JP2019201206A5 - - Google Patents
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- Publication number
- JP2019201206A5 JP2019201206A5 JP2019091547A JP2019091547A JP2019201206A5 JP 2019201206 A5 JP2019201206 A5 JP 2019201206A5 JP 2019091547 A JP2019091547 A JP 2019091547A JP 2019091547 A JP2019091547 A JP 2019091547A JP 2019201206 A5 JP2019201206 A5 JP 2019201206A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- light emitting
- emitting diode
- forming
- adhesive portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 238000000034 method Methods 0.000 claims 18
- 239000000758 substrate Substances 0.000 claims 18
- 239000000853 adhesive Substances 0.000 claims 10
- 230000001070 adhesive effect Effects 0.000 claims 10
- 238000004519 manufacturing process Methods 0.000 claims 2
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023188094A JP2023181464A (ja) | 2018-05-14 | 2023-11-02 | 発光装置及びその製造方法 |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201862670900P | 2018-05-14 | 2018-05-14 | |
| US62/670,900 | 2018-05-14 | ||
| US201862697387P | 2018-07-12 | 2018-07-12 | |
| US62/697,387 | 2018-07-12 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023188094A Division JP2023181464A (ja) | 2018-05-14 | 2023-11-02 | 発光装置及びその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019201206A JP2019201206A (ja) | 2019-11-21 |
| JP2019201206A5 true JP2019201206A5 (enExample) | 2022-05-20 |
| JP7441612B2 JP7441612B2 (ja) | 2024-03-01 |
Family
ID=68337028
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019091547A Active JP7441612B2 (ja) | 2018-05-14 | 2019-05-14 | 発光装置及びその製造方法 |
| JP2023188094A Pending JP2023181464A (ja) | 2018-05-14 | 2023-11-02 | 発光装置及びその製造方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023188094A Pending JP2023181464A (ja) | 2018-05-14 | 2023-11-02 | 発光装置及びその製造方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (4) | US10923641B2 (enExample) |
| JP (2) | JP7441612B2 (enExample) |
| KR (2) | KR102498453B1 (enExample) |
| CN (3) | CN116682924A (enExample) |
| DE (1) | DE102019112546B4 (enExample) |
| TW (2) | TWI879686B (enExample) |
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| KR102445450B1 (ko) | 2017-06-12 | 2022-09-20 | 쿨리케 & 소파 네덜란드 비.브이. | 개별 부품들의 기판 상으로의 병렬적 조립 |
| JP7072977B2 (ja) * | 2018-03-05 | 2022-05-23 | 株式会社ディスコ | デバイスの移設方法 |
| KR102498453B1 (ko) * | 2018-05-14 | 2023-02-09 | 에피스타 코포레이션 | 발광 디바이스 및 그 제조 방법 |
| KR102786764B1 (ko) * | 2018-07-11 | 2025-03-27 | 엘지전자 주식회사 | 반도체 발광 소자를 이용한 디스플레이 장치 및 이의 제조방법 |
| US11424224B2 (en) * | 2019-04-24 | 2022-08-23 | Seoul Viosys Co., Ltd. | LED display panel, LED display apparatus having the same and method of fabricating the same |
| JP7321792B2 (ja) * | 2019-06-26 | 2023-08-07 | 株式会社ジャパンディスプレイ | 異方性導電膜及び表示装置 |
| US11011669B2 (en) * | 2019-10-14 | 2021-05-18 | Shaoher Pan | Integrated active-matrix light emitting pixel arrays based devices |
| US10847083B1 (en) | 2019-10-14 | 2020-11-24 | Shaoher Pan | Integrated active-matrix light emitting pixel arrays based devices by laser-assisted bonding |
| US11901497B2 (en) * | 2019-12-24 | 2024-02-13 | Seoul Viosys Co., Ltd. | Method of repairing light emitting device, apparatus for repairing light emitting device, and display panel having repaired light emitting device |
| KR20210106056A (ko) * | 2020-02-19 | 2021-08-30 | 한국전자통신연구원 | 레이저를 이용한 전사 및 접합 방법 |
| KR20220151599A (ko) * | 2020-03-09 | 2022-11-15 | 세키스이가가쿠 고교가부시키가이샤 | 전자 부품의 제조 방법, 및, 표시 장치의 제조 방법 |
| EP3907725A1 (en) * | 2020-05-06 | 2021-11-10 | Admesy B.V. | Method and setup for performing a series of optical measurements with a 2d imaging system |
| CN111710745B (zh) * | 2020-06-28 | 2023-03-21 | 重庆邮电大学 | 一种锰掺杂纯无机钙钛矿-Au纳米晶异质结及其制备方法和应用 |
| WO2022021003A1 (zh) * | 2020-07-27 | 2022-02-03 | 重庆康佳光电技术研究院有限公司 | 转接板、巨量转移方法及Micro-LED显示器 |
| CN112967980B (zh) * | 2020-08-13 | 2021-12-24 | 重庆康佳光电技术研究院有限公司 | 芯片转移组件及其制作方法、芯片转移方法 |
| JP7522611B2 (ja) * | 2020-08-28 | 2024-07-25 | 株式会社ジャパンディスプレイ | 表示装置の製造方法 |
| CN216793640U (zh) * | 2020-09-30 | 2022-06-21 | 深圳市晶相技术有限公司 | 一种半导体外延结构及其应用 |
| KR102436469B1 (ko) * | 2020-11-27 | 2022-08-26 | 주식회사 아큐레이저 | 반도체 소자의 전사 장치 및 전사 방법 |
| CN114583018B (zh) * | 2020-12-02 | 2025-05-13 | 乐金显示有限公司 | 发光二极管转移方法和使用该方法的显示装置的制造方法 |
| JP2022115803A (ja) * | 2021-01-28 | 2022-08-09 | 東レエンジニアリング株式会社 | 転写装置および転写基板 |
| CN115685619B (zh) | 2021-07-28 | 2025-08-12 | 群创光电股份有限公司 | 背光模块以及电子装置 |
| US12446374B2 (en) * | 2022-03-21 | 2025-10-14 | GM Global Technology Operations LLC | Transparent structural composites with encapsulated micro-LEDs |
| CN115763351B (zh) * | 2022-04-01 | 2025-08-26 | 友达光电股份有限公司 | 发光元件阵列基板及其制造方法 |
| US20230317497A1 (en) * | 2022-04-01 | 2023-10-05 | AUO Corporation | Display apparatus |
| CN119384888A (zh) * | 2022-09-01 | 2025-01-28 | 三星电子株式会社 | 包括连接发光二极管和基板的接合构件的显示模块 |
| CN117476532B (zh) * | 2023-03-09 | 2025-09-02 | 深圳市华星光电半导体显示技术有限公司 | 巨量转移方法 |
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| US4535219A (en) | 1982-10-12 | 1985-08-13 | Xerox Corporation | Interfacial blister bonding for microinterconnections |
| JP4491948B2 (ja) * | 2000-10-06 | 2010-06-30 | ソニー株式会社 | 素子実装方法および画像表示装置の製造方法 |
| WO2002084631A1 (en) | 2001-04-11 | 2002-10-24 | Sony Corporation | Element transfer method, element arrangmenet method using the same, and image display apparatus production method |
| JP4151420B2 (ja) * | 2003-01-23 | 2008-09-17 | セイコーエプソン株式会社 | デバイスの製造方法 |
| US7244326B2 (en) * | 2003-05-16 | 2007-07-17 | Alien Technology Corporation | Transfer assembly for manufacturing electronic devices |
| JP4667803B2 (ja) * | 2004-09-14 | 2011-04-13 | 日亜化学工業株式会社 | 発光装置 |
| KR20100080423A (ko) * | 2008-12-30 | 2010-07-08 | 삼성엘이디 주식회사 | 발광소자 패키지 및 그 제조방법 |
| JP5444798B2 (ja) * | 2009-04-10 | 2014-03-19 | ソニー株式会社 | 素子の移載方法 |
| JP2010251360A (ja) | 2009-04-10 | 2010-11-04 | Sony Corp | 表示装置の製造方法および表示装置 |
| JP5402804B2 (ja) * | 2010-04-12 | 2014-01-29 | デクセリアルズ株式会社 | 発光装置の製造方法 |
| US8877567B2 (en) * | 2010-11-18 | 2014-11-04 | Stats Chippac, Ltd. | Semiconductor device and method of forming uniform height insulating layer over interposer frame as standoff for semiconductor die |
| KR101963421B1 (ko) * | 2011-04-11 | 2019-03-28 | 엔디에스유 리서치 파운데이션 | 별개의 구성요소의 선택적인 레이저 보조 전사 |
| US9306117B2 (en) * | 2011-07-25 | 2016-04-05 | Industrial Technology Research Institute | Transfer-bonding method for light emitting devices |
| TWI499031B (zh) * | 2012-03-22 | 2015-09-01 | 光芯科技股份有限公司 | 發光裝置 |
| JP2013211443A (ja) * | 2012-03-30 | 2013-10-10 | Toyohashi Univ Of Technology | 発光装置の製造方法 |
| KR102135352B1 (ko) * | 2013-08-20 | 2020-07-17 | 엘지전자 주식회사 | 표시장치 |
| JP6853186B2 (ja) * | 2015-04-28 | 2021-03-31 | ネーデルランドセ・オルガニサティ・フォール・トゥーヘパスト−ナトゥールウェテンスハッペライク・オンデルズーク・テーエヌオー | フラッシュランプを使用してチップを非接触移送およびはんだ付けするための装置および方法 |
| EP3271951B1 (en) * | 2015-05-21 | 2019-03-20 | Goertek Inc. | Transferring method, manufacturing method of micro-led |
| TW202524641A (zh) | 2016-01-15 | 2025-06-16 | 荷蘭商庫力克及索發荷蘭公司 | 放置超小或超薄之離散組件 |
| US10312310B2 (en) * | 2016-01-19 | 2019-06-04 | Diftek Lasers, Inc. | OLED display and method of fabrication thereof |
| KR102617563B1 (ko) * | 2016-09-22 | 2023-12-27 | 엘지전자 주식회사 | 반도체 발광 소자를 이용한 디스플레이 장치 및 이의 제조방법 |
| JP2018060993A (ja) * | 2016-09-29 | 2018-04-12 | 東レエンジニアリング株式会社 | 転写方法、実装方法、転写装置、及び実装装置 |
| EP3529838B1 (en) * | 2016-10-24 | 2022-02-23 | Nanosys, Inc. | Indium gallium nitride red light emitting diode and method of making thereof |
| US20190043843A1 (en) * | 2017-08-01 | 2019-02-07 | Innolux Corporation | Methods for manufacturing a display device |
| CN107658371B (zh) * | 2017-09-15 | 2019-01-04 | 武汉大学 | 基于激光直写的Micro-LED的制造方法 |
| TWI642047B (zh) * | 2018-01-26 | 2018-11-21 | 鼎展電子股份有限公司 | 可撓性微發光二極體顯示模組 |
| US10707105B1 (en) * | 2018-03-29 | 2020-07-07 | Facebook Technologies, Llc | Selective shape memory alloy pick-up head |
| KR102498453B1 (ko) * | 2018-05-14 | 2023-02-09 | 에피스타 코포레이션 | 발광 디바이스 및 그 제조 방법 |
| US10985046B2 (en) * | 2018-06-22 | 2021-04-20 | Veeco Instruments Inc. | Micro-LED transfer methods using light-based debonding |
| US11107947B2 (en) * | 2018-07-10 | 2021-08-31 | Long Yang | Micro light emitting diode |
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2019
- 2019-05-14 KR KR1020190056461A patent/KR102498453B1/ko active Active
- 2019-05-14 JP JP2019091547A patent/JP7441612B2/ja active Active
- 2019-05-14 CN CN202310554922.6A patent/CN116682924A/zh active Pending
- 2019-05-14 CN CN201910398713.0A patent/CN110491987A/zh active Pending
- 2019-05-14 CN CN202310554915.6A patent/CN116682923A/zh active Pending
- 2019-05-14 US US16/411,145 patent/US10923641B2/en active Active
- 2019-05-14 TW TW113138203A patent/TWI879686B/zh active
- 2019-05-14 TW TW108116535A patent/TWI878222B/zh active
- 2019-05-14 DE DE102019112546.4A patent/DE102019112546B4/de active Active
-
2021
- 2021-02-02 US US17/165,886 patent/US11621384B2/en active Active
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2023
- 2023-02-06 KR KR1020230015617A patent/KR102688372B1/ko active Active
- 2023-02-06 US US18/164,629 patent/US11894507B2/en active Active
- 2023-11-02 JP JP2023188094A patent/JP2023181464A/ja active Pending
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2024
- 2024-02-05 US US18/433,367 patent/US12317664B2/en active Active