JP7459936B2 - 圧電デバイス - Google Patents

圧電デバイス Download PDF

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Publication number
JP7459936B2
JP7459936B2 JP2022514061A JP2022514061A JP7459936B2 JP 7459936 B2 JP7459936 B2 JP 7459936B2 JP 2022514061 A JP2022514061 A JP 2022514061A JP 2022514061 A JP2022514061 A JP 2022514061A JP 7459936 B2 JP7459936 B2 JP 7459936B2
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JP
Japan
Prior art keywords
layer
piezoelectric
laminate
insulating layer
region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022514061A
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English (en)
Japanese (ja)
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JPWO2021206050A1 (https=
JPWO2021206050A5 (https=
Inventor
宗久 渡辺
康政 谷口
克也 大門
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of JPWO2021206050A1 publication Critical patent/JPWO2021206050A1/ja
Publication of JPWO2021206050A5 publication Critical patent/JPWO2021206050A5/ja
Application granted granted Critical
Publication of JP7459936B2 publication Critical patent/JP7459936B2/ja
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Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02818—Means for compensation or elimination of undesirable effects
    • H03H9/02897—Means for compensation or elimination of undesirable effects of strain or mechanical damage, e.g. strain due to bending influence
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02574—Characteristics of substrate, e.g. cutting angles of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02818—Means for compensation or elimination of undesirable effects
    • H03H9/02866—Means for compensation or elimination of undesirable effects of bulk wave excitation and reflections
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/058—Holders or supports for surface acoustic wave devices
    • H03H9/059—Holders or supports for surface acoustic wave devices consisting of mounting pads or bumps
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1092—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a cover cap mounted on an element forming part of the surface acoustic wave [SAW] device on the side of the IDT's
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/25—Constructional features of resonators using surface acoustic waves

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
JP2022514061A 2020-04-10 2021-04-05 圧電デバイス Active JP7459936B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020071025 2020-04-10
JP2020071025 2020-04-10
PCT/JP2021/014486 WO2021206050A1 (ja) 2020-04-10 2021-04-05 圧電デバイス

Publications (3)

Publication Number Publication Date
JPWO2021206050A1 JPWO2021206050A1 (https=) 2021-10-14
JPWO2021206050A5 JPWO2021206050A5 (https=) 2022-10-24
JP7459936B2 true JP7459936B2 (ja) 2024-04-02

Family

ID=78023270

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022514061A Active JP7459936B2 (ja) 2020-04-10 2021-04-05 圧電デバイス

Country Status (4)

Country Link
US (1) US20230027753A1 (https=)
JP (1) JP7459936B2 (https=)
CN (1) CN115349226B (https=)
WO (1) WO2021206050A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116722838B (zh) * 2023-06-29 2024-08-02 北京超材信息科技有限公司 声表面波滤波器及组、多工器及射频模组
CN120675527A (zh) * 2024-09-25 2025-09-19 华为技术有限公司 压电器件及其制备方法、电子设备

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015098678A1 (ja) 2013-12-27 2015-07-02 株式会社村田製作所 弾性波装置
JP2019179961A (ja) 2018-03-30 2019-10-17 株式会社村田製作所 弾性波装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5807715B2 (ja) * 2012-03-23 2015-11-10 株式会社村田製作所 弾性波フィルタ素子及びその製造方法
KR101929333B1 (ko) * 2015-06-25 2018-12-14 가부시키가이샤 무라타 세이사쿠쇼 탄성파 장치
KR102369436B1 (ko) * 2017-04-19 2022-03-03 삼성전기주식회사 체적 음향 공진기

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015098678A1 (ja) 2013-12-27 2015-07-02 株式会社村田製作所 弾性波装置
JP2019179961A (ja) 2018-03-30 2019-10-17 株式会社村田製作所 弾性波装置

Also Published As

Publication number Publication date
JPWO2021206050A1 (https=) 2021-10-14
WO2021206050A1 (ja) 2021-10-14
CN115349226B (zh) 2025-12-16
CN115349226A (zh) 2022-11-15
US20230027753A1 (en) 2023-01-26

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