JP7441612B2 - 発光装置及びその製造方法 - Google Patents

発光装置及びその製造方法 Download PDF

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Publication number
JP7441612B2
JP7441612B2 JP2019091547A JP2019091547A JP7441612B2 JP 7441612 B2 JP7441612 B2 JP 7441612B2 JP 2019091547 A JP2019091547 A JP 2019091547A JP 2019091547 A JP2019091547 A JP 2019091547A JP 7441612 B2 JP7441612 B2 JP 7441612B2
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light emitting
substrate
emitting element
adhesive
intermediate layer
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JP2019201206A5 (enExample
JP2019201206A (ja
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シェ ミン－シュン
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Epistar Corp
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Epistar Corp
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H10W72/0198—
    • H10W90/00—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0364—Manufacture or treatment of packages of interconnections
    • H10W72/072—
    • H10W72/07207—
    • H10W72/073—
    • H10W74/15—

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  • Led Device Packages (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Planar Illumination Modules (AREA)
JP2019091547A 2018-05-14 2019-05-14 発光装置及びその製造方法 Active JP7441612B2 (ja)

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JP2023188094A JP2023181464A (ja) 2018-05-14 2023-11-02 発光装置及びその製造方法

Applications Claiming Priority (4)

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US201862670900P 2018-05-14 2018-05-14
US62/670,900 2018-05-14
US201862697387P 2018-07-12 2018-07-12
US62/697,387 2018-07-12

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JP2019201206A JP2019201206A (ja) 2019-11-21
JP2019201206A5 JP2019201206A5 (enExample) 2022-05-20
JP7441612B2 true JP7441612B2 (ja) 2024-03-01

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US (4) US10923641B2 (enExample)
JP (2) JP7441612B2 (enExample)
KR (2) KR102498453B1 (enExample)
CN (3) CN116682924A (enExample)
DE (1) DE102019112546B4 (enExample)
TW (2) TWI878222B (enExample)

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US11424224B2 (en) * 2019-04-24 2022-08-23 Seoul Viosys Co., Ltd. LED display panel, LED display apparatus having the same and method of fabricating the same
JP7321792B2 (ja) * 2019-06-26 2023-08-07 株式会社ジャパンディスプレイ 異方性導電膜及び表示装置
US10847083B1 (en) 2019-10-14 2020-11-24 Shaoher Pan Integrated active-matrix light emitting pixel arrays based devices by laser-assisted bonding
US11011669B2 (en) * 2019-10-14 2021-05-18 Shaoher Pan Integrated active-matrix light emitting pixel arrays based devices
US11901497B2 (en) * 2019-12-24 2024-02-13 Seoul Viosys Co., Ltd. Method of repairing light emitting device, apparatus for repairing light emitting device, and display panel having repaired light emitting device
KR20210106056A (ko) * 2020-02-19 2021-08-30 한국전자통신연구원 레이저를 이용한 전사 및 접합 방법
KR20220151599A (ko) * 2020-03-09 2022-11-15 세키스이가가쿠 고교가부시키가이샤 전자 부품의 제조 방법, 및, 표시 장치의 제조 방법
EP3907725A1 (en) * 2020-05-06 2021-11-10 Admesy B.V. Method and setup for performing a series of optical measurements with a 2d imaging system
CN111710745B (zh) * 2020-06-28 2023-03-21 重庆邮电大学 一种锰掺杂纯无机钙钛矿-Au纳米晶异质结及其制备方法和应用
WO2022021003A1 (zh) * 2020-07-27 2022-02-03 重庆康佳光电技术研究院有限公司 转接板、巨量转移方法及Micro-LED显示器
CN112967980B (zh) * 2020-08-13 2021-12-24 重庆康佳光电技术研究院有限公司 芯片转移组件及其制作方法、芯片转移方法
JP7522611B2 (ja) * 2020-08-28 2024-07-25 株式会社ジャパンディスプレイ 表示装置の製造方法
CN217361526U (zh) * 2020-09-30 2022-09-02 广东晶相光电科技有限公司 一种发光二极管及发光二极管显示器
KR102436469B1 (ko) * 2020-11-27 2022-08-26 주식회사 아큐레이저 반도체 소자의 전사 장치 및 전사 방법
KR102899002B1 (ko) * 2020-12-02 2025-12-10 엘지디스플레이 주식회사 발광 소자의 전사 방법 및 이를 이용한 표시 장치의 제조 방법
JP7788849B2 (ja) * 2021-01-28 2025-12-19 東レエンジニアリング株式会社 転写装置および転写基板
CN118483848A (zh) 2021-07-28 2024-08-13 群创光电股份有限公司 发光装置
US12446374B2 (en) * 2022-03-21 2025-10-14 GM Global Technology Operations LLC Transparent structural composites with encapsulated micro-LEDs
CN115763351B (zh) * 2022-04-01 2025-08-26 友达光电股份有限公司 发光元件阵列基板及其制造方法
US20230317497A1 (en) * 2022-04-01 2023-10-05 AUO Corporation Display apparatus
CN119384888A (zh) * 2022-09-01 2025-01-28 三星电子株式会社 包括连接发光二极管和基板的接合构件的显示模块
CN117476532B (zh) * 2023-03-09 2025-09-02 深圳市华星光电半导体显示技术有限公司 巨量转移方法

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JP2010251359A (ja) 2009-04-10 2010-11-04 Sony Corp 素子の移載方法
JP2010251360A (ja) 2009-04-10 2010-11-04 Sony Corp 表示装置の製造方法および表示装置
JP2014515883A (ja) 2011-04-11 2014-07-03 エヌディーエスユー リサーチ ファウンデーション レーザで促進される、分離した部品の選択的な転写
JP2018060993A (ja) 2016-09-29 2018-04-12 東レエンジニアリング株式会社 転写方法、実装方法、転写装置、及び実装装置

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JP2010251359A (ja) 2009-04-10 2010-11-04 Sony Corp 素子の移載方法
JP2010251360A (ja) 2009-04-10 2010-11-04 Sony Corp 表示装置の製造方法および表示装置
JP2014515883A (ja) 2011-04-11 2014-07-03 エヌディーエスユー リサーチ ファウンデーション レーザで促進される、分離した部品の選択的な転写
JP2018060993A (ja) 2016-09-29 2018-04-12 東レエンジニアリング株式会社 転写方法、実装方法、転写装置、及び実装装置

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Publication number Publication date
US20230187597A1 (en) 2023-06-15
TW202508018A (zh) 2025-02-16
US20210159379A1 (en) 2021-05-27
TW201947737A (zh) 2019-12-16
CN116682923A (zh) 2023-09-01
DE102019112546A1 (de) 2019-11-14
TWI879686B (zh) 2025-04-01
US20190348588A1 (en) 2019-11-14
CN116682924A (zh) 2023-09-01
US20240234660A1 (en) 2024-07-11
KR20230023696A (ko) 2023-02-17
KR102688372B1 (ko) 2024-07-24
JP2023181464A (ja) 2023-12-21
US10923641B2 (en) 2021-02-16
KR20190130518A (ko) 2019-11-22
JP2019201206A (ja) 2019-11-21
US11894507B2 (en) 2024-02-06
TWI878222B (zh) 2025-04-01
DE102019112546B4 (de) 2023-09-28
CN110491987A (zh) 2019-11-22
US12317664B2 (en) 2025-05-27
KR102498453B1 (ko) 2023-02-09
US11621384B2 (en) 2023-04-04

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