JP7444006B2 - セラミック電子部品 - Google Patents
セラミック電子部品 Download PDFInfo
- Publication number
- JP7444006B2 JP7444006B2 JP2020157976A JP2020157976A JP7444006B2 JP 7444006 B2 JP7444006 B2 JP 7444006B2 JP 2020157976 A JP2020157976 A JP 2020157976A JP 2020157976 A JP2020157976 A JP 2020157976A JP 7444006 B2 JP7444006 B2 JP 7444006B2
- Authority
- JP
- Japan
- Prior art keywords
- electrode layer
- metal
- glass
- ceramic
- baked
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000919 ceramic Substances 0.000 title claims description 66
- 239000002184 metal Substances 0.000 claims description 69
- 229910052751 metal Inorganic materials 0.000 claims description 69
- 239000011521 glass Substances 0.000 claims description 59
- 230000007547 defect Effects 0.000 claims description 35
- 239000000463 material Substances 0.000 claims description 23
- 238000007747 plating Methods 0.000 claims description 18
- 230000002950 deficient Effects 0.000 claims description 8
- 239000000843 powder Substances 0.000 description 26
- 239000003985 ceramic capacitor Substances 0.000 description 21
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 16
- 239000002245 particle Substances 0.000 description 13
- 238000005422 blasting Methods 0.000 description 12
- 229910000679 solder Inorganic materials 0.000 description 11
- 238000004880 explosion Methods 0.000 description 9
- 238000012360 testing method Methods 0.000 description 9
- 229910052759 nickel Inorganic materials 0.000 description 8
- 238000009713 electroplating Methods 0.000 description 7
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 6
- 238000005336 cracking Methods 0.000 description 6
- 229910002113 barium titanate Inorganic materials 0.000 description 5
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 5
- 238000005488 sandblasting Methods 0.000 description 5
- 238000000550 scanning electron microscopy energy dispersive X-ray spectroscopy Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 230000008646 thermal stress Effects 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 230000006355 external stress Effects 0.000 description 3
- 239000011148 porous material Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 239000013256 coordination polymer Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000008034 disappearance Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000012798 spherical particle Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 229910052845 zircon Inorganic materials 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
- H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
- H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
- H01G4/1227—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates based on alkaline earth titanates
Description
2 セラミック層
3 セラミック素体
9,10 内部電極
11 外部電極
12 焼付電極層
13 めっき膜
14 ニッケル層
15 錫層
17 金属部
18 ガラス部
19 クラック
21 ガラスによる金属欠損部
22 粉体の付着による金属欠損部
Claims (4)
- 内部電極を有しかつ前記内部電極の一部が表面に露出している、セラミック素体と、
前記セラミック素体の表面の一部に設けられ、前記内部電極と電気的に接続される、外部電極と、
を備え、
前記外部電極は、導電性金属およびガラスを含む焼付電極層と、前記焼付電極層の表面に設けられためっき膜と、を含み、
前記焼付電極層は、前記導電性金属からなる金属部と、前記金属部に接する状態で分布する、前記ガラスからなるガラス部と、を含み、
前記ガラス部には、前記金属部と前記ガラス部との界面を起点として、前記ガラス部の内部方向に向かうクラックが存在し、
前記焼付電極層の表面には、前記金属部が存在しない金属欠損部が存在し、前記金属欠損部は、前記セラミック素体のモース硬度以下のモース硬度を有する材料を含む、
セラミック電子部品。 - 前記金属欠損部は、前記ガラスを含む、請求項1に記載のセラミック電子部品。
- 前記金属欠損部の、前記焼付電極層の表面における最大長さは1.7μm以下である、請求項1または2に記載のセラミック電子部品。
- 前記セラミック素体は、積層された複数のセラミック層と前記セラミック層間の複数の界面に沿ってそれぞれ配置された複数の前記内部電極とからなる積層構造を有する、請求項1ないし3のいずれかに記載のセラミック電子部品。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020157976A JP7444006B2 (ja) | 2020-09-19 | 2020-09-19 | セラミック電子部品 |
CN202110922267.6A CN114255987A (zh) | 2020-09-19 | 2021-08-11 | 陶瓷电子部件 |
US17/463,759 US11488780B2 (en) | 2020-09-19 | 2021-09-01 | Ceramic electronic component |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020157976A JP7444006B2 (ja) | 2020-09-19 | 2020-09-19 | セラミック電子部品 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2022051584A JP2022051584A (ja) | 2022-04-01 |
JP7444006B2 true JP7444006B2 (ja) | 2024-03-06 |
Family
ID=80741752
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020157976A Active JP7444006B2 (ja) | 2020-09-19 | 2020-09-19 | セラミック電子部品 |
Country Status (3)
Country | Link |
---|---|
US (1) | US11488780B2 (ja) |
JP (1) | JP7444006B2 (ja) |
CN (1) | CN114255987A (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7444006B2 (ja) * | 2020-09-19 | 2024-03-06 | 株式会社村田製作所 | セラミック電子部品 |
WO2024034187A1 (ja) * | 2022-08-10 | 2024-02-15 | 太陽誘電株式会社 | 電子部品、回路基板、電子機器および電子部品の製造方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005050895A (ja) | 2003-07-30 | 2005-02-24 | Murata Mfg Co Ltd | セラミック電子部品およびその製造方法 |
JP2008251990A (ja) | 2007-03-30 | 2008-10-16 | Tdk Corp | 電子部品の製造方法 |
JP2018056266A (ja) | 2016-09-28 | 2018-04-05 | 株式会社村田製作所 | 電子部品の製造方法 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2867748B2 (ja) | 1991-06-25 | 1999-03-10 | 三菱マテリアル株式会社 | チップ型積層セラミックスコンデンサ |
JP4192796B2 (ja) * | 2004-02-02 | 2008-12-10 | 株式会社村田製作所 | 積層セラミックコンデンサおよびその実装構造 |
JP2012033621A (ja) * | 2010-07-29 | 2012-02-16 | Kyocera Corp | 積層セラミックコンデンサ |
JP5939475B2 (ja) * | 2012-02-29 | 2016-06-22 | 株式会社村田製作所 | 導電性ペースト、及び電子部品、並びに電子部品の製造方法 |
JP6171937B2 (ja) * | 2012-10-19 | 2017-08-02 | 東レ株式会社 | 離型用二軸配向ポリエステルフィルム |
KR101699389B1 (ko) * | 2013-04-25 | 2017-01-24 | 가부시키가이샤 무라타 세이사쿠쇼 | 적층 세라믹 콘덴서 및 그 제조방법 |
JP2018049883A (ja) * | 2016-09-20 | 2018-03-29 | 株式会社村田製作所 | 積層セラミック電子部品 |
US10395827B2 (en) * | 2016-09-28 | 2019-08-27 | Murata Manufacturing Co., Ltd. | Electronic component |
JP2018067568A (ja) * | 2016-10-17 | 2018-04-26 | 株式会社村田製作所 | 積層セラミックコンデンサの製造方法 |
KR102105345B1 (ko) * | 2016-12-09 | 2020-04-28 | 가부시키가이샤 무라타 세이사쿠쇼 | 적층 세라믹 콘덴서 |
JP7243487B2 (ja) * | 2019-06-27 | 2023-03-22 | 株式会社村田製作所 | 積層セラミックコンデンサの製造方法 |
JP7444006B2 (ja) * | 2020-09-19 | 2024-03-06 | 株式会社村田製作所 | セラミック電子部品 |
JP7392616B2 (ja) * | 2020-09-19 | 2023-12-06 | 株式会社村田製作所 | セラミック電子部品の製造方法 |
JP2022123936A (ja) * | 2021-02-15 | 2022-08-25 | 株式会社村田製作所 | 積層セラミックコンデンサ |
-
2020
- 2020-09-19 JP JP2020157976A patent/JP7444006B2/ja active Active
-
2021
- 2021-08-11 CN CN202110922267.6A patent/CN114255987A/zh active Pending
- 2021-09-01 US US17/463,759 patent/US11488780B2/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005050895A (ja) | 2003-07-30 | 2005-02-24 | Murata Mfg Co Ltd | セラミック電子部品およびその製造方法 |
JP2008251990A (ja) | 2007-03-30 | 2008-10-16 | Tdk Corp | 電子部品の製造方法 |
JP2018056266A (ja) | 2016-09-28 | 2018-04-05 | 株式会社村田製作所 | 電子部品の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2022051584A (ja) | 2022-04-01 |
US11488780B2 (en) | 2022-11-01 |
CN114255987A (zh) | 2022-03-29 |
US20220093336A1 (en) | 2022-03-24 |
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