TWI878222B - 一種發光裝置及其製造方法 - Google Patents

一種發光裝置及其製造方法 Download PDF

Info

Publication number
TWI878222B
TWI878222B TW108116535A TW108116535A TWI878222B TW I878222 B TWI878222 B TW I878222B TW 108116535 A TW108116535 A TW 108116535A TW 108116535 A TW108116535 A TW 108116535A TW I878222 B TWI878222 B TW I878222B
Authority
TW
Taiwan
Prior art keywords
substrate
light
emitting element
light emitting
emitting diode
Prior art date
Application number
TW108116535A
Other languages
English (en)
Chinese (zh)
Other versions
TW201947737A (zh
Inventor
謝明勳
Original Assignee
晶元光電股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 晶元光電股份有限公司 filed Critical 晶元光電股份有限公司
Publication of TW201947737A publication Critical patent/TW201947737A/zh
Application granted granted Critical
Publication of TWI878222B publication Critical patent/TWI878222B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H10W72/0198—
    • H10W90/00—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0364—Manufacture or treatment of packages of interconnections
    • H10W72/072—
    • H10W72/07207—
    • H10W72/073—
    • H10W74/15—

Landscapes

  • Led Device Packages (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Planar Illumination Modules (AREA)
TW108116535A 2018-05-14 2019-05-14 一種發光裝置及其製造方法 TWI878222B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201862670900P 2018-05-14 2018-05-14
US62/670900 2018-05-14
US201862697387P 2018-07-12 2018-07-12
US62/697387 2018-07-12

Publications (2)

Publication Number Publication Date
TW201947737A TW201947737A (zh) 2019-12-16
TWI878222B true TWI878222B (zh) 2025-04-01

Family

ID=68337028

Family Applications (2)

Application Number Title Priority Date Filing Date
TW108116535A TWI878222B (zh) 2018-05-14 2019-05-14 一種發光裝置及其製造方法
TW113138203A TWI879686B (zh) 2018-05-14 2019-05-14 一種發光裝置及其製造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW113138203A TWI879686B (zh) 2018-05-14 2019-05-14 一種發光裝置及其製造方法

Country Status (6)

Country Link
US (4) US10923641B2 (enExample)
JP (2) JP7441612B2 (enExample)
KR (2) KR102498453B1 (enExample)
CN (3) CN116682924A (enExample)
DE (1) DE102019112546B4 (enExample)
TW (2) TWI878222B (enExample)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102696459B1 (ko) 2017-06-12 2024-08-19 쿨리케 & 소파 네덜란드 비.브이. 개별 부품들의 기판 상으로의 병렬적 조립
JP7072977B2 (ja) * 2018-03-05 2022-05-23 株式会社ディスコ デバイスの移設方法
KR102498453B1 (ko) * 2018-05-14 2023-02-09 에피스타 코포레이션 발광 디바이스 및 그 제조 방법
KR102786764B1 (ko) * 2018-07-11 2025-03-27 엘지전자 주식회사 반도체 발광 소자를 이용한 디스플레이 장치 및 이의 제조방법
US11424224B2 (en) * 2019-04-24 2022-08-23 Seoul Viosys Co., Ltd. LED display panel, LED display apparatus having the same and method of fabricating the same
JP7321792B2 (ja) * 2019-06-26 2023-08-07 株式会社ジャパンディスプレイ 異方性導電膜及び表示装置
US10847083B1 (en) 2019-10-14 2020-11-24 Shaoher Pan Integrated active-matrix light emitting pixel arrays based devices by laser-assisted bonding
US11011669B2 (en) * 2019-10-14 2021-05-18 Shaoher Pan Integrated active-matrix light emitting pixel arrays based devices
US11901497B2 (en) * 2019-12-24 2024-02-13 Seoul Viosys Co., Ltd. Method of repairing light emitting device, apparatus for repairing light emitting device, and display panel having repaired light emitting device
KR20210106056A (ko) * 2020-02-19 2021-08-30 한국전자통신연구원 레이저를 이용한 전사 및 접합 방법
KR20220151599A (ko) * 2020-03-09 2022-11-15 세키스이가가쿠 고교가부시키가이샤 전자 부품의 제조 방법, 및, 표시 장치의 제조 방법
EP3907725A1 (en) * 2020-05-06 2021-11-10 Admesy B.V. Method and setup for performing a series of optical measurements with a 2d imaging system
CN111710745B (zh) * 2020-06-28 2023-03-21 重庆邮电大学 一种锰掺杂纯无机钙钛矿-Au纳米晶异质结及其制备方法和应用
WO2022021003A1 (zh) * 2020-07-27 2022-02-03 重庆康佳光电技术研究院有限公司 转接板、巨量转移方法及Micro-LED显示器
CN112967980B (zh) * 2020-08-13 2021-12-24 重庆康佳光电技术研究院有限公司 芯片转移组件及其制作方法、芯片转移方法
JP7522611B2 (ja) * 2020-08-28 2024-07-25 株式会社ジャパンディスプレイ 表示装置の製造方法
CN217361526U (zh) * 2020-09-30 2022-09-02 广东晶相光电科技有限公司 一种发光二极管及发光二极管显示器
KR102436469B1 (ko) * 2020-11-27 2022-08-26 주식회사 아큐레이저 반도체 소자의 전사 장치 및 전사 방법
KR102899002B1 (ko) * 2020-12-02 2025-12-10 엘지디스플레이 주식회사 발광 소자의 전사 방법 및 이를 이용한 표시 장치의 제조 방법
JP7788849B2 (ja) * 2021-01-28 2025-12-19 東レエンジニアリング株式会社 転写装置および転写基板
CN118483848A (zh) 2021-07-28 2024-08-13 群创光电股份有限公司 发光装置
US12446374B2 (en) * 2022-03-21 2025-10-14 GM Global Technology Operations LLC Transparent structural composites with encapsulated micro-LEDs
CN115763351B (zh) * 2022-04-01 2025-08-26 友达光电股份有限公司 发光元件阵列基板及其制造方法
US20230317497A1 (en) * 2022-04-01 2023-10-05 AUO Corporation Display apparatus
CN119384888A (zh) * 2022-09-01 2025-01-28 三星电子株式会社 包括连接发光二极管和基板的接合构件的显示模块
CN117476532B (zh) * 2023-03-09 2025-09-02 深圳市华星光电半导体显示技术有限公司 巨量转移方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101859728A (zh) * 2009-04-10 2010-10-13 索尼公司 转移器件的方法
TW201340290A (zh) * 2012-03-22 2013-10-01 光芯科技股份有限公司 發光裝置
CN103597589A (zh) * 2011-04-11 2014-02-19 北达科他州立大学研究基金会 分立元件的选择性激光辅助的转移
US20180130683A1 (en) * 2015-04-28 2018-05-10 Nederlandse Organisatie Voor Toegepast-Natuurwetenschappelijk Onderzoek Tno Apparatus and method for contactless transfer and soldering of chips using a flash lamp

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4535219A (en) 1982-10-12 1985-08-13 Xerox Corporation Interfacial blister bonding for microinterconnections
JP4491948B2 (ja) * 2000-10-06 2010-06-30 ソニー株式会社 素子実装方法および画像表示装置の製造方法
WO2002084631A1 (en) 2001-04-11 2002-10-24 Sony Corporation Element transfer method, element arrangmenet method using the same, and image display apparatus production method
JP4151420B2 (ja) * 2003-01-23 2008-09-17 セイコーエプソン株式会社 デバイスの製造方法
US7244326B2 (en) * 2003-05-16 2007-07-17 Alien Technology Corporation Transfer assembly for manufacturing electronic devices
JP4667803B2 (ja) * 2004-09-14 2011-04-13 日亜化学工業株式会社 発光装置
KR20100080423A (ko) * 2008-12-30 2010-07-08 삼성엘이디 주식회사 발광소자 패키지 및 그 제조방법
JP2010251360A (ja) 2009-04-10 2010-11-04 Sony Corp 表示装置の製造方法および表示装置
JP5402804B2 (ja) * 2010-04-12 2014-01-29 デクセリアルズ株式会社 発光装置の製造方法
US8877567B2 (en) * 2010-11-18 2014-11-04 Stats Chippac, Ltd. Semiconductor device and method of forming uniform height insulating layer over interposer frame as standoff for semiconductor die
US9306117B2 (en) * 2011-07-25 2016-04-05 Industrial Technology Research Institute Transfer-bonding method for light emitting devices
JP2013211443A (ja) * 2012-03-30 2013-10-10 Toyohashi Univ Of Technology 発光装置の製造方法
KR102135352B1 (ko) * 2013-08-20 2020-07-17 엘지전자 주식회사 표시장치
US10193012B2 (en) * 2015-05-21 2019-01-29 Goertek, Inc. Transferring method, manufacturing method, device and electronic apparatus of micro-LED
TWI783910B (zh) 2016-01-15 2022-11-21 荷蘭商庫力克及索發荷蘭公司 放置超小或超薄之離散組件
US10312310B2 (en) * 2016-01-19 2019-06-04 Diftek Lasers, Inc. OLED display and method of fabrication thereof
KR102617563B1 (ko) * 2016-09-22 2023-12-27 엘지전자 주식회사 반도체 발광 소자를 이용한 디스플레이 장치 및 이의 제조방법
JP2018060993A (ja) 2016-09-29 2018-04-12 東レエンジニアリング株式会社 転写方法、実装方法、転写装置、及び実装装置
JP6853882B2 (ja) * 2016-10-24 2021-03-31 グロ アーベーＧｌｏ Ａｂ 発光ダイオード、ディスプレイデバイス、および、直視型ディスプレイデバイス
US20190043843A1 (en) * 2017-08-01 2019-02-07 Innolux Corporation Methods for manufacturing a display device
CN107658371B (zh) * 2017-09-15 2019-01-04 武汉大学 基于激光直写的Micro-LED的制造方法
TWI642047B (zh) * 2018-01-26 2018-11-21 Flex Tek Co., Ltd. 可撓性微發光二極體顯示模組
US10707105B1 (en) * 2018-03-29 2020-07-07 Facebook Technologies, Llc Selective shape memory alloy pick-up head
KR102498453B1 (ko) * 2018-05-14 2023-02-09 에피스타 코포레이션 발광 디바이스 및 그 제조 방법
US10985046B2 (en) * 2018-06-22 2021-04-20 Veeco Instruments Inc. Micro-LED transfer methods using light-based debonding
US11107947B2 (en) * 2018-07-10 2021-08-31 Long Yang Micro light emitting diode

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101859728A (zh) * 2009-04-10 2010-10-13 索尼公司 转移器件的方法
CN103597589A (zh) * 2011-04-11 2014-02-19 北达科他州立大学研究基金会 分立元件的选择性激光辅助的转移
TW201340290A (zh) * 2012-03-22 2013-10-01 光芯科技股份有限公司 發光裝置
US20180130683A1 (en) * 2015-04-28 2018-05-10 Nederlandse Organisatie Voor Toegepast-Natuurwetenschappelijk Onderzoek Tno Apparatus and method for contactless transfer and soldering of chips using a flash lamp

Also Published As

Publication number Publication date
US20230187597A1 (en) 2023-06-15
TW202508018A (zh) 2025-02-16
US20210159379A1 (en) 2021-05-27
TW201947737A (zh) 2019-12-16
CN116682923A (zh) 2023-09-01
DE102019112546A1 (de) 2019-11-14
JP7441612B2 (ja) 2024-03-01
TWI879686B (zh) 2025-04-01
US20190348588A1 (en) 2019-11-14
CN116682924A (zh) 2023-09-01
US20240234660A1 (en) 2024-07-11
KR20230023696A (ko) 2023-02-17
KR102688372B1 (ko) 2024-07-24
JP2023181464A (ja) 2023-12-21
US10923641B2 (en) 2021-02-16
KR20190130518A (ko) 2019-11-22
JP2019201206A (ja) 2019-11-21
US11894507B2 (en) 2024-02-06
DE102019112546B4 (de) 2023-09-28
CN110491987A (zh) 2019-11-22
US12317664B2 (en) 2025-05-27
KR102498453B1 (ko) 2023-02-09
US11621384B2 (en) 2023-04-04

Similar Documents

Publication Publication Date Title
TWI878222B (zh) 一種發光裝置及其製造方法
JP7473702B2 (ja) シリコン上のカラーｉｌｅｄディスプレイ
JP7170809B2 (ja) 発光装置
US10340257B2 (en) Display device using semiconductor light emitting device and fabrication method thereof
CN111048497B (zh) 一种有源矩阵彩色显示器件的制造方法
KR101968527B1 (ko) 반도체 발광 소자를 이용한 디스플레이 장치 및 이의 제조방법
KR20180059249A (ko) 반도체 발광 소자를 이용한 디스플레이 장치 및 이의 제조방법
JP2017529557A5 (enExample)
JP2022530370A (ja) 発光ダイオードディスプレイパネル、それを有するディスプレイ装置及びそれを製造する方法
KR20200105843A (ko) 반도체 발광 소자를 이용한 디스플레이 장치의 제조방법 및 디스플레이 장치
KR20220147565A (ko) 마이크로 led 디스플레이 제조 시스템 및 방법
KR20190115838A (ko) 원칩 타입의 발광 다이오드를 이용한 디스플레이 장치 및 그 제조 방법
TWI835978B (zh) 發光裝置