CN115349226B - 压电器件 - Google Patents

压电器件

Info

Publication number
CN115349226B
CN115349226B CN202180023499.6A CN202180023499A CN115349226B CN 115349226 B CN115349226 B CN 115349226B CN 202180023499 A CN202180023499 A CN 202180023499A CN 115349226 B CN115349226 B CN 115349226B
Authority
CN
China
Prior art keywords
layer
piezoelectric
region
insulating layer
laminate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202180023499.6A
Other languages
English (en)
Chinese (zh)
Other versions
CN115349226A (zh
Inventor
渡边宗久
谷口康政
大门克也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of CN115349226A publication Critical patent/CN115349226A/zh
Application granted granted Critical
Publication of CN115349226B publication Critical patent/CN115349226B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02574—Characteristics of substrate, e.g. cutting angles of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02818—Means for compensation or elimination of undesirable effects
    • H03H9/02897—Means for compensation or elimination of undesirable effects of strain or mechanical damage, e.g. strain due to bending influence
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02818—Means for compensation or elimination of undesirable effects
    • H03H9/02866—Means for compensation or elimination of undesirable effects of bulk wave excitation and reflections
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/058—Holders or supports for surface acoustic wave devices
    • H03H9/059—Holders or supports for surface acoustic wave devices consisting of mounting pads or bumps
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1092—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a cover cap mounted on an element forming part of the surface acoustic wave [SAW] device on the side of the IDT's
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/25—Constructional features of resonators using surface acoustic waves

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
CN202180023499.6A 2020-04-10 2021-04-05 压电器件 Active CN115349226B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020-071025 2020-04-10
JP2020071025 2020-04-10
PCT/JP2021/014486 WO2021206050A1 (ja) 2020-04-10 2021-04-05 圧電デバイス

Publications (2)

Publication Number Publication Date
CN115349226A CN115349226A (zh) 2022-11-15
CN115349226B true CN115349226B (zh) 2025-12-16

Family

ID=78023270

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180023499.6A Active CN115349226B (zh) 2020-04-10 2021-04-05 压电器件

Country Status (4)

Country Link
US (1) US20230027753A1 (https=)
JP (1) JP7459936B2 (https=)
CN (1) CN115349226B (https=)
WO (1) WO2021206050A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116722838B (zh) * 2023-06-29 2024-08-02 北京超材信息科技有限公司 声表面波滤波器及组、多工器及射频模组
CN120675527A (zh) * 2024-09-25 2025-09-19 华为技术有限公司 压电器件及其制备方法、电子设备

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105794108A (zh) * 2013-12-27 2016-07-20 株式会社村田制作所 弹性波装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5807715B2 (ja) * 2012-03-23 2015-11-10 株式会社村田製作所 弾性波フィルタ素子及びその製造方法
KR101929333B1 (ko) * 2015-06-25 2018-12-14 가부시키가이샤 무라타 세이사쿠쇼 탄성파 장치
KR102369436B1 (ko) * 2017-04-19 2022-03-03 삼성전기주식회사 체적 음향 공진기
JP2019179961A (ja) * 2018-03-30 2019-10-17 株式会社村田製作所 弾性波装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105794108A (zh) * 2013-12-27 2016-07-20 株式会社村田制作所 弹性波装置

Also Published As

Publication number Publication date
JP7459936B2 (ja) 2024-04-02
JPWO2021206050A1 (https=) 2021-10-14
WO2021206050A1 (ja) 2021-10-14
CN115349226A (zh) 2022-11-15
US20230027753A1 (en) 2023-01-26

Similar Documents

Publication Publication Date Title
US11218130B2 (en) Acoustic wave device
KR102205855B1 (ko) 탄성파 장치
KR102146391B1 (ko) 탄성파 장치
CN110289826B (zh) 弹性波装置
JP6397352B2 (ja) 弾性波デバイス
JP7545404B2 (ja) 弾性波装置
WO2007034832A1 (ja) 弾性表面波素子及び弾性表面波装置
US20190305748A1 (en) Elastic wave device
US12149223B2 (en) Acoustic wave device
CN115349226B (zh) 压电器件
JP6919707B2 (ja) 弾性波装置、フロントエンド回路及び通信装置
CN113169725A (zh) 弹性波装置
CN212463171U (zh) 弹性波装置
CN115699574A (zh) 弹性波装置
CN105247785A (zh) 声表面波装置
WO2024014167A1 (ja) 弾性波装置
CN115485973B (zh) 弹性波装置
CN118285056A (zh) 弹性波装置
CN115428338B (zh) 压电器件
CN113243083B (zh) 弹性波元件以及弹性波装置
JP2025135828A (ja) 弾性波フィルタ
CN118216087A (zh) 滤波器装置
WO2023058713A1 (ja) 弾性波素子の製造方法および弾性波素子
CN114731147A (zh) 弹性波装置
CN116250178A (zh) 弹性波装置

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant