CN219873463U - Frame type chip packaging assembly with positioning structure - Google Patents
Frame type chip packaging assembly with positioning structure Download PDFInfo
- Publication number
- CN219873463U CN219873463U CN202320862191.7U CN202320862191U CN219873463U CN 219873463 U CN219873463 U CN 219873463U CN 202320862191 U CN202320862191 U CN 202320862191U CN 219873463 U CN219873463 U CN 219873463U
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- China
- Prior art keywords
- threaded rod
- adjusting component
- type chip
- frame
- motor
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 22
- 230000005540 biological transmission Effects 0.000 claims description 13
- 230000000712 assembly Effects 0.000 claims 2
- 238000000429 assembly Methods 0.000 claims 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
Abstract
The utility model discloses a frame type chip packaging component with a positioning structure, which relates to the technical field of chip packaging and aims to solve the technical problem that the positioning adjustment treatment of a chip is inconvenient in the prior art; the frame type chip packaging assembly comprises a mounting plate; the upper end of the mounting plate is fixedly provided with a fixing seat, the inner side of the fixing seat is provided with a front adjusting component and a rear adjusting component, the inner side of the front adjusting component and the rear adjusting component is provided with a movable plate, the upper end of the movable plate is fixedly provided with a transverse plate, the inner side of the transverse plate is provided with a left adjusting component and a right adjusting component, the upper ends of the left adjusting component and the right adjusting component are provided with supporting blocks, and the upper ends of the supporting blocks are fixedly provided with trays; this frame-type chip packaging assembly with location structure passes through the regulation subassembly and drives the fly leaf and adjust from beginning to end, drives the regulation from beginning to end of tray through the fly leaf, and adjust about the supporting shoe through controlling regulation subassembly drive support piece, adjust about driving the tray through the supporting shoe to realized carrying out location adjustment to the chip and handled.
Description
Technical Field
The utility model belongs to the technical field of chip packaging, and particularly relates to a frame type chip packaging assembly with a positioning structure.
Background
Nowadays, the application of chip packaging technology is more common in the chip processing process, the chip packaging is to cover the silicon chip placement point on the surface of the substrate with heat-conducting epoxy resin, then directly place the silicon chip on the surface of the substrate, and heat treatment is carried out until the silicon chip is firmly fixed on the substrate, so that a frame type chip packaging component is usually used for conveniently packaging the chip.
At present, the utility model patent number CN201921885114.3 discloses a semiconductor chip packaging frame with a positioning function, which comprises an upper frame and a lower frame, wherein at least two positioning lock catches are arranged on the lower frame, and connecting holes matched with the positioning lock catches are correspondingly arranged on the upper frame; the defective rate of the packaged semiconductor chip is reduced, but the position of the chip is fixed in the use process of the frame type chip packaging assembly, so that the positioning adjustment treatment of the chip is inconvenient.
Disclosure of Invention
(1) Technical problem to be solved
Aiming at the defects of the prior art, the utility model aims to provide a frame type chip packaging assembly with a positioning structure, which aims to solve the technical problem that the positioning adjustment treatment of a chip is inconvenient in the prior art.
(2) Technical proposal
In order to solve the technical problems, the utility model provides a frame type chip packaging assembly with a positioning structure, which comprises a mounting plate; the upper end fixed mounting of mounting panel has the fixing base, the inboard of fixing base is provided with front and back adjusting part, the inboard of front and back adjusting part is provided with the fly leaf, the upper end fixed mounting of fly leaf has the diaphragm, the inboard of diaphragm is provided with controls adjusting part, control adjusting part's upper end is provided with the supporting shoe, the upper end fixed mounting of supporting shoe has the tray.
When the frame-type chip packaging assembly with the positioning structure is used, the chip is placed at the upper end of the tray, the movable plate is driven to be adjusted back and forth through the back and forth adjusting assembly, the tray is driven to be adjusted back and forth through the movable plate, the supporting block is driven to be adjusted left and right through the left and right adjusting assembly, the tray is driven to be adjusted left and right through the supporting block, and therefore positioning adjustment treatment of the chip is achieved.
Further, the inside of adjusting part around including first motor, first motor set up in the outside of fixing base, the output of first motor is provided with first threaded rod, first threaded rod with the fixing base rotates to be connected, starts first motor and drives first threaded rod and rotate, carries out drive processing to first threaded rod.
Further, the inside of adjusting part around including the screw thread groove, the screw thread groove set up in the inboard of fly leaf, the screw thread groove with first threaded rod transmission is connected, drives the fly leaf and adjusts around the transmission connection through first threaded rod and screw thread groove.
Further, the inside of adjusting part around including the gag lever post, gag lever post fixed mounting is in the inboard of fixing base, the spacing groove has been seted up to the inboard of fly leaf, the spacing groove with gag lever post sliding connection moves spacing processing through the sliding connection of gag lever post and spacing groove to the fly leaf.
Further, the inside of controlling the adjusting part is including the second motor, the second motor set up in the outside of diaphragm, the output of second motor is provided with the second threaded rod, the second threaded rod with the diaphragm rotates to be connected, starts the second motor and drives the second threaded rod and rotate, carries out drive processing to the second threaded rod.
Further, the inside of controlling the adjusting part is including the screwed ring, the screwed ring set up in the outside of second threaded rod, the screwed ring with second threaded rod transmission is connected, drives the supporting shoe and controls the regulation through the transmission of second threaded rod and screwed ring and be connected.
Further, the inside of controlling the adjusting part is including the spout, the spout set up in the upper end of diaphragm, the upper end of screwed ring is provided with the slider, the upper end of slider with the bottom interconnect of supporting shoe, the slider with spout sliding connection carries out removal spacing processing to the supporting shoe through the sliding connection of spout and slider.
(3) Advantageous effects
Compared with the prior art, the utility model has the beneficial effects that:
1. the frame type chip packaging assembly with the positioning structure provided by the utility model has the advantages that the chip is arranged at the upper end of the tray, the first motor is started to drive the first threaded rod to rotate, the movable plate is driven to be adjusted back and forth through the transmission connection between the first threaded rod and the threaded groove, the movable plate is subjected to movement limiting treatment through the sliding connection between the limiting rod and the limiting groove, and the tray is driven to be adjusted back and forth through the movable plate, so that the back and forth adjustment treatment of the chip is realized;
2. the frame type chip packaging assembly with the positioning structure provided by the utility model has the advantages that the second motor is started to drive the second threaded rod to rotate, the supporting block is driven to be adjusted left and right through the transmission connection between the second threaded rod and the threaded ring, the supporting block is subjected to movement limiting treatment through the sliding connection between the sliding groove and the sliding block, the supporting block is used for driving the tray to be adjusted left and right, and the left and right adjustment treatment of the chip is realized.
Drawings
FIG. 1 is a schematic view of a three-dimensional structure of an embodiment of the present utility model;
FIG. 2 is a schematic view of a structure developed in accordance with an embodiment of the present utility model;
FIG. 3 is a schematic cross-sectional perspective view of an embodiment of the present utility model;
fig. 4 is a schematic cross-sectional perspective view of an embodiment of the present utility model.
The marks in the drawings are: 1. a mounting plate; 2. a fixing seat; 3. a front-to-back adjustment assembly; 4. a movable plate; 5. a cross plate; 6. left and right adjusting components; 7. a support block; 8. a tray; 9. a first motor; 10. a first threaded rod; 11. a thread groove; 12. a limit rod; 13. a limit groove; 14. a second motor; 15. a second threaded rod; 16. a threaded ring; 17. a chute; 18. a sliding block.
Detailed Description
The specific embodiment is a frame type chip packaging assembly with a positioning structure, the schematic diagram of the three-dimensional structure is shown in fig. 1, the schematic diagram of the unfolding structure is shown in fig. 2, and the frame type chip packaging assembly comprises a mounting plate 1; the upper end fixed mounting of mounting panel 1 has fixing base 2, the inboard of fixing base 2 is provided with front and back adjusting part 3, the inboard of front and back adjusting part 3 is provided with fly leaf 4, the upper end fixed mounting of fly leaf 4 has diaphragm 5, the inboard of diaphragm 5 is provided with controls adjusting part 6, control adjusting part 6's upper end is provided with supporting shoe 7, the upper end fixed mounting of supporting shoe 7 has tray 8.
For the present embodiment, the shape structure of the mounting board 1 is set according to practical application, for example, the mounting board 1 may be a rectangular structure, an arc structure, a polygonal structure, or the like.
The inside of the front-back adjusting component 3 comprises a first motor 9, the first motor 9 is arranged on the outer side of the fixed seat 2, a first threaded rod 10 is arranged at the output end of the first motor 9, the first threaded rod 10 is rotationally connected with the fixed seat 2, the first motor 9 is started to drive the first threaded rod 10 to rotate, the first threaded rod 10 is driven to be processed, the inside of the front-back adjusting component 3 comprises a thread groove 11, the thread groove 11 is formed in the inner side of the movable plate 4, the thread groove 11 is in transmission connection with the first threaded rod 10, and the movable plate 4 is driven to be adjusted back and forth through the transmission connection of the first threaded rod 10 and the thread groove 11.
The present embodiment is a frame-type chip package assembly with a positioning structure, a schematic cross-sectional perspective structure is shown in fig. 3, a schematic cross-sectional perspective structure is shown in fig. 4, the inside of the front-rear adjusting assembly 3 includes a limiting rod 12, the limiting rod 12 is fixedly mounted on the inner side of the fixing seat 2, a limiting groove 13 is formed on the inner side of the movable plate 4, the limiting groove 13 is slidably connected with the limiting rod 12, the movable plate 4 is subjected to movement limiting treatment through the sliding connection between the limiting rod 12 and the limiting groove 13, the inside of the left-right adjusting assembly 6 includes a second motor 14, the second motor 14 is arranged on the outer side of the transverse plate 5, a second threaded rod 15 is arranged at the output end of the second motor 14, the second threaded rod 15 is rotatably connected with the transverse plate 5, and the second motor 14 is started to drive the second threaded rod 15 to rotate, and the second threaded rod 15 is subjected to driving treatment.
Simultaneously, control the inside of adjusting part 6 including screwed ring 16, screwed ring 16 set up in the outside of second threaded rod 15, screwed ring 16 with second threaded rod 15 transmission is connected, drives supporting shoe 7 through the transmission connection of second threaded rod 15 and screwed ring 16 and controls the regulation, control the inside of adjusting part 6 including spout 17, spout 17 set up in diaphragm 5's upper end, screwed ring 16's upper end is provided with slider 18, slider 18's upper end with the bottom interconnect of supporting shoe 7, slider 18 with slider 17 sliding connection carries out the spacing processing that removes to supporting shoe 7 through the sliding connection of spout 17 and slider 18.
When the frame-type chip packaging assembly with the positioning structure is used, a chip is placed at the upper end of the tray 8, the first motor 9 is started to drive the first threaded rod 10 to rotate, the movable plate 4 is driven to be adjusted back and forth through the transmission connection of the first threaded rod 10 and the threaded groove 11, the movable plate 4 is driven to be subjected to movement limiting treatment through the sliding connection of the limiting rod 12 and the limiting groove 13, the tray 8 is driven to be adjusted back and forth through the movable plate 4, the second motor 14 is started to drive the second threaded rod 15 to rotate, the supporting block 7 is driven to be adjusted left and right through the transmission connection of the second threaded rod 15 and the threaded ring 16, the supporting block 7 is driven to be subjected to movement limiting treatment through the sliding connection of the sliding groove 17 and the sliding block 18, and the tray 8 is driven to be adjusted left and right through the supporting block 7, so that the chip is subjected to positioning adjustment treatment is realized.
Claims (7)
1. A frame-type chip package assembly having a positioning structure, the frame-type chip package assembly including a mounting board; the device is characterized in that a fixing seat is fixedly arranged at the upper end of the mounting plate, a front-back adjusting component is arranged at the inner side of the fixing seat, a movable plate is arranged at the inner side of the front-back adjusting component, a transverse plate is fixedly arranged at the upper end of the movable plate, a left-right adjusting component is arranged at the inner side of the transverse plate, a supporting block is arranged at the upper end of the left-right adjusting component, and a tray is fixedly arranged at the upper end of the supporting block.
2. The frame-type chip package assembly with the positioning structure according to claim 1, wherein the front-rear adjusting assembly comprises a first motor, the first motor is arranged on the outer side of the fixing seat, a first threaded rod is arranged at the output end of the first motor, and the first threaded rod is rotatably connected with the fixing seat.
3. The frame type chip package assembly with the positioning structure according to claim 2, wherein the front and rear adjusting assembly comprises a thread groove, the thread groove is formed on the inner side of the movable plate, and the thread groove is in transmission connection with the first threaded rod.
4. The frame-type chip package assembly with the positioning structure according to claim 3, wherein the front-rear adjusting assembly comprises a limiting rod, the limiting rod is fixedly installed on the inner side of the fixing seat, a limiting groove is formed in the inner side of the movable plate, and the limiting groove is in sliding connection with the limiting rod.
5. The frame type chip packaging assembly with the positioning structure according to claim 1, wherein the inside of the left-right adjusting assembly comprises a second motor, the second motor is arranged on the outer side of the transverse plate, a second threaded rod is arranged at the output end of the second motor, and the second threaded rod is rotatably connected with the transverse plate.
6. The framed chip package assembly of claim 5 wherein said left and right adjustment assemblies include a threaded ring disposed on an outer side of said second threaded rod, said threaded ring in driving engagement with said second threaded rod.
7. The frame-type chip package assembly with the positioning structure according to claim 6, wherein the inside of the left and right adjusting assemblies comprises a sliding groove, the sliding groove is formed in the upper end of the transverse plate, a sliding block is arranged at the upper end of the threaded ring, the upper end of the sliding block is connected with the bottom end of the supporting block, and the sliding block is connected with the sliding groove in a sliding manner.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320862191.7U CN219873463U (en) | 2023-04-17 | 2023-04-17 | Frame type chip packaging assembly with positioning structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320862191.7U CN219873463U (en) | 2023-04-17 | 2023-04-17 | Frame type chip packaging assembly with positioning structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219873463U true CN219873463U (en) | 2023-10-20 |
Family
ID=88325833
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320862191.7U Active CN219873463U (en) | 2023-04-17 | 2023-04-17 | Frame type chip packaging assembly with positioning structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219873463U (en) |
-
2023
- 2023-04-17 CN CN202320862191.7U patent/CN219873463U/en active Active
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