JP7459368B2 - プローブカード用アライメントチップ、プローブカード及びプローブカード補修方法 - Google Patents

プローブカード用アライメントチップ、プローブカード及びプローブカード補修方法 Download PDF

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Publication number
JP7459368B2
JP7459368B2 JP2023500448A JP2023500448A JP7459368B2 JP 7459368 B2 JP7459368 B2 JP 7459368B2 JP 2023500448 A JP2023500448 A JP 2023500448A JP 2023500448 A JP2023500448 A JP 2023500448A JP 7459368 B2 JP7459368 B2 JP 7459368B2
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Japan
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symbol
alignment
probe
substrate
chip
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Japanese (ja)
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JPWO2022176143A1 (https=
JPWO2022176143A5 (https=
Inventor
敬 吉田
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Japan Electronic Materials Corp
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Japan Electronic Materials Corp
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0491—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets for testing integrated circuits on wafers, e.g. wafer-level test cartridge
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06705—Apparatus for holding or moving single probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2023500448A 2021-02-19 2021-02-19 プローブカード用アライメントチップ、プローブカード及びプローブカード補修方法 Active JP7459368B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/006256 WO2022176143A1 (ja) 2021-02-19 2021-02-19 プローブカード用アライメントチップ、プローブカード及びプローブカード補修方法

Publications (3)

Publication Number Publication Date
JPWO2022176143A1 JPWO2022176143A1 (https=) 2022-08-25
JPWO2022176143A5 JPWO2022176143A5 (https=) 2023-04-28
JP7459368B2 true JP7459368B2 (ja) 2024-04-01

Family

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JP2023500448A Active JP7459368B2 (ja) 2021-02-19 2021-02-19 プローブカード用アライメントチップ、プローブカード及びプローブカード補修方法

Country Status (5)

Country Link
US (1) US12596147B2 (https=)
JP (1) JP7459368B2 (https=)
KR (1) KR102876398B1 (https=)
CN (1) CN116194784A (https=)
WO (1) WO2022176143A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116547543B (zh) 2021-03-15 2026-01-27 日本电子材料株式会社 探针卡

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001330626A (ja) 2000-05-22 2001-11-30 Micronics Japan Co Ltd プローブカード及びこれにアライメントマークを形成する方法
US6429671B1 (en) 1998-11-25 2002-08-06 Advanced Micro Devices, Inc. Electrical test probe card having a removable probe head assembly with alignment features and a method for aligning the probe head assembly to the probe card
JP2007184417A (ja) 2006-01-06 2007-07-19 Kawasaki Microelectronics Kk プローブカードの取り付け位置ずれの検出方法及びプローバ装置
WO2008120575A1 (ja) 2007-04-03 2008-10-09 Advantest Corporation コンタクタの実装方法
JP2011117761A (ja) 2009-12-01 2011-06-16 Japan Electronic Materials Corp プローブカードおよびプローブカードの製造方法
JP2017118138A (ja) 2017-02-23 2017-06-29 ルネサスエレクトロニクス株式会社 半導体装置の製造方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0196944A (ja) * 1987-10-08 1989-04-14 Nec Corp 高周波特性測定装置
JPH1096944A (ja) * 1996-09-25 1998-04-14 Toshiba Electron Eng Corp 電気的接続構造および液晶表示装置
JPH11154694A (ja) * 1997-11-21 1999-06-08 Matsushita Electric Ind Co Ltd ウェハ一括型測定検査用アライメント方法およびプローブカードの製造方法
GB9826596D0 (en) 1998-12-04 1999-01-27 P J O Ind Limited Conductive materials
JP2000346875A (ja) 1999-06-07 2000-12-15 Advantest Corp プローブカードおよびこれを用いたｉｃ試験装置
JP2006078351A (ja) * 2004-09-10 2006-03-23 Matsushita Electric Ind Co Ltd プローブカード
JP4187718B2 (ja) * 2004-12-20 2008-11-26 松下電器産業株式会社 プローブカード
JP2007071699A (ja) * 2005-09-07 2007-03-22 Rika Denshi Co Ltd 垂直型プローブカード
JP2014146829A (ja) * 2005-11-10 2014-08-14 Renesas Electronics Corp 半導体チップおよび半導体装置
JP2007200934A (ja) * 2006-01-23 2007-08-09 Fujitsu Ltd プローブカードのプローブ針の針跡評価方法
WO2007092593A2 (en) * 2006-02-08 2007-08-16 Sv Probe Pte Ltd. Probe repair methods
JP5199859B2 (ja) 2008-12-24 2013-05-15 株式会社日本マイクロニクス プローブカード
JP2011075532A (ja) * 2009-10-02 2011-04-14 Japan Electronic Materials Corp プローブカード及びその製造方法
JP2011204889A (ja) * 2010-03-25 2011-10-13 Kyocera Corp インターポーザ基板
JP5297491B2 (ja) * 2011-03-23 2013-09-25 ルネサスエレクトロニクス株式会社 半導体装置
JP5847663B2 (ja) * 2012-08-01 2016-01-27 日本電子材料株式会社 プローブカード用ガイド板の製造方法
US10529593B2 (en) * 2018-04-27 2020-01-07 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor package comprising molding compound having extended portion and manufacturing method of semiconductor package
TW202022386A (zh) 2018-12-04 2020-06-16 蔚華科技股份有限公司 測試半導體設備之方法及結構
CN116547543B (zh) * 2021-03-15 2026-01-27 日本电子材料株式会社 探针卡
KR102760918B1 (ko) * 2021-04-23 2025-02-03 재팬 일렉트로닉 메트리얼스 코오포레이숀 프로브 카드 및 프로브 카드 보수 방법

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6429671B1 (en) 1998-11-25 2002-08-06 Advanced Micro Devices, Inc. Electrical test probe card having a removable probe head assembly with alignment features and a method for aligning the probe head assembly to the probe card
JP2001330626A (ja) 2000-05-22 2001-11-30 Micronics Japan Co Ltd プローブカード及びこれにアライメントマークを形成する方法
JP2007184417A (ja) 2006-01-06 2007-07-19 Kawasaki Microelectronics Kk プローブカードの取り付け位置ずれの検出方法及びプローバ装置
WO2008120575A1 (ja) 2007-04-03 2008-10-09 Advantest Corporation コンタクタの実装方法
JP2011117761A (ja) 2009-12-01 2011-06-16 Japan Electronic Materials Corp プローブカードおよびプローブカードの製造方法
JP2017118138A (ja) 2017-02-23 2017-06-29 ルネサスエレクトロニクス株式会社 半導体装置の製造方法

Also Published As

Publication number Publication date
KR102876398B1 (ko) 2025-10-24
WO2022176143A1 (ja) 2022-08-25
US12596147B2 (en) 2026-04-07
TW202234067A (zh) 2022-09-01
CN116194784A (zh) 2023-05-30
JPWO2022176143A1 (https=) 2022-08-25
US20240103071A1 (en) 2024-03-28
KR20230044303A (ko) 2023-04-03

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