CN113618936A - Automatic splitting device of wafer based on vision positioning - Google Patents

Abstract

The invention discloses an automatic wafer splitting device based on visual positioning in the technical field of wafer processing, which is provided with a table plate component, wherein a riving knife component and a splitting platform are arranged on the table plate component, a lower camera component is arranged on the table plate component and positioned at the lower side of the splitting platform, the splitting platform is used for positioning a wafer, a lower camera component shoots the condition of the wafer through an opening on the table plate component, and then judges the quality of a wafer product and determines a processing position, at the moment, a receiving platform component of the splitting platform is separated from the receiving platform component, the wafer is shot and determined to be in a separated state, the riving knife component moves down the wafer after the determined processing position is shot, then the riving knife component moves up, the receiving platform component of the splitting platform is separated from the wafer, the splitting platform rotates the wafer to the next splitting position, the lower camera component moves to the shooting position again, the splitting action is repeated, and the device has accurate positioning and high automation degree, can process the wafer product with excellent quality efficiently.

Description

Automatic splitting device of wafer based on vision positioning

Technical Field

The invention relates to the technical field of wafer processing, in particular to an automatic wafer splitting device based on visual positioning.

Background

The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the shape is circular; various circuit element structures can be processed and manufactured on the silicon wafer to become products with specific electrical functions. With the rapid development of integrated circuits, higher requirements are made on the quality of wafers, and the quality of processed wafers plays a crucial role in the normal operation of the wafers. Therefore, a wafer splitter is needed to implement the processing and manufacturing of the wafer so as to improve the mechanical automation level during the wafer processing.

Disclosure of Invention

The invention aims to provide an automatic wafer splitting device based on visual positioning.

In order to achieve the purpose, the invention provides the following technical scheme: the automatic wafer splitting device based on visual positioning comprises a platen assembly, wherein a chopper assembly and a splitting platform are arranged on the platen assembly, the chopper assembly is used for splitting a wafer, the splitting platform is used for positioning the wafer, a lower camera assembly is arranged on the platen assembly and located on the lower side of the splitting platform, and the lower camera assembly is used for being matched with the splitting platform to achieve wafer positioning.

Preferably, the bedplate component comprises a bedplate, wherein the bedplate is symmetrically and fixedly connected with supports, and the supports are provided with portal frames.

Preferably, the beam part of the portal frame adopts a marble beam body, and the marble beam body is used for reducing mechanical vibration in the wafer splitting process.

Preferably, the chopper assembly comprises a linear module, the linear module is connected to the portal frame through a connecting plate, a first motor is arranged on the upper side of the linear module, vertical guide rails are symmetrically arranged on the linear module, a moving block is connected to the vertical guide rails in a sliding mode, a U-shaped groove is formed in the moving block, a chopper is screwed in the U-shaped groove, the vertical guide rails are located between the vertical guide rails, a hammer piece is arranged on the upper side of the chopper, an upper limiting block is arranged on the upper side of the chopper, a limiting rod is screwed on the upper limiting block, and a pressing strip used for matching a linear light source used by the lower phase assembly and used for pressing wafers is further installed on the linear module.

Preferably, a buffer block is arranged on the moving block.

Preferably, the splitting platform includes the bottom plate, the bottom plate install in on the deck plate, symmetry fixedly connected with slide rail mounting panel on the bottom plate, the lateral part of slide rail mounting panel sets up the grating strip, install the slide rail on the slide rail mounting panel, sliding connection has the location panel on the slide rail, the location panel is driven by linear motor, be provided with circular guide rail on the location panel, circular guide rail can by second motor drive rotate on the location panel, circular guide rail's week side evenly sets up the jack catch cylinder, jack catch cylinder control jack catch presss from both sides tightly or relaxs, circular guide rail's week side still is provided with the sensor.

Preferably, the lower camera component comprises a connecting frame, the connecting frame is fixedly connected to the lower end face of the table panel, a camera mounting table is fixedly connected to the connecting frame, a horizontal guide rail and a lead screw are arranged on the camera mounting table, a camera part is slidably connected to the horizontal guide rail, the camera part is fixedly connected with a lead screw nut on the camera mounting table, and the lead screw is driven by a third motor to rotate.

Preferably, the pressing strip is a square-shaped pressing strip.

Preferably, the buffer block is a rubber block, a through hole is formed in the buffer block, a spring is arranged in the through hole, and an adjusting screw penetrates through the spring and is fixedly connected with the moving block.

Preferably, the output end of the claw cylinder is hooked with one end of the hook block, the other end of the hook block is fixedly connected with the claw, and a spring is arranged at the end part of the claw.

Compared with the prior art, the invention has the beneficial effects that: setting a table board component, wherein the table board component is provided with a riving knife component and a riving platform, the riving knife component is used for riving a wafer, the riving platform is used for positioning the wafer, a lower camera component is arranged on the table board component and positioned at the lower side of the riving platform, the lower camera component is used for matching with the riving platform to realize wafer positioning, the wafer is grabbed onto the riving platform by a mechanical arm, the riving platform is used for positioning the wafer, the lower camera component is moved to a photographing position, the condition of the wafer can be photographed by matching with a linear light source on the riving platform through a hole on the table board component, so as to judge the quality of the wafer product and determine a processing position, a receiving platform component of the riving platform is separated from the receiving platform component, after the photographing determines the processing position, the lower camera component is moved away, the receiving platform component is moved to the processing position, the riving knife component moves downwards, and the riving knife component works to riving the wafer, subsequently, the cleaver assembly moves upwards, the receiving platform assembly of the splitting platform is separated from the splitting platform, the splitting platform rotates the wafer to the next splitting position, the lower phase machine assembly moves to the photographing position again, the splitting action is repeated, after the wafers are completely processed, the splitting platform releases the positioning of the wafer, and the mechanical arm takes away the processed wafer.

Wherein: the beam part of the portal frame adopts a marble beam body which is used for reducing mechanical vibration in the wafer splitting process;

the rubber buffer block and the spring are arranged in the cleaver assembly, the buffer block is provided with a through hole, the spring is arranged in the through hole, an adjusting screw penetrates through the spring and is fixedly connected with the moving block, the adjusting screw has certain elasticity under the action of the spring, the adjusting screw and the buffer block jointly reduce the impact of a reaction force during splitting, the rapid mechanical abrasion and the position dislocation caused by long-term impact are prevented, the problem that the splitting precision and the splitting effect are poor caused by abrasion and dislocation is further effectively prevented, the service life of the device is prolonged, and the processing precision and the processing effect are ensured;

a square-clip-shaped pressing strip is arranged in the cleaver assembly, and the square-clip-shaped pressing strip has the effect of preventing the wafer from being slightly raised and warped to influence the splitting effect;

the processing position is positioned by taking a picture, so that the processing quality can be detected, and the processing positioning precision can be ensured;

the lower camera component is movable, so that the damage of dust and other waste materials caused by splitting to a camera lens can be avoided;

the clamping jaw and the clamping jaw cylinder are not directly connected in the splitting platform, the clamping jaw is clamped and the station is rotated by utilizing the characteristics of the spring, compared with a clamping jaw direct connection mode, the clamping jaw needs to be released repeatedly, and the time for station conversion is reduced and the processing efficiency is improved because one wafer processed by the assembly only needs to stretch and retract twice.

Drawings

FIG. 1 is a schematic view of the main structure of the present invention;

FIG. 2 is a schematic view of the riving knife assembly of the present invention;

FIG. 3 is a schematic diagram of a cleaving platform according to the present invention;

FIG. 4 is a schematic view of the clamping portion of the cleaving platform of the present invention;

FIG. 5 is a front view of the main structure of the present invention.

In the figure: 1. a platen assembly; 101. a table top plate; 102. a support; 103. a gantry; 2. a riving knife assembly; 201. a linear module; 202. a first motor; 203. a vertical guide rail; 204. a moving block; 205. a riving knife; 206. a hammer member; 207. an upper limit block; 208. a limiting rod; 209. layering; 3. splitting the platform; 301. a base plate; 302. a slide rail mounting plate; 303. a slide rail; 304. a positioning panel; 305. a circular guide rail; 306. a claw cylinder; 307. a hook block; 308. a claw; 4. a lower camera assembly; 401. a connecting frame; 402. a camera mounting table; 403. a horizontal guide rail; 404. a camera element; 405. a third motor.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

The description of the directions (up, down, left, right, front, and rear) is made with reference to the structure shown in fig. 1 of the drawings attached to the specification, but the practical use direction of the present invention is not limited thereto.

Example (b):

referring to fig. 1-4, the present invention provides a technical solution: the automatic wafer splitting device based on visual positioning comprises a platen assembly 1, wherein a chopper assembly 2 and a splitting platform 3 are arranged on the platen assembly 1, the chopper assembly 2 is used for splitting a wafer, the splitting platform 3 is used for positioning the wafer, a lower camera assembly 4 is arranged on the platen assembly 1 and positioned at the lower side of the splitting platform 3, the lower camera assembly 4 is used for matching with the splitting platform 3 to realize wafer positioning, the wafer is grabbed onto the splitting platform 3 through a mechanical arm and is positioned by the splitting platform 3, the lower camera assembly 4 moves to a photographing position, a linear light source on the splitting platform 3 is matched through a hole in the platen assembly 1, the lower camera assembly 4 can photograph the wafer, the quality of the wafer product is judged, the processing position is determined, and at the moment, a receiving platform assembly of the splitting platform 3 is separated from the receiving platform assembly, after the processing position is determined by shooting, the lower camera component 4 moves away, the received platform component moves to the processing position, the cleaver component 2 moves downwards, the cleaver component 2 works to cleave the wafer, then the cleaver component 2 moves upwards, the received platform component of the cleaving platform 3 is separated from the received platform component, the cleaving platform 3 rotates the wafer to the next cleaving position, the lower camera component 4 moves to the photographing position again, the above cleaving action is repeated, after the wafers are completely processed, the cleaving platform 3 releases the positioning of the wafer, and the mechanical arm takes away the processed wafer.

Specifically, the platen assembly 1 includes a platen 101, the platen 101 is symmetrically and fixedly connected with a support 102, the support 102 is provided with a gantry 103, and the platen assembly 1 plays a bearing role for other assemblies.

Specifically, the beam portion of the gantry 103 is a marble beam body, and the marble beam body is used for reducing mechanical vibration in the wafer splitting process.

Specifically, the riving knife assembly 2 comprises a linear module 201, the linear module 201 is connected to the gantry 103 through a connecting plate, a first motor 202 is arranged on the upper side of the linear module 201, the first motor 202 is used for driving the linear module 201 to move integrally so as to adjust the overall position of the riving knife assembly 2, vertical guide rails 203 are symmetrically arranged on the linear module 201, a moving block 204 is connected onto the vertical guide rails 203 in a sliding manner, a U-shaped groove is formed in the moving block 204, a riving knife 205 is screwed in the U-shaped groove, the position of the riving knife 205 can be adjusted on the U-shaped groove, a hammer striking member 206 is arranged between the two vertical guide rails 203 and on the upper side of the riving knife 205, the riving knife 205 is driven to strike through the hammer striking member 206, the moving block 204 moves downwards on the vertical guide rails 203 in cooperation with the riving knife 205 to cleave wafers, the upside of riving knife 205 is provided with last spacing block 207, it has gag lever post 208 to go up the spiro union on the spacing block 207, through rotating the gag lever post 208 makes it move on going up the spacing block 207, move to the last spacing position that riving knife 205 installed can, simplify the adjustment from this the positioning operation of riving knife 205, still install on the straight line module 201 and be used for the cooperation the straight line light source 209 that camera subassembly 4 used down and the layering 209 that is used for compressing tightly the wafer, layering 209 is used for the splitting process to compress tightly the wafer, prevents that the wafer from rising a little and upwarping and influencing the splitting effect.

Specifically, be provided with buffer block 210 on the movable block 204, buffer block 210 is used for reducing the impact of reaction force when splitting, prevents to strike quick mechanical wear and the position dislocation that causes for a long time, and then effectively prevents that the splitting precision that wearing and tearing and dislocation arouse and the poor problem of splitting effect from taking place.

Specifically, the cleaving platform 3 includes a bottom plate 301, the bottom plate 301 is installed on the stage board 101, slide rail mounting plates 302 are symmetrically and fixedly connected to the bottom plate 301, grating strips are disposed on the side portions of the slide rail mounting plates 302, slide rails 303 are installed on the slide rail mounting plates 302, positioning panels 304 are connected to the slide rails 303 in a sliding manner, the positioning panels 304 are driven by linear motors, circular guide rails 305 are disposed on the positioning panels 304, the circular guide rails 305 are driven by a second motor to rotate on the positioning panels 304, claw cylinders 306 are uniformly disposed on the circumferential sides of the circular guide rails 305, the claw cylinders 306 control claws 308 to clamp or release, sensors are further disposed on the circumferential sides of the circular guide rails 305, the positioning panels 304 are driven by the linear motors to move on the slide rails 303, so that the position of related positioning components on the positioning panels 304 can be moved, and the grating is matched to further realize accurate movement positioning, the second motor drives the circular guide rail 305 to rotate, the positioning sensor senses the circular guide rail to be in place, when the positioning assembly is in an initial state, the push-pull rod of the claw cylinder 306 is in a contraction state, the claw 308 is in a non-clamping state on the wafer in the contraction state, and after the wafer is prevented, the push-pull rod of the claw cylinder 306 is in an extension state, and the claw 308 is in a clamping state on the wafer in the extension state.

Specifically, the lower camera assembly 4 includes a connecting frame 401, the connecting frame 401 is fixedly connected to the lower end surface of the platform 101, a camera mounting table 402 is fixedly connected to the connecting frame 401, a horizontal guide rail 403 and a lead screw are arranged on the camera mounting table 402, a camera component 404 is slidably connected to the horizontal guide rail 403, the camera component 404 is fixedly connected to a lead screw nut located on the camera mounting table 402, and the lead screw is driven by a third motor 405 to rotate.

Specifically, the pressing bar 209 is a square-shaped pressing bar, and the square-shaped pressing bar has the effect of preventing the wafer from being slightly raised to affect the splitting.

Particularly, buffer block 210 is the rubber block, buffer block 210 has seted up the perforation, sets up the spring in the perforation, run through adjusting screw in the spring with movable block 204 fixed connection, adjusting screw has certain elasticity under the spring action, its with buffer block 210 reduces the impact of reaction force when splitting jointly, prevents to strike quick mechanical wear and the position dislocation that causes for a long time, and then effectively prevents wearing and tearing and the poor problem emergence of splitting precision and splitting effect that the dislocation arouses.

Specifically, the output end of the jaw cylinder 306 is hooked with one end of a hook block 307, the other end of the hook block 307 is fixedly connected with a jaw 308, a spring is arranged at the end of the jaw 308, when the positioning assembly is in an initial state, the push-pull rod of the jaw cylinder 306 is in a contracted state, the hook block 307 is hung on the push-pull rod of the jaw cylinder 306, the jaw 308 is in an outward-pulled state, and the spring is in a stretched state; when a wafer is placed on the circular guide rail 305, the claw cylinder 306 pushes outwards, the spring resets without external force, the hook block 307 and the claw 308 move inwards along with the acting force of the spring and press the wafer, and because the push-pull rod of the claw cylinder 306 and the hook block 307 are not directly connected, the related components of the claw can rotate along with the circular guide rail 305, the processing station is changed, the wafer is always in a pressing state under the action of the spring, and when the wafer is processed, the push-pull rod of the claw cylinder 306 pulls back, the hook block 307 and the claw 308 are pulled back, and the wafer is loosened.

The working principle is as follows: the method comprises the steps of arranging a table plate component 1, arranging a cleaver component 2 and a splitting platform 3 on the table plate component 1, enabling the cleaver component 2 to be used for splitting a wafer, enabling the splitting platform 3 to be used for positioning the wafer, arranging a lower camera component 4 on the table plate component 1 and located on the lower side of the splitting platform 3, enabling the lower camera component 4 to be used for being matched with the splitting platform 3 to achieve wafer positioning, enabling the wafer to be grabbed onto the splitting platform 3 through a mechanical arm, enabling the splitting platform 3 to position the wafer, enabling the lower camera component 4 to move to a photographing position, enabling the lower camera component 4 to photograph the wafer through a hole in the table plate component 1, further judging the quality of the wafer product and determining the processing position, enabling a receiving table component of the splitting platform 3 to be in a separated state, enabling the lower camera component 4 to move away after the photographing determining the processing position, enabling the receiving table component to move to the processing position, the cleaver component 2 moves downwards, the cleaver component 2 works to cleave the wafer, then the cleaver component 2 moves upwards, the receiving platform component of the cleaving platform 3 is separated from the receiving platform component, the cleaving platform 3 rotates the wafer to the next cleaving position, the lower camera component 4 moves to the photographing position again, the above cleaving action is repeated, after the wafers are completely processed, the cleaving platform 3 is used for removing the positioning of the wafer, the mechanical arm takes away the processed wafer, the positioning of the device is accurate, the automation degree is high, and the wafer product with excellent quality can be efficiently processed.

In the description of the present invention, unless otherwise expressly specified or limited, the terms "disposed," "mounted," "connected," and "secured" are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integral to; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

The standard parts used by the invention can be purchased from the market, and the special-shaped parts can be customized according to the description and the description of the attached drawings.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (10)

1. Automatic splitting device of wafer based on visual positioning, its characterized in that: including platen subassembly (1), be provided with chopper subassembly (2) and splitting platform (3) on platen subassembly (1), chopper subassembly (2) are used for the splitting wafer, splitting platform (3) are used for fixing a position the wafer, on platen subassembly (1) and be located the downside of splitting platform (3) is provided with down camera subassembly (4), camera subassembly (4) are used for cooperating down splitting platform (3) realize the wafer location.

2. The automatic wafer cleaving device of claim 1, wherein: the bedplate component (1) comprises a bedplate (101), wherein the bedplate (101) is symmetrically and fixedly connected with supports (102), and the supports (102) are provided with a portal frame (103).

3. The automatic wafer cleaving device of claim 2, wherein: the beam part of the portal frame (103) adopts a marble beam body which is used for reducing mechanical vibration in the wafer splitting process.

4. The automatic wafer cleaving device of claim 3, wherein: the riving knife component (2) comprises a linear module (201), the linear module (201) is connected to the portal frame (103) through a connecting plate, a first motor (202) is arranged on the upper side of the linear module (201), vertical guide rails (203) are symmetrically arranged on the linear module (201), a moving block (204) is connected on the vertical guide rails (203) in a sliding manner, a U-shaped groove is formed in the moving block (204), a riving knife (205) is screwed in the U-shaped groove, a hammer striking piece (206) is arranged between the two vertical guide rails (203) and positioned on the upper side of the riving knife (205), an upper limiting block (207) is arranged on the upper side of the riving knife (205), a limiting rod (208) is screwed on the upper limiting block (207), the linear module (201) is further provided with a linear light source (209) used for being matched with the lower camera assembly (4) to use and a pressing strip (209) used for pressing the wafer.

5. The automatic wafer cleaving device of claim 4, wherein: the moving block (204) is provided with a buffer block (210).

6. The automatic wafer cleaving device of claim 3, wherein: the splitting platform (3) comprises a bottom plate (301), the bottom plate (301) is arranged on the table top plate (101), the bottom plate (301) is symmetrically and fixedly connected with a slide rail mounting plate (302), the side part of the slide rail mounting plate (302) is provided with a grating strip, the slide rail mounting plate (302) is provided with a slide rail (303), the slide rail (303) is connected with a positioning panel (304) in a sliding way, the positioning panel (304) is driven by a linear motor, a circular guide rail (305) is arranged on the positioning panel (304), the circular guide rail (305) is driven by a second motor to rotate on the positioning panel (304), the week side of circular guide rail (305) evenly sets up jack catch cylinder (306), jack catch cylinder (306) control jack catch (308) press from both sides tightly or relax, week side of circular guide rail (305) still is provided with the sensor.

7. The automatic wafer cleaving device of claim 3, wherein: lower camera subassembly (4) include link (401), link (401) fixed connection in the lower terminal surface of deck plate (101), fixedly connected with camera mount table (402) on link (401), set up horizontal guide rail (403) and lead screw on camera mount table (402), sliding connection has looks parts (404) on horizontal guide rail (403), looks parts (404) with be located lead screw nut fixed connection on camera mount table (402), the lead screw is rotated by third motor (405) drive.

8. The automatic wafer cleaving device of claim 4, wherein: the pressing strip (209) is a square-shaped pressing strip.

9. The automatic wafer cleaving device of claim 5, wherein: the buffer block (210) is a rubber block, a through hole is formed in the buffer block (210), a spring is arranged in the through hole, and an adjusting screw penetrates through the spring and is fixedly connected with the moving block (204).

10. The automatic wafer cleaving device of claim 6, wherein: the output end of the claw cylinder (306) is hooked with one end of a hook block (307), the other end of the hook block (307) is fixedly connected with a claw (308), and a spring is arranged at the end part of the claw (308).

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