JP7455117B2 - Method and apparatus for accelerating transfer speed of semiconductor devices through fine adjustment - Google Patents

Description

Cross-reference to related patent applications This application was filed on October 1, 2018, entitled "Method and Apparatus to Increase Transfer Speed of Semiconductor Devices with Micro-Adjustment" No. 16/147,456 Priority is claimed and incorporated by reference in its entirety. This application is filed in U.S. patent application Ser. , No. 896, U.S. patent application Ser. direct Transfer of Semiconductor Devices” U.S. Patent Application No. 15/360,471, filed on November 23, 2016, entitled "Pattern Array Direct Transfer Apparatus and Method Therefor," filed on November 23, 2016. No. 15/360,645, U.S. patent application Ser. Apparatus for Multiple Direct No. 15/987,094, filed May 12, 2018, entitled ``Transfers of Semiconductor Devices'' is incorporated by reference.

Semiconductor devices are electrical components that utilize semiconductor materials such as silicon, germanium, and gallium arsenide. Semiconductor devices are typically manufactured as single discrete elements or as integrated circuits (ICs). Examples of single discrete elements include electrically actuatable elements such as light emitting diodes (LEDs), diodes, transistors, resistors, capacitors, fuses, and the like.

Manufacturing semiconductor devices typically involves complex manufacturing processes involving numerous steps. The final product of manufacture is a "packaged" semiconductor device. A "packaged" variant refers to the enclosure and protection features that were incorporated into the final product, as well as the interfaces that allow the device within the package to be incorporated into the final circuit.

The conventional manufacturing process for semiconductor devices begins with the handling of semiconductor wafers. The wafer is diced into a number of "unpackaged" semiconductor devices. An "unpackaged" variant refers to an unsealed semiconductor device with no protective features. An unpackaged semiconductor device may be referred to herein as a semiconductor device die, or simply a "die" for simplicity. A single semiconductor wafer can be diced into dies of various sizes, allowing over 100,000 or even over 1 million dies to be formed from a semiconductor wafer (depending on the starting size of the semiconductor), with each The die has certain qualities. The unpackaged die is then "packaged" via conventional manufacturing processes briefly described below. The operations during wafer handling and packaging are sometimes referred to as "die preparation."

In some cases, preparing the die may include sorting the die through a "pick and place process." As a result, the diced dies are individually picked and sorted into bins. Sorting may be based on forward voltage capacity of the die, average power of the die, and/or wavelength of the die.

Packaging typically involves attaching the die to a plastic or ceramic package (such as a mold or housing). Packaging also includes connecting die contacts to pins/wires to interface/interconnect with the final circuit. Packaging of semiconductor devices is typically completed by hermetically sealing the die to protect it from the environment (such as dust).

The product manufacturer then places the packaged semiconductor device into a product circuit. Through packaging, the device is ready to be "plugged into" the circuit assembly of the product being manufactured. Additionally, while device packaging protects the device from elements that might degrade or destroy it, the packaged device is inherently larger than the die found within the package (e.g., in some cases , about 10 times the thickness, about 10 times the area, and 100 times the volume). Therefore, the resulting circuit assembly cannot be made thinner than the package of the semiconductor device.

As previously mentioned, a single semiconductor wafer can be diced to produce over 100,000 or even over 1 million dies from the semiconductor wafer. Therefore, when transferring thousands if not millions of dies, efficiency becomes a primary concern. When transferring these dies, there are often die transfer parameters that the manufacturer cannot control for efficiency and/or speed. For example, if the die is transferred at a relatively high speed, the high speed transfer process may transmit vibrations throughout the semiconductor substrate. In other aspects, even when configured to perform transfer at high speeds, starting and stopping the transport mechanism that positions the die for transfer can be costly in terms of efficiency. Conventional transfer mechanisms and methods do not provide the ability to control and/or improve these parameters and/or others without reducing the efficiency of the transfer process.

The detailed description will now be described with reference to the accompanying figures. In the figures, the leftmost digit(s) of a reference number identifies the figure in which the reference number first appears. The use of the same reference numbers in different figures indicates similar or identical items. Additionally, the drawings may be considered to provide approximate depictions of the relative sizes of the individual components within the individual figures. However, the drawings are not to scale and the relative sizes of individual components, both within individual figures and between different figures, may differ from what is shown. Specifically, some diagrams may show components as a particular size or shape, whereas other diagrams may show the same components on a larger scale or with different shapes for clarity. There are cases.

1 shows an isometric view of an embodiment of a direct transfer device. FIG. 1 depicts a schematic diagram of an embodiment of a direct transfer device in a pre-transfer position; FIG. 1 depicts a schematic diagram of an embodiment of a direct transfer device in a transfer position; FIG. FIG. 7 illustrates an embodiment of the shape profile of the needle end of a direct transfer mechanism. FIG. 7 illustrates an embodiment of a needle actuation stroke profile. FIG. 3 shows a top view of an embodiment of a support substrate having circuit traces on the support substrate. 1 shows a schematic diagram of an embodiment of elements of a direct die transfer system. FIG. FIG. 2 shows a schematic diagram of an embodiment of a circuit path between machine hardware and a controller of a direct die transfer system. 1 illustrates a method for a direct die transfer process, according to an embodiment of the present application. 4 illustrates a method of direct die transfer operation according to an embodiment of the present application. 1 illustrates an embodiment of a direct transfer apparatus and process implementing a conveyor system. (A) shows a schematic diagram of another embodiment of a direct transfer device in a pre-transfer position. (B) shows a schematic top view of the post-transfer operation of the support base material transport mechanism of the embodiment of (A). Figure 3 shows a schematic diagram of another embodiment of a direct transfer device in a pre-transfer position. Figure 3 shows a schematic diagram of another embodiment of a direct transfer device in a pre-transfer position. 1 shows a schematic diagram of an embodiment of a direct transfer device in a pre-transfer position with a fine adjustment assembly implemented in accordance with certain embodiments of the present disclosure; FIG. FIG. 3 illustrates an isometric view of a fine adjustment assembly, according to an embodiment of the present disclosure. 15B shows a schematic cross-sectional view of the fine adjustment assembly of FIG. 15A, according to an embodiment of the present disclosure. FIG. 15B shows another schematic cross-sectional view of the micro-adjustment assembly of FIG. 15A according to an embodiment of the present disclosure. FIG. 3 illustrates a bottom view of a fine adjustment assembly having two fine adjustment actuators, according to an embodiment of the present disclosure. FIG. 3 illustrates a bottom view of a fine adjustment assembly having four fine adjustment actuators, according to an embodiment of the present disclosure. 1 illustrates an exemplary process method of operating a direct transfer device, according to an embodiment of the present disclosure. FIG. 2 shows an isometric view of a two-axis rail fine adjustment assembly with two microactuators, according to an embodiment of the present disclosure. 19B illustrates a side view of the two-axis rail fine adjustment assembly of FIG. 19A, according to an embodiment of the present disclosure. FIG. 19B illustrates a bottom view of the two-axis rail fine adjustment assembly of FIG. 19A, according to an embodiment of the present disclosure. FIG. 5 illustrates another method of an exemplary process for performing direct transfer using an apparatus having a fine adjustment assembly, according to an embodiment of the present disclosure. 1 illustrates a partial schematic diagram of a direct die transfer head with multiple pins/needles for use with an apparatus having a fine adjustment assembly, according to an embodiment of the present disclosure; FIG.

The present disclosure is directed to a machine for directly transferring and securing a die of a semiconductor device to a circuit, and a process for accomplishing the same, as well as a circuit (as an output product) with the die attached to the machine. In some embodiments, the machine functions to directly transfer unpackaged die from a substrate such as a "wafer tape" to a supporting substrate such as a circuit board. Direct transfer of unpackaged dies significantly reduces the thickness of the final product, as well as the amount of time and/or cost to manufacture the supporting substrate, compared to similar products manufactured by traditional means. can be reduced to

For purposes of this description, the term "substrate" refers to any material on or against which a process or action occurs. Additionally, the term "product" refers to the desired output from a process or operation, regardless of its state of completion. Thus, a supporting substrate refers to any material on or to which a process or action is generated for a desired output.

In some embodiments, the machine may secure a support substrate for receiving an "unpackaged" die, such as an LED, transferred from a wafer tape, for example. In order to reduce the size of the product using a die, the die may be very small and thin, for example, the die may be about 50 microns (μm) thick. Due to the relatively small size of the die, this machine requires precise alignment of both the wafer tape carrying the die and the supporting substrate to ensure accurate placement and/or avoid waste of product material. Contains components that function for In some embodiments, the component for aligning the support substrate and the die on the wafer tape is configured such that the wafer tape and the support substrate are each fixed, and a particular die on the wafer tape is aligned with a particular spot on the support substrate. The image may include a set of frames that are individually transported to an alignment position such that they are transferred to a .

The frame carrying the support substrate can move in various directions, including in-plane horizontal, vertical, and/or rotational directions of various alignment axes, or out-of-plane directions to allow transfer to curved surfaces. obtain. The frame carrying the wafer tape may also move in various directions. A system having gears, tracks, motors, and/or other elements is used to secure and transport the frame carrying the support substrate and wafer tape, respectively, to place the die in a precise location on the support substrate. The support substrate can then be aligned with the wafer tape. Additionally, each frame system may be moved to an extraction position to facilitate extraction of the wafer tape and support substrate upon completion of the transfer process. Any or all of the first substrate, second substrate, and transfer mechanism are movable relative to each other to facilitate the most efficient alignment of the components based on the particular embodiment. I also want you to understand what you can gain.

In some embodiments, the component that aligns the support substrate and the die on the wafer tape moves the wafer tape over a short distance (e.g., from 5 microns to 50 microns, or from 1 micron to 1000 microns, or from 0.5 microns to 5000 microns) to finely adjust the desired location of the transfer die to the die transfer location. These short-distance transports (hereinafter referred to as fine adjustments) reduce inaccuracies in the location of the frame transporting the wafer tape due to vibrations caused by the start and stop of frame transport (coarse adjustment of transport mechanism(s)). can be quickly canceled out. Inertial vibration noise may change depending on speed, unit mass, deceleration, etc. To counteract vibrations before die transfer, the fine adjustment occurs quickly (eg, about 0.5 ms from start to finish of the fine adjustment). Additionally, after transporting the tape to the transfer location and transferring the die, subsequent fine adjustments may be made to align the transfer die with additional transfer locations before the next coarse adjustment.

In some embodiments, the machine further includes a transfer mechanism for directly transferring the die from the wafer tape to the supporting substrate without "packaging" the die. The transfer mechanism may be positioned vertically above the wafer tape to push the die down through the wafer tape toward the support substrate. This process of pushing down on the die may begin at the side of the die and peel the die from the wafer tape until the die separates from the wafer tape attached to the support substrate. That is, the die may be transferred by reducing the adhesion between the die and the wafer tape and increasing the adhesion between the die and the supporting substrate.

In some embodiments, the transfer mechanism may include an elongated rod, such as a pin or needle, that can be periodically actuated against the wafer tape to push the wafer tape from above. Additionally and/or alternatively, the transfer mechanism may include multiple needles that can be individually actuated against the wafer tape. The needle(s) may be sized to be no wider than the width of the die being transferred. As another example, the needle width may be wider than the die width or any other dimension. When the end of the needle contacts the wafer tape, the wafer tape may experience localized sag in the area between the die and the wafer tape. As long as the deflection is highly localized and performed quickly, the portion of the wafer tape that is not under pressure from the needle may begin to bend away from the surface of the die. Therefore, this partial separation may cause the die to lose sufficient contact with the wafer tape so that it can be released from the wafer tape. Additionally, in some embodiments, the wafer tape deflection extends the opposing surfaces of the die beyond the extension of the corresponding surfaces of adjacent dies, while also avoiding inadvertent transfer of adjacent dies. can be minimized to maintain the entire surface area of the wafer in contact with the wafer tape.

Alternatively, or in addition, the machine may further include a securing mechanism for securing the separated "unpackaged" die to the support substrate. In some embodiments, the support substrate may have circuit traces thereon to which the die is transferred and secured. The fixation mechanism may include a device that emits energy, such as a laser, to melt/soften the material of the circuit traces on the support substrate. Additionally, in some embodiments, a laser may be used to activate/cure the material of the circuit traces. Thus, the locking mechanism may be actuated before and/or after the die contacts the circuit trace material. Thus, upon actuation of the transfer mechanism to release the die onto the support substrate, the energy emitting device may also be activated to prepare the trace material for receiving the die. Activation of the energy emitting device may further enhance the release and capture of the die from the wafer tape to initiate the formation of semiconductor products on the supporting substrate.

In some embodiments, as the frame holding the wafer tape is transported from location to location, the transport mechanism holding the wafer frame moves to the transfer location, stops abruptly, and then moves slightly across the transfer location. Fine adjustments may be made to adjust and/or eliminate vibrations in the system. The system then transfers the die through the locking mechanism as described above.

In other embodiments, the transport mechanism may not come to a complete stop before transferring the die from the wafer tape to the supporting substrate. In some embodiments, the system may vary the speed of the transport mechanism as it approaches the desired transfer location, and in other embodiments, the transport mechanism may vary the speed of the transport mechanism as it passes the desired transfer location. speed may be maintained. At a moment that is calculable with respect to the transfer position, the system may actuate the fine movement mechanism in one or more axes of movement at 180 degrees from the direction of movement. The speed of the fine movement matches the speed of movement of the frame so that the position of the die being transferred is stationary relative to the target position on the support. That is, due to the opposite direction of operation of the fine adjustment mechanism, the relative speed of the transfer elements (eg, the transport mechanism and the transfer mechanism) becomes zero. At the moment when the die is stationary relative to the target location, the transfer mechanism forces the die away from the wafer tape and into position on the substrate support, and the fixing mechanism fixes the die as described herein. do. Because the transport mechanism never comes to a complete stop, manufacturing efficiencies are gained by saving time waiting for the system vibrations of the coarse transport mechanism to settle down at each transfer location.

First Exemplary Embodiment of Direct Transfer Apparatus FIG. 1 shows an embodiment of an apparatus 100 that may be used to directly transfer unpackaged semiconductor components (or "dies") from a wafer tape to a supporting substrate. show. Wafer tape is sometimes referred to herein as a semiconductor device die substrate, or simply a die substrate. Apparatus 100 may include a support substrate transport mechanism 102 and a wafer tape transport mechanism 104. Support substrate transport mechanism 102 and wafer tape transport mechanism 104 each may include a frame system or other means for securing the respective transported substrates in a desired alignment relative to each other. Apparatus 100 may further include a transfer mechanism 106, which may be positioned vertically above wafer tape transport mechanism 104, as shown. In some embodiments, transfer mechanism 106 may be positioned to substantially contact the wafer tape. Additionally, device 100 may include a locking mechanism 108. The fixing mechanism 108 may be disposed vertically below the support substrate transport mechanism 102 in alignment with the transport mechanism 106 at a transfer position where the die may be placed on the support substrate. As discussed below, FIGS. 2A and 2B show exemplary details of apparatus 100.

Because FIGS. 2A and 2B illustrate different stages of a transfer operation while referring to the same elements and features of apparatus 200, the following description of specific features will be similar to FIGS. 2A and 2B, except where explicitly indicated. and FIG. 2B, or both may be referred to interchangeably. Specifically, FIGS. 2A and 2B illustrate an embodiment of an apparatus 200 that includes a support substrate transport mechanism 202, a wafer tape transport mechanism 204, a transfer mechanism 206, and a fixation mechanism 208. Support substrate transport mechanism 202 may be located adjacent to wafer tape transport mechanism 204 . For example, as shown, the support substrate transport mechanism 202 may extend substantially horizontally below the wafer tape transport mechanism 204 to take advantage of any effects that gravity may have on the transfer process. may be placed perpendicular to. Alternatively, the support substrate transport mechanism 202 may be oriented to extend transversely to a horizontal plane.

During a transfer operation, the transport mechanisms 202, 204 perform support substrate transport depending on various other aspects of the apparatus 200, including the amount of deflection experienced by the components during the transfer operation, as described herein below. It may be positioned such that the space between the surface of the support substrate transported by mechanism 202 and the surface of the wafer tape transported by wafer tape transport mechanism 204 may be more or less than 1 mm. In some embodiments, the opposing surfaces of each of the wafer tape and support substrate may be the most prominent structures compared to the support structures of the transport mechanisms 202, 204. That is, each of the wafer tape and supporting substrate is The distance between surfaces may be less than the distance between any of the surfaces and other opposing structural components.

As shown, in some embodiments, the transfer mechanism 206 may be vertically disposed above the wafer tape transport mechanism 204 and the fixation mechanism 208 may be vertically disposed below the support substrate transport mechanism 202. There may be cases. It is contemplated that in some embodiments, one or both of the transport mechanism 206 and the securing mechanism 208 may be oriented in a different position than that shown in FIGS. 2A and 2B. For example, the transfer mechanism 206 may be arranged to extend at an acute angle with respect to a horizontal plane. In another embodiment, the fixation mechanism 208 emits energy from the same direction of operation as the transfer mechanism 206 during the transfer process, or alternatively, from any direction and location where the fixation mechanism 208 can participate in the transfer process. It may be oriented so that

Support substrate transport mechanism 202 may be used to secure support substrate 210. As used herein, the term "support substrate" refers to wafer tape (e.g., for pre-sorting dies and creating a sorted die sheet for future use) and polymeric, translucent or other materials. - a paper or polymer substrate formed as a sheet or other non-planar shape, which may be selected from any suitable polymer, including but not limited to silicone, acrylic, polyester, polycarbonate, etc., and a circuit board (printed circuit board); (such as a PCB), a string or thread circuit that may include a pair of parallel conductive wires or "threads," and a fabric material such as cotton, nylon, rayon, or leather. Not done. Selection of materials for the support substrate may include durable materials, flexible materials, rigid materials, and other materials that allow the transfer process to be successful and maintain suitability of the support substrate for the end use. Support substrate 210 may be formed solely or at least partially from an electrically conductive material such that support substrate 210 functions as a conductive circuit for forming an article. Potential types of support substrates may further include items such as glass bottles, vehicle windows, or glass plates.

In the embodiment shown in FIGS. 2A and 2B, support substrate 210 may include circuit traces 212 disposed thereon. As shown, circuit traces 212 include a pair of adjacent trace lines separated by a trace spacing, or gap, to accommodate the distance between electrical contact terminals (not shown) on the die being transferred. May include. Accordingly, the trace spacing, or gap, between adjacent trace lines of circuit traces 212 may be sized according to the size of the die being imprinted to ensure proper connection and subsequent activation of the die. For example, circuit traces 212 may have trace spacings, or gaps, in the range of about 75-200 microns, about 100-175 microns, or about 125-150 microns.

The circuit traces 212 may be formed from conductive inks that are laid down via screen printing, inkjet printing, laser printing, manual printing, or other printing means. Additionally, the circuit traces 212 may be pre-cured, semi-dried, or dried to provide additional stability while still being activatable for die conductivity purposes. In some cases, wet conductive inks may be used to form the circuit traces 212, or a combination of wet and dry inks may be used for the circuit traces 212. Alternatively, or in addition, the circuit traces 212 may be pre-formed or photo-etched as wire traces, or may be formed from molten material into a circuit pattern that is subsequently glued, embedded, or otherwise secured to the supporting substrate 210.

Materials for circuit traces 212 may include, but are not limited to, silver, copper, gold, carbon, conductive polymers, and the like. In some embodiments, circuit traces 212 may include silver-coated copper particles. The thickness of the circuit traces 212 may vary depending on the type of material used, the intended function and appropriate strength or flexibility to achieve that function, energy capacity, size of the LED, etc. . For example, the thickness of the circuit traces may range from about 5 microns to 20 microns, about 7 microns to 15 microns, or about 10 microns to 12 microns.

Thus, in one non-limiting example, support substrate 210 is a flexible substrate on which a desired circuit pattern screen is printed using a silver-based conductive ink material to form circuit traces 212. It may also be a translucent polyester sheet.

The support substrate transport mechanism 202 may include a support substrate conveyor frame 214 for securing a support substrate holder frame 216. The structure of the support substrate holder frame 216 may vary widely depending on the type and characteristics (eg, shape, size, elasticity, etc.) of the support substrate being used. Since the support substrate 210 may be a flexible material, the support substrate 210 is attached to the support substrate holder frame 216 to create a more rigid surface on which the transfer operations described later herein are performed. It may also be held under tension. In the above example, the stiffness created by tension in the support substrate 210 may increase placement accuracy when transferring components.

In some embodiments, the use of durable or more rigid materials for support substrate 210 naturally provides a robust surface for component placement accuracy. In contrast, allowing the support substrate 210 to sag may cause wrinkles and/or other discontinuities to form in the support substrate 210, to the extent that the transfer operation may be unsuccessful. It may interfere with the

Although the means for holding the support substrate 210 may vary widely, FIG. 2 shows an embodiment of a support substrate holder frame 216 that includes two portions 216b. In the illustrated example, tension is applied to the support substrate 210 by inserting the outer periphery of the support substrate 210 between the first portion 216a and the second portion 216b, thereby firmly clamping the support substrate 210. occurs.

The supporting substrate conveyor frame 214 may be conveyed in at least three directions, two in the horizontal plane and also in the vertical direction. Conveyance may be accomplished through a system with motors, rails, and gears (none of which are shown). Thus, the support substrate holder frame 216 may be transported and held in a particular position as directed and/or programmed and controlled by the user of the apparatus 200.

Wafer tape transport mechanism 204 may be implemented to secure wafer tape 218 having die 220 (ie, a semiconductor device die) thereon. Wafer tape 218 may be transported in multiple directions via wafer tape conveyor frame 222 to a particular transport location for a transport operation. Similar to support substrate conveyor frame 214, wafer tape conveyor frame 222 may include a system with motors, rails, and gears (none of which are shown).

The unpackaged semiconductor die 220 for transfer may be very small. In fact, the height of die 220 may range from 12.5 to 200 microns, or from 25 to 100 microns, or from 50 to 80 microns.

Due to the small size of the die, when the wafer tape 218 is transported to the appropriate transfer location, the gap distance between the wafer tape 218 and the support substrate 210 is, for example, about 0.25 mm to about 1.50 mm, or It may range from about 0.50 mm to about 1.25 mm, or from about 0.75 mm to about 1.00 mm. The minimum gap spacing includes the thickness of the die to be transferred, the stiffness of the wafer tape involved, the amount of wafer tape deflection required to provide proper acquisition and release of the die, the proximity of adjacent dies, etc. May depend on factors. As the distance between the wafer tape 218 and the support substrate 210 decreases, the speed of the transfer operation may also decrease because the cycle time (described further herein) of the transfer operation decreases. Reducing the duration of such a transfer operation may therefore accelerate the transfer rate of the die. For example, the die transfer rate may range from about 6 to 250 dies per second.

Additionally, the wafer tape conveyor frame 222 may secure a wafer tape holder frame 224 that may be placed under tension to stretch and hold the wafer tape 218. As shown in FIG. 2A, wafer tape 218 may be secured within wafer tape holder frame 224 by clamping the wafer tape 218 around the wafer tape holder frame 224 between adjacent components of wafer tape holder frame 224. Such clamps help maintain the tension and elongation properties of wafer tape 218, thereby increasing the success rate of transfer operations. Considering the various characteristics of the different types/brands/quality of wafer tapes available, a particular wafer tape is selected for use based on its ability to consistently stay at the desired tension during the transfer process. obtain. In certain embodiments, the needle actuation performance profile (described further herein below) may vary depending on the tension of the wafer tape 218.

The material used for wafer tape 218 may include, for example, a material with elastic properties such as rubber or silicone. Additionally, since the temperature of the environment and the wafer tape 218 itself may cause potential damage to the wafer tape 218 during the transfer process, materials with properties that are resistant to temperature fluctuations may be advantageous. Additionally, in some embodiments, wafer tape 218 may be stretched slightly to create separations or gaps between individual dies 220 to assist in the transfer operation. The surface of wafer tape 218 may include an adhesive material that allows die 220 to be removably adhered to wafer tape 218.

Dies 220 on wafer tape 218 may include dies that are individually cut from a solid semiconductor wafer and then placed on wafer tape 218 to secure the die. In such situations, the dies may be pre-sorted and explicitly organized on the wafer tape 218, for example, to aid in the transfer operation. Specifically, the dies 220 may be arranged sequentially according to the expected order of transfer to the support substrate 210. Such pre-positioning of die 220 on wafer tape 218 may reduce the amount of movement that would otherwise occur between support substrate transport mechanism 202 and wafer tape transport mechanism 204. Additionally or alternatively, the dies on wafer tape 218 may be presorted to include only dies with substantially similar performance characteristics. In this case, the efficiency of the supply chain can be increased and therefore the travel time of the wafer tape transport mechanism 204 can be minimized.

In some embodiments, the materials used for the die may include, but are not limited to, silicon carbide, gallium nitride, coated silicon oxide, and the like. Additionally, sapphire or silicon may also be used as the die. Additionally, as noted above, "die" herein may generally represent an electrically actuatable element.

In some embodiments, the wafer tape 218 is not pre-sorted, but rather simply cuts the semiconductor directly onto the wafer die tape and leaves the die on the wafer tape without "pick-and-place". may include dies formed by sorting dies according to their respective performance qualities. In such a situation, the dies on the wafer tape may be mapped to describe the exact relative locations of dies of different quality. Therefore, in some embodiments, it may not be necessary to use a wafer tape with pre-sorted dies. In such cases, the time and amount of movement for wafer tape transport mechanism 204 to move between particular dies for each sequential transfer operation may increase. This may be caused in part by variations in the quality of the die distributed within the area of the semiconductor. That is, the die of a particular quality for the next transfer operation may not be directly adjacent to the previously transferred die. Accordingly, the wafer tape transport mechanism 204 is more sensitive than would be required for a wafer tape 218 containing dies of substantially equivalent quality to align appropriate dies of a particular quality for transfer. , the wafer tape 218 may be further moved.

Further regarding die 220 on wafer tape 218, in some embodiments, a data map of die 220 may be provided with wafer tape 218. The data map may include a digital file that provides information describing the specific quality and location of each die on wafer tape 218. The data map file can be input to a processing system in communication with apparatus 200 such that apparatus 200 is controlled/programmed to look for the correct die 220 on wafer tape 218 for transfer to support substrate 210. It is possible.

The transfer operation is performed, in part, through transfer mechanism 206, which is a die separation device to assist in separation of the die from wafer tape 218. Actuation of transfer mechanism 206 may cause one or more die 220 to be released from wafer tape 218 and captured by support substrate 210. In some embodiments, transfer mechanism 206 may operate by pressing an elongate rod, such as a pin or needle 226, against the die 220 and onto the top surface of wafer tape 218. Needle 226 may be connected to needle actuator 228. Needle actuator 228 may include a motor connected to needle 226 to drive needle 226 toward wafer tape 218 at predetermined/programmed times.

Considering the functionality of needle 226, needle 226 includes a material that is durable enough to withstand repeated, rapid, mild impacts while minimizing potential harm to die 220 upon impact. But that's fine. For example, needle 226 may include metal, ceramic, plastic, etc. Additionally, the tip of the needle 226 may have a particular shape profile that allows the needle to function repeatedly without either frequent breakage of the tip or damage to the wafer tape 218 or die 220. may affect the ability of The profile shape of the needle tip is described in more detail below with respect to FIG.

In a transfer operation, the needle 226 may be aligned with the die 220, as shown in FIG. 2A, and the needle actuator moves the needle 226 so that the die 220 is aligned with the wafer tape 218, as shown in FIG. 2B. Adjacent sides of wafer tape 218 may be pressed in positions to be aligned on opposite sides. The pressure from needle 226 may cause wafer tape 218 to flex and extend die 220 closer to support substrate 210 than an untransferred adjacent die 220. As mentioned above, the amount of deflection may vary depending on several factors such as die thickness and circuit traces. For example, if die 220 is approximately 50 microns thick and circuit traces 212 are approximately 10 microns thick, the amount of flex in wafer tape 218 may be approximately 75 microns. Thus, the die 220 can be pushed towards the support substrate 210 via the needles 226 to the extent that the die's electrical contact terminals (not shown) can join the circuit traces 212, at which point , the transfer operation proceeds to completion and the die 220 is released from the wafer tape 218.

To the extent that the transfer process may include a rapidly repeated series of steps including periodic actuation of needle 226 pressing against die 220, the method of the process is described in detail herein below with respect to FIG. Additionally, the stroke profile of actuation of needle 226 (within the context of the transfer process) is explained in more detail below with respect to FIG. 4.

Returning to FIGS. 2A and 2B, in some embodiments, the transfer mechanism 206 may further include a needle storage support 230 (also known as a pepperpot). In some embodiments, the support 230 may include a structure with a hollow space, and the needle 226 may be received by passing into the space through the opening 232 in the first end of the support 230. . Support 230 may further include at least one aperture 234 at a second opposing end of support 230. Further, the support may include a plurality of perforations near opening 234. At least one opening 234 may be sized relative to the diameter of needle 226 to receive passage of needle 226 therethrough to press against wafer tape 218 during the transfer process.

Additionally, in some embodiments, support 230 may be positioned adjacent the top surface of wafer tape 218. Thus, when needle 226 is retracted from pressing against wafer tape 218 during a transfer operation, the base surface of support 230 (having at least one opening 234 therein) contacts the top surface of wafer tape 218; Thereby, upward deflection of the wafer tape 218 can be prevented. This upward deflection may be caused if the wafer tape sticks to the tip of the needle 226 while the needle 226 at least partially penetrates the wafer tape 218 and is retracted. Thus, support 230 may reduce the time it takes to move to the next die 220. The peripheral wall shape of support 230 may be cylindrical or any other shape that can be accommodated in device 200. Thus, support 230 may be positioned between needle 226 and the top surface of wafer tape 218.

Regarding the effect of temperature on the integrity of wafer tape 218, it is contemplated that the temperature of support 230 may be adjusted to adjust the temperature of needle 226 and wafer tape 218 at least near the point of transfer operation. Accordingly, the temperature of support 230 may be heated or cooled, and the material of support 230 may be selected to maximize thermal conductivity. For example, support 230 may be formed of aluminum, or another relatively high thermal conductivity metal or equivalent material, thereby allowing temperature regulation to maintain consistent results of the transfer operation. . In some embodiments, air may be circulated within support 230 to help regulate the temperature of localized portions of wafer tape 218. Additionally or alternatively, a fiber optic cable 230a may be inserted into the needle storage support 230 and may be further opposed to the needle 226 to assist in temperature regulation of the wafer tape 218 and/or the needle 226. There is.

As mentioned above, the securing mechanism 208 may assist in securing the die 220 to the circuit traces 212 on the surface of the support substrate 210. FIG. 2B shows apparatus 200 in the transfer stage, with die 220 pressed against circuit traces 212. In some embodiments, the fixation mechanism 208 may include an energy emitting device 236 including, but not limited to, lasers, electromagnetic radiation, pressure vibrations, ultrasonic welding, and the like. In some embodiments, the use of pressure vibrations for the energy emitting device 236 uses vibrational energy forces to cause molecules in the circuit traces to fracture against molecules of the electrical contact terminals, forming a bond through the vibrational pressure. It may function by releasing . Furthermore, in some embodiments, the fixation mechanism 208 may be omitted entirely and transfer of one or more dies to the circuit substrate may occur via other means, including adhesive strength or bonding potential.

In a non-limiting example, a laser may be implemented as an energy emitting device 236, as shown in FIG. 2B. During a transfer operation, laser 236 may be activated to emit light energy of a particular wavelength and intensity directed at die 220 being transferred. The wavelength of the light of the laser 236 may be specifically selected based on the absorption of light at that wavelength for the material of the circuit traces 212 without significantly affecting the material of the support substrate 210. For example, a laser with an operating wavelength of 808 nm and operating at 5 W can be easily absorbed by silver, but not by polyester. Therefore, the laser beam may pass through the polyester substrate and affect the silver in the circuit traces. Alternatively, the wavelength of the laser may match the absorption of the circuit trace and substrate material. The focal region of laser 236 (indicated by the dashed line emanating perpendicularly from laser 236 toward support substrate 210 in FIG. 2B) is sized according to the size of the LED, e.g., a 300 micron wide region. You can decide.

Upon activation of a predetermined, controlled pulse duration of laser 236, circuit trace 212 is heated to the extent that a fused bond may be formed between the material of circuit trace 212 and electrical contact terminals (not shown) on die 220. It may begin to harden (and/or melt or soften). This bonding further assists in separating unpackaged die 220 from wafer tape 218 while simultaneously assisting in securing die 220 to support substrate 210. Additionally, laser 236 may cause some heat transfer onto wafer tape 218, thereby reducing adhesion of die 220 to wafer tape 218 and thus assisting in the transfer operation.

In other examples, the die may be heated/activated to heat/activate circuit traces thereby curing the epoxy or phase change bonding material, or to deactivate/release the die from the wafer tape, or some number of reactions. can be released and fixed to a supporting substrate in a number of ways, including using a laser or focused light (e.g. IR, UV, broadband/multispectral) with a predetermined wavelength to initiate the combination. . Additionally or alternatively, a laser or light of a particular wavelength may be used to pass through one layer of the system and interact with another layer. Additionally, a vacuum can be implemented to pull the die from the wafer tape, and air pressure can be applied to force the die onto a support substrate that potentially includes a rotating head between the die wafer tape and the support substrate. It can be implemented. In yet another example, ultrasonic vibrations may be combined with pressure to bond the die to the circuit traces.

Similar to the needle storage support 230, the securing mechanism may include a support substrate support 238 that may be disposed between the laser 236 and the bottom surface of the support substrate 210. Support 238 may include an opening 240 at its proximal end and an opening 242 at its upper end. For example, support 238 may be formed as a ring or a hollow cylinder. The support may further include structure for securing a lens (not shown) to assist in directing the laser. Laser 236 emits light through apertures 240, 242 to reach support substrate 210. Additionally, the top end of the sidewall of support 238 may be placed in direct contact with or closely adjacent the bottom surface of support substrate 210. So positioned, support 238 may help prevent damage to support substrate 210 during the stroke of needle 226 during a transfer operation. In some embodiments, during the transfer operation, a portion of the bottom surface of the support substrate 210 that is aligned with the support 238 may contact the support 238, thereby causing the die 220 being pressed by the needles 226 to contact the support 238. Provides resistance to incoming movement. Further, the support 238 may be movable in the direction of a vertical axis, and its height, including the height of the support substrate 210, can be adjusted to raise or lower the support 238 as desired. can.

In addition to the above functionality, apparatus 200 may further include a first sensor 244 from which apparatus 200 receives information regarding die 220 on wafer tape 218. Wafer tape 218 may have a bar code (not shown) or other identifier that is read or otherwise detected to determine which die to use in a transfer operation. The identifier may provide die map data to device 200 via first sensor 244.

As shown in FIGS. 2A and 2B, the first sensor 244 is located approximately 1-5 mm from the transfer mechanism 206 in the vicinity of the transfer mechanism 206 (or specifically the needle 226) to increase the accuracy of location detection. They may be spaced apart by a distance d, which may be in the range of inches. In an alternative embodiment, a first sensor 244 may be placed adjacent the tip of the needle 226 to sense the precise position of the die 220 in real time. During the transfer process, wafer tape 218 may be punctured or further stretched over time, thereby changing the previously mapped and therefore expected location of die 220 on wafer tape 218. Therefore, small changes in the elongation of wafer tape 218 could result in significant errors in the alignment of die 220 being transferred. Therefore, real-time sensing may be implemented to assist in accurate die positioning.

In some embodiments, first sensor 244 may be able to identify the exact location and type of die 220 being sensed. This information may be used to provide instructions to wafer tape conveyor frame 222 indicating the exact location where wafer tape 218 should be transported to perform the transfer operation. Sensor 244 may be one of many types of sensors or a combination of sensor types to better perform multiple functions. Sensor 244 may include an optical sensor, such as, but not limited to, a laser range finder, or a high resolution optical camera with micro-photography capabilities.

Additionally, in some embodiments, a second sensor 246 may also be included in device 200. A second sensor 246 may be positioned relative to the support substrate 210 to detect the precise location of the circuit trace 212 on the support substrate 210. This information is then used to determine any positional adjustments necessary to align support substrate 210 between transfer mechanism 206 and fixation mechanism 208 so that the next transfer operation occurs at the correct location on circuit trace 212. can be used to determine. This information may be further relayed to apparatus 200 to coordinate transporting support substrate 210 to the correct position while simultaneously communicating instructions to wafer tape conveyor frame 222. A variety of sensors are also contemplated for sensor 246, including optical sensors, such as one non-limiting example of a high resolution optical camera with micro-photography capabilities.

2A and 2B further illustrate that first sensor 244, second sensor 246, and laser 236 may be grounded. In some embodiments, first sensor 244, second sensor 246, and laser 236 may all be grounded to the same ground (G) or different grounds (G).

Depending on the type of sensor used for the first and second sensors 244, 246, the first or second sensor may be able to further test the functionality of the transferred die. Alternatively, additional tester sensors (not shown) may be incorporated into the structure of apparatus 200 to test individual dies prior to removing support substrate 210 from apparatus 200.

Additionally, in some examples, a machine may be implemented with multiple independently actuatable needles and/or lasers to transfer and fix multiple dies at a given time. The multiple needles and/or lasers may be independently movable in three-dimensional space. The transfer of multiple dies may occur synchronously (several needles are lowered at the same time) or simultaneously, but not necessarily synchronously (e.g., one needle is lowered while the other is raised). one needle is lowered, this configuration allows the components to be better balanced and vibrations to be minimized). Control of the needles and/or lasers may be adjusted to avoid collisions between components. Furthermore, in other examples, multiple needles and/or lasers may be placed in fixed positions relative to each other.

Exemplary Needle Tip Profile As previously mentioned, the profile shape of the needle tip 300 is described with respect to FIG. 3, which shows a schematic exemplary profile shape of the tip 300. In some embodiments, the distal end 300 may be defined as the end of a needle that includes a tapered portion 304, a corner 306, and a sidewall 302 adjacent the proximal end 308, which may extend laterally to the opposite side of the needle. . The particular size and shape of tip 300 may vary depending on, for example, the size of die 220 being transferred and factors in the transfer process such as the speed and impact force of the transfer operation. For example, the angle θ seen in FIG. 3, measured between the longitudinal direction of the central axis of the needle and the tapered portion 304, may be in the range of approximately 10-15°, and the radius r of the angle 306 is The width w of the proximal end 308 may range from about 0 to 100+ microns, where w is less than or equal to the width of the die 220 being transferred. The height h of the tapered portion 304 may be in the range of approximately 1-2 mm, where h may be greater than the distance traveled by the needle during the stroke of the transfer operation. , the diameter d of needle 226 may be approximately 1 mm.

Other needle tip profiles are contemplated and may have different advantages depending on various factors related to the transfer operation. For example, the needle tip 300 may be blunter to reflect the width of the die, or more pointed to press within a smaller area of the wafer tape. In some embodiments, transfer mechanism 206 may implement more than one needle. In such cases, the two or more needles may have substantially similar needle profiles, or they may have substantially different needle profiles. For example, transfer mechanism 206 may include one or more needles 226 having the needle tip profile described and illustrated with respect to FIG. The transfer mechanism further includes one or more needles 226 having substantially different needle tip profiles (i.e., wider than the illustrated and described needle tip profiles or narrower than the illustrated and described needle tip profiles). But that's fine. In some embodiments, the needle profile may not include any taper to a point such that the needle 226 includes a constant width along the entire length of the needle 226.

Exemplary Needle Actuation Performance Profile An embodiment of a needle actuation performance profile is shown in FIG. That is, FIG. 4 illustrates an example of a stroke pattern performed during a transfer operation by displaying the height of the needle tip relative to the plane of the wafer tape 218 as the wafer tape 218 changes over time. Therefore, the "0" position in FIG. 4 may be the top surface of wafer tape 218. Additionally, needle idle time and needle ready time are changes in the programmed process or period between transferring a first die and the time it takes to reach a second die for transfer. The dashed lines shown for the idle and ready phases of the stroke pattern are approximate times and indicate that the periods may be longer or shorter, as they may vary depending on the stroke pattern. Additionally, while the solid lines shown for the use of a laser are exemplary times for embodiments shown herein, the actual duration of the laser on and off times may vary depending on the material used in forming the circuit. (e.g. choice of circuit trace material), type of support substrate, desired effect (pre-fused circuit trace, partial bond, full bond, etc.), distance of the laser from the bond point (i.e. top surface of the support substrate), It should be understood that this may vary depending on the size of the die being imprinted and the laser power/intensity/wavelength, etc. Accordingly, the following description of the profile shown in FIG. 4 may be an exemplary embodiment of a needle profile.

In some embodiments, prior to the transfer operation, the fully retracted needle tip may idle approximately 2000 μm above the surface of the wafer tape. After various amounts of time, the needle tip can rapidly lower and come to rest approximately 750 μm above the surface of the wafer tape in a ready state. After another indeterminate amount of time in the ready state, the needle tip descends again and contacts the die, pushing the wafer tape down with the die to a height of about −1000 μm, where it transfers the die to the supporting substrate. obtain. The vertical dotted line at the beginning of the laser-on section indicates that the laser may be turned on at some point between the beginning of the descent from the ready phase and the bottom of the needle tip stroke. For example, the laser may be on about 50% of the way down. In some embodiments, by turning on the laser early, such as before the needle begins to descend, the circuit traces may begin to soften before contacting the die to form a stronger bond; , the die wafer may be affected or prepared during this time. The laser on phase may last approximately 20 ms ("milliseconds"). At the bottom of the stroke, when the laser is on, that phase may be the bonding phase between the die and the support substrate. This bonding phase allows the circuit traces to attach to the die contacts and harden immediately after the laser is turned off. Thus, the die may be bonded to a supporting substrate. The bonding phase may last approximately 30ms. The laser can then be turned off and the needle can be quickly raised to the ready phase. Conversely, the laser can be turned off before the needle begins to rise, or at some point during the needle tip's return to the ready phase. After the needle tip rises to the ready phase, the needle tip height may overshoot and bounce slightly buoyant below the ready phase height. Some of the buoyancy may be due to the speed at which the needle tip rises to the ready phase, but the speed and buoyancy are the same as the wafer tape in the case that the needle penetrates the wafer tape and may become stuck there. may be intentional to assist in retracting the needle tip from the surface of the needle.

As shown in FIG. 4, the timing when the laser is off can be longer than the timing when the laser is on, a slower rate of fall may help prevent damage to the die, and as previously mentioned, a faster rate of rise may help more effectively extract the needle tip from the wafer tape. Nonetheless, as previously mentioned, the timings shown in FIG. 4 are approximate, particularly with respect to the idle and ready periods. Thus, the numerical values assigned along the bottom edge of FIG. 4 are for reference only and should not be taken literally unless otherwise noted.

Exemplary Support Substrate FIG. 5 shows an exemplary embodiment of a fabricated support substrate 500. Support substrate 502 may include a first portion of circuit trace 504A that can function as a negative or positive power terminal when power is applied thereto. A second portion of circuit trace 504B may extend adjacent to the first portion of circuit trace 504A and may function as a corresponding positive or negative power terminal when power is applied thereto.

As also discussed above with respect to wafer tape, the support substrate 502 is provided with a bar code (not shown) that is read or otherwise detected to determine where to transport the support substrate 502 to perform a transfer operation. ) or other identifiers. The identifier may provide circuit trace data to the device. Support substrate 502 may further include reference points 506. Reference points 506 provide visual indicators for sensing by a supporting substrate sensor (e.g., second sensor 246 in FIG. 2) to locate the first and second portions of circuit traces 504a, 504b. It may be. Once the reference point 506 is sensed, the shape and relative position of the first and second portions of the circuit traces 504A, 504B with respect to the reference point 506 may be determined based on pre-programmed information. Using the sensed information in conjunction with the pre-programmed information, the support substrate transport mechanism may transport the support substrate 502 to the proper alignment position for the transfer operation.

Additionally, die 508 is shown in FIG. 5 as spanning between first and second portions of circuit traces 504A, 504B. In this manner, electrical contact terminals (not shown) of die 508 can be contacted to support substrate 502 during the transfer operation. Accordingly, power may be applied to run between the first and second portions of circuit traces 504A, 504B, thereby powering die 508. For example, the die may be an unpackaged LED transferred directly from a wafer tape to circuit traces on the support substrate 502. The support substrate 502 can then be processed to complete the support substrate 502 and used in circuits or other final products. Additionally, other components of the circuit may be added by the same or other transcription means to create a complete circuit, either as one or more groups in some static or programmable or adaptable manner. Control logic may be included to control the LEDs.

Simplified Exemplary Direct Transfer System A simplified example of an embodiment of a direct transfer system 600 is shown in FIG. Transfer system 600 may include a personal computer (PC) 602 (or server, data input device, user interface, etc.), a data store 604, a wafer tape mechanism 606, a support substrate mechanism 608, a transfer mechanism 610, and a fixation mechanism 612. good. A more detailed description of the wafer tape mechanism 606, support substrate mechanism 608, transfer mechanism 610, and fixation mechanism 612 has been provided above, so specific details regarding these mechanisms will not be repeated here. However, a brief description of how wafer tape mechanism 606, support substrate mechanism 608, transfer mechanism 610, and fixation mechanism 612 relate to the interaction between PC 602 and data store 604 is provided below. do.

In some embodiments, the PC 602 communicates with the data store 604 to directly transfer the die from a wafer tape in a wafer tape mechanism 606 onto a support substrate in a support substrate mechanism 608 using a transfer mechanism 610. Having received the information and data useful for the transfer process, at support substrate mechanism 608, the die may be secured onto the support substrate through actuation of a laser or other energy emitting device positioned at securing mechanism 612. . PC 602 may function as a receiver, compiler, organizer, and controller for data relayed to and from each of wafer tape mechanism 606, support substrate mechanism 608, transfer mechanism 610, and fixation mechanism 612. PC 602 may also receive information directed by a user of transcription system 600.

It should be noted that FIG. 6 shows directional movement capability arrows adjacent to the wafer tape mechanism 606 and support substrate mechanism 608, which arrows simply indicate the general direction of mobility; It is contemplated that both substrate features 608 may also be capable of movement in other directions, including, for example, in-plane rotation, pitch, roll, and yaw.

Additional details of the interaction of the components of transfer system 600 are described below with respect to FIG.

Detailed Exemplary Direct Transfer System A schematic diagram of the communication paths between each element of transfer system 700 may be described as follows.

The direct transcription system may include a personal computer (PC) 702 (or server, data input device, user interface, etc.) that may receive communications from and provide communications to the data store 704. PC 702 may further communicate with a first cell manager 706 (denoted as "Cell Manager 1") and a second cell manager 708 (denoted as "Cell Manager 2"). Accordingly, PC 702 may control and synchronize instructions between first cell manager 706 and second cell manager 708.

PC 702 may include processor and memory components upon which instructions may be executed to perform various functions with respect to first and second cell managers 706 , 708 and data store 704 . In some embodiments, PC 702 may include a project manager 710 and a needle profile definer 712.

A project manager 710 receives input from first and second cell managers 706, 708 and data store 704 to orchestrate the direct transfer process and orient and align the support substrate relative to the wafer tape and die thereon. can maintain smooth functioning.

The needle profile definer 712 may include data regarding a needle stroke performance profile, where the needle stroke performance profile determines the desired needle stroke according to a particular die on the loaded wafer tape and the pattern of circuit traces on the support substrate. Can be used to direct transcription mechanisms regarding performance. Additional details of needle profile definer 712 are described further herein below.

Returning to data store 704, data store 704 may include memory containing data such as a die map 714 that may be specific to the wafer tape loaded into the wafer tape mechanism. As previously discussed, the die map may describe the relative location of each die on the wafer tape and its quality for the purpose of providing a pre-organized description of the location of a particular die. Additionally, data store 704 may also include memory that includes circuit CAD files 716. Circuit CAD file 716 may include data regarding specific circuit trace patterns on the loaded support substrate.

Project manager 710 may receive die map 714 and circuit CAD file 716 from data store 704 and may relay the respective information to first and second cell managers 706, 708, respectively.

In some embodiments, first cell manager 706 may use die map 714 from data store 704 via die manager 718. More specifically, die manager 718 may compare die map 714 to information received by sensor manager 720 and, based thereon, may provide instructions to motion manager 722 regarding the location of a particular die. Sensor manager 720 may receive data from die detector 724 regarding the actual location of the die on the wafer tape. Sensor manager 720 may direct die detector 724 to look for a particular die at a particular location according to die map 714 . Die detector 724 may include a sensor such as second sensor 244 of FIGS. 2A and 2B. Based on the received data of the actual location of the die on the wafer tape (either a confirmation or an update regarding a change in position), the motion manager 722 directs the first robot 726 (denoted as "Robot 1") to move the wafer tape onto the wafer tape. may be instructed to transport the transfer mechanism to a position for alignment with the needle of the transfer mechanism.

Upon reaching the indicated location, first robot 726 may communicate completion of its movement to needle control board manager 728. Additionally, needle control board manager 728 may communicate directly with PC 702 to coordinate performance of transfer operations. Upon execution of a transfer operation, the PC 702 can instruct the needle control board manager 728 to activate the needle actuator/needle 730, thereby causing the needle to be exposed to the loaded needle in the needle profile definer 712. Make the stroke execute according to the profile. The needle control board manager 728 can also activate the laser control/laser 732, thereby directing the laser toward the support substrate as the needle pushes the die down through the wafer tape to perform the transfer operation. Emit a beam. As mentioned above, laser control/activation of laser 732 can occur before, simultaneously with, during, or after needle stroke activation, ie, complete actuation.

Therefore, the first cell manager 706 can: determine where to tell the first robot 726 to go; direct the first robot 726 to go to the determined location; Multiple states may be passed through, including turning on, activating the fixation device, and resetting.

Prior to performing the transfer operation, project manager 710 may relay data in circuit CAD file 716 to second cell manager 708. Second cell manager 708 may include a sensor manager 734 and a motion manager 736. Using the circuit CAD file 716, the sensor manager 734 causes the substrate alignment sensor 738 to locate a reference point on the support substrate, thereby detecting the support substrate according to the location of the circuit trace thereon; It can be instructed to orient. Sensor manager 734 may receive confirmation or updated location information of the circuit trace pattern on the support substrate. Sensor manager 734 transmits motion signals to a second robot 740 (denoted as "Robot 2") to convey the support substrate to an alignment position (i.e., a transfer fixation position) for performing a transfer operation. May coordinate with manager 736. Accordingly, the circuit CAD file 716 may assist the project manager 710 in aligning the support substrate relative to the wafer tape so that the die can be accurately transferred to the circuit traces thereon.

Accordingly, the second cell manager 708 is responsible for: determining where to direct the second robot 740 to go; directing the second robot 740 to go to the determined location; and It may pass through multiple states, including resetting.

It should be appreciated that additional and alternative communication paths between all or less than all of the various components of transfer system 700 described above are possible.

Exemplary Direct Transfer Method A method 800 for performing a direct transfer process in which one or more dies are transferred directly from a wafer tape to a supporting substrate is shown in FIG. The steps of method 800 described herein may not be in any particular order and, therefore, may be performed in any satisfactory order to achieve a desired product condition. Method 800 may include loading transcription process data into a PC and/or data store 802. The transfer process data may include data such as die map data, circuit CAD file data, needle profile data, and the like.

Loading wafer tape into wafer tape conveyor mechanism 804 may also be included in method 800. Loading the wafer tape conveyor mechanism with wafer tape may include controlling the wafer tape conveyor mechanism to move to a loading position, also known as an extraction position. The wafer tape may be secured with a wafer tape conveyor mechanism in a loading position. The wafer tape may be loaded with the semiconductor die facing downwardly toward the supporting substrate conveyor mechanism.

Method 800 may further include preparing a support substrate for loading onto support substrate conveyor mechanism 806. Preparing the support substrate may include screen printing circuit traces on the support substrate according to a pattern in a CAD file that is loaded into a PC or data store. Additionally, fiducials may be printed on the circuit substrate to aid in the transfer process. The support substrate conveyor mechanism may be controlled to move to a loading position, also known as an extraction position, where support substrates may be loaded onto the support substrate conveyor mechanism. The support substrate may be loaded such that the circuit traces face the die on the wafer. In certain embodiments, for example, the support substrate may be delivered and placed at the loading position by a conveyor (not shown) or other automated mechanism, for example in the style of an assembly line. Alternatively, the support substrate may be loaded manually by an operator.

Once the support substrate has been properly loaded into the wafer tape support substrate conveyor mechanism, a method for controlling the direct transfer of die from the wafer tape to the circuit traces on the support substrate. A program may be executed via a PC to initiate the direct transfer operation 808. Details of the direct transfer operation will be explained below.

Exemplary Direct Transfer Operation Method A method of direct transfer operation in which a die is directly transferred from a wafer tape (or other substrate-carrying die, also referred to as a "die substrate" for the simplified illustration of FIG. 9) to a supporting substrate. 900 is shown in FIG. The steps of method 900 described herein may not be in any particular order and, therefore, may be performed in any satisfactory order to achieve a desired product condition.

To determine which die to place on the support substrate and where to place the die on the support substrate, the PC identifies the support substrate and the die substrate containing the die to be transferred. Input may be received 902 regarding. This input may be entered manually by the user, or the PC may send a request to the cell manager that controls the support substrate alignment sensor and die detector, respectively. The request may instruct the sensor to scan the loaded substrate for an identification marker such as a barcode or QR code, and/or the request may instruct the sensor to scan the loaded substrate for an identification marker such as a barcode or QR code. The detector may be instructed to scan the die substrate.

Using the support substrate identification input, the PC may query a data store or other memory to match identification markers on each of the support substrate and die substrate and retrieve associated data files 904. Specifically, the PC may retrieve a circuit CAD file associated with the support substrate that describes the pattern of circuit traces on the support substrate. The circuit CAD file may further include data such as the number of dies transferred to the circuit traces, their relative positions, and their respective quality requirements. Similarly, the PC may retrieve a die map data file associated with the die substrate that provides a map of the relative location of a particular die on the die substrate.

In the process of performing the transfer of the die to the support substrate, the PC may determine the initial orientation of the support substrate and die substrate relative to the transfer and fixation mechanisms. Within step 906, the PC may instruct the substrate alignment sensor to locate a reference point on the supporting substrate. As explained above, fiducial points may be used as fiducial markers to determine the relative location and orientation of circuit traces on a support substrate. Additionally, the PC may instruct the die detector to locate one or more fiducial points on the die substrate to determine the outline of the die.

Once the initial orientation of the support substrate and die substrate is determined, the PC transfers the support substrate and die substrate to the respective support substrate transport mechanism and die substrate transport mechanism, respectively. may be directed to the alignment position.

The alignment step 908 may include determining 910 the location of the portion of the circuit trace to which the die will be transferred, and determining 912 where the portion will be positioned relative to the transfer fixation location. The transfix position may be considered an alignment point between the transfer mechanism and the fixation mechanism. Based on the data determined in steps 910 and 912, the PC transports the support substrate to the support substrate transport mechanism to align 914 the portion of the circuit trace to which the die will be transferred with the transfer fixation position. I can instruct you to do so.

The alignment step 908 may further include determining 916 which die on the die substrate is to be transferred and determining 918 where the die is positioned relative to the transfer fixing location. Based on the data determined in steps 916 and 918, the PC may instruct the wafer tape transport mechanism to transport the die substrate to align 920 the die to be transferred with the transfer fixation location.

and when the die to be transferred from the die substrate and the portion of the circuit trace to which the die is transferred are aligned with the transfer mechanism and the fixation mechanism to effectuate transfer of the die from the die substrate to the support substrate. At 922, the needle and fixation device (eg, laser) may be activated.

After the die is transferred, the PC may decide 924 whether to transfer additional dies. If another die is to be transferred, the PC may return to step 908 and readjust the product and die substrate accordingly for subsequent transfer operations. If there are no more dies to transfer, the transfer process ends 926.

Exemplary Direct Transfer Conveyor/Assembly Line System In one embodiment described with respect to FIG. 10, some of the components of the direct transfer apparatus described above may be implemented in a conveyor/assembly line system 1000 (hereinafter "conveyor system"). Specifically, FIGS. 2A and 2B show the support substrate 210 being held by a support substrate conveyor frame 214 and tensioned by a support substrate holder frame 216. Instead of fixing the support substrate conveyor frame 214 in a confined area via a system having motors, rails, and gears, as shown with respect to the apparatus 200, FIG. 10 shows the support substrate conveyor frame 214 being transported through a conveyor system 1000 where the support substrate passes through an assembly line style process. As the actual transport means between operations performed on the transported support substrate, the conveyor system 1000 may include a series of tracks, rollers, and belts 1002 and/or other handling devices to sequentially transport multiple support substrate conveyor frames 214, each of which holds a support substrate.

In some embodiments, the operating stations of conveyor system 1000 may include one or more printing stations 1004. When the blank support substrate is transported to printing station(s) 1004, circuit traces may be printed thereon. If multiple printing stations 1004 are present, the multiple printing stations 1004 can be arranged in series and each configured to perform one or more printing operations to form a complete circuit trace. I can do it.

Additionally, in conveyor system 1000, supporting substrate conveyor frame 214 may be transported to one or more die transfer stations 1006. If multiple die transfer stations 1006 are present, the multiple die transfer stations 1006 can be arranged in series and each configured to perform one or more die transfers. At the transfer station(s), the support substrate is transferred and secured thereto via a transfer operation using one or more of the direct transfer device embodiments described herein. can be done. For example, each transfer station 1006 may include a wafer tape transport mechanism, a transfer mechanism, and a fixation mechanism. In some embodiments, the circuit traces may be pre-prepared on the support substrate, and thus the support substrate may be transported directly to one or more transfer stations 1006.

At the transfer station 1006, the wafer tape transport mechanism, transfer mechanism, and fixation mechanism may be aligned relative to the transported support substrate conveyor frame 214 upon entering the station. In this situation, components of the transfer station 1006 may repeatedly perform the same transfer operation at the same relative position on each support substrate as the multiple support substrates are conveyed through the conveyor system 1000.

Additionally, conveyor system 1000 may further include one or more finishing stations 1008 that may transport support substrates for final processing to occur. The type, amount, and duration of final processing may depend on the characteristics of the product and the properties of the materials used in its manufacture. For example, the supporting substrate may receive additional curing time, protective coatings, additional components, etc. at finishing station(s) 1008.

Second Exemplary Embodiment of a Direct Transfer Device In another embodiment of a direct transfer device, a “light string” may be formed, as seen in FIGS. 11A and 11B. Although many of the features of the apparatus 1100 may remain substantially similar to those of the apparatus 200 of FIGS. 2A and 2B, as shown in FIGS. 11A and 11B, the substrate transport mechanism 1102 210 may be configured to transport a different support substrate 1104. Specifically, in FIGS. 2A and 2B, support substrate transport mechanism 202 includes a support substrate conveyor frame 214 and a tensioner frame 216 that secure sheet-like support substrate 218 under tension. However, in the embodiment of FIGS. 11A and 11B, the support substrate transport mechanism 1102 may include a support substrate reel system.

The support substrate reel system may include one or two circuit trace reels 1106 wound with “string circuits,” which include a pair of conductive strings or wires wound adjacently as the support substrate 1104. May include. If there is only one reel, the reel 1106 may be positioned on a first side of the transfer location, and the pair of conductive strings (1104) may be wrapped around the single reel 1106. Alternatively, there may be two circuit trace reels 1106 positioned on a first side of the transfer location, where each reel 1106 includes a single strand of string circuitry, and the strands then are grouped together to pass through the transfer location.

Regardless of whether one reel 1106 or two reels 1106 are implemented, the die transfer process to form the string circuit may be substantially similar in each case. Specifically, conductive strings of support substrate 1104 may be threaded across the transfer location from reel(s) 1106 and fed to finishing device 1108. In some embodiments, the finishing device 1108 may include, for example, a coating device for receiving a translucent or transparent plastic protective coating, or a curing device that may finish curing the string circuit as part of the final processing of the product. It may be a device. Additionally or alternatively, the circuit string may be fed onto a separate reel on which the string circuit may be wound prior to final processing of the string circuit. As the conductive strings of support substrate 1104 are pulled through the transfer location, transfer mechanism 206 is actuated to transfer die 220 to the support substrate such that the electrical contact terminals of die 220 are each disposed over an adjacent string. A needle stroke to transfer to the conductive strings of material 1104 can be performed (as described above) and locking mechanism 208 can be actuated to lock die 220 in place.

Additionally, the apparatus 1100 may include tension rollers 1110 on which the conductive strings of the support substrate 1104 may be supported and further tensioned. Accordingly, tension roller 1110 may help maintain tension within the formed string circuit to enhance die transfer accuracy.

In FIG. 11B, die 220 is shown transferred to the conductive strings of support substrate 1104, thereby coupling (to some degree) the conductive strings of support substrate 1104 to form a string circuit.

Third Exemplary Embodiment of Direct Transfer Apparatus As seen in FIG. 12, in an additional embodiment of a direct transfer apparatus, apparatus 1200 may include a wafer tape transport mechanism 1202. Specifically, instead of the wafer tape conveyor frame 222 and wafer tape holder frame 224 shown in FIGS. 2A and 2B, the wafer tape transport mechanism 1202 transports the die 220 through the transfer location of the apparatus 1200 to unify the die. The system may include one or more reels 1204 for transferring to a substrate. Specifically, each reel 1204 may include a die substrate 1206 formed as a narrow continuous elongated strip with dies 220 attached successively along the length of the strip.

If a single reel 1204 is used, the transfer operation may use motors, tracks, and gears to transport the support substrate 210 through the support substrate transport mechanism 202 substantially as described above. May include. However, the wafer tape transport mechanism 1202 may continuously feed the die 220 through the transport position by unwinding the die substrate 1206 from the reel 1204, while the reel 1204 itself remains primarily in a fixed position. It may include a mechanism that is substantially static in that it is static. In some embodiments, tension in die substrate 1206 may be maintained by a tension reel 1210, which may be placed on the side of apparatus 1200 opposite tension roller 1208 and/or reel 1204 for stability purposes. Tension reel 1210 may wind up die substrate 1206 after the die has been transferred. Alternatively, tension is maintained by any other suitable means for securing the die substrate 1206 to assist in pulling the die substrate through the transfer location and cycling the die 220 after each transfer operation. may be done.

In some embodiments where multiple reels 1204 are used, each reel 1204 may be positioned laterally adjacent to other reels 1204. Each reel 1204 may be paired with a particular transfer mechanism 206 and a particular fixation mechanism 208. In this case, each respective set of transfer mechanisms and fixation mechanisms may be positioned relative to the support substrate 210 such that multiple dies may be placed simultaneously at multiple locations on the same support substrate 210. For example, in some embodiments, each transfer location (i.e., the alignment between the transfer feature and the corresponding fixation feature) may be in-line, offset, or staggered to accommodate various circuit trace patterns. There may be.

Regardless of whether one reel 1204 or multiple reels 1204 are implemented, the die transfer operation is relatively similar to the transfer operation described above with respect to the first exemplary embodiment of apparatus 200. can be similar to For example, support substrate 210 may be transported to a transfer position (die fixation position) in the same manner as described above via support substrate transport mechanism 202, and transfer mechanism(s) 206 may perform a needle stroke to Die 220 may be transferred from die substrate 1206 to support substrate 210 and securing mechanism 208 may be actuated to assist in securing die 220 to support substrate 210.

Note that in some embodiments having multiple reels 1204, the circuit trace pattern may be such that it is not necessary to operate all transfer mechanisms at the same time. Accordingly, multiple transfer mechanisms may be operated intermittently as the support substrate is transported to various locations for transfer.

Fourth Exemplary Embodiment of Direct Transfer Apparatus FIG. 13 shows an embodiment of a direct transfer apparatus 1300. As in FIGS. 2A and 2B, support substrate transport mechanism 202 may be positioned adjacent to wafer tape transport mechanism 204. However, there is a space between transport mechanisms 202, 204 in which transport mechanism 1302 can be placed to effectuate the transfer of die 220 from wafer tape 218 to support substrate 210.

Transfer mechanism 1302 may include a collet 1304 that picks dies 220 one or more at a time from wafer tape 218 and rotates about axis A that extends through arm 1306. For example, FIG. 13 shows collet 1304 pivoting 180 degrees about pivot point 1308 (see directional pivot arrow) between the die transport surface of wafer tape 218 and the transfer surface of support substrate 210. Wafer tape 218 is shown facing support substrate 210 as shown. That is, the direction of elongation of collet 1304 pivots in a plane perpendicular to the surface or plane of the transfer of both wafer tape 218 and support substrate 210. Alternatively, in some embodiments, the collet arm structure may be arranged to pivot between two parallel surfaces, with the collet arms pivoting along parallel planes. obtain. Thus, when collet 1304 is facing wafer tape 218 , it can pick die 220 and immediately pivot onto the surface of support substrate 210 into alignment with fixation mechanism 208 . Collet 1304 releases die 220 to transfer die 220 which is then secured to circuit traces 212 on support substrate 210.

In some embodiments, the transfer mechanism 1302 may include two or more collets (not shown) extending in different directions from the arm. In such embodiments, the collet may be indexed through a 360 degree rotation through the collet stop locations to pick and transfer the die each time the collet passes the wafer tape 218.

Additionally, one or more collets 1304 may pick and release die 220 from the wafer tape using positive and negative vacuum pressure through the collets 1304.

First Exemplary Embodiment of Direct Transfer Device with Fine Adjustment Assembly FIG. 14 shows an embodiment of a direct transfer device 1400. In the illustrated embodiment, a fine adjustment mechanism 1402 is attached to a wafer tape transport mechanism 1404, which may assist in transferring semiconductor device die 220 directly from wafer tape 218 to support substrate 210. Many features of the transfer apparatus 1400 may remain substantially similar to those of the apparatus 200 of FIGS. 2A and 2B, but with minor adjustments to the orientation and/or position of the wafer tape 218 and die 220 during the die transfer process. Several differences are noted herein, including the implementation of a fine adjustment feature 1402 that adds a This will be explained below with respect to FIG.

In summary, the transfer apparatus 1400 may include a support substrate transport mechanism 202 (also shown with respect to FIGS. 2A and 2B) and a wafer tape transport mechanism 1404. The wafer tape transport mechanism 1404 is generally functionally similar to the wafer tape transport mechanism 204 since it includes a wafer tape conveyor frame 1406 and a wafer tape holder frame 1408. Generally, the support substrate transport mechanism 202 and the wafer tape transport mechanism 1404 may be described herein as mechanisms providing "coarse motion" since they generally move for larger movements (compared to fine movements) between successive die transport locations. However, as noted above, the wafer tape transport mechanism 1404 in the embodiment of FIG. 14 includes a fine adjustment mechanism 1402, which will be described in detail below. The coarse motion mechanism is believed to be suitable for larger macro movements (e.g., about 1-2 mm or more), although the coarse motion mechanism may be used to adjust between transfer locations on a smaller scale as needed, including micro distances. Therefore, implementing a fine adjustment mechanism in conjunction with the coarse transport mechanism may be advantageous in some situations. For example, a fine adjustment may be performed in addition to the coarse if the coarse transport mechanism overshoots the transfer location, undershoots the transfer location, or wobbles near the transfer location due to a stop from the coarse motion, resulting in slight misalignment of the transfer, for example, on a microscopic scale.

Fine adjustment mechanism 1402 works in conjunction with cell manager 706 (FIG. 7) to provide real-time fine adjustment to align and/or more closely align support substrate 210 and die 220 during the die transfer process. It can be executed. In some embodiments, the transfer device 1400 may be used for different purposes, including compensating for vibrational motion after stopping moving components, and/or adjusting the speed of movement of the transport mechanism 202, 1404 for subsequent die transfer. Fine tuning may be performed for the purpose of speeding up the overall die transfer operation by slowing down (rather than completely stopping with each transfer operation) before the die transfer operation.

For example, in one aspect, the fine adjustment mechanism 1402 compensates for position errors caused by vibrations due to starting and/or stopping transport of the wafer tape conveyor frame 1406. The die transfer rate may range from about 6 to 450 or more dies per second. Generally, as transfer speeds increase, the mechanical complexity and weight of the transport device may also increase. Accelerating the velocity of the moving masses and accelerating the transfer rate may collectively add to the vibrations of the system components as those masses rapidly accelerate and then abruptly stop. The settling time required to dissipate vibrations can introduce time-related inefficiencies in die transfer. In certain embodiments, fine tuning of the wafer tape holder frame 1408 may increase system efficiency by counteracting vibrations that affect the relative positions of the dies and reducing or eliminating settling time of the wafer tape transport mechanism 1404.

In some embodiments, the fine adjustment is such that the wafer tape transport mechanism 1404 continues to move continuously without repeating starts and stops as the wafer tape transport mechanism 1404 moves from one transfer location to the next. This may be done to improve system efficiency by allowing die 220 to be transferred to support substrate 210 while tape holder frame 1408 is in motion.

Considering the structure of the device, FIG. 15A shows an isometric view of a fine adjustment mechanism 1500 (hereinafter "fine adjustment mechanism 1500") according to one embodiment. The fine adjustment mechanism 1500 includes an actuator 1502, an actuator flange 1504 having a support arm 1504A to which the actuator 1502 can be fixed, and a wafer support block 1506 for fixing a wafer tape holder frame 1408 for holding a wafer tape 218. One or more spring members 1508 connecting wafer support block 1506 and actuator flange 1504 may be included. In some embodiments not shown, actuator flange 1504 may connect directly or indirectly with wafer tape holder frame 1408. Fine adjustment mechanism 1500 may be secured to wafer tape conveyor frame 1406 (as shown in FIG. 14) such that fine adjustment mechanism 1500 moves with wafer tape conveyor frame 1406 to position wafer tape 218. Make small independent adjustments to the

According to one embodiment, actuator 1502 may include an elongated rod that may be attached to actuator flange 1504 using actuator bracket assembly 1510. Actuator bracket assembly 1510 may include one or more fastening means, such as, for example, socket bolts, latches, clips, welds, and the like. Fine adjustment mechanism 1500 may include a plurality of through holes 1512 located in actuator flange 1504 for attaching fine adjustment mechanism 1500 to wafer tape conveyor frame 1406 with suitable fasteners (not shown). .

Actuator 1502 is positioned on actuator flange 1504 such that, when assembled, the body of actuator 1502 is slidable in one direction relative to a surface along actuator flange 1504. However, actuator 1502 remains in a fixed orientation with respect to its distance from actuator flange 1504 and direction of extension along actuator flange 1504. Although the actuator 1502 is shown as a cylindrical body bolted to the actuator flange 1504 using socket bolts through an actuator bracket assembly 1510, it may take many shapes other than the cylindrical shape shown in FIG. 15A. It should be appreciated that actuator flange 1504 and actuator 1502 may be secured to actuator flange 1504 in any manner such that actuator flange 1504 and actuator 1502 operate as a single unit with respect to each other.

Actuator 1502 may be a piezoelectric actuator. Piezoelectric actuators (also called piezoelectric transducers, translators, etc.) convert electrical energy into linear motion. Alternatively, actuator 1502 may include a motion control actuator other than a piezoelectric actuator that may be configured for fast and precise movement. Exemplary alternative actuators include linear motors, servo or stepper motors with ball screws, voice coils, and the like. For example, using a piezoelectric actuator, the actuator 1502 causes the actuator 1502 to be in contact with the wafer support block 1506 when a signal stimulus is applied via an electrical connector 1514 located at a second end of the actuator 1502. A relatively large pushing force (eg, 1000+N) may be applied to the first end.

Actuator 1502 may connect to one or more system controllers via electrical connector 1514. As discussed above with respect to FIG. 7, several system controls may be configured to control actuator 1502. The system controller may control operational aspects of the actuator 1502, including the stroke distance of the first end of the actuator 1502 based on the signal stimulus. Exemplary controller systems may be, for example, a sensor manager 720, a motion manager 722, a sensor manager 734, and/or a motion manager 736, as shown with respect to FIG.

Those skilled in the art of electromechanical control systems will appreciate that the response of an actuator can routinely be controlled via a single-channel or multi-channel controller system in conjunction with one or more signal amplifiers. According to an embodiment, actuator 1502 is controllable such that a first end of actuator 1502, when actuated, moves the position of wafer tape holder frame 1408, and thus wafer tape 218. Wafer tape holder frame 1408 may be movable relative to actuator flange 1504 via one or more spring members 1508 (in embodiments with spring members). Alternatively, with other motion control actuators capable of outputting forces in multiple directions, the wafer tape holder frame 1408 may be movable without the spring member since the actuator itself can cause motion in the return direction. . Also, actuator 1502 may be placed within the structure of the system at the different locations shown. That is, it is contemplated that the position of the actuator 1502 relative to the coarse transport mechanism and the substrate or transfer mechanism being finely adjusted may be different. For example, the actuator 1502 may have its position adjusted by a fine adjustment member (i.e., either a coarse transport mechanism or a transfer mechanism, or a combination thereof) stacked between the coarse transport mechanism and the fine adjustment member. component). Once the wafer tape holder frame 1408, wafer tape 218, and die 220 are collectively displaced to the intended location (i.e., the registered position is achieved), the transfer mechanism 206 (FIG. 14) Die 220 may be transferred to support substrate 210 with location precision. An alignment position is accurate if the die is placed in a predetermined intended location and the actual location is within a predetermined error range (i.e., the location is accurate within a predetermined tolerance). An example of a predetermined tolerance range may be, for example, 10-50 microns. Other tolerance ranges are possible.

As described above, in some embodiments, the spring member 1508 is attached to the wafer support block 1506 and the actuator flange such that the first end of the actuator 1502 can apply an actuation force (shown as an arrow 1502A indicating the direction of force). 1504. Actuation force 1502A displaces wafer support block 1506, which moves wafer tape holder frame 1408 from a first (rest) position to a second position along the actuation axis (shown as the X-axis in FIG. 15A). converted to displacement. The displacement is a predetermined distance from the first position relative to the actuator flange 1504. Spring member 1508 may deform slightly to allow displacement of wafer tape holder frame 1408 by moving wafer support block 1506 along the axis of actuation force 1502A. By way of example, the wafer tape displacement used herein may range from about 5 microns to about 200 microns. After the actuation force 1502A is applied, a return force (shown as an arrow 1508A indicating the direction of the force) may be applied by the restoring force of the spring member 1508, thereby causing the load that has already been returned to the rest position by other means. If not, the first end of actuator 1502 is forced back to a rest position relative to actuator flange 1504. In this way, the spring member can function as a return member.

Actuator flange 1504 (and specifically spring member 1508) may be constructed from a suitable material with sufficient elastic mechanical properties, which may depend on the particular spring design. For example, materials such as alloy steel, carbon steel, cobalt nickel, copper-based alloys, nickel-based alloys, titanium alloys, aluminum, etc. may be sufficient in the illustrated embodiments. Additionally and/or alternatively, plastics and other composition materials are contemplated. It is to be understood that the shape of fine adjustment mechanism 1500 and its constituent materials may vary and is not limited to that described herein.

According to one embodiment, actuator flange 1504 and spring member 1508 (or a portion thereof) may be integrated in that they are manufactured from only one material. In other aspects, they are manufactured as separate components and secured together (e.g., via welding or other securing techniques) to form an integrated fine adjustment mechanism 1500. It is possible. For example, if manufactured from a single piece of raw material, the plurality of spring members 1508 may be formed by removing a portion of the actuator flange 1504 (e.g., via machining, electrical discharge machining (EDM), etc.). (The removed portion is shown here as a spiral cavity in FIG. 15A). Although shown in FIGS. 15A-17 as an arched spring arm, the spring member 1508, such as a coiled spring, can move the wafer tape holder frame 1408 into a first (stationary) position after the actuation force 1502A is removed. It may also be in another form or shape suitable for returning to position.

One of the possible advantages of piezoelectric actuators is the variably controllable actuation of actuator 1502 and the available pushing force. The strength of the actuation combined with the speed and precision of the actuation may provide precision in positioning adjustments that may position the transferring die. Another advantage is that the speed and precision of actuation provides fine adjustment that cancels out vibrations. For example, with respect to counteracting vibrational forces, the fine adjustment mechanism 1500, as shown with a single actuator 1502, may rapidly accelerate the mass associated with the support substrate conveyor frame 214, regardless of the direction of movement prior to stopping. The system may be configured to assist the system in counteracting vibrations caused by rapid deceleration (i.e., stopping) following a . In other words, when the actuator is actuated to cancel vibrations caused by a sudden stop of the wafer tape transport mechanism 1404 to which the fine adjustment mechanism 1500 is connected, when considering the direction of actuation of the actuator 1502, the stop The moving directions of the previous fine adjustment mechanism 1500 and the wafer tape transport mechanism 1404 may be unrelated. At least some of the vibrations caused by the stop may be counteracted with a single actuator.

Piezoelectric actuators can provide fine adjustment by pushing (e.g., by applying a linear force in one direction) but do not have equivalent pulling capabilities (e.g., by applying a linear force in the opposite direction) There are cases. For example, unidirectional actuation is useful for precise actuation (e.g., position adjustment) in situations where the system has the ability to move in two directions (e.g., positive along the X-axis and negative along the X-axis). When used, it may have physical limitations. Therefore, when using a piezoelectric actuator for actuator 1502, it may be advantageous to provide a fine adjustment mechanism configured to actuate in multiple directions (described further herein with respect to FIGS. 16 and 17). do).

FIG. 15B shows a schematic cross-sectional view of a wafer tape transport mechanism 1404 that includes a fine adjustment mechanism 1500, taken generally along line XVB-XVB shown in FIG. 15A, according to an embodiment of the present application. Needles 226 and needle storage support 230 are shown with respect to the orientation of wafer tape conveyor mechanism 1404. For clarity, FIG. 15A shows fine adjustment assembly 1500 in an inverted orientation from that shown in FIG. 15B. As shown in FIG. 15B, wafer tape holder frame 1408 is configured to secure wafer tape 218, and fine adjustment assembly 1500 may make fine adjustments to the position of wafer tape 218. Wafer tape conveyor frame 1406 is mechanically coupled to actuator flange 1504. Additionally, FIG. 15B shows a gap 1516 in the actuator flange 1504. Gap 1516 has a portion of material removed (i.e., as described above in certain embodiments where actuator flange 1504 and wafer support block 1506 are made from a single piece of stock) to form spring member 1508. Represents a hollow space. Generally, gap 1516 represents the maximum amount of space in which fine adjustments to the position of die 220 can be made. In an alternative embodiment (not shown), the actuator flange and wafer support block are two parts mechanically coupled by fasteners and springs other than those shown and expressly described herein. They may be separate components, and even then, the gap 1516 may represent a space in which alignment may occur between an alternatively coupled actuator flange and wafer support block.

FIG. 15C shows another cross-sectional view of the fine adjustment assembly 1500 taken generally along line XVC-XVC shown in FIG. 15A, according to an embodiment. The needle and storage support have been omitted in this figure for clarity. Although the wafer tape conveyor frame 1406 is shown slightly spaced from the actuator flange 1504 to clearly show component distinction, in use the wafer tape conveyor frame 1406 is It will be understood by those skilled in the art that it is mechanically coupled to the wafer tape holder frame 1408. As shown in FIG. 15C, the actuator 1502 is mounted on or held in close proximity to the actuator flange 1504 using an actuator bracket assembly 1510 that can include bushings, gaskets, washers, brackets, etc. Good too. In some embodiments, maintaining an offset between actuator 1502 and actuator flange 1504 may, for example, minimize friction during movement.

Second Exemplary Embodiment of Direct Transfer Device with Fine Adjustment Assembly FIG. 16 shows a first actuator 1602 for performing fine adjustment of one or more components of the device according to another embodiment of the present application. and a bottom view of a fine adjustment mechanism 1600 (hereinafter referred to as "fine adjustment mechanism 1600") having a second actuator 1604. Although many features of the fine adjustment mechanism 1600 may remain substantially similar to those of the fine adjustment mechanism 1500 of FIG. 15A, several differences are noted herein with respect to the second actuator 1604. It is explained below.

The fine adjustment mechanism 1600 is positioned to contact a first side of a wafer support block 1606 configured to secure a wafer tape holding frame for holding a wafer tape (not shown in FIG. 16). The first actuator 1602 includes a first actuator 1602 having a distal end. Further, the fine adjustment mechanism 1600 includes a second actuator 1604 having a distal end positioned to contact the wafer support block 1606 at a location 180 degrees opposite the distal end of the first actuator 1602. include. The proximity of the distal ends of each of the first actuator 1602 and the second actuator 1604 to the wafer support block 1606 may include direct contact, indirect contact, abutment, abutment, etc. Fine adjustment mechanism 1600 may include an actuator flange 1608 to which support block 1606 is fixed. Additionally, actuator flange 1608 may include support arms 1608A and 1608B to which first actuator 1602 and second actuator 1604 are secured. In some embodiments that may further implement a spring-based return system as shown in FIG. 16, the fine adjustment mechanism 1600 may include a plurality of deformable spring members 1610 connecting the wafer support block 1606 to the actuator flange 1608. . Fine adjustment mechanism mechanism 1600 may be securely secured to wafer tape conveyor frame 1406 via holes 1612 (similar to fine adjustment mechanism 1500 as shown in FIG. 15B), thereby allowing fine adjustment. Mechanism 1600 may move with the wafer tape conveyor frame (when attached to the wafer tape conveyor frame) to fine-tune the position of the wafer tape.

Spring member 1610 thus connects wafer support block 1606 and actuator flange 1608 such that the distal end of first actuator 1602 moves wafer support block 1606 from the first (rest) position to the actuation axis. An actuation force 1602A may be applied that causes a displacement to a second position along the axis (shown in FIG. 16 as the X-axis). The displacement may be a variable predetermined distance from the first position with respect to the actuator flange 1608. Spring member 1610 may temporarily deform slightly to allow displacement of wafer support block 1606 by moving wafer support block 1606 along the axis of actuation force 1602A. After applying actuation force 1602A, spring member 1610 forces the distal end of first actuator 1602 to the first position relative to actuator flange 1608, if it has not already been returned to the first position. A return spring force 1610A may be applied so that the return spring force 1610A is returned to .

Additionally and/or alternatively, second actuator 1604 may apply actuation force 1604A to assist in returning wafer support block 1606 to the first position. If the embodiment includes a spring-based return system, return spring force 1610A may act on wafer support block 1606 to return wafer support block 1606 to the first position. Further, the actuation force 1604A may be greater than the return spring force 1610B, and may vary depending on the transport speed, the acceleration of the transport relative to the actuator flange 1608, and the precise movement of the wafer support block 1606 into the first position relative to the actuator flange 1608. Additional control may be provided regarding other controllable factors that direct returns. Return force 1610B may also return wafer support block 1606 to the first position when second actuator 1604 is performing a fine adjustment operation as described above. That is, the first position is a common rest position, and the third position may be reached when the second actuator 1604 pushes the wafer support block 1606 toward the first actuator 1602.

According to certain embodiments, precise actuation control for fine-tuning the wafer support block 1606 in two directions along a single axis may provide greater optimization capabilities for fine-tuning operations when transferring dies. Each of first actuator 1602 and second actuator 1604 may be connected to a control system (not shown) via a corresponding one of connectors 1614 and 1616, respectively. Thus, embodiments such as the embodiment described with respect to FIG. 16 provide timing of alignment in two directions of movement along a single axis.

Third Exemplary Embodiment of Direct Transfer Device with Fine Adjustment Assembly Additionally and/or alternatively, FIG. FIG. 17 shows a bottom view of an embodiment of a fine adjustment mechanism 1700 having an actuator 1706 and a fourth actuator 1708. FIG. Many functions of fine adjustment mechanism 1700 may remain substantially similar to those of fine adjustment mechanisms 1500 and 1600 of FIGS. 15 and 16, respectively. For example, the first actuator 1702 and the second actuator 1704 are connected to the actuator flanges 1710 on the support arms 1710A and 1710B, respectively, in the fine adjustment mechanism 1700, as described with respect to the first actuator 1602 and the second actuator 1604. may be placed against. However, actuator flange 1710 may have additional support arms 1710C and 1710D that may support third actuator 1706 and fourth actuator 1708, respectively. As shown, the third actuator 1706 and the fourth actuator 1708 are aligned collinearly opposite each other and rotated 90 degrees from the first actuator 1702 and the second actuator 1704, respectively. It is contemplated that it may be positioned to contact support block 1712. That is, the third actuator 1706 and the fourth actuator 1708 are oriented perpendicular to the collinear alignment of the first actuator 1702 and the second actuator 1704 so that the first actuator 1702 and the second actuator The actuator 1704 of can adjust the position of the die in a direction perpendicular to the direction line in which the adjustment can be made. Note that the oppositely facing actuator may function as a return member to reset the adjusted feature to a neutral state.

First Illustrative Example of a Method for Performing Direct Transfer Using a Direct Transfer Apparatus with a Fine Adjustment Assembly In one embodiment, as a frame holding a wafer tape is transported from location to location. , the transport mechanism holding the wafer frame may move to the transfer location, suddenly stop or slow down significantly, and then perform fine adjustments to the transfer location and/or to remove system vibrations. obtain. Once calibrated, the system then transfers the die. FIG. 18 illustrates a method 1800 of a direct transfer operation for an embodiment of a direct transfer device with a fine adjustment mechanism, where the transport mechanism stops at each transfer registration or completely stops at each transfer registration. may not stop, but rather simply slow down.

The steps of method 1800 described herein may not be in any particular order and, therefore, may be performed in any satisfactory order to achieve a desired product condition. For ease of explanation, method 1800 is described as being performed at least in part by a direct transfer device with a fine adjustment mechanism, such as those shown in FIGS. 14-17, for example. Note that, for convenience, the steps of method 1800 are described as if the fine adjustment mechanism was located with the wafer substrate transport mechanism. However, it is contemplated that the principles of the fine adjustment mechanism may be adapted to be implemented in other coarse adjustment mechanisms, as described above. Accordingly, it is also contemplated that the steps of method 1800 may be applicable as adapted to devices in which fine adjustment mechanisms are placed on coarse movement mechanisms other than those shown in FIGS. 14-17.

An example method 1800 of direct transfer operations (and each process described herein) is illustrated as a logical flow graph, where each respective operation is a sequence of operations that may be performed by hardware, software, or a combination thereof. can be expressed. In some situations, one or more of the operations may be performed by one or more human users.

In the context of software, operations may refer to computer-executable instructions stored on one or more computer-readable media that, when executed by one or more processors, perform the recited operations. Generally, computer-executable instructions may include routines, programs, objects, components, data structures, etc. that perform particular functions or implement particular abstract data types.

Computer-readable media can include hard drives, floppy disks, optical disks, CD-ROMs, DVDs, read-only memory (ROM), random access memory (RAM), EPROM, EEPROM, flash memory, magnetic or optical cards, and solid-state memory devices. or other types of storage media suitable for storage of electronic instructions. Further, in some embodiments, a computer-readable medium may include a transitory computer-readable signal (in compressed or uncompressed form). Examples of computer readable signals, whether or not modulated using a carrier wave, include signals that are downloaded over the Internet or other networks, and that are accessed by a computer system that hosts or executes a computer program. including, but not limited to, signals that may be configured to: Finally, unless otherwise noted, the order in which operations are described is not intended to be construed as a limitation, and any number of described operations may be performed in any order and/or to implement a process. Can be combined in parallel.

Now considering FIG. 18 in more detail, at 1802, the PC (described above with respect to FIG. 7) sends the system a first substrate (e.g., a die transport substrate, such as a wafer tape to which a die is secured). , a second substrate (a transfer substrate to which a die, such as a circuit board or other die, is to be transported), and a transfer mechanism (described further herein) to an alignment position. It is possible. That is, in some embodiments, the PC transfers the die from the first substrate to the second substrate in any one or all of the first substrate transport mechanism, the second substrate transport mechanism, or the transfer mechanism. may be directed to a transfer registration position to be transferred to a transfer location on the material. At least one of the first substrate transport mechanism, the second substrate transport mechanism, or the transfer mechanism is configured to minimize misalignment that may result from coarse movement and/or other factors in the transfer process. Note that it is contemplated that a fine adjustment mechanism may be implemented therewith.

As used herein, an alignment position may be a position within an alignment distance between moving components. For example, the alignment position may be such that all three components (e.g., a transfer mechanism, a first substrate carrying the die to be transferred, and a second substrate having a target transfer location for the die) are located between the three components. Any variation in alignment (ie, misalignment) can occur when aligned to range from 10 microns to 75 microns. In some embodiments, the alignment position may include a narrower range of allowed deviations, such as 10 microns to 20 microns. Other deviation tolerance ranges are contemplated and, therefore, are not limited to the ranges expressly set forth herein.

Further regarding step 1802 above, in some embodiments, the system aligns the substrate with the transfer mechanism and causes complete cessation of coarse movement(s) from the system components once the alignment position is achieved. may be used to prepare for die transfer. When stopping, the structure may vibrate. For example, vibrations may cause alignment changes on the order of 30 microns to 50 microns as a result of deceleration of the moving mass.

Additionally and/or alternatively, in some embodiments, the system may align the substrate with the transfer mechanism to prepare for die transfer while one or more of the three components is in motion. . For example, the transport mechanism transporting the first substrate may have instructions to maintain a deliberate, slow, continuous movement, or the movement may be faster during coarse movements. , and the system may slow down the moving component as it approaches the desired transfer location. Thus, at a precise and determinable point in time, for example 180 degrees from the direction of movement of the component during coarse movement, the system will ensure that the position of the die being imprinted is stationary relative to the target position on the support. The fine adjustment mechanism within the moving axis may be adjusted at a speed of That is, the relative velocity of the component being fine-tuned becomes zero. Once the die is aligned closest to the target transfer location, the transfer mechanism is actuated to transfer the die from the first substrate. Possible advantages of embodiments implementing continuous movement may include manufacturing efficiencies derived from time saved compared to waiting for system vibrations to settle at each transfer location.

In either embodiment, to determine the timing of actuation and the control parameters under which the actuator is actuated, the cell manager (described with respect to FIG. Real-time operating factors may be determined, including timing, time, and other factors. Therefore, before each actuation, the sensor manager, motion manager, and die manager determine the timing and speed of actuation to operate the actuator.

At 1804, the transfer device optionally makes one or more minor adjustments to one or more positions of the component to improve the alignment. The one or more fine adjustments may be performed by displacing the component through actuation of at least one fine adjustment actuator, thereby accommodating any minute size deviations. The displacement may include, for example, displacement of the first substrate from a first position relative to the actuator flange to a second position relative to the actuator flange using a fine adjustment actuator. The displacement can be variably controlled and thus position the transferred die from the first substrate to the transfer location on the second substrate with greater precision to ensure effective placement. It may be a predetermined distance to match. That is, the alignment position described for 1802 can be improved in real time during the transfer process by reducing and/or eliminating any die misalignment despite microscale effects caused by oscillatory or continuous motion. can be done.

At 1806, the apparatus transfers the semiconductor device die from the first substrate to the second substrate via actuation of a transfer mechanism (eg, cycling a needle/pin/wire, pivoting a collet, etc.).

At step 1808, the finely tuned component(s) may be returned to a neutral position (rest). For example, in some embodiments using a spring member, the return force may be generated automatically due to the nature of the spring member of the fine adjustment mechanism, or in other embodiments, the return force is generated by the second actuator. , a third actuator, and/or a fourth actuator.

At 1810, the transfer apparatus determines whether to transfer another semiconductor device die. If no other die is to be transferred, the process ends at 1812. However, if it is determined to transfer more dies, the process may begin again at 1802.

Fourth exemplary embodiment of direct transfer device with fine adjustment assembly
FIG. 19A shows an isometric view of a two-axis rail fine adjustment assembly 1900 (hereinafter referred to as rail assembly 1900) according to an embodiment of the present application. Again, the fine adjustment mechanism is implemented together with, for example, the wafer tape transport mechanism. However, as discussed above, it is contemplated that similar fine adjustment mechanisms may be adapted to be implemented with product substrate transport mechanisms. Nevertheless, for convenience, FIGS. 19A-19C refer to a rail assembly 1900 adapted to adjust the relative position of the wafer tape carrying the die to be transferred.

In some embodiments, the rail assembly 1900 includes a substage member 1902 (e.g., plates, frames, rigid support structures, etc.). Rail guide slide plates 1904, 1906 act as supports for transporting wafer tapes carrying semiconductor device die along their respective axes in response to actuation of one or more fine adjustment actuators 1908, 1910, respectively. It is possible. Additionally, rail assembly 1900 may include a first set of rails 1912 attached to substage member 1902. A first set of rails 1912 is positioned to engage a slide mechanism 1914 that is attached to the side of the first axial slide plate 1904 facing the substage member 1902. The first axis slide plate 1904 may be configured to slide along a single axis in a direction parallel to the direction of extension of the first set of rails 1912 when actuated by the fine adjustment actuator 1908. . Although the first set of rails 1912 is shown as including two rails, other configurations are contemplated where there may be more or less than two rails.

A second set of rails 1916 may be attached to the side of the first axial slide plate 1904 opposite the side to which the slide mechanism 1914 is attached. The second set of rails 1916 may engage a second set of slide mechanisms 1918 attached to the side of the second axial slide plate 1906 facing the first slide plate 1904. The second axis slide plate 1906 may transport a wafer tape carrying semiconductor device die along an axis parallel to the second set of rails 1916 when actuated by the fine adjustment actuator 1910. 19A-19C show the first set of rails 1912 and the second set of rails 1916 as perpendicular to each other, but the first set of rails 1912 and the second set of rails 1916 are not shown. It is contemplated that they may be oriented relative to each other in different orientations.

The rail assembly 1900 may include a first stop block 1920 and a second stop block 1922 to provide stop points at the edges of the first axial slide plate 1904 and the second axial slide plate 1906, respectively. . Further, the first stop block 1920 and the second stop block 1922 may each secure a compression bumper 1922, 1924 within their respective cavities, and the plurality of rail guide slide plates may have a fine adjustment actuator 1908, 1910 can abut the compression bumper without damage. Compression bumpers 1922, 1924 may be formed from a deformable, resilient material such as a rubberized polymer, polymer, rubber, or other suitable material (e.g., soft silicone, sponge, foam, rubber, plastic, etc.). be. Thus, the compression bumpers 1922, 1924 may function as return members to reset the wafer holder or substrate holder in a neutral position.

19B shows a side view and FIG. 19C shows a bottom view of the two-axis rail fine adjustment assembly 1900.

Second Illustrative Example of a Method for Performing Direct Transfer Using a Direct Transfer Apparatus Having a Fine Adjustment Assembly FIG. 20 shows a method 2000 for transferring a semiconductor device die using a fine adjustment mechanism. 1 illustrates an embodiment. Although the apparatus for transferring dies may perform coarse adjustments over relatively long distances (which may be, for example, 1 mm, 2 mm, etc.) for some die transfers, as explained above, Sometimes deviations may occur, for which a fine adjustment mechanism may be advantageous. Additionally, in some instances, a series of dies may be transferred and coarse alignment may be used, but coarse alignment may be impractical due to the relative proximity of adjacent dies. . In such situations, a fine adjustment mechanism may again be advantageous.

According to method 2000, the die transfer sequence may be as follows. At step 2002, the system may set the fine adjustment mechanism to a neutral position. At step 2004, the system may perform a coarse adjustment by, for example, activating one or more system components, such as a transport mechanism, to place the components in a transfer registration position. Assuming that the coarse adjustment satisfactorily places the component in the transfer registration position, the method 2000 proceeds to step 2006 by transferring the die. At step 2008, the system determines whether there are other dies to be transferred to the registered position that can be achieved by using fine adjustments. The mechanism operates the fine adjustment mechanism to move one or more of the components to a next transfer registration position. If the determination at step 2008 is positive, the system proceeds to step 2010 and activates the fine adjustment mechanism to place the component in the next alignment position. If the determination in step 2008 is negative, the system proceeds to step 2012 and determines whether there are other dies to be transferred to the registered position that can be achieved using coarse adjustment. If the determination in step 2012 is positive, the method returns to step 2004. If the determination in step 2012 is negative, the method ends in step 2014.

Note that at step 2006, the system may be required to transfer multiple dies simultaneously and/or sequentially. In situations where the registration position exceeds the stroke length available to one or more needles of the transfer mechanism, one or more transfers may occur either simultaneously when possible or very quickly sequentially. A fine adjustment actuator may be actuated to enable the adjustment and thereby avoid coarse adjustment. Additionally, the die transfer head can include a plurality of pins arranged in an array that approximately matches the pitch between the untransferred dies, so that by actuating two or more pins on the die transfer head simultaneously, multiple dies can be transferred simultaneously (see, eg, FIG. 21).

FIG. 21 shows a die transfer head 2102 having multiple pins 2104. In the illustrated example, die transfer head 2102 includes 24 pins 2104 arranged as two rows of 12 pins on a 0.275 mm pitch. Pins 2104 may be configured to transfer a die in accordance with one or more embodiments of the present application as described above. As shown in FIG. 21, circuit pads 2106 may be configured on the circuit substrate at a predetermined pitch (eg, 2.23 mm). The known pitch configuration may enable multi-pin die transfer using heads with pin pitches that are the same (or similar) to the predetermined die pitch. For example, a single multi-pin device die transfer head can be used to transfer two or more device dies (transfer combination #1 and #2) can be transferred.

Exemplary Clause A: An apparatus for performing direct transfer of a semiconductor device die disposed on a first substrate to a second substrate, the apparatus comprising: providing primary positioning of the first substrate; a substrate conveyance mechanism movable on two axes, and a fine adjustment mechanism coupled to the substrate conveyance mechanism, the fine adjustment mechanism holding a first substrate, and a primary adjustment mechanism caused by the substrate conveyance mechanism. The fine adjustment mechanism is configured to perform secondary position adjustment on a smaller scale than the position adjustment, and the fine adjustment mechanism is configured to fix a fine adjustment actuator having a movable distal end and a first substrate. a substrate holder frame, the substrate holder frame being movable via actuation of a distal end of a fine adjustment actuator; and a second substrate. pressing the first substrate with a substrate frame configured to secure the second substrate such that the transfer surface of the second substrate faces the semiconductor device die disposed on the first substrate; and a transfer mechanism configured to transfer the semiconductor device die to the second substrate.

B: The fine adjustment mechanism further includes a wafer support for fixing the substrate holder frame and a return member for resetting the substrate holder frame to a neutral position, and the distal end of the fine adjustment actuator is configured to The apparatus of paragraph A, wherein the apparatus is disposed proximate a wafer support.

C: the fine adjustment actuator is a first fine adjustment actuator, and the fine adjustment mechanism further includes a second fine adjustment actuator having a distal end positioned to adjust the position of the substrate holder frame; the distal ends of the first fine adjustment actuators are positioned to adjust the position of the substrate holder frame at respective locations approximately 90 degrees displaced relative to the distal ends of the second fine adjustment actuators; A device according to paragraph A or paragraph B.

D: The device according to any one of paragraphs A to C, wherein the fine adjustment mechanism is a two-axis rail conveyance mechanism.

E: The apparatus according to any one of paragraphs A to D, wherein the fine adjustment mechanism further includes a substage plate attached to the substrate transport mechanism.

F: The fine adjustment mechanism is a first pair of parallel rails attached to the substage plate, the first pair of parallel rails extending in the first direction, and the second pair of parallel rails of the first axis slide plate. a first axis slide plate having laterally opposed first sides, the first axis slide plate being indirectly connected to the substage via a first pair of parallel rails on the first side of the first axis slide plate; and a second pair of parallel rails attached to a second side of the first axis slide plate, the second pair of parallel rails extending in a second direction transverse to the first direction. a second shaft slide plate indirectly connected to the first shaft slide plate via a second pair of parallel rails, the second shaft slide plate supporting the substrate holder frame; The apparatus of any of paragraphs A to E, further comprising: an axial slide plate of.

G: The apparatus of any of paragraphs A to F, wherein the movable distal end of the fine adjustment actuator is arranged to contact an edge of the first axial slide plate.

H: An apparatus for performing direct transfer of a semiconductor device die placed on a first substrate onto a second substrate, the substrate for performing macro positional adjustment of the first substrate. a transport mechanism; and a fine adjustment mechanism connected to the base material transport mechanism, the fine adjustment mechanism being configured to hold a first base material and finely adjust the position of the first base material; The fine adjustment mechanism includes a fine adjustment actuator having a movable distal end and a substrate holder frame configured to fix the first substrate, the substrate holder frame being configured to secure the first substrate, the substrate holder frame a fine adjustment mechanism configured to secure a second substrate, the substrate holder frame being secured to the slide plate and movable through contact with the distal end; A base material frame is arranged such that the transfer surface of the second base material faces the semiconductor device die disposed on the first base material, and the first base material is pressed, and the semiconductor device die is transferred to the second base material. a transfer mechanism configured to transfer to the
A device comprising:

I: the fine adjustment actuator is a first fine adjustment actuator, the slide plate is a first slide plate of a fine adjustment mechanism and is positionally adjustable in a first direction, the fine adjustment mechanism is a first fine adjustment actuator; a second slide plate positionally adjustable in a second direction transverse to the first direction; and a second slide plate having a movable distal end disposed to contact and adjust the position of the second slide plate. 2 fine adjustment actuators.

J: The first slide plate and the second slide plate are interconnected by a pair of parallel rails, whereby the second slide plate is movable in a linear direction relative to the first slide plate, paragraph The apparatus according to any of paragraphs H to I.

K: The fine adjustment mechanism includes a first fine adjustment mechanism disposed on a side surface of the first slide plate facing the first fine adjustment actuator to stop the first slide plate after actuation of the first fine adjustment actuator. a compression bumper, a second compression bumper disposed on a side of the second slide plate opposite the second fine adjustment actuator for stopping the second slide plate after actuation of the second fine adjustment actuator; The apparatus according to any one of paragraphs H to J, further comprising:

L: The apparatus according to any one of paragraphs H to K, wherein the substrate transport mechanism is movable in at least two directions.

M: The device according to any of paragraphs H to L, wherein the fine adjustment actuator is configured to perform position adjustment in a range of 0.5 microns to 5000 microns.

N: The device described in any of paragraphs H to M, wherein the fine adjustment actuator is configured to provide position adjustment in the range of 1 micron to 1000 microns.

O: The device according to any of paragraphs H to N, wherein the fine adjustment actuator is configured to perform position adjustment in a range of 5 microns to 50 microns.

P: An apparatus for performing direct transfer of a semiconductor device die placed on a first substrate onto a second substrate, the apparatus comprising: a base material transport mechanism configured to move in more than one direction; and a fine adjustment mechanism coupled to the base material transport mechanism, wherein the fine adjustment mechanism is configured to move in two or more directions, the fine adjustment mechanism being configured to move in one or more directions; The fine adjustment mechanism is configured to further convey a substrate of the fine adjustment mechanism, the fine adjustment mechanism being movable via one or more fine adjustment actuators having a movable distal end and actuation of the one or more fine adjustment actuators. a substrate holder frame configured to secure the first substrate for the transfer of the second substrate; a substrate frame disposed with a surface facing a semiconductor device die disposed on a first substrate and operative to press the first substrate and transfer the semiconductor device die to a second substrate; and a transfer member capable of being used.

Q: The apparatus of paragraph P, wherein the one or more fine adjustment actuators are controlled to counteract the location inaccuracy of the macro position adjustment.

R: The fine adjustment mechanism is configured to adjust the position of the first base material with respect to the base material transport mechanism while the base material transport mechanism is moving, as described in any one of paragraphs P to Q. equipment.

S: The apparatus according to any one of paragraphs P to R, wherein the movement of the base material transport mechanism is a vibration movement that occurs when the base material transport mechanism stops after macro position adjustment.

T: The apparatus according to any one of paragraphs P to S, wherein the movement of the base material transport mechanism is a movement that occurs when the base material transport mechanism moves continuously during macro position adjustment.
conclusion

Although some embodiments have been described in language specific to structural features and/or methodological acts, it is to be understood that the claims are not necessarily limited to the specific features or acts described. . Rather, the specific features and acts are disclosed as example forms of implementing the claimed subject matter. Additionally, the use of the term "may" herein is used to indicate that a particular feature may be used in one or more different embodiments, but not necessarily in all embodiments. There is no guarantee that it will be done.

Claims (20)

An apparatus for performing direct transfer of a semiconductor device die disposed on a first substrate to a second substrate, the apparatus comprising:
a base material transport mechanism movable on two axes to perform primary position adjustment of the first base material;
a fine adjustment mechanism coupled to the substrate transport mechanism, the fine adjustment mechanism holding the first substrate and performing second position adjustments on a smaller scale than the primary position adjustment caused by the substrate transport mechanism; The fine adjustment mechanism is configured to perform next position adjustment, and the fine adjustment mechanism
a fine adjustment actuator having a movable distal end;
a substrate holder frame configured to secure the first substrate, the substrate holder frame being movable via actuation of the distal end of the fine adjustment actuator; the fine adjustment mechanism including a material holder frame;
a substrate frame configured to secure the second substrate such that a transfer surface of the second substrate is positioned toward the semiconductor device die disposed on the first substrate; and,
a transfer mechanism configured to press the first substrate and transfer the semiconductor device die to the second substrate;
A device comprising: The fine adjustment mechanism is
a wafer support for fixing the substrate holder frame;
further comprising a return member for resetting the substrate holder frame to a neutral position;
the distal end of the fine adjustment actuator is positioned proximate the wafer support;
The device according to claim 1. the fine adjustment actuator is a first fine adjustment actuator,
the fine adjustment mechanism further includes a second fine adjustment actuator having a distal end positioned to adjust the position of the substrate holder frame;
adjusting the position of the substrate holder frame at a location where the distal ends of the first fine adjustment actuators are each displaced about 90 degrees relative to the distal ends of the second fine adjustment actuators; positioned as,
The device according to claim 1. the fine adjustment mechanism is a two-axis rail conveyance mechanism;
The device according to claim 1. The fine adjustment mechanism further includes a substage plate attached to the substrate transport mechanism.
The device according to claim 1. The fine adjustment mechanism is
a first pair of parallel rails attached to the substage plate, the first pair of parallel rails extending in a first direction;
the first axial slide plate having a first side surface opposite to a second side surface of the first axial slide plate, the first axial slide plate having a first side surface opposite to a second side surface of the first axial slide plate; the first axis slide plate indirectly connected to the substage plate via a pair of parallel rails ;
a second pair of parallel rails attached to the second side surface of the first axial slide plate, the second pair of parallel rails extending in a second direction transverse to the first direction; ,
a second axial slide plate indirectly connected to the first axial slide plate via the second pair of parallel rails, the second axial slide plate supporting the substrate holder frame; and,
further including,
Apparatus according to claim 5. the movable distal end of the fine adjustment actuator is arranged to contact an edge of the first axial slide plate;
7. Apparatus according to claim 6. An apparatus for performing direct transfer of a semiconductor device die disposed on a first substrate to a second substrate, the apparatus comprising:
a base material transport mechanism for performing macro positional adjustment of the first base material;
A fine adjustment mechanism connected to the base material transport mechanism, the fine adjustment mechanism configured to hold the first base material and finely adjust the position of the first base material, The fine adjustment mechanism is
a fine adjustment actuator having a movable distal end;
a substrate holder frame configured to secure the first substrate, the substrate holder frame being movable through contact with the distal end of the fine adjustment actuator; the fine adjustment mechanism including the base material holder frame fixed to the plate;
a substrate frame configured to secure the second substrate such that a transfer surface of the second substrate is positioned toward the semiconductor device die disposed on the first substrate; and,
a transfer mechanism configured to press the first substrate and transfer the semiconductor device die to the second substrate;
A device comprising: the fine adjustment actuator is a first fine adjustment actuator,
the slide plate is a first slide plate of the fine adjustment mechanism and is positionally adjustable in a first direction;
The fine adjustment mechanism is
a second slide plate positionally adjustable in a second direction transverse to the first direction;
a second fine adjustment actuator having a movable distal end disposed to contact and adjust the position of the second slide plate;
further including,
9. Apparatus according to claim 8. The first slide plate and the second slide plate are interconnected by a pair of parallel rails, such that the second slide plate is movable in a linear direction relative to the first slide plate. ,
Apparatus according to claim 9. The fine adjustment mechanism is
a first compression bumper disposed on a side of the first slide plate opposite the first fine adjustment actuator to stop the first slide plate after actuation of the first fine adjustment actuator; ,
a second compression bumper disposed on a side of the second slide plate opposite the second fine adjustment actuator to stop the second slide plate after actuation of the second fine adjustment actuator; ,
further including,
Apparatus according to claim 9. the substrate transport mechanism is movable in at least two directions;
9. Apparatus according to claim 8. the fine adjustment actuator is configured to provide position adjustment in a range of 0.5 microns to 5000 microns;
9. Apparatus according to claim 8. the fine adjustment actuator is configured to provide position adjustment in a range of 1 micron to 1000 microns;
9. Apparatus according to claim 8. the fine adjustment actuator is configured to provide position adjustment in a range of 5 microns to 50 microns;
9. Apparatus according to claim 8. An apparatus for performing direct transfer of a semiconductor device die disposed on a first substrate to a second substrate, the apparatus comprising:
a substrate transport mechanism configured to move in one or more directions to transport the first substrate with macro position adjustment;
a fine adjustment mechanism connected to the base material transport mechanism, the fine adjustment mechanism configured to further transport the first base material in fine adjustment of the position with respect to the base material transport mechanism; The adjustment mechanism
one or more fine adjustment actuators having a movable distal end;
a substrate holder frame configured to secure the first substrate for movement via actuation of the one or more fine adjustment actuators;
a substrate frame configured to secure the second substrate such that a transfer surface of the second substrate is positioned toward the semiconductor device die disposed on the first substrate; and,
a transfer member operable to press the first substrate and transfer the semiconductor device die to the second substrate;
A device comprising: the one or more fine adjustment actuators are controlled to counteract location inaccuracies of the macro position adjustment;
17. Apparatus according to claim 16. the fine adjustment mechanism is configured to adjust the position of the first substrate relative to the substrate transport mechanism while the substrate transport mechanism is moving;
17. Apparatus according to claim 16. The movement of the base material transport mechanism is a vibration movement that occurs when the base material transport mechanism stops after macro position adjustment;
19. Apparatus according to claim 18. The movement of the base material transport mechanism is a movement that occurs when the base material transport mechanism continuously moves during the macro position adjustment.
19. Apparatus according to claim 18.