CN215731633U - Double-optical-path monitoring type chip positioning device - Google Patents
Double-optical-path monitoring type chip positioning device Download PDFInfo
- Publication number
- CN215731633U CN215731633U CN202120826750.XU CN202120826750U CN215731633U CN 215731633 U CN215731633 U CN 215731633U CN 202120826750 U CN202120826750 U CN 202120826750U CN 215731633 U CN215731633 U CN 215731633U
- Authority
- CN
- China
- Prior art keywords
- chip
- positioning
- driving
- path monitoring
- turnover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Abstract
The utility model relates to a double-optical-path monitoring type chip positioning device, which comprises a workbench for processing a chip, a transverse moving mechanism for driving the workbench to move, and a turnover mechanism for turning over and moving away the chip on the workbench; a feeding station is arranged on the workbench, and the turnover mechanism drives the position of the chip after turnover to form a positioning station for positioning the chip; still including the visual positioning mechanism who is used for gathering the image of material loading station and location station, visual positioning mechanism includes the location camera, and the light that will come from material loading station and location station converges the piece that closes of location camera, form two image light paths through closing the piece, when tilting mechanism drives the chip upset to the location station, the position of chip and the workstation upper base plate on the tilting mechanism is caught to the camera, overlap two pictures of catching, like this alright eliminate when single light path the chip can not catch the problem of chip location after sheltering from by the suction nozzle, realize the accurate counterpoint of chip.
Description
Technical Field
The utility model relates to the technical field of chip positioning, in particular to a double-optical-path monitoring type chip positioning device.
Background
In a semiconductor integrated circuit, the welding process between a chip and a substrate mainly comprises glue pasting and eutectic welding, and equipment for realizing the chip mounting mainly comprises manual chip mounting equipment and automatic chip mounting equipment. In terms of packaging technology and process implementation, with the development of domestic packaging technology, the technical gap between the packaging technology and developed countries is gradually reduced, the foreign technology is simulated to be a design-owned technology, and the Chinese standard is gradually established. When the existing technology is designed, the process is greatly changed, and the existing equipment cannot adapt to the new technology, so that the new equipment needs to be developed aiming at the new process and the new technology to verify the feasibility of the new technology. The automatic paster equipment can realize mass and high-efficiency pasting production work and ensure the consistency of products. But the automatic equipment has the disadvantages of difficult process modification, higher purchase cost, professional maintenance, poor flexibility and the like.
For research and development and small-batch sample preparation, the manual patch device solves the disadvantages of automatic equipment, and has the advantages of low price, simple operation, low requirement on personnel and high flexibility. Manual paster equipment does not have vision automatic positioning function, but carries out manual location to the product through the camera of artifical observation high magnification, and the problem that exists of manual counterpoint: when the chip is sucked and moved to the adhering position area by the suction nozzle, the camera light path is shielded by the suction nozzle mechanism, so that the position of the chip cannot be effectively monitored. The current method is usually monitored by visual inspection or by adding a microscope device on the oblique side, but the method is inconvenient to observe, has high requirement on the operation skill of an operator, and does not make samples with stable quality.
SUMMERY OF THE UTILITY MODEL
The present invention is directed to a dual optical path monitoring type chip positioning device, which can solve the above problems.
In order to meet the requirements, the technical scheme adopted by the utility model for solving the technical problems is as follows:
the double-optical-path monitoring type chip positioning device comprises a workbench for processing chips, a transverse moving mechanism for driving the workbench to move, and a turnover mechanism for turning over and removing the chips on the workbench; the worktable is provided with a feeding station, and the turnover mechanism drives the position of the chip after turnover to form a positioning station for positioning the chip; the vision positioning mechanism comprises a positioning camera and a light combining sheet for converging light rays from the feeding station and the positioning station into the positioning camera.
The utility model relates to a double-optical-path monitoring type chip positioning device, wherein a workbench comprises a substrate carrying platform, a chip carrying platform and an eutectic platform; the substrate carrying platform and the chip carrying platform are respectively arranged on the left side and the right side of the eutectic platform.
The double-optical-path monitoring type chip positioning device further comprises a first rotating mechanism, a second rotating mechanism and a third rotating mechanism which respectively drive the substrate carrying platform, the chip carrying platform and the eutectic platform to horizontally rotate.
The double-optical-path monitoring type chip positioning device further comprises a fixed seat for fixing the workbench, the first rotating mechanism comprises a supporting seat, a worm wheel is rotatably arranged on the supporting seat, and the substrate carrying platform is coaxially fixed on the worm wheel; the first rotating mechanism further comprises a worm adjusting handle for driving the worm wheel to rotate.
The utility model relates to a double-optical-path monitoring type chip positioning device, wherein a turnover mechanism comprises a suction nozzle assembly for picking up a chip, a turnover arm for fixing the suction nozzle assembly and a turnover driving assembly for driving the turnover arm to turn from a horizontal state to a vertical state; in an initial state, the suction nozzle assembly is positioned right below the positioning camera; and in the overturning state, the light combining sheet and the suction nozzle component are respectively positioned at two opposite sides of the chip on the suction nozzle component.
The double-optical-path monitoring type chip positioning device comprises a turnover mechanism, a first X-axis driving assembly and a Z-axis driving assembly, wherein the turnover mechanism further comprises a feeding module, and the feeding module comprises a first X-axis driving assembly and a Z-axis driving assembly, the first X-axis driving assembly drives the turnover driving assembly to transversely move, and the Z-axis driving assembly drives the first X-axis driving assembly to lift.
The double-optical-path monitoring type chip positioning device also comprises a lifting mechanism for driving the visual positioning mechanism to lift.
The utility model relates to a double-optical-path monitoring type chip positioning device, wherein a lifting mechanism comprises a support, a sliding support and a Z-axis adjusting knob, wherein the sliding support is longitudinally arranged on the support in a sliding manner, and the Z-axis adjusting knob is used for adjusting the position height of the sliding support; the Z-axis adjusting knob is longitudinally and rotatably arranged at the upper end of the sliding support, and the upper end of the Z-axis adjusting knob is in threaded connection with the support; the visual positioning mechanism is arranged on the sliding support.
The utility model relates to a double-light-path monitoring type chip positioning device, wherein a protective shell is arranged at the lower end of a positioning camera, a light combining sheet is obliquely arranged in the protective shell at an angle of 45 degrees, light inlets are respectively arranged on the bottom surface and the side wall of the protective shell corresponding to the upper surface and the lower surface of the light combining sheet, and an annular lamp is arranged on the protective shell corresponding to the light inlets.
The double-optical-path monitoring type chip positioning device comprises a transverse moving mechanism, a first X-axis driving assembly and a second X-axis driving assembly, wherein the transverse moving mechanism comprises a Y-axis driving assembly and a second X-axis driving assembly, the Y-axis driving assembly drives the workbench to move along the Y-axis direction, and the second X-axis driving assembly drives the Y-axis driving assembly to move along the X-axis direction.
The utility model has the beneficial effects that: the utility model discloses a double-light-path monitoring type chip positioning device, which forms two image acquisition light paths through light combination sheets, when a turnover mechanism drives a chip to turn over to a positioning station, a camera captures the positions of the chip on the turnover mechanism and a substrate on a workbench, and the position of the chip can be known by overlapping two captured pictures, so that the problem that the chip cannot capture the position of the chip after being shielded by a suction nozzle in a single light path can be solved, and the accurate alignment of the chip is realized.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the present invention will be further described with reference to the accompanying drawings and embodiments, wherein the drawings in the following description are only part of the embodiments of the present invention, and for those skilled in the art, other drawings can be obtained without inventive efforts according to the accompanying drawings:
fig. 1 is an overall structural view of a dual optical path monitoring type chip positioning device according to the present invention.
Fig. 2 is a structural view of a transverse moving mechanism of the double optical path monitoring type chip positioning device of the utility model.
Fig. 3 is a structural diagram of a turnover mechanism of the dual optical path monitoring type chip positioning device of the utility model.
Fig. 4 is a structural diagram of a lifting mechanism of the dual optical path monitoring type chip positioning device of the present invention.
Fig. 5 is a structural diagram of a first rotating mechanism of the dual optical path monitoring type chip positioning device according to the present invention.
Fig. 6 is a cross-sectional view of a first rotating mechanism of the dual optical path monitoring type chip positioning device according to the present invention.
FIG. 7 is a diagram of a display screen of the dual optical path monitoring chip positioning device according to the present invention.
FIG. 8 is a schematic optical path diagram of the dual optical path monitoring chip positioning device according to the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the following will clearly and completely describe the technical solutions in the embodiments of the present invention, and it is obvious that the described embodiments are some embodiments of the present invention, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present invention without inventive step, are within the scope of the present invention.
As shown in fig. 1 to 8, the dual optical path monitoring type chip positioning device according to the preferred embodiment of the present invention includes a worktable 1 for processing a chip 100, a traverse mechanism 2 for driving the worktable 1 to move, and a turnover mechanism 3 for turning over and removing the chip on the worktable 1, and exposing the back of the chip on the worktable 1; the device comprises a worktable 1, a loading station 200, a turnover mechanism 3, a visual positioning mechanism 4 and a light combining sheet 42, wherein the loading station 200 is arranged on the worktable 1, the turnover mechanism 3 picks up a chip from the loading station 200 and drives the chip to turn over, the turnover mechanism 3 drives the position of the chip after turning over to form a positioning station 300 for positioning the chip, the visual positioning mechanism 4 is arranged above the worktable 1, the turnover mechanism 3 is arranged behind the worktable 1, the visual positioning mechanism 4 comprises a positioning camera 41 and a light combining sheet 42 for combining light from the loading station 200 and the positioning station 300 into the positioning camera 41, specifically a semi-transparent semi-reflective mirror, in addition, the light combining sheet 42 can also adopt a prism structure or a semi-transparent semi-reflective mirror, the proposal preferably adopts a prism, the light combining sheet 42 is obliquely arranged, the bottom surface of the light combining sheet is right opposite to the loading station 200, the upper surface of the light combining sheet is right to the positioning station 300, and two image collecting light paths are formed by the light combining sheet 42, when tilting mechanism 3 drove the chip and overturns to location station 300, location camera 41 caught the chip on tilting mechanism 3 and the position of workstation 1 material loading station 200 simultaneously, further overlap two pictures of catching through backstage system alright know the position of chip, like this alright eliminate when single light path the chip can not catch the problem of chip position after sheltering from by the suction nozzle, realize the accurate counterpoint of chip.
Preferably, the workbench 1 comprises a substrate carrier 101 for placing the substrate tray 5, a chip carrier 102 for placing the chip tray 6, and an eutectic table 103 for processing chips, wherein the eutectic table 103 forms a feeding station 200; the substrate carrier 101 and the chip carrier 102 are respectively arranged at the left side and the right side of the eutectic platform 103 so as to facilitate loading of the substrate and the chips, and during processing, the substrate on the substrate tray 5 is firstly placed on the eutectic platform 103, and then the chips on the chip tray 6 are placed on the substrate.
Preferably, the apparatus further includes a first rotating mechanism 7, a second rotating mechanism 8, and a third rotating mechanism 9 for driving the substrate stage 101, the chip stage 102, and the eutectic station 103 to rotate horizontally, respectively, so as to adjust the horizontal angles of the substrate, the chip, and the eutectic station 103, respectively.
Preferably, the device further comprises a fixed seat 10 for fixing the workbench 1, the first rotating mechanism 7 comprises a supporting seat 71, a worm gear 72 is rotatably arranged on the supporting seat 71, and the substrate carrying platform 101 is coaxially fixed on the worm gear 72; the first rotating mechanism 7 further comprises a worm adjusting handle 73 for driving the worm wheel 72 to rotate, specifically, the second rotating mechanism 8 is also formed by a worm and gear, in addition, the first rotating mechanism 7 and the second rotating mechanism 8 can also be realized by adopting a motor, specifically, the substrate carrier 101 or the chip carrier 102 can be connected with an output shaft of the motor, and the third rotating mechanism 9 can be realized by adopting a conventional means, such as a motor, a ball bearing or a worm and gear, preferably, the scheme adopts the bearing 11 for realizing the rotation adjustment of the eutectic platform 103, compared with a worm and gear rotation driving mode, the ball bearing has no rotation idle distance difference, and further, the precision of processing and welding the chip by the eutectic platform 103 is ensured, specifically, the bearing seat 12 is arranged on the fixed seat 10, so that the eutectic platform 103 is rotatably connected with the bearing seat 12 through the bearing 11, and in addition, in order to conveniently adjust the rotation angle of the eutectic platform 103, the push rod 13 for pushing the eutectic platform 103 to rotate can be arranged on the bearing seat, the push rod 13 can be realized by adopting a fine adjustment push rod mechanism such as a differential screw ruler or a micrometer so as to ensure the adjustment precision, and the rotation angle range of the eutectic platform 103 is +/-5 degrees in actual production.
Preferably, the turnover mechanism 3 includes a nozzle assembly 31 for picking up a chip, a turnover arm 32 for fixing the nozzle assembly 31, and a turnover driving assembly 33 for driving the turnover arm 32 to turn from a horizontal state to a vertical state; specifically, the overturning driving component 33 can be realized by a conventional mode such as a motor or an overturning handle, when the overturning component is realized by the motor, the overturning arm 32 can be overturned by vertically fixing the overturning arm 32 on an output shaft of the motor, when the overturning component is realized by the overturning handle 332, a rotating shaft 331 is configured, the overturning arm 32 is vertically fixed at one end of the rotating shaft 331, the overturning handle 332 is fixed at the other end of the rotating shaft 331, when the overturning component needs to be overturned, the overturning handle 332 is manually overturned to drive the overturning arm 32 to overturn, and the overturning handle driving mode is preferred in the scheme; in the initial state, the flipping arm 32 is in a horizontal state, the suction nozzle assembly 31 is located right below the positioning camera 41, and at this time, the lower surfaces of the lens of the positioning camera 41 and the light combining sheet 42 are right opposite to the front surface of the chip; in the turning state, the turning arm 32 is in a vertical state, the light combining sheet 42 and the suction nozzle assembly 31 are respectively positioned at two opposite sides of the chip on the suction nozzle assembly 31, at this time, the upper surface of the light combining sheet 42 is opposite to the back surface of the chip, the suction nozzle is moved to the positioning station 300 through the turning arm 32 in cooperation with the suction nozzle assembly 31, the image of the back surface of the chip is further guided into the positioning camera 41 through the light combining sheet 42, the positioning camera 41 receives the light of the vertically lower transmission and horizontal reflection two light paths, the center of the suction nozzle assembly 31 is exactly superposed with the two light paths at the 90-degree position and the 0-degree position, when the suction nozzle assembly 31 sucks the chip and rotates to the 90-degree position, the positioning camera 41 simultaneously captures the chip and the substrate through the two light paths, and further the defect that the camera cannot capture the image of the chip due to the shielding of the suction nozzle assembly 31 in the traditional positioning mode is avoided, and realizing accurate alignment of the chip.
Preferably, the turnover mechanism 3 further includes a feeding module 34, and the feeding module 34 includes a first X-axis driving assembly 341 for driving the turnover driving assembly 33 to move laterally, and a Z-axis driving assembly 342 for driving the first X-axis driving assembly 341 to move up and down; specifically, the first X-axis driving assembly 341 and the Z-axis driving assembly 342 can be implemented by the prior art, such as driving modes of a motor matching with a screw rod and a guide rail, a motor matching with a rack and a guide rail, a motor matching with a transmission belt and a guide rail or a cylinder and a guide rail, etc., in the present scheme, the motor 19 matching with the screw rod 20 and the guide rail is preferably adopted, the turnover mechanism 3 can be moved up and down and left and right by arranging the first X-axis driving assembly 341 and the Z-axis driving assembly 342, so as to facilitate the suction nozzle assembly 31 to pick up the substrate and the chip on the eutectic platform 103, and avoid the chip damage of the turnover arm 32 when the turnover arm is in place, so as to play a role of excessive buffering, no matter whether the turnover is realized by the motor or the turnover handle, in the process of rotating the turnover arm 32 from a vertical state to a horizontal state, the turnover arm 32 and the suction nozzle assembly 31 have certain speed, because the processing precision is not enough or the inertial deformation of the turnover arm 32 can cause positioning error, if directly place the chip on the base plate on the eutectic platform 103 this moment, because the existence of error, the chip can be crushed by pressure, and through configuration material loading module 34, when upset arm 32 resets to the horizontality, the space between eutectic platform 103 and the chip leaves redundancy this moment, this space redundancy alright guarantee that the chip can not direct contact eutectic platform 103, further through the slow decline of Z axle drive assembly 342 drive tilting mechanism 3, and then place the chip on the base plate on eutectic platform 103.
Preferably, the device further comprises a lifting mechanism 14 for driving the visual positioning mechanism 4 to lift, so as to adjust the height of the visual positioning mechanism 4 and avoid the movement of the turnover mechanism 3.
Preferably, the lifting mechanism 14 comprises a bracket 141, a sliding bracket 142 longitudinally slidably disposed on the bracket 141, and a Z-axis adjusting knob 143 for adjusting the height of the sliding bracket 142; the Z-axis adjusting knob 143 is longitudinally rotatably arranged at the upper end of the sliding support 142, the upper end of the Z-axis adjusting knob 143 is in threaded connection with the support 141, the visual positioning mechanism 4 is arranged on the sliding support 142, and in addition, the lifting mechanism 14 can be replaced by a driving structure such as a motor-matched screw rod, a motor-matched rack, a motor-matched transmission belt or a cylinder drive.
Preferably, the lower end of the positioning camera 41 is provided with a protective shell 15, the light combining sheet 42 is obliquely arranged in the protective shell 15 at an angle of 45 degrees, the bottom surface and the side wall of the protective shell 15 are respectively provided with light inlets corresponding to the upper surface and the lower surface of the light combining sheet 42, the protective shell 15 is provided with an annular lamp 16 corresponding to the light inlets, when the eutectic platform 103 moves in place, the eutectic platform 103 is positioned under the light combining sheet 42 and is opposite to the oblique bottom surface thereof, and the positioning station 300 and the upper surface of the light combining sheet 42 are also opposite to the oblique top surface thereof and are positioned on the same horizontal line; in addition, in order to adjust the horizontal rotation angle of the light combining sheet 42 conveniently, the upper end of the protective shell 15 is provided with a rotating platform 17 which is coaxial with the positioning camera 41, the rotating platform 17 can be realized by adopting a ball bearing or a circular ring guide slide rail, the rotating platform 17 is further fixed on the slide bracket 142 through a connecting piece, in order to transmit light, the upper end of the protective shell 15 is provided with an opening for the positioning camera 41 to shoot, in order to avoid the self-rotation of the light combining sheet 42, the protective shell 15 and the rotating platform 17 can be connected in a damping rotation manner, or the outer side wall of the rotating platform 17 can be provided with worm teeth to form a worm wheel, and then a driving worm 18 is arranged in a matching manner, the reverse self-locking principle of the worm wheel and the worm can be utilized to realize that the angle of the light combining sheet 42 can be adjusted, the self-rotation of the protective shell 15 can be prevented, and in addition, a driving motor can be additionally configured to drive the rotation of the rotating platform 17.
Preferably, the traverse mechanism 2 includes a Y-axis driving assembly 21 for driving the worktable 1 to move along the Y-axis direction, and a second X-axis driving assembly 22 for driving the Y-axis driving assembly 21 to move along the X-axis direction, the Y-axis driving assembly 21 and the second X-axis driving assembly 22 can be implemented by the prior art, such as a motor matching a lead screw and a slide rail, a motor matching a rack and a slide rail, a motor matching a transmission belt and a slide rail, or a linear motor and a slide rail, or directly adopting driving structures such as a cylinder and a slide rail, and the like, and can be implemented by suspending different implementation manners according to different situations, and the scheme preferably adopts a motor 2a matching a lead screw 2b and a slide rail 2 c; in addition, in order to ensure the machining precision, a sliding plate 1a is slidably arranged on the fixed seat 10, the workbench 1 is arranged on the sliding plate 1a, an X-axis fine adjustment knob 1b for adjusting the sliding plate 1a to move along an X axis and a Y-axis fine adjustment knob 1c for adjusting the sliding plate 1a to move along a Y axis are further arranged on the fixed seat 10, and specifically, the X-axis fine adjustment knob and the Y-axis fine adjustment knob can be realized by a micrometer and also can be realized by a screw rod.
The positioning process comprises the following steps: placing the substrate → aligning and sucking the chip → turning the chip → aligning the substrate → turning the chip → moving down and pasting the chip → completing the chip positioning, wherein, in order to facilitate the people to watch the positioning, the display K1 can be configured to display the captured picture of the positioning camera 41, and the specific positioning steps are as follows:
the first step is as follows: placing a substrate tray 5 and a chip tray 6 on a substrate carrier 101 and a chip carrier 102;
the second step is that: the position of the substrate carrying platform 101 is adjusted through the transverse moving mechanism 2, so that the 1PCS substrate 400 is positioned under the visual field of the positioning camera 41, and the placing angle of the substrate is adjusted through the third rotating mechanism 9, so that the suction nozzle assembly 31 can pick up the substrate conveniently;
the third step: sucking the substrate by the feeding module 34 in cooperation with the suction nozzle assembly 31, placing the substrate on the eutectic platform 103 and determining the position of the substrate;
the fourth step: the position of the chip carrier 102 is adjusted through the transverse moving mechanism 2, so that the 1PCS chip is positioned under the field of view of the camera, the transverse moving mechanism 2 is matched with the third rotating mechanism 9 to adjust the chip and determine the position of the chip and enable the chip to be overlapped with the preset position of the chip, and the position a0b0c0d0 overlapped with the preset position of the chip is marked on the display screen for convenient observation;
the fifth step: controlling the suction nozzle assembly 31 to suck the chip, and enabling the chip to reach the positioning station 300 through the overturning arm 32;
and a sixth step: the position of the eutectic platform 103 is adjusted through the transverse moving mechanism 2 and the third rotating mechanism 9, so that the position of the substrate on the eutectic platform 103 is coincided with the preset position of the substrate, and the position e0f0g0h0 coincided with the preset position of the substrate is marked on the display screen for convenient observation;
the seventh step: the chip is reset through the turnover mechanism 3, and the turnover arm 32 is also in a horizontal state;
eighth step: placing the chip on the substrate on the eutectic table 103 through the feeding module 34;
the ninth step: if a plurality of chips are to be pasted on the same substrate, repeating the step 4-8;
the tenth step: and finishing the positioning and pasting of the chip.
It will be understood that modifications and variations can be made by persons skilled in the art in light of the above teachings and all such modifications and variations are intended to be included within the scope of the utility model as defined in the appended claims.
Claims (10)
1. A double-optical-path monitoring type chip positioning device is characterized by comprising a workbench for processing chips, a transverse moving mechanism for driving the workbench to move, and a turnover mechanism for turning over and removing the chips on the workbench; the worktable is provided with a feeding station, and the turnover mechanism drives the position of the chip after turnover to form a positioning station for positioning the chip; the vision positioning mechanism comprises a positioning camera and a light combining sheet for converging light rays from the feeding station and the positioning station into the positioning camera.
2. The dual optical path monitoring type chip positioning device according to claim 1, wherein the stage comprises a substrate stage and a chip stage and a eutectic stage; the substrate carrying platform and the chip carrying platform are respectively arranged on the left side and the right side of the eutectic platform.
3. The dual optical path monitoring type chip positioning device as claimed in claim 2, further comprising a first rotating mechanism, a second rotating mechanism and a third rotating mechanism for driving the substrate stage, the chip stage and the eutectic stage to rotate horizontally.
4. The dual optical path monitoring type chip positioning device according to claim 3, further comprising a fixing base for fixing the worktable, wherein the first rotating mechanism comprises a supporting base on which a worm wheel is rotatably disposed, and the substrate carrying platform is coaxially fixed on the worm wheel; the first rotating mechanism further comprises a worm adjusting handle for driving the worm wheel to rotate.
5. The dual optical path monitoring type chip positioning device according to claim 1, wherein the turnover mechanism comprises a nozzle assembly for picking up a chip, a turnover arm for fixing the nozzle assembly, and a turnover driving assembly for driving the turnover arm to turn from a horizontal state to a vertical state; in an initial state, the suction nozzle assembly is positioned right below the positioning camera; and in the overturning state, the light combining sheet and the suction nozzle component are respectively positioned at two opposite sides of the chip on the suction nozzle component.
6. The dual optical path monitoring type chip positioning device as claimed in claim 5, wherein the flipping mechanism further comprises a loading module, and the loading module comprises a first X-axis driving component for driving the flipping driving component to move laterally, and a Z-axis driving component for driving the first X-axis driving component to move up and down.
7. The dual optical path monitoring die bonder of claim 1, further comprising a lift mechanism for driving said vision positioning mechanism to move up and down.
8. The dual optical path monitoring type chip positioning device according to claim 7, wherein said elevating mechanism comprises a support, a sliding support longitudinally slidably disposed on said support, and a Z-axis adjusting knob for adjusting the height of said sliding support; the Z-axis adjusting knob is longitudinally and rotatably arranged at the upper end of the sliding support, and the upper end of the Z-axis adjusting knob is in threaded connection with the support; the visual positioning mechanism is arranged on the sliding support.
9. The dual optical path monitoring type chip positioning device according to claim 7, wherein a protective case is disposed at a lower end of the positioning camera, the light combining plate is obliquely disposed in the protective case by 45 °, light inlets are disposed on a bottom surface and a side wall of the protective case respectively corresponding to upper and lower surfaces of the light combining plate, and an annular lamp is disposed on the protective case corresponding to the light inlets.
10. The dual optical path monitoring die bonder of claim 1, wherein said traversing mechanism comprises a Y-axis drive assembly for driving said stage in a Y-axis direction, a second X-axis drive assembly for driving said Y-axis drive assembly in an X-axis direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120826750.XU CN215731633U (en) | 2021-04-21 | 2021-04-21 | Double-optical-path monitoring type chip positioning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120826750.XU CN215731633U (en) | 2021-04-21 | 2021-04-21 | Double-optical-path monitoring type chip positioning device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215731633U true CN215731633U (en) | 2022-02-01 |
Family
ID=80029569
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120826750.XU Active CN215731633U (en) | 2021-04-21 | 2021-04-21 | Double-optical-path monitoring type chip positioning device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215731633U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114929006A (en) * | 2022-06-08 | 2022-08-19 | 重庆电子工程职业学院 | Submicron chip mounter and using method thereof |
-
2021
- 2021-04-21 CN CN202120826750.XU patent/CN215731633U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114929006A (en) * | 2022-06-08 | 2022-08-19 | 重庆电子工程职业学院 | Submicron chip mounter and using method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN215731633U (en) | Double-optical-path monitoring type chip positioning device | |
| CN111940306A (en) | Detection device and detection method for semiconductor chip | |
| CN210309464U (en) | Automatic laminating equipment for liquid crystal display | |
| CN112850145B (en) | Curved surface screen crack check out test set | |
| CN108855962A (en) | It is a kind of for being pressed into the detection machine of the jig plate of electroceramics particle capacitor | |
| CN216213270U (en) | Double-channel chip detection equipment | |
| CN214472864U (en) | Polaroid defect detection equipment and system | |
| CN111515140A (en) | CELL automatic lighting detector | |
| CN110911311A (en) | Visual inspection machine to wafer after cutting | |
| CN110126428A (en) | A kind of bonding structure for liquid crystal display and touch screen | |
| WO2023134168A1 (en) | Automated ball-planting testing system using welding ball array packaging | |
| CN115863226A (en) | Folding machine capable of automatically breaking wafer for inspection and transferring | |
| CN215844315U (en) | Sorting equipment capable of automatically feeding and discharging | |
| CN210590943U (en) | Soft-to-hard laminating feeding and discharging structure suitable for touch screen | |
| CN110967168A (en) | Backlight finished product outward appearance detects machine | |
| CN211756921U (en) | Wafer sorting machine | |
| CN112684617A (en) | LCD screen Bonding foreign matter automated inspection machine | |
| CN115274483B (en) | Wafer electrical property detection equipment | |
| CN210309465U (en) | A laminated structure for LCD screen and touch-sensitive screen | |
| CN219391854U (en) | PCB outward appearance automatic checkout device | |
| JP5830650B2 (en) | Component mounting method and component mounting apparatus | |
| CN110850702B (en) | Watch lens detection machine | |
| CN211652024U (en) | Backlight finished product outward appearance detects machine | |
| CN211319004U (en) | Watch lens detector | |
| CN109499900B (en) | Detection equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |