CN114929006A - Submicron chip mounter and using method thereof - Google Patents
Submicron chip mounter and using method thereof Download PDFInfo
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- CN114929006A CN114929006A CN202210645142.8A CN202210645142A CN114929006A CN 114929006 A CN114929006 A CN 114929006A CN 202210645142 A CN202210645142 A CN 202210645142A CN 114929006 A CN114929006 A CN 114929006A
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- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 7
- 230000008569 process Effects 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 6
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 4
- 239000001257 hydrogen Substances 0.000 claims description 4
- 229910052739 hydrogen Inorganic materials 0.000 claims description 4
- 230000002159 abnormal effect Effects 0.000 claims description 3
- 238000006073 displacement reaction Methods 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- 241000755266 Kathetostoma giganteum Species 0.000 claims 1
- 238000012545 processing Methods 0.000 abstract description 6
- 230000003287 optical effect Effects 0.000 description 4
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/0409—Sucking devices
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0465—Surface mounting by soldering
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
Abstract
The invention discloses a submicron chip mounter which comprises an outer casing, a plurality of gas cylinder interfaces and a control power supply, wherein a mounting groove is formed in the center line of the outer casing, the mounting groove is provided with the plurality of gas cylinder interfaces, the control power supply is mounted on one side of the outer casing, a pair of operation stations are symmetrically arranged on two sides of the outer casing, and a pair of symmetrical chip mounting mechanisms are arranged on the pair of operation stations; the submicron chip mounter and the using method thereof have the advantages that the chip mounter adopts a pair of symmetrical chip mounting mechanisms, and the double-station mode is adopted for operation, so that the processing speed of the chip mounter is improved, and in order to improve the fine tuning precision, a multi-stage speed reduction fine tuning structure is adopted, and through multi-stage speed reduction, the adjusting speed is slower, the adjusting precision is higher, the use is simple, and the operation is convenient.
Description
Technical Field
The invention relates to the technical field of chip mounters, in particular to a submicron chip mounter and a using method thereof.
Background
Submicron chip mounters are generally used for bonding submicron chips, and most of the submicron chip mounters at the present stage adopt a negative pressure structure to attract chips, and then perform a mounting operation in various forms such as hot-press welding.
In the optical research equipment application at the present stage, with the progress of electronic technology, the integrated circuit is made smaller and smaller, so the submicron chip mounter is also widely applied to the production of the optical research equipment, two chips which are most commonly applied in the production of the optical research equipment are TX chips and DFB chips, and the submicron chip mounter is mostly used for thermally bonding and processing the two chips in the production of the optical research equipment.
In the application process of the submicron chip mounter in the present stage, the amplifying sight glass is mostly adopted to manually align the chip, and only one operation station is usually provided, so that the operation efficiency is low, and meanwhile, because the micro adjustment mostly adopts the direct adjustment effect of the screw thread, the error of fine adjustment of the position can be caused by large action amplitude in the adjustment process.
Disclosure of Invention
The invention aims to solve the problems, designs a submicron chip mounter and a using method thereof, and solves the problems of the prior art.
The technical scheme of the invention for realizing the aim is as follows: a submicron chip mounter comprises an outer casing, a plurality of gas cylinder interfaces and a control power supply, wherein a mounting groove is formed in the center line of the outer casing, the mounting groove is provided with the plurality of gas cylinder interfaces, the control power supply is mounted on one side of the outer casing, a pair of operation stations are symmetrically arranged on two sides of the outer casing, and a pair of symmetrical chip mounting mechanisms are arranged on the pair of operation stations;
the surface mounting mechanism comprises a supporting table board and a suction nozzle which is arranged corresponding to the upper part of the supporting table board, a feeding device is arranged on the supporting table board, and a multi-stage speed-reducing fine-tuning structure is respectively arranged on the supporting table board and the suction nozzle;
the multistage deceleration fine adjustment structure comprises: the device comprises a pair of supporting seats, a sliding clamp, an adjusting threaded rod, a first bevel gear, a second bevel gear, a rotating shaft, an adjusting worm wheel and an adjusting worm;
be provided with a pair of supporting seat on the support mesa, be provided with slide jig on the support mesa, slide jig thread bush is located adjusting threaded rod, and is a pair of movable mounting has adjusting threaded rod on the supporting seat, adjusting threaded rod's tip and one of a pair of one of them supporting seat relatively fixed, adjusting threaded rod's tip is provided with first bevel gear, one side meshing of first bevel gear is connected with the second bevel gear, the cover is located one of axis of rotation on the second bevel gear and is served, the other end of axis of rotation is connected with the regulation worm wheel, the bottom of adjusting the worm wheel is connected with the regulation worm and adjusts the worm wheel meshing, the regulation worm link up the support mesa.
The end part of the adjusting worm is connected with an adjusting knob, and the axial direction of the adjusting worm is parallel to the moving direction of the sliding clamp.
And a pair of operation grooves are respectively formed in two sides of the outer shell and are respectively connected with the supporting table board.
The bottom surface of the sliding clamp is provided with a pair of parallel sliding grooves, and the supporting table surface is provided with a pair of sliding blocks matched with the sliding grooves.
And the pair of sliding blocks is parallel to the axis of the adjusting threaded rod.
The gas cylinder structure comprises an outer shell, a plurality of gas cylinder interfaces and a plurality of gas cylinders, wherein a mounting groove is formed in the central axis of the outer shell, the plurality of gas cylinder interfaces are respectively provided with a halving interface, and the plurality of gas cylinders are structurally connected with the plurality of gas cylinders.
The pair of the branch interfaces are respectively connected to the suction nozzles on the two sides.
And a pair of movable control foot pedals are respectively arranged on the inner side wall surfaces of the pair of operation stations.
A use method of a submicron chip mounter comprises the following steps: step S1, pre-production check, step S2, startup, step S3, mixed gas initialization, step S4, DFB chip alignment, step S5, TX chip alignment, step S6, step S7;
step S1: whether a power switch of the equipment normally operates is checked, whether the equipment switch is in a closed state is checked before the equipment switch is used, whether the emergency stop switch can normally operate is confirmed, whether the equipment has an abnormal condition or not, and whether a machine abnormally sounds or not are confirmed;
step S2: sequentially turning on equipment and a computer power switch, double-clicking a software icon, entering a login interface, selecting a mode, and inputting a login password;
step S3: opening a switch of mixed gas (hydrogen and nitrogen are provided by an inflation gas bottle), clicking for initialization to enable an indicated value of the inside and the outside to be 2, and waiting for the initialization of the equipment to be completed;
step S4: holding the console by two hands, and treading down the pedal to move the console out; carefully taking down a DFB chip by using a wide flat clamp and placing the DFB chip on a white transparent shell, wherein the side surface of the clamp does not clamp two sides of a waveguide, adjusting the horizontal position of the DFB chip by using an insulating tweezers clamp and placing the DFB chip on a control console, stepping down the control console pedal to enable red light to be aligned with the DFB, loosening the pedal in a light reflecting state, completely aligning a red point, observing a picture to adjust a Z-axis handle, focusing and aligning, enabling the DFB chip to be aligned with a middle circle of a suction nozzle, clicking an automatic suction mode of the suction nozzle of software, enabling the suction nozzle head to start sucking the DFB, sucking the DFB chip onto the suction nozzle by using an operating device at the moment, checking the direction of the DFB chip, clicking the right side of a triangle to be not on the right side, putting down the DFB, and adjusting the position to suck again;
step S5: holding the console by two hands, and treading down a pedal of the console to move the console out; clamping a TX chip by using a wide flat head forceps, placing the TX chip on a console and aligning to a cross small hole on the console, stepping down a pedal of the console to move the console so as to enable red light to align to the TX chip, and then loosening the pedal; observing a chip picture, adjusting a Z-axis handle to enable the TX chip to be clear, clicking a bottom plate on software to lock, and enabling a console to suck the TX chip; moving a heated cover of the console to align a hole in the cover with the center of the TX;
step S6: adjusting a sucker knob to enable the DFB to be horizontal, selecting a No. 7 line by referring to the auxiliary line, adjusting the position of the DFB, aligning to a channel gap and reserving a space for vibration displacement of a machine table, wherein the space is close to the edge of the DFB; adjusting X and Y axes according to the Objects of the menu bar to align the DFB with the corresponding auxiliary line, stepping on the pedal to move the console to align the chip with the green-blue auxiliary line better, aligning the red line on the right with the channel, and keeping the waveguide from skewing; the blue lines on the right side are aligned with the blue lines of the 4 + character circles and need to be vertically overlapped; manually moving the console to level the TX chip; referring to the auxiliary line aligned with the DFB, adjusting the X axis and then adjusting the Y axis to align the TX chip and the DFB chip;
step S7: controlling the temperature of the control console and the suction nozzle head to be closed, canceling a chip locking button, scratching a heating cover plate, taking out the attached chip by using an insulated sharp-nose tweezers, taking out the attached chip, attaching ID (identity) labels, and storing the ID labels into a sample cabinet in sequence; in the process, the upper side and the lower side of the chip can be only clamped by the insulating tweezers, so that the chip is prevented from being damaged and subsequent observation is not influenced.
The submicron chip mounter manufactured by the technical scheme of the invention and the use method thereof are characterized in that the chip mounter adopts a pair of symmetrical chip mounting mechanisms, and adopts a double-station mode to operate, so that the processing speed of the chip mounter is improved, and in order to improve the fine tuning precision, a multi-stage speed reduction fine tuning structure is adopted, and multi-stage speed reduction is carried out, so that the adjusting speed is slower, the adjusting precision is higher, the use is simple, and the operation is convenient.
Drawings
Fig. 1 is a schematic front view of a sub-micron chip mounter and a method for using the same according to the present invention.
Fig. 2 is a schematic side view of a sub-micron chip mounter and a method for using the same according to the present invention.
Fig. 3 is a schematic top view of a sub-micron chip mounter and a method for using the same according to the present invention.
Fig. 4 is a schematic structural diagram of a multi-stage deceleration fine-tuning structure of a submicron chip mounter and a using method thereof according to the present invention.
Fig. 5 is a schematic view of a partially enlarged structure of a submicron chip mounter and a method for using the same according to the present invention.
In the figure: 1. an outer housing; 2. a gas cylinder interface; 3. controlling a power supply; 4. supporting the table top; 5. a suction nozzle; 6. a feeding device; 7. a supporting seat; 8. a sliding jig; 9. adjusting the threaded rod; 10. a first bevel gear; 11. a second bevel gear; 12. a rotating shaft; 13. adjusting the worm gear; 14. adjusting the worm; 15. adjusting a knob; 16. a slider; 17. an inflatable gas cylinder; 18. dividing an interface; 19. the foot pedal is controlled.
Detailed Description
The invention is described in detail below with reference to the drawings, as shown in fig. 1-5.
All the electrical components in the present application are connected with the power supply adapted to the electrical components through the wires, and an appropriate controller should be selected according to actual conditions to meet the control requirements, and specific connection and control sequences should be obtained.
Example (b): according to the attached figures 1-5 of the specification, the submicron chip mounter comprises an outer casing 1, a plurality of gas cylinder interfaces 2 and a control power supply 3, wherein a mounting groove is formed in the center line of the outer casing 1, the plurality of gas cylinder interfaces 2 are arranged on the mounting groove, the control power supply 3 is mounted on one side of the outer casing 1, a pair of operation stations are symmetrically arranged on two sides of the outer casing 1, a pair of symmetrical chip mounting mechanisms are arranged on the pair of operation stations, in the specific implementation process, the outer casing 1 serves as a main body supporting and mounting platform of the device, the pair of operation stations on two sides of the outer casing 1 serves as an operation space for double-line operation, production gas supplies gas for the chip mounting mechanisms on two sides through the plurality of gas cylinder interfaces 2 respectively, and the control power supply 3 supplies power for the pair of chip mounting mechanisms;
as can be seen from fig. 1-5 of the specification, the chip mounting mechanism comprises a support table top 4 and a suction nozzle 5 arranged corresponding to the upper part of the support table top 4, wherein a feeding device 6 is arranged on the support table top 4, a multi-stage speed reduction fine adjustment structure is respectively arranged on the support table top 4 and the suction nozzle 5, the support table top 4 is used as an operation platform of a processing station, a chip is fed to the processing station through the feeding device 6, the suction nozzle 5 is used for sucking the chip at the upper part, and the chip at the lower part passes through the support table top 4;
as can be seen from fig. 1 to 4 of the specification, the multi-stage deceleration fine adjustment structure includes: a pair of supporting seats 7, a sliding clamp 8, an adjusting threaded rod 9, a first bevel gear 10, a second bevel gear 11, a rotating shaft 12, an adjusting worm wheel 13 and an adjusting worm 14, wherein the connection relationship and the position relationship are as follows;
a pair of supporting seats 7 are arranged on the supporting table top 4, a sliding clamp 8 is arranged on the supporting table top 4, the sliding clamp 8 is sleeved on an adjusting threaded rod 9 in a threaded manner, the adjusting threaded rod 9 is movably mounted on the pair of supporting seats 7, the end part of the adjusting threaded rod 9 is relatively fixed with one of the pair of supporting seats 7, a first bevel gear 10 is arranged at the end part of the adjusting threaded rod 9, a second bevel gear 11 is meshed and connected to one side of the first bevel gear 10, the second bevel gear 11 is sleeved on one end of a rotating shaft 12, the other end of the rotating shaft 12 is connected with an adjusting worm wheel 13, an adjusting worm 14 is connected to the bottom of the adjusting worm wheel 13 and meshed with the adjusting worm wheel 13, and the adjusting worm 14 penetrates through the supporting table top 4;
in the specific implementation process, the sliding fixture 8 is used for clamping a chip at the bottom, the sliding fixture 8 is supported by the support table top 4, when fine adjustment is needed, the adjusting worm 14 is rotated to enable the adjusting worm 14 to be meshed with the adjusting worm wheel 13 and further drive the rotating shaft 12 to rotate, torque is transmitted to the second bevel gear 11 through the rotating shaft 12, the second bevel gear 11 is meshed with the first bevel gear 10, the first bevel gear 10 drives the adjusting threaded rod 9 to rotate, the adjusting threaded rod 9 is rotated, the adjusting threaded rod 9 is meshed with the sliding fixture 8, the sliding fixture 8 is linearly displaced, the adjusting threaded rod 9 is movably mounted through the pair of support seats 7, the position of the adjusting threaded rod 9 is fixed correspondingly, and the adjusting threaded rod 9 can rotate at a fixed position.
An adjusting knob 15 is connected to the end of the adjusting worm 14, the axial direction of the adjusting worm 14 is parallel to the moving direction of the sliding fixture 8, and the adjusting knob 15 is used as a rotating element of the adjusting worm 14.
A pair of operation grooves are formed in two sides of the outer shell 1 respectively and are connected with the supporting table board 4 respectively, and the operation grooves and the supporting table board 4 form enclosure of the operation platform.
The bottom surface of the sliding clamp 8 is provided with a pair of parallel sliding grooves, and the supporting table top 4 is provided with a pair of sliding blocks 16 matched with the sliding grooves to limit the sliding direction of the sliding clamp 8.
The pair of sliders 16 is parallel to the axis of the adjusting screw 9, and slides the slide jig 8 in a predetermined direction.
The mounting groove has been seted up on the center axis of outer casing 1, is provided with one on a plurality of gas cylinder interfaces 2 respectively and divides the interface 18, and a plurality of gas cylinders are connected with a plurality of gas cylinders 17 structurally, and a plurality of gas cylinders 17 intussuseption are filled with hydrogen and nitrogen gas, are a pair of paster mechanism air feed respectively through one to interface 18.
A pair of half interfaces 18 are respectively connected with the suction nozzles 5 on the two sides.
A pair of movable control foot pedals 19 are respectively arranged on the inner side wall surfaces of the pair of operation stations and are used for controlling the operation of the suction heads and the like.
The scheme also discloses a using method of the submicron chip mounter, which comprises the following steps:
the method comprises the following steps: whether a power switch of the equipment normally operates is checked, whether the equipment switch is in a closed state is checked before the equipment switch is used, whether the emergency stop switch can normally operate is confirmed, whether the equipment has an abnormal condition or not, and whether a machine abnormally sounds or not are confirmed;
step two: sequentially turning on equipment and a computer power switch, double-clicking a software icon, entering a login interface, selecting a mode, and inputting a login password;
step three: opening a switch of mixed gas (hydrogen and nitrogen are provided by an inflation gas bottle), clicking for initialization to enable an indicated value of the inside and the outside to be 2, and waiting for the initialization of the equipment to be completed;
step four: holding the console by both hands, and treading down the pedal to move the console out; carefully taking down a DFB chip by using a wide flat-mouth clamp and placing the DFB chip on a white transparent shell, wherein the side surfaces of the clamp do not clamp two sides of a waveguide, adjusting the horizontal position of the DFB chip by using an insulating tweezers clamp, placing the DFB chip on a control console, stepping down the control console pedal to enable red light to be aligned with the DFB, loosening the pedal in a light reflecting state, observing a picture to adjust a Z-axis handle after a red point is completely aligned, focusing the DFB chip, aligning the DFB chip to a middle circle of a suction nozzle, clicking an automatic suction mode of the suction nozzle of software, starting to suck the DFB by using a suction nozzle head, sucking the DFB chip onto the suction nozzle by using an operating device at the moment, checking the direction of the DFB chip, clicking the right side of a triangle, judging that the right side of the triangle is not on the right side, putting down the DFB, adjusting the position and sucking again;
step five: holding the console by two hands, and treading down a pedal of the console to move the console out; clamping a TX chip by using a wide flat head forceps, placing the TX chip on a console and aligning to a cross small hole on the console, stepping down a pedal of the console to move the console so as to enable red light to align to the TX chip, and then loosening the pedal; observing a chip picture, adjusting a Z-axis handle to enable the TX chip to be clear, clicking a bottom plate on software to lock, and enabling a console to suck the TX chip; moving a heated cover of the console to align a hole in the cover with the center of the TX;
step six: adjusting a sucker knob to enable the DFB to be horizontal, selecting a No. 7 line by referring to the auxiliary line, adjusting the position of the DFB, aligning to a channel gap and reserving a space for vibration displacement of a machine table, wherein the space is close to the edge of the DFB; adjusting X and Y axes according to the Objects of the menu bar to align the DFB with the corresponding auxiliary line, stepping on the pedal to move the console to align the chip with the green-blue auxiliary line better, aligning the red line on the right with the channel, and keeping the waveguide from skewing; the blue lines on the right side are aligned with the blue lines of the 4 + character circles and need to be vertically overlapped; manually moving the console to make the TX chip horizontal; referring to the auxiliary line aligned with the DFB, adjusting the X axis and then adjusting the Y axis to align the TX chip and the DFB chip with each other;
step seven: controlling the temperature of the control console and the suction nozzle head to be closed, canceling a chip locking button, scratching a heating cover plate, taking out the attached chip by using an insulated sharp-nose tweezers, taking out the attached chip, attaching ID (identity) labels, and storing the ID labels into a sample cabinet in sequence; in the process, the upper side and the lower side of the chip can be only clamped by using insulating tweezers, so that the chip is prevented from being damaged and subsequent observation is not influenced.
In summary, in the submicron chip mounter and the using method thereof, the chip mounter adopts a pair of symmetrical chip mounting mechanisms, and adopts a double-station mode to operate, so that the processing speed of the chip mounter is improved, and in order to improve the fine tuning precision, a multistage speed-reducing fine tuning structure is adopted, and multistage speed reduction is performed, so that the adjusting speed is slower, the adjusting precision is higher, and the submicron chip mounter is simple to use and convenient to operate.
The technical solutions described above only represent the preferred technical solutions of the present invention, and some possible modifications made to some parts by those skilled in the art all represent the principles of the present invention, and fall within the protection scope of the present invention.
Claims (9)
1. A submicron chip mounter comprises an outer casing (1), a plurality of gas cylinder interfaces (2) and a control power supply (3), wherein a mounting groove is formed in the center line of the outer casing (1), the mounting groove is provided with the plurality of gas cylinder interfaces (2), and the control power supply (3) is mounted on one side of the outer casing (1), and is characterized in that a pair of operation stations are symmetrically arranged on two sides of the outer casing (1), and a pair of symmetrical chip mounting mechanisms is arranged on the pair of operation stations;
the patch mechanism comprises a supporting table top (4) and a suction nozzle (5) which is arranged corresponding to the upper part of the supporting table top (4), wherein a feeding device (6) is arranged on the supporting table top (4), and a multi-stage speed reduction fine adjustment structure is respectively arranged on the supporting table top (4) and the suction nozzle (5);
the multistage deceleration fine adjustment structure comprises: the device comprises a pair of supporting seats (7), a sliding clamp (8), an adjusting threaded rod (9), a first bevel gear (10), a second bevel gear (11), a rotating shaft (12), an adjusting worm wheel (13) and an adjusting worm (14);
the utility model discloses a support of a motor vehicle, including support table face (4), be provided with a pair of supporting seat (7) on the support table face (4), be provided with slide jig (8) on support table face (4), slide jig (8) thread bush is located on adjusting threaded rod (9), and is a pair of movable mounting has adjusting threaded rod (9) on supporting seat (7), the tip and one of a pair of adjusting threaded rod (9) relatively fixed supporting seat (7), adjusting threaded rod's (9) tip is provided with first bevel gear (10), one side meshing of first bevel gear (10) is connected with second bevel gear (11), the second bevel gear (11) is gone up the cover and is located on the one end of axis of rotation (12), the other end of axis of rotation (12) is connected with adjusting worm wheel (13), the bottom of adjusting worm wheel (13) is connected with adjusting worm (14) and adjusts worm wheel (13) meshing, the adjusting worm (14) penetrates through the supporting table top (4).
2. The submicron chip mounter according to claim 1, characterized in that an adjusting knob (15) is connected to an end of said adjusting worm (14), and an axial direction of said adjusting worm (14) is parallel to a moving direction of said slide jig (8).
3. The submicron chip mounter according to claim 1, wherein a pair of operation slots are respectively formed on two sides of the outer casing (1), and the operation slots are respectively connected with the supporting table top (4).
4. The submicron chip mounter according to claim 1, wherein a pair of parallel sliding grooves are formed on the bottom surface of said sliding jig (8), and a pair of sliders (16) are disposed on said supporting table (4) to match with said pair of sliding grooves.
5. The submicron chip mounter according to claim 1, wherein a pair of said sliders (16) is parallel to a shaft center of said adjusting screw rod (9).
6. The submicron chip mounter according to claim 1, wherein a mounting groove is formed on a central axis of the outer case (1), a pair of interfaces (18) is respectively arranged on the plurality of gas cylinder interfaces (2), and a plurality of gas cylinders (17) are structurally connected to the plurality of gas cylinders.
7. The submicron chip mounter according to claim 1, wherein a pair of said interfaces (18) are respectively connected to suction nozzles (5) at both sides.
8. The sub-micron mounter according to claim 1, wherein a pair of movable control foot pedals (19) are respectively provided on inner side wall surfaces of a pair of said operation stations.
9. The method of using a sub-micron placement machine as claimed in claims 1-8, comprising the steps of: step S1, pre-production check, step S2, startup, step S3, mixed gas initialization, step S4, DFB chip alignment, step S5, TX chip alignment, step S6, step S7;
step S1: whether a power switch of the equipment normally operates is checked, whether the equipment switch is in a closed state is checked before the equipment switch is used, whether the emergency stop switch can normally operate is confirmed, whether the equipment has an abnormal condition or not, and whether a machine abnormally sounds or not are confirmed;
step S2: sequentially turning on a device and a computer power switch, double-clicking a software icon, entering a login interface, selecting a mode, and inputting a login password;
step S3: opening a switch of mixed gas (hydrogen and nitrogen are provided by an inflation gas bottle), clicking for initialization to enable an indicated value of the inside and the outside to be 2, and waiting for the initialization of the equipment to be completed;
step S4: holding the console by two hands, and treading down the pedal to move the console out; carefully taking down a DFB chip by using a wide flat clamp and placing the DFB chip on a white transparent shell, wherein the side surface of the clamp does not clamp two sides of a waveguide, adjusting the horizontal position of the DFB chip by using an insulating tweezers clamp and placing the DFB chip on a control console, stepping down the control console pedal to enable red light to be aligned with the DFB, loosening the pedal in a light reflecting state, completely aligning a red point, observing a picture to adjust a Z-axis handle, focusing and aligning, enabling the DFB chip to be aligned with a middle circle of a suction nozzle, clicking an automatic suction mode of the suction nozzle of software, enabling the suction nozzle head to start sucking the DFB, sucking the DFB chip onto the suction nozzle by using an operating device at the moment, checking the direction of the DFB chip, clicking the right side of a triangle to be not on the right side, putting down the DFB, and adjusting the position to suck again;
step S5: holding the console by two hands, and treading down a pedal of the console to move the console out; clamping a TX chip by using a wide flat-head tweezers, placing the TX on a control console and aligning to a cross small hole on the control console, treading down a pedal of the control console to move the control console to enable red light to be aligned to the TX chip, and then loosening the pedal; observing a chip picture, adjusting a Z-axis handle to enable the TX chip to be clear, clicking a bottom plate on software to lock, and enabling a console to suck the TX chip; moving a heated cover of the console to align a hole in the cover with the center of the TX;
step S6: adjusting a sucker knob to enable the DFB to be horizontal, selecting a No. 7 line by referring to the auxiliary line, adjusting the position of the DFB, aligning to a channel gap and reserving a space for vibration displacement of a machine table, wherein the space is close to the edge of the DFB; adjusting X and Y axes according to the Objects of the menu bar to align the DFB with the corresponding auxiliary line, stepping on the pedal to move the console to align the chip with the green-blue auxiliary line better, aligning the red line on the right with the channel, and keeping the waveguide from skewing; the blue lines on the right side are aligned with the blue lines of the 4 + character circles and need to be vertically overlapped; manually moving the console to make the TX chip horizontal; referring to the auxiliary line aligned with the DFB, adjusting the X axis and then adjusting the Y axis to align the TX chip and the DFB chip with each other;
step S7: controlling the temperature of a control console and the temperature of a suction nozzle head to be closed, canceling a chip locking button, cutting a heating cover plate open, taking out the attached chips by using insulating sharp-nozzle tweezers, taking out the attached chips, attaching ID labels, and storing the ID labels into a sample cabinet in sequence; in the process, the upper side and the lower side of the chip can be only clamped by using insulating tweezers, so that the chip is prevented from being damaged and subsequent observation is not influenced.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210645142.8A CN114929006A (en) | 2022-06-08 | 2022-06-08 | Submicron chip mounter and using method thereof |
Applications Claiming Priority (1)
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