JPWO2021206050A1 - - Google Patents

Info

Publication number
JPWO2021206050A1
JPWO2021206050A1 JP2022514061A JP2022514061A JPWO2021206050A1 JP WO2021206050 A1 JPWO2021206050 A1 JP WO2021206050A1 JP 2022514061 A JP2022514061 A JP 2022514061A JP 2022514061 A JP2022514061 A JP 2022514061A JP WO2021206050 A1 JPWO2021206050 A1 JP WO2021206050A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022514061A
Other languages
Japanese (ja)
Other versions
JP7459936B2 (ja
JPWO2021206050A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021206050A1 publication Critical patent/JPWO2021206050A1/ja
Publication of JPWO2021206050A5 publication Critical patent/JPWO2021206050A5/ja
Application granted granted Critical
Publication of JP7459936B2 publication Critical patent/JP7459936B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02574—Characteristics of substrate, e.g. cutting angles of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02818—Means for compensation or elimination of undesirable effects
    • H03H9/02897—Means for compensation or elimination of undesirable effects of strain or mechanical damage, e.g. strain due to bending influence
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02818—Means for compensation or elimination of undesirable effects
    • H03H9/02866—Means for compensation or elimination of undesirable effects of bulk wave excitation and reflections
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/058—Holders or supports for surface acoustic wave devices
    • H03H9/059—Holders or supports for surface acoustic wave devices consisting of mounting pads or bumps
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1092—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a cover cap mounted on an element forming part of the surface acoustic wave [SAW] device on the side of the IDT's
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/25—Constructional features of resonators using surface acoustic waves

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
JP2022514061A 2020-04-10 2021-04-05 圧電デバイス Active JP7459936B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020071025 2020-04-10
JP2020071025 2020-04-10
PCT/JP2021/014486 WO2021206050A1 (ja) 2020-04-10 2021-04-05 圧電デバイス

Publications (3)

Publication Number Publication Date
JPWO2021206050A1 true JPWO2021206050A1 (https=) 2021-10-14
JPWO2021206050A5 JPWO2021206050A5 (https=) 2022-10-24
JP7459936B2 JP7459936B2 (ja) 2024-04-02

Family

ID=78023270

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022514061A Active JP7459936B2 (ja) 2020-04-10 2021-04-05 圧電デバイス

Country Status (4)

Country Link
US (1) US20230027753A1 (https=)
JP (1) JP7459936B2 (https=)
CN (1) CN115349226B (https=)
WO (1) WO2021206050A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116722838B (zh) * 2023-06-29 2024-08-02 北京超材信息科技有限公司 声表面波滤波器及组、多工器及射频模组
CN120675527A (zh) * 2024-09-25 2025-09-19 华为技术有限公司 压电器件及其制备方法、电子设备

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015098678A1 (ja) * 2013-12-27 2015-07-02 株式会社村田製作所 弾性波装置
JP2019179961A (ja) * 2018-03-30 2019-10-17 株式会社村田製作所 弾性波装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5807715B2 (ja) * 2012-03-23 2015-11-10 株式会社村田製作所 弾性波フィルタ素子及びその製造方法
KR101929333B1 (ko) * 2015-06-25 2018-12-14 가부시키가이샤 무라타 세이사쿠쇼 탄성파 장치
KR102369436B1 (ko) * 2017-04-19 2022-03-03 삼성전기주식회사 체적 음향 공진기

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015098678A1 (ja) * 2013-12-27 2015-07-02 株式会社村田製作所 弾性波装置
JP2019179961A (ja) * 2018-03-30 2019-10-17 株式会社村田製作所 弾性波装置

Also Published As

Publication number Publication date
JP7459936B2 (ja) 2024-04-02
WO2021206050A1 (ja) 2021-10-14
CN115349226B (zh) 2025-12-16
CN115349226A (zh) 2022-11-15
US20230027753A1 (en) 2023-01-26

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