JP2012156473A - Component transfer device and component transfer method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a technology of shortening the processing time required for transferring a plurality of components, held on the holding surface of a first holding body, to the transfer positions of a second holding body predetermined for respective components.SOLUTION: A component 7 is transferred from a dicing tape 6 to a transfer position provided on the component mounting surface 8a of a glass substrate 8, when the component 7 held on the dicing tape 6 is pressed against the component mounting surface 8a of the glass substrate 8, in a state where the component 7 is supported while facing the holding surface of the dicing tape 6 and the component mounting surface 8a of the glass substrate 8 each other. Since pick-up of the component 7 from the holding surface of the dicing tape 6 and transfer of the component 7 thus picked up to the component mounting surface 8a of the glass substrate 8 are carried out in the same process, processing time can be shortened.

Description

  The present invention relates to a technique for transferring a plurality of parts held on a holding surface of a first holding body to a predetermined transfer position predetermined for each part on a second holding body.

  Conventionally, an IC chip obtained by dicing a wafer affixed to a mount is picked up from the mount and flip-chip (reversed) bonded to the glass substrate, so that the IC chip is transferred from the mount to the glass substrate. The device is known. For example, the apparatus described in Patent Document 1 includes a carrier frame on which a mount on which a plurality of IC chips are attached by dicing a wafer is mounted, and a mount (diced wafer) mounted on the carrier frame. A push-up member that pushes up the IC chip from below, a transfer means that picks up the IC chip pushed up from the mount by the push-up member, an inversion means that inverts the IC chip picked up by the transfer means, and an inversion by the inversion means And a mounting means for mounting the IC chip on a glass substrate fixed to the mounting table later.

  This device picks up an IC chip with bumps on its surface and stuck to the mount by pushing it up from below with a push-up means, and then reverses the picked-up IC chip so that the bump faces the electrode on the glass substrate. By doing so, the IC chip can be transferred to the glass substrate.

Japanese Patent Laid-Open No. 11-97489 (paragraphs 0010 to 0020, FIGS. 1 to 5 etc.)

  In the above-described conventional apparatus, the component (IC chip) obtained by dicing the wafer attached to the first holding body (mounting board) is transferred from the first holding body to the second holding body (glass substrate). When transferring, the process of separating and picking up the parts from the first holding body, and aligning the picked-up parts at a transfer position predetermined for the second holding body corresponding to the parts It is necessary to carry out three steps: a step of carrying out and a step of mounting the aligned part on the transfer position of the second holding body. However, in order to shorten the processing time, further technical improvement is required. It was done.

  The present invention has been made in view of the above-described problem, and a plurality of parts held on the holding surface of the first holding body are preliminarily determined corresponding to each part on the second holding body. It is an object of the present invention to provide a technique capable of shortening the processing time for transferring to the transfer position.

  In order to achieve the above-described object, the component transfer apparatus according to the present invention provides a plurality of components held on the holding surface of the first holding body corresponding to each of the components on the second holding body. In a component transfer apparatus for transferring to a predetermined transfer position determined in advance, a support means for supporting the first and second holding bodies in a state of facing each other, and the first and second by the support means Positioning means for aligning the part held by the first holding body with the transfer position of the second holding body corresponding to the part in a state where the holding body is supported; In a state where the alignment by the aligning means is completed, the part held on the holding surface of the first holding body is pressed against the second holding body, and the part is moved from the first holding body to the first holding body. And a pressing means for transferring to the transfer position of the two holding bodies. Are (claim 1).

  In addition, the plurality of components are held by being adhered to the holding surface of the first holding body with an adhesive, and the pressing means presses the component against the second holding body, It is good to have a function which cancels the pasting state of the part by an adhesive (Claim 2).

  The pressure-sensitive adhesive is made of a UV-type pressure-sensitive adhesive that loses its adhesiveness due to UV light, and the pressing means irradiates the UV-type pressure-sensitive adhesive with UV light to release the attached state of the component. (Claim 3).

  The pressing means includes a pressing body that presses the component, a receiving hole that is provided in a portion of the pressing body that presses the component, a protruding pin that is provided in the receiving hole, and the protruding pin. Urging means for urging the part in a direction projecting from the accommodation hole, and by projecting the part from the first holding body with the projecting pin projecting from the accommodation hole by the urging force of the urging means. The sticking state of the part by the adhesive may be released (Claim 4).

  Further, the pressing means may press and join the component to the second holding body (Claim 5).

  The first holding body is formed by forming the holding surface by providing the pressure-sensitive adhesive on the surface of a flexible sheet-like member. When pressing against the second holding body, the peripheral portion of the part of the sheet-like member is sucked from the back side of the sheet-like member, and the peripheral portion is maintained in a state separated from the second holding body. It is good to have the suction part to perform (claim 6).

  Also, the component transfer method of the present invention transfers a plurality of components held on the holding surface of the first holding body to the second holding body in accordance with a predetermined transfer corresponding to each component. In the component transfer method of transferring to a position, in a state where the first and second holding bodies are supported to face each other, the parts held by the first holding body are changed to the parts corresponding to the parts. An alignment step of aligning the second holding body with the transfer position, and in a state where the positioning is completed, the part held by the first holding body is pressed against the second holding body. And a transfer step of transferring the component from the first holding body to the transfer position of the second holding body (Claim 7).

  In addition, a plurality of chips obtained by dicing a wafer as the component are attached to the holding surface of the first holding body in which the holding surface is formed by providing an adhesive on the surface of the sheet-like member. The chip may be mounted and held, and in the transfer step, the chip may be transferred to the second holding body formed by the substrate while being pressed and bonded (Claim 8).

  The pressure-sensitive adhesive is made of an ultraviolet-type pressure-sensitive adhesive that loses its adhesiveness due to ultraviolet rays, and a portion where the chip is held when the chip is pressed against the second holding body in the transfer step. The adhesive state of the component by the pressure-sensitive adhesive may be released by irradiating the ultraviolet-ray pressure-sensitive adhesive with ultraviolet light to lose the pressure-sensitive adhesive property (claim 9).

  Moreover, in the said transfer process, you may cancel | release the sticking state of the said part by the said adhesive by protruding the said part from the said 1st holding body with a protrusion pin (Claim 10).

  According to the first and seventh aspects of the present invention, the plurality of parts held on the holding surface of the first holding body are transferred to the second holding body by a predetermined transfer corresponding to each part. When the first and second holding bodies are supported to face each other when transferred to the mounting position, the part held by the first holding body and the second holding corresponding to the part The transfer position of the body is aligned, the part held by the first holding body is pressed by the second holding body, and the part is transferred from the first holding body to the second holding body. Since it is transferred to the position, the removal of the component from the holding surface of the first holding body and the transfer of the taken-out component to the second holding body are performed in the same process, so that the processing time can be shortened. Can be planned.

  According to the second aspect of the present invention, the plurality of parts are held by being adhered to the holding surface of the first holding body with the adhesive, and the parts are pressed against the second holding body by the pressing means. In this case, since the state of sticking of the part by the adhesive is released, the part can be efficiently taken out from the first holding body and transferred to the transfer position of the second holding body.

  According to the invention of Claims 3 and 9, when a plurality of parts are stuck and held on the holding surface of the first holding body by an ultraviolet-type pressure-sensitive adhesive that loses adhesiveness due to ultraviolet rays, When the part is pressed against the second holding body, the UV-type adhesive in the part where the part is held is irradiated with ultraviolet rays, and the adhesiveness is lost, so that the part is stuck to the adhesive. Therefore, the part can be efficiently taken out from the first holding body and transferred to the transfer position of the second holding body.

  According to the invention described in claims 4 and 10, when a plurality of parts are stuck and held on the holding surface of the first holding body with an adhesive, the parts are pressed against the second holding body. When the part is protruded from the first holding body by the protruding pin, the sticking state of the part by the adhesive is released, so that the part is efficiently removed from the first holding body. Thus, it can be transferred to the transfer position of the second holding body.

  According to the fifth aspect of the present invention, the plurality of parts held on the holding surface of the first holding body are predetermined transfer positions predetermined for each part on the second holding body. Since the component is pressed and joined to the second holding body by the pressing means when being transferred to, it is very practical.

  According to the invention described in claim 6, the first holding body has a holding surface formed by providing an adhesive on the surface of the flexible sheet-like member, and the component is When the second holding body is pressed by the pressing means, the peripheral part of the part of the sheet-like member is sucked by the suction part from the back side of the sheet-like member, and the peripheral part of the part to be transferred is the first part. Since it is maintained in a state of being separated from the second holding body, there is no possibility that parts around the part to be transferred are in contact with the second holding body, and parts other than the part are erroneously in contact with the second holding body. Can be prevented from being transferred.

  According to the invention described in claim 8, a plurality of wafers are diced as a part on the holding surface of the first holding body in which the holding surface is formed by providing the adhesive on the surface of the sheet-like member. This chip is very practical because it is stuck and held, and the chip is transferred to the second holding body formed by the substrate while being pressed and joined.

It is a figure which shows 1st Embodiment of the components transfer apparatus of this invention. It is a flowchart which shows an example of a component transfer process. It is a figure which shows an example of a component transfer process, Comprising: It is a figure which shows a wafer mounting process. It is a figure which shows an example of a component transfer process, Comprising: It is a figure which shows a wafer mounting process. It is a figure which shows an example of a component transfer process, Comprising: It is a figure which shows a board | substrate mounting process. It is a figure which shows an example of a component transfer process, Comprising: It is a figure which shows an opposing arrangement | positioning process. It is a figure which shows an example of a component transfer process, Comprising: It is a figure which shows a transfer component recognition process. It is a figure which shows an example of a component transfer process, Comprising: It is a figure which shows a transfer component adsorption | suction process. It is a figure which shows an example of a component transfer process, Comprising: It is a figure which shows a proximity | contact process. It is a figure which shows an example of a component transfer process, Comprising: It is a figure which shows a positioning process. It is a figure which shows an example of a component transfer process, Comprising: It is a figure which shows a transfer process. It is a figure which shows an example of a component transfer process, Comprising: It is a figure which shows the state which the component transfer process was completed. It is a principal part enlarged view which shows 2nd Embodiment of the components transfer apparatus of this invention. It is a figure which shows an example of a component transfer process, Comprising: It is a figure which shows a transfer component recognition process. It is a figure which shows an example of a component transfer process, Comprising: It is a figure which shows a transfer component adsorption | suction process. It is a figure which shows an example of a component transfer process, Comprising: It is a figure which shows a proximity | contact process. It is a figure which shows an example of a component transfer process, Comprising: It is a figure which shows a positioning process. It is a figure which shows an example of a component transfer process, Comprising: It is a figure which shows a transfer process. It is a figure which shows an example of a component transfer process, Comprising: It is a figure which shows the state immediately after the press with respect to a transfer component was cancelled | released. It is a figure which shows an example of a component transfer process, Comprising: It is a figure which shows the state which the component transfer process was completed. It is a figure which shows the transfer process of the components transfer process in 3rd Embodiment of the components transfer apparatus of this invention. It is a figure which shows the state which the components transfer process completed in the transfer apparatus of FIG.

<First Embodiment>
A first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a diagram showing a first embodiment of a component transfer apparatus according to the present invention. FIG. 2 is a flowchart showing an example of the component transfer process. 3 to 12 are diagrams showing an example of the component transfer process, in which FIGS. 3 and 4 show the wafer placement process, FIG. 5 shows the substrate placement process, and FIG. 6 shows the opposing placement process. FIG. 7 is a diagram showing the transfer component recognition process, FIG. 8 is a diagram showing the transfer component suction process, FIG. 9 is a diagram showing the proximity process, FIG. 10 is a diagram showing the alignment process, and FIG. FIG. 12 is a diagram illustrating a transfer process, and FIG. 12 is a diagram illustrating a state in which the component transfer process is completed.

(Parts transfer device)
The component transfer apparatus 1 transfers a plurality of components 7 such as IC chips held on a holding surface of a dicing tape 6 (first holding body) to a glass substrate 8 (second holding body) for each component 7. Correspondingly, the sample is transferred to a predetermined transfer position.

  In this embodiment, the dicing tape 6 loses its adhesiveness to the surface of a flexible sheet-like member made of a resin material such as polyethylene terephthalate (PET), polyvinyl chloride (PVC), or polyolefin due to ultraviolet rays. A holding surface is formed by providing a pressure-sensitive adhesive layer made of an ultraviolet-type pressure-sensitive adhesive. A plurality of IC chips formed by dicing a wafer attached to the holding surface are formed as components 7 on the holding surface. Retained. Further, as shown in FIG. 1, the dicing tape 6 has a peripheral portion of the opening of a hollow dicing frame 6a in which the peripheral portion of the adhesive layer of the holding surface is formed in a ring shape in plan view with a resin material, stainless steel, or the like. And is held by the dicing frame 6a.

  Bumps 7 a are provided on the upper surface of the component 7 held on the holding surface of the dicing tape 6, that is, on the surface opposite to the bonding surface of the component 7 to the dicing tape 6, and the component mounting surface of the glass substrate 8. Electrodes (not shown) that are electrically connected to the bumps 7a of the component 7 are provided at predetermined transfer positions corresponding to the respective components 7 in 8a. In this embodiment, when the component 7 is transferred from the dicing tape 6 to the component mounting surface 8a of the glass substrate 8, the bumps 7a of the component 7 and the electrodes provided at the transfer position of the glass substrate 8 are provided. Be joined.

  In general, UV-type pressure-sensitive adhesives that lose their tackiness by UV irradiation are generally those whose adhesive strength is weakened by ultraviolet irradiation, those whose adhesive strength is weakened by the expansion of microspheres by UV irradiation, It is known that the adhesive strength is weakened by the generation of nitrogen gas or the like by irradiation, and the dicing tape 6 formed as described above is a well-known one. Is omitted. Further, the glass substrate 8 of this embodiment forms a liquid crystal panel of a liquid crystal display or the like, and a component 7 formed as a driver IC is transferred to a predetermined mounting surface 8a of the glass substrate 8 in advance. It is transferred (mounted) to the position.

  As shown in FIG. 1, the component transfer apparatus 1 includes a support unit 2 that supports a dicing tape 6 and a glass substrate 8 facing each other, and a dicing tape 6 and a glass substrate 8 that are supported by the support unit 2. An alignment mark (not shown) provided on each of the XY table 3 moving in the XY direction in a horizontal plane substantially orthogonal to the direction of the arrow Z inside, the component 7 held on the holding surface of the dicing tape 6 and the glass substrate 8. Is recognized on the holding surface of the dicing tape 6 and the recognition means 4 for recognizing the positions of the bumps 7a provided on the component 7 and the electrodes (transfer positions) provided on the component mounting surface 8a of the glass substrate 8. A head 5 that presses the held component 7 against the upper glass substrate 8 from the back side of the dicing tape 6 is provided.

  The support means 2 includes a first support portion 21 having an alignment table 23 (corresponding to the “positioning means” of the present invention) that supports the glass substrate 8, and a second support portion 22 that supports the dicing tape 6. Yes. The first support portion 21 and the second support portion 22 are hingedly connected by a rotating shaft 24, and the first support portion 21 includes the dicing tape 6 and the glass substrate 8 as indicated by a dashed line arrow in FIG. Is a first position where the dicing tape 6 and the glass substrate 8 are opposed to each other at the first position (hereinafter referred to as “closed state”), the upper side of the dicing tape 6 (second support portion 22) is opened. It is rotated between a second position indicated by a dotted line in the figure (hereinafter, a state where the upper side of the dicing tape 6 is opened at the second position is referred to as an “open state”).

  Further, the second support portion 22 is provided with a support column 25 for fixing the first and second support portions 21 and 22 in the closed state at a predetermined interval. In the closed state, the first support portion 21 is It is fixed to the column 25 with bolts or screws. The first support portion 21 and the alignment table 23 are provided with transmission windows 21a and 23a formed of transparent quartz glass or the like, respectively, and the second support portion 22 is provided with an opening 22a. , 23a and the opening 22a are arranged so as to overlap in the vertical direction (the direction of arrow Z in FIG. 1).

  Each of the alignment table 23 and the second support portion 22 includes a vacuum suction mechanism (not shown). The alignment table 23 includes a plurality of electrodes formed on the glass substrate 8 as transfer positions of the components 7. The peripheral portion of the glass substrate 8 is sucked and supported so as to be arranged in the transmission window 23a, and the second support portion 22 is diced so that a plurality of components 7 held on the holding surface of the dicing tape 6 are arranged in the opening 22a. The peripheral portion of the tape 6 (dicing frame 6a) is sucked and supported.

  Further, a convex portion 22b is formed on the upper surface of the second support portion 22 along the edge of the opening 22a, and the dicing tape 6 (dicing frame 6a) is supported on the upper surface of the second support portion 22. In addition, the peripheral portion of the portion of the holding surface of the dicing tape 6 where the components 7 are held is slightly pushed upward from below by the convex portion 22b. Accordingly, since the dicing tape 6 is slightly extended in all directions while being supported on the upper surface of the second support portion 22, the dicing tape 6 is disposed in close contact with the holding surface of the dicing tape 6 when the wafer is diced. Since a minute gap is generated between the respective components 7 that are present, each component 7 can be easily transferred individually to the component mounting surface 8 a of the glass substrate 8.

  The alignment table 23 is formed so as to be movable in the XY direction substantially orthogonal to the arrow Z direction in FIG. 1 and is formed so as to be rotatable in the θ direction with the arrow Z direction as the center of rotation. By being driven, the relative position of the glass substrate 8 supported by the alignment table 23 with respect to the dicing tape 6 is adjusted. As a result, the alignment table 23 has the bumps 7a of the components 7 held on the dicing tape 6 and the respective components 7 in a state where the dicing tape 6 and the glass substrate 8 are supported by the support means 2 in the closed state. Corresponding to the electrode (transfer position) provided on the component mounting surface 8a of the glass substrate 8 is aligned. The alignment table 23 is driven by an actuator such as a ball nut mechanism having a servo motor or a linear motor.

  The XY table 3 includes an X table 31 having an X axis 31 a and a Y table 32 having a Y axis 32 a, and the Y table 32 is disposed on the X axis 31 a of the X table 31. Therefore, when the X table 31 is driven, the Y table 32 moves in the X direction on the X axis 31a. The second support portion 22 of the support means 2 is disposed on the Y axis 32a of the Y table 32. When the Y table 32 is driven, the support means 2 moves on the Y axis 32a in the Y direction. To do. Therefore, when the XY table 3 is driven, the positions of the dicing tape 6 and the glass substrate 8 supported by the support means 2 in the XY direction are adjusted.

  The XY table 3 is driven by an actuator such as a ball nut mechanism having a servo motor or a linear motor. The X table 31 and the Y table 32 have openings 31b and 32b, and the openings 31b and 32b are arranged so as to overlap the transmission windows 21a and 23a and the opening 22a in the vertical direction.

  The recognition unit 4 includes a first camera 41 disposed below the support unit 2 and a second camera 42 disposed above the support unit 2, and the first and second cameras 41, Each 42 is formed by imaging means such as a CCD camera. The first and second cameras 41 and 42 are respectively provided with illumination portions 41a and 42a formed of LEDs or the like. The first and second cameras 41 and 42 include the component 7 and the glass substrate. When recognizing the alignment marks respectively provided in 8, illumination by the illumination units 41 a and 42 a is performed to recognize the respective alignment marks.

  The first camera 41 recognizes the part 7 to be transferred from among the plurality of parts 7 held on the holding surface of the dicing tape 6 from below the support means 2. By driving the XY table 3 based on the recognition result of the camera 41, the component 7 to be transferred is placed above the head 5.

  In addition, the second camera 42 includes an alignment mark provided on the component 7 to be transferred from above the support means 2 in a state where the dicing tape 6 and the glass substrate 8 are supported to face each other, and the component. 7 and the alignment mark provided corresponding to a predetermined transfer position (electrode) on the component mounting surface 8a of the glass substrate 8 corresponding to the same. The relative position (displacement) between the bump 7a thus formed and the electrode provided on the component mounting surface 8a of the glass substrate 8 corresponding to the component 7 is recognized. By driving the alignment table 23 based on the recognition result of the second camera 42, the bump 7 a of the component 7 to be transferred held on the dicing tape 6 and the glass substrate 8 corresponding to the component 7. The electrode (transfer position) provided on the component mounting surface 8a is aligned.

  The head 5 (corresponding to the “pressing means” and “pressing body” of the present invention) is provided below the support means 2 and can be moved in the vertical direction (arrow Z direction) by an actuator such as an air cylinder or a linear motor. Is formed. The head 5 is in a state in which the alignment between the bump 7a of the component 7 to be transferred and the electrode provided on the component mounting surface 8a of the glass substrate 8 corresponding to the component 7 is completed by the alignment table 23. Then, the glass substrate 8 is driven upward, and the component 7 is pressed and joined to the component mounting surface 8a of the upper glass substrate 8 from the back surface side of the dicing tape 6 by the pressing surface 5a provided at the tip. Thus, the component 7 is transferred from the dicing tape 6 to a predetermined transfer position on the component mounting surface 8 a of the glass substrate 8.

  Further, the pressing surface 5 a provided in a convex shape at the tip of the head 5 is used to mount another component 7 held around the component 7 to be transferred on the holding surface of the dicing tape 6 on the component mounting surface of the glass substrate 8. In order not to be pressed against 8a, it is formed in an area that is substantially the same as or slightly smaller than the area of the back surface of the component 7 (attachment surface with the dicing tape 6).

  Further, the suction surface 51a that presses the component 7 of the head 5 is provided with a suction hole 51a, and suction is performed by a suction means such as a vacuum pump (not shown) from the suction hole 51b communicating with the suction hole 51a. 5 can adsorb the back surface of the dicing tape 6 to the pressing surface 5a at the tip. Further, a space 52 communicating with the suction hole 51a and the suction hole 51b is provided at the tip portion of the head 5, and an optical path changing means 53 formed by a prism, a mirror or the like is disposed in the space 52. Has been. Then, the ultraviolet rays from the ultraviolet lamp (not shown) are projected from the side of the head 5 onto the optical path changing means 53 disposed in the space 52, so that the ultraviolet rays are passed through the optical path changing means 53. Irradiation is performed on the UV-type pressure-sensitive adhesive forming the pressure-sensitive adhesive layer.

  Therefore, when the component 7 to be transferred is pressed against the component mounting surface 8a of the glass substrate 8 by the pressing surface 5a of the head 5, the ultraviolet rays that form the adhesive layer of the portion of the dicing tape 6 where the component 7 is held. By irradiating the mold adhesive with ultraviolet light, the adhesiveness of the adhesive layer in the portion irradiated with ultraviolet light is lost, and the part 7 is stuck to the adhesive layer. As described above, the “ultraviolet irradiation portion” of the present invention is formed by the ultraviolet lamp and the optical path changing means 53.

  In this embodiment, the bump 7a provided on the component 7 and the electrode provided on the component mounting surface 8a of the glass substrate 8 are made of ultraviolet curable conductive material using ultraviolet light from the ultraviolet irradiation unit. Although bonding is performed using an adhesive, bonding may be performed using a thermosetting conductive adhesive or solder by providing the head 5 with a heating unit such as a heater. Further, by forming the head 5 with a resonator, by applying ultrasonic vibration, the bumps 7a provided on the component 7 and the electrodes provided on the component mounting surface 8a of the glass substrate 8 are joined. Also good.

  Further, the bump 7a provided on the component 7 and the electrode provided on the component mounting surface 8a of the glass substrate 8 may be pressure-bonded by simply pressurizing, and any generally employed bonding is possible. The bump 7a and the electrode may be joined using a method. The bumps 7a and the electrodes need not necessarily be joined. An adhesive layer is provided on the surface of the glass substrate 8, and the component 7 is attached to the adhesive layer to transfer the component 7 from the dicing tape 6 to the glass substrate 8. The component 7 is transferred from the dicing tape 6 to the glass substrate 8 by releasing the sticking state of the component 7 by the adhesive layer on the holding surface of the dicing tape 6 at the same time as placing the component 7 on the surface of the glass substrate 8. It may be listed.

(Parts transfer process)
Next, an example of a component transfer process for transferring the component 7 to a predetermined transfer position on the glass substrate 8 executed in the component transfer apparatus 1 will be described.

  First, the support means 2 is opened, and in the wafer mounting process, the dicing tape 6 that holds the plurality of components 7 having the bumps 7a on the holding surface is supplied to the second support portion 22 and is sucked and supported (step). S1, FIGS. 3, 4). Next, in the substrate placing step, the glass substrate 8 provided with a plurality of electrodes at predetermined transfer positions corresponding to each component 7 is supplied to the alignment table 23 and held by suction (step S2, 5), the first support portion 21 is rotated from the second position to the first position in the direction of the one-dot chain line arrow in FIG. 6 with the rotation shaft 24 as the center of rotation. Is closed, and the dicing tape 6 and the glass substrate 8 are arranged to face each other (step S3, FIG. 6).

  Subsequently, in the transfer component recognition step, each component 7 is illuminated by the illumination unit 41 a of the first camera 41, and the transfer target component 7 (hereinafter referred to as “the component 7” hereinafter). ) Is recognized (step S4, FIG. 7). Then, in the transfer component suction step, the XY table 3 is driven based on the recognition result in the transfer component recognition step and the position of the support means 2 is adjusted, so that the component 7 is moved to the pressing surface 5 a of the head 5. When the head 5 is driven upward and suction is performed from the suction hole 51b, the component 7 is attracted to the pressing surface 5a from the back side of the dicing tape 6 (step S5, FIG. 8). ).

  Next, in the proximity process, as shown in the enlarged view within the dotted line in FIG. 9, the head 5 is driven further upward to mount the bump 7 a of the component 7 and the component mounting of the glass substrate 8. The component 7 and the glass substrate 8 are arranged close to each other so that the distance D from the surface 8a is within the focal depth of the second camera 42, for example, 50 μm or less (step S6). Subsequently, in the alignment step, the component 7 and the glass substrate 8 are illuminated by the illumination unit 42 a of the second camera 42, and the alignment mark provided on the component 7 and the glass substrate corresponding to the component 7 are used. The alignment mark corresponding to the electrode formed on the component mounting surface 8a is simultaneously recognized by the second camera 42, and the alignment table 23 is driven based on the recognition result of the second camera 42. The bumps 7a of the component 7 and the electrodes formed on the component mounting surface 8a of the glass substrate 8 corresponding to the component 7 are aligned (step S7, FIG. 10).

  Then, in the transfer process, as shown in the enlarged view within the dotted line in FIG. 11, the head 5 is driven further upward, so that the component 7 is transferred to the component mounting surface 8 a of the glass substrate 8. The portion of the adhesive layer that holds the component 7 of the adhesive layer that forms the holding surface of the dicing tape 6 is irradiated with the ultraviolet light L that is pressed by the pressing surface 5 a and projected onto the optical path changing means 53. Therefore, the component 7 pressed by the pressing surface 5 a of the head 5 is bonded to a predetermined transfer position on the component mounting surface 8 a of the glass substrate 8, and the component 7 is adhered by the adhesive layer of the dicing tape 6. The state is released (step S8).

  Then, as shown in the enlarged view within the dotted line in FIG. 12, the head 5 is driven downward while maintaining the suction state of the dicing tape 6 by the pressing surface 5a, whereby the dicing tape sucked to the pressing surface 5a. 6 moves downward and the component 7 bonded to the component mounting surface 8a of the glass substrate 8 is peeled off from the holding surface of the dicing tape 6. When the separation between the component 7 and the holding surface of the dicing tape 6 is completed, the suction state of the dicing tape 6 by the pressing surface 5a is released, and the head 5 is returned to the standby position set below the support means 2 This completes the process.

  As described above, according to this embodiment, the plurality of components 7 held on the holding surface of the dicing tape 6 are provided with electrodes corresponding to the respective components 7 on the component mounting surface 8a of the glass substrate 8. Is held on the dicing tape 6 in a state where the holding surface of the dicing tape 6 and the component mounting surface 8a of the glass substrate 8 are supported to face each other. The component 7 to be transferred and the transfer position provided on the component mounting surface 8a of the glass substrate 8 corresponding to the component 7 are aligned, and the component 7 held on the dicing tape 6 is aligned with the glass substrate 8. The component 7 is pressed from the component mounting surface 8a and transferred to the transfer position provided on the component mounting surface 8a of the glass substrate 8 from the dicing tape 6, so that the component 7 from the holding surface of the dicing tape 6 is transferred. Take Out when, will be placing the move to the component mounting surface 8a of the glass substrate 8 was taken out part 7 is performed in the same process, it is possible to shorten the processing time.

  A plurality of parts 7 are stuck and held on the holding surface of the dicing tape 6 by an adhesive layer formed of an ultraviolet-type adhesive that loses its adhesiveness due to ultraviolet rays. When the component mounting surface 8a of the glass substrate 8 is pressed, ultraviolet light is irradiated to a portion of the ultraviolet adhesive that holds the component 7 and the adhesiveness is lost. Since the attached state is released, the component 7 can be efficiently taken out from the holding surface of the dicing tape 6 and transferred to the transfer position provided on the component mounting surface 8 a of the glass substrate 8.

  In addition, a plurality of IC chips obtained by dicing the wafer as the component 7 are stuck and held on the holding surface of the dicing tape 6 on which the holding surface is formed by providing an adhesive on the surface of the sheet-like member. When the component 7 to be transferred is transferred to the predetermined mounting position corresponding to each component 7 on the component mounting surface 8a of the glass substrate 8, the component 7 Since the pressing surface 5a of the head 5 is pressed and joined to the component mounting surface 8a of the glass substrate 8, it is transferred at the same time, so it is very practical.

  Moreover, even when the wafer adhered to the holding surface of the dicing tape 6 is diced into a plurality of IC chips (components 7), even if the wafer chips remain on the dicing tape 6, Since the dicing tape 6 supported by the second support portion 22 is disposed below the glass substrate 8 supported by the alignment table 23, the wafer chips remaining on the dicing tape 6 are mounted on the glass substrate 8 as component parts. It can prevent falling and adhering to the surface 8a.

  Further, in the conventional apparatus, when a plurality of components 7 that are adhesively held on the holding surface of the dicing tape 6 and provided with bumps 7a on the surface are transferred to the glass substrate 8, the components individually taken out from the dicing tape 6 7 must be reversed by flip chip (reversing) means and mounted on the component mounting surface 8 a of the glass substrate 8. However, in this embodiment, the bump 7a forming surface of the component 7 and the component mounting surface 8a of the glass substrate 8 are supported by the support means 2 so as to face each other, and the component 7 is supported by the head 5 on the component mounting surface 8a. , The removal of the component 7 from the dicing tape 6 and the transfer of the component 7 to the component mounting surface 8a are performed almost simultaneously. Therefore, it is not necessary to invert the component 7 taken out from the dicing tape 6 and no flip chip means is required, so that the apparatus cost can be reduced. In addition, since the process of inverting the component 7 taken out from the dicing tape 6 is not necessary, the processing time for transferring the component 7 from the dicing tape 6 to the glass substrate 8 can be greatly shortened.

Second Embodiment
A second embodiment of the present invention will be described with reference to FIGS. FIG. 13 is an enlarged view of an essential part showing a second embodiment of the component transfer apparatus of the present invention. 14 to 20 are diagrams illustrating an example of the component transfer process. FIG. 14 is a diagram illustrating a transfer component recognition process, FIG. 15 is a diagram illustrating a transfer component suction process, and FIG. FIG. 17 is a diagram illustrating the proximity process, FIG. 17 is a diagram illustrating the positioning process, FIG. 18 is a diagram illustrating the transfer process, and FIG. 19 is a diagram illustrating a state immediately after the pressing on the transfer component is released. FIG. 20 is a diagram illustrating a state in which the component transfer process is completed.

  This embodiment is different from the first embodiment described above in that the configuration of the head 105 (corresponding to “pressing means, pressing body” of the present invention) is different as shown in FIG. Since other configurations and operations are the same as those in the first embodiment described above, the description of the configurations and operations will be omitted by citing the same reference numerals.

  As shown in FIG. 13, a convex pressing surface 105 a that presses the component 7 against the component mounting surface 8 a of the glass substrate 8 is provided at the tip of the head 105. A receiving hole 154 is formed at a substantially central portion of the pressing surface 105 a, and a protruding pin 155 that protrudes and retracts from the receiving hole 154 and a protruding pin 155 protrudes from the receiving hole 154 into the receiving hole 154. And an urging means 156 formed by a coil spring, an air cylinder, a hydraulic cylinder, or the like that urges in the direction in which the projection pin 155 is urged. In this state, it is accommodated in the accommodation hole 154.

  Therefore, when the component 7 to be transferred is pressed against the component mounting surface 8a of the glass substrate 8 from the back surface side of the dicing tape 6 by the pressing surface 105a of the head 105, the receiving hole 154 is applied by the urging force of the urging means 156. Since the component 7 to be transferred is projected upward from the back surface side of the dicing tape 6 at the tip of the projecting pin 155 projecting from the sticking state, the pasting state of the component 7 by the adhesive is released.

  Further, a concave curved surface 157a is formed at the rear end of the tip portion of the head 105, and a convex curved surface 157b is formed at the base tip of the head 105, so that the concave curved surface 157a and the convex curved surface 157b can be slidably contacted. A copying mechanism 157 is formed by attaching the tip portion to the base of the head 105. Therefore, for example, the inclination of the pressing surface 105a can be adjusted according to the inclination of the component mounting surface 8a of the glass substrate 8 by the copying mechanism 157 by the sliding contact between the concave curved surface 157a and the convex curved surface 157b. Further, a suction hole 151a is formed in the projecting pin 155, and the suction surface 151b communicating with the suction hole 151a is sucked by a suction means formed by a vacuum pump or the like, so that the dicing tape 6 is placed on the pressing surface 105a. The back surface can be adsorbed.

  Further, a suction hole 158a is formed in the flange portion 105b around the pressing surface 105a provided in a convex shape at the tip of the head 105, and suction is performed by suction means from the suction hole 158b communicating with the suction hole 158a. Thus, the peripheral portion of the portion adsorbed by the adsorption hole 151a on the back surface of the dicing tape 6 is sucked. That is, when the component 7 to be transferred is pressed from the back surface side of the dicing tape 6 to the component mounting surface 8a of the glass substrate 8 by the pressing surface 105a of the head 105, the suction is performed from the suction hole 158b communicating with the suction hole 158a. When suction is performed by means, the peripheral portion of the component 7 is sucked from the back surface side of the dicing tape 6 and is sucked into the suction hole 158a, so that the peripheral portion of the component 7 of the dicing tape 6 is mounted on the component of the glass substrate 8. It is maintained in a state of being separated from the surface 8a. As described above, the “suction part” of the present invention is configured by the suction means (not shown), the suction hole 158a, and the suction hole 158b.

  In this embodiment, the pressure-sensitive adhesive that forms the holding surface of the dicing tape 6 may not be an ultraviolet-type pressure-sensitive adhesive, and the holding surface of the dicing tape 6 is formed using a general pressure-sensitive type pressure-sensitive adhesive. May be.

  Next, a component transfer process for transferring the component 7 to a predetermined transfer position of the glass substrate 8 executed in this embodiment will be described focusing on differences from the above-described first embodiment.

  First, after the wafer placement process (step S1) to the opposing placement process (step S3) are performed, the illumination unit 41a of the first camera 41 is used in the transfer component recognition process, as in the first embodiment described above. Thus, each component 7 is illuminated, and the first camera 41 recognizes the component 7 to be transferred (hereinafter referred to as “the component 7”) (step S4, FIG. 13). Then, in the transfer component suction step, the XY table 3 is driven based on the recognition result in the transfer component recognition step and the position of the support means 2 is adjusted, so that the component 7 moves to the pressing surface 105a of the head 105. When the head 105 is driven upward and suction is performed from the suction hole 151b, the component 7 is attracted to the tip of the projecting pin 155 from the back side of the dicing tape 6 (step S5, FIG. 15).

  Next, in the proximity process, as shown in the enlarged view in the dotted line in FIG. 16, the head 105 is driven further upward to mount the bump 7 a of the component 7 and the component mounting of the glass substrate 8. The component 7 and the glass substrate 8 are arranged close to each other so that the distance D to the surface 8a is within the focal depth of the second camera 42, for example, 50 μm or less, and suction is performed from the suction hole 158b. The peripheral portion of the component 7 is sucked from the back side of the dicing tape 6 and sucked into the suction hole 158a. At this time, the part 7 is protruded upward from the back side of the dicing tape by the tip of the protruding pin 155, and the sticking state of the part 7 by the adhesive is partially released (step S6).

  Subsequently, in the alignment step, the component 7 and the glass substrate 8 are illuminated by the illumination unit 42 a of the second camera 42, and the alignment mark provided on the component 7 and the glass substrate corresponding to the component 7 are used. The alignment mark corresponding to the electrode formed on the component mounting surface 8a is simultaneously recognized by the second camera 42, and the alignment table 23 is driven based on the recognition result of the second camera 42. The bumps 7a of the component 7 and the electrodes formed on the component mounting surface 8a of the glass substrate 8 corresponding to the component 7 are aligned (step S7, FIG. 17).

  Next, in the transfer process, as shown in the enlarged view within the dotted line in FIG. 18, the head 105 is driven further upward, so that the protruding pin 155 moves against the urging force of the urging means 156. Then, the whole is accommodated in the accommodation hole 154, and the component 7 is pressed by the pressing surface 105 a to a predetermined transfer position on the component mounting surface 8 a of the glass substrate 8. In this embodiment, the component 7 pressed by the pressing surface 105a of the head 105 by being heated by a heater (not shown) provided in the head 105 is a predetermined part of the component mounting surface 8a of the glass substrate 8. The transfer position is joined by a thermosetting conductive adhesive (step S8).

  Subsequently, as shown in the enlarged view within the dotted line in FIG. 19, the head 105 is driven downward while maintaining the suction state of the dicing tape 6 by the suction holes 151 a and 158 a, so that the head 105 is housed in the housing hole 154. The protruding pin 155 is re-projected to project the component 7 from the back surface side of the dicing tape 6 so that the adhesive state of the component 7 by the adhesive is further released and the dicing that is adsorbed by the suction holes 151a and 158a. The tape 6 moves downward, and the component 7 bonded to the component mounting surface 8 a of the glass substrate 8 is peeled from the holding surface of the dicing tape 6. When the separation between the component 7 and the holding surface of the dicing tape 6 is completed, the suction state of the dicing tape 6 by the suction holes 151a and 158a is released, and the head 105 is set at a standby position set below the support means 2. The process is completed by moving back.

  As described above, in this embodiment, the same effects as those of the first embodiment described above can be achieved, and the following effects can be achieved. That is, the dicing tape 6 has a holding surface formed by providing an adhesive on the surface of a flexible sheet-like member, and the component 7 to be transferred is attached to the glass substrate 8 by the head 105. When pressed against the component mounting surface 8a, the peripheral portion of the component 7 of the dicing tape 6 is sucked from the back side of the dicing tape 6 by the suction hole 158a, and the peripheral portion of the component 7 is the component of the glass substrate 8. Since the component 7 is maintained in a state of being separated from the mounting surface 8a, there is no possibility that the components 7 around the component 7 come into contact with the glass substrate 8. Can be prevented from being transferred.

  Further, when the component 7 attached and held on the holding surface of the dicing tape 6 with the adhesive is pressed against the component mounting surface 8a of the glass substrate 8, the component 7 is removed from the dicing tape 6 by the protruding pins 155. Since the sticking state of the component 7 by the adhesive is released by the protrusion, the component 7 is efficiently removed from the holding surface of the dicing tape 6 and transferred to the component mounting surface 8a of the glass substrate 8. Can do.

<Third Embodiment>
A third embodiment of the present invention will be described with reference to FIGS. FIG. 21 is a diagram showing a transfer process of the component transfer process in the third embodiment of the component transfer apparatus of the present invention. FIG. 22 is a diagram illustrating a state in which the component transfer process is completed in the transfer apparatus of FIG.

  This embodiment differs from the first and second embodiments described above in that an alignment table 23 is provided on the second support portion 22 and the dicing tape 6 is provided on the first support portion 21 as shown in FIG. The substrate 8 is supported by the alignment table 23. Unlike the first and second embodiments described above, the first support portion 21 has an opening 221a, and the second support portion 22 has a transmission window 222a made of transparent quartz glass or the like. . Further, similarly to the above-described embodiment, the suction surface 251a is formed with a suction hole 251a at the tip of the head 205, and by performing suction from the suction hole 251b communicating with the suction hole 251a, dicing is performed on the pressure surface 205a. The back surface of the tape 6 can be adsorbed.

  Further, the head 205 (corresponding to “pressing means” and “pressing body” of the present invention) is provided with a copying mechanism 257 by sliding the concavo-convex surface as in the second embodiment described above. In this embodiment, the head 205 and the first camera 41 are disposed above the support unit 2, and the second camera 42 is disposed below the support unit 2. Since other configurations and operations are the same as those in the first embodiment described above, the description of the configurations and operations will be omitted by citing the same reference numerals.

  Also in the component transfer apparatus 1 configured as described above, the component transfer process is executed in the same manner as in the above-described embodiment.

  That is, as in the above-described embodiment, after the wafer placement process (step S1) to the alignment process (step S7) are performed, in the transfer process, as shown in the enlarged view within the dotted line in FIG. When the head 205 is further driven downward, the component 7 is pressed to a predetermined transfer position on the component mounting surface 8a of the glass substrate 8 by the pressing surface 205a, and the head 205 is not shown. When heated by the heater, the component 7 pressed by the pressing surface 205a of the head 205 is joined to a predetermined transfer position on the component mounting surface 8a of the glass substrate 8 by a thermosetting conductive adhesive ( Step S8).

  Then, as shown in the enlarged view within the dotted line in FIG. 22, the dicing tape attracted to the pressing surface 205a is driven by driving the head 205 upward while maintaining the attracting state of the dicing tape 6 to the pressing surface 205a. 6 moves upward and the component 7 bonded to the component mounting surface 8a of the glass substrate 8 is peeled off from the holding surface of the dicing tape 6. When the separation between the component 7 and the holding surface of the dicing tape 6 is completed, the suction state of the dicing tape 6 by the pressing surface 205a (the suction hole 251a) is released, and the head 205 is set above the support means 2. The process ends by returning to the standby position.

  As described above, in this embodiment, the same effects as those of the first embodiment described above can be obtained.

Note that the present invention is not limited to the above-described embodiment, and various modifications other than those described above can be made without departing from the spirit of the present invention. As long as it does not deviate from the above, any combination may be used. The holding surface of the dicing tape 6 of the component 7 by the adhesive by the position adjusting mechanism such as the XY table 3 and the alignment table 23, the projecting pin 155 and the ultraviolet irradiation unit, etc. You may combine the function etc. which cancel | release the sticking state to any way.

  Further, the number of parts 7 transferred from the first holding body (dicing tape 6) to the second holding body (glass substrate 8) is not limited to one, and two or more parts are transferred simultaneously. You may comprise so that it may carry.

  In the embodiment described above, electrodes are provided on the component mounting surface 8 a of the glass substrate 8, and bumps provided on the component 7 when the component 7 is transferred to the component mounting surface 8 a of the glass substrate 8. Although the component transfer process has been described by giving an example of electrically joining the electrode of 7a and the component mounting surface 8a, an adhesive layer made of an adhesive is provided on the component mounting surface 8a of the glass substrate 8 on which no electrode is provided. In the component transfer process, the component 7 having the bump 7a can be transferred to the adhesive layer of the component mounting surface 8a by face-up or face-down. That is, the component transfer process does not have to be for the purpose of electrical connection between the component held by the first holding body and the second holding body such as the glass substrate 8. In this case, the part held by the first holding body may simply be placed on the second holding body, or the part may be transferred to the second holding body by an insulating adhesive or adhesive. You may just stick on a mounting surface, or just join by heating or ultrasonic vibration.

  In addition, the first holding body and the second holding body are not limited to the above-described example, and a chip tray on which a plurality of components are arranged is adopted as the first holding body, or from a wafer or an organic material. A rigid substrate, a flexible substrate, a ceramic substrate, or the like may be used as the second holding body. When the chip tray is adopted as the first holding body, each part of the chip tray is placed with a hole for pressing the component 7 from the back side of the chip tray to the second holding body by the pressing means. It is good to provide in the bottom face of an accommodating part. In addition, the component to be transferred does not necessarily need to be an electronic component having an electrical function, and the first holding unit and the component can be selected by selecting the first and second holding bodies according to the purpose. Various components held by the body can be transferred to the second holding body.

  In the above-described embodiment, the transfer target component 7 is recognized by the first camera 41. However, the transfer target component 7 is recognized by the second camera 42 without providing the first camera 41. May be. Further, without providing the first camera 41, map data including the position information of the defective product of the component 7 held on the first holding body (dicing tape 6) is acquired in advance, and the map data is included in the map data. Based on this, it may be controlled that the component 7 to be transferred is disposed above the head 5.

  In the embodiment described above, the transmission windows 21a, 23a, and 222a are formed of transparent quartz glass. However, instead of providing the transmission windows 21a, 23a, and 222a, openings similar to the openings 22a and 221a may be formed. Good. Further, the openings may be formed only partially at positions corresponding to the alignment marks so that the alignment marks provided on the component 7 and the glass substrate 8 can be recognized.

  In the embodiment described above, the alignment marks of the component 7 and the glass substrate 8 are recognized using the first and second cameras 41 and 42 having sensitivity in the visible light region. When the holder and the component are formed of a member that transmits infrared rays, for example, a semiconductor such as GaAs or Si, the alignment mark provided on the component and the second holder is recognized using an infrared camera. Also good.

  Further, by providing a copying mechanism or the like, the inclination of the alignment table 23 that supports the second holding body may be adjusted.

  Furthermore, in the above-described embodiment, the first and second holding bodies are arranged in the vertical direction (the direction of the arrow Z shown in FIG. 1). However, the arrangement direction of the first and second holding bodies is limited to this. Instead, they may be arranged in the left-right direction substantially perpendicular to the up-down direction.

  The configuration of the support means 2 is not limited to the example in which the first and second support portions 21 and 22 are connected in a hinge shape, and the first and second holding bodies face each other. Any configuration may be used as long as it can be supported. For example, by configuring at least one of a first support part that supports the first holding body and a second support part that supports the second holding body to be slidable, the first and second holding bodies The support means 2 may be configured to be switchable between a state where the two are opposed to each other and a state where the first and second holding bodies are not opposed to each other. Also, a first support part for supporting the first holding body and a second support part for supporting the second holding body are provided separately, and the first and second holding bodies are simply overlapped with screws or You may comprise the support means 2 so that the 1st, 2nd holding body may oppose by fastening with a volt | bolt.

  A component transfer device that transfers a plurality of components held on the holding surface of the first holding body to a predetermined transfer position determined in advance corresponding to each component on the second holding body. The present invention can be widely applied.

DESCRIPTION OF SYMBOLS 1 ... Component transfer apparatus 2 ... Support means 23 ... Alignment table (positioning means)
5, 105, 205... Head (pressing means, pressing body)
53. Optical path changing means (ultraviolet irradiation part)
6. Dicing tape (first holding body)
7 ... Parts 8 ... Glass substrate (second holder)
154 ... Accommodating hole 155 ... Protruding pin 156 ... Biasing means 158a ... Adsorption hole (suction part)
158b ... Suction hole (suction part)

Claims (10)

In the component transfer apparatus for transferring a plurality of components held on the holding surface of the first holding body to a predetermined transfer position determined in advance corresponding to each component on the second holding body,
Supporting means for supporting the first and second holding bodies in a state of facing each other;
In a state where the first and second holding bodies are supported by the support means, the part held by the first holding body is transferred to the transfer position of the second holding body corresponding to the part. Alignment means for aligning with,
In a state where the alignment by the alignment means is completed, the part held on the holding surface of the first holding body is pressed against the second holding body, and the part is removed from the first holding body. A component transfer apparatus comprising: a pressing unit that transfers the transfer position to the transfer position of the second holding body. The plurality of parts are adhered and held by an adhesive on the holding surface of the first holding body,
2. The component transfer according to claim 1, wherein the pressing unit has a function of canceling a sticking state of the component by the adhesive when the component is pressed against the second holding body. apparatus. The pressure-sensitive adhesive is composed of an ultraviolet-type pressure-sensitive adhesive that loses its adhesiveness due to ultraviolet rays,
3. The component transfer apparatus according to claim 2, wherein the pressing unit includes an ultraviolet irradiation unit that irradiates the ultraviolet type adhesive with ultraviolet rays to release the attached state of the component. The pressing means is
A pressing body for pressing the component;
A receiving hole provided in a portion for pressing the component of the pressing body;
A projecting pin provided so as to freely appear and retract in the accommodation hole;
Urging means for urging the projecting pin in a direction projecting from the accommodation hole,
The sticking state of the component by the adhesive is released by protruding the component from the first holding body with the protruding pin protruding from the accommodation hole by the biasing force of the biasing means. The component transfer apparatus according to claim 2 or 3.   5. The component transfer apparatus according to claim 1, wherein the pressing unit presses the component against the second holding body to perform bonding. 6. The first holding body is formed by forming the holding surface by providing the pressure-sensitive adhesive on the surface of a flexible sheet-like member,
The pressing means sucks the peripheral part of the part of the sheet-like member from the back side of the sheet-like member when the part is pressed against the second holding body, and the peripheral part is the second part. The component transfer apparatus according to claim 1, further comprising a suction section that maintains a state of being separated from the holding body. In the component transfer method for transferring a plurality of components held on the holding surface of the first holding body to a predetermined transfer position determined in advance corresponding to each component on the second holding body,
With the first and second holding bodies supported in opposition, the part held by the first holding body is moved to the transfer position of the second holding body corresponding to the part. An alignment process for alignment;
In a state where the alignment is completed, the part held by the first holding body is pressed against the second holding body, and the part is moved from the first holding body to the second holding body. A component transfer method comprising: a transfer step of transferring to the transfer position. A plurality of chips are bonded to the holding surface of the first holding body formed by providing the pressure-sensitive adhesive on the surface of the sheet-like member and the wafer is diced as the component. Held
The component transfer method according to claim 7, wherein, in the transfer step, the chip is transferred to the second holding body formed by the substrate while being pressed and bonded. The pressure-sensitive adhesive is composed of an ultraviolet-type pressure-sensitive adhesive that loses its adhesiveness due to ultraviolet rays,
In the transfer step, when the chip is pressed against the second holding body, the UV-type pressure-sensitive adhesive in the portion where the chip is held is irradiated with ultraviolet rays to lose the adhesiveness. The component transfer method according to claim 8, wherein the state of sticking of the component by the adhesive is released.   10. The component according to claim 8, wherein in the transfer step, the component is released from the adhesive state by the adhesive by protruding the component from the first holding body with a protruding pin. Transfer method.

Images