

Publication number Publication date
JP2024094333A (ja) 2024-07-09
CN118742588A (zh) 2024-10-01
JP7477055B2 (ja) 2024-05-01
KR20240154052A (ko) 2024-10-24
EP4488314A1 (en) 2025-01-08
JPWO2023162975A1 (https=) 2023-08-31
WO2023162975A1 (ja) 2023-08-31
EP4488314A4 (en) 2026-03-04

Similar Documents

Publication Publication Date Title
JP7651926B2 (ja) 成形用樹脂組成物及び電子部品装置
JP6102913B2 (ja) 封止用樹脂組成物およびこれを用いた電子装置
JP2024094333A (ja) 封止用樹脂組成物および半導体装置
JP5842995B2 (ja) 封止用樹脂組成物およびこれを用いる電子装置
WO2014007068A1 (ja) フェノール樹脂組成物
TW202000767A (zh) 硬化性樹脂組成物及電子零件裝置
CN111094450A (zh) 环氧树脂组合物和电子部件装置
WO2020066856A1 (ja) 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法
JP7827100B2 (ja) 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法
JP7609173B2 (ja) 成形用樹脂組成物及び電子部品装置
JP2014062173A (ja) 樹脂組成物および電子部品装置
JP7501818B2 (ja) 成形用樹脂組成物及び電子部品装置
JP2022093030A (ja) 樹脂組成物及び高周波デバイス
TW202016169A (zh) 硬化性樹脂組成物用添加劑、硬化性樹脂組成物及電子零件裝置
CN112805315A (zh) 硬化性树脂组合物及电子零件装置
CN119173552A (zh) 硬化性树脂组合物及电子零件装置
JP2020152825A (ja) 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法
JP2020122071A (ja) 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法
JP2001316453A (ja) エポキシ樹脂組成物及び半導体装置
JP2009242719A (ja) フェノールノボラック樹脂、エポキシ樹脂組成物及びその硬化物、並びに半導体装置
JP5721519B2 (ja) フェノール系重合体、その製法およびその用途
JP2021116329A (ja) 封止用樹脂組成物、電子部品装置、及び電子部品装置の製造方法
JP3223012B2 (ja) フェノール樹脂、その製造方法および用途
KR20150066441A (ko) 페놀 수지 조성물, 열경화성 수지 조성물, 및 경화물
JPH09157353A (ja) 半導体封止用に適したエポキシ樹脂組成物