KR102498453B1 - 발광 디바이스 및 그 제조 방법 - Google Patents

발광 디바이스 및 그 제조 방법 Download PDF

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KR102498453B1
KR102498453B1 KR1020190056461A KR20190056461A KR102498453B1 KR 102498453 B1 KR102498453 B1 KR 102498453B1 KR 1020190056461 A KR1020190056461 A KR 1020190056461A KR 20190056461 A KR20190056461 A KR 20190056461A KR 102498453 B1 KR102498453 B1 KR 102498453B1
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light emitting
substrate
emitting elements
emitting element
adhesive
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KR20190130518A (ko
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민-순 시에
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에피스타 코포레이션
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    • H01L33/005—
    • H01L27/156—
    • H01L33/20—
    • H01L33/36—
    • H01L33/62—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0364—Manufacture or treatment of packages of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07202—Connecting or disconnecting of bump connectors using auxiliary members
    • H10W72/07204—Connecting or disconnecting of bump connectors using auxiliary members using temporary auxiliary members, e.g. sacrificial coatings
    • H10W72/07207—Temporary substrates, e.g. removable substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills

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  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Planar Illumination Modules (AREA)
KR1020190056461A 2018-05-14 2019-05-14 발광 디바이스 및 그 제조 방법 Active KR102498453B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
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US201862670900P 2018-05-14 2018-05-14
US62/670,900 2018-05-14
US201862697387P 2018-07-12 2018-07-12
US62/697,387 2018-07-12

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KR102498453B1 true KR102498453B1 (ko) 2023-02-09

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US (4) US10923641B2 (enExample)
JP (2) JP7441612B2 (enExample)
KR (2) KR102498453B1 (enExample)
CN (3) CN110491987A (enExample)
DE (1) DE102019112546B4 (enExample)
TW (2) TWI878222B (enExample)

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US11011669B2 (en) * 2019-10-14 2021-05-18 Shaoher Pan Integrated active-matrix light emitting pixel arrays based devices
US10847083B1 (en) 2019-10-14 2020-11-24 Shaoher Pan Integrated active-matrix light emitting pixel arrays based devices by laser-assisted bonding
US11901497B2 (en) * 2019-12-24 2024-02-13 Seoul Viosys Co., Ltd. Method of repairing light emitting device, apparatus for repairing light emitting device, and display panel having repaired light emitting device
KR20210106056A (ko) * 2020-02-19 2021-08-30 한국전자통신연구원 레이저를 이용한 전사 및 접합 방법
JP7804461B2 (ja) * 2020-03-09 2026-01-22 積水化学工業株式会社 電子部品の製造方法、及び、表示装置の製造方法
EP3907725A1 (en) * 2020-05-06 2021-11-10 Admesy B.V. Method and setup for performing a series of optical measurements with a 2d imaging system
CN111710745B (zh) * 2020-06-28 2023-03-21 重庆邮电大学 一种锰掺杂纯无机钙钛矿-Au纳米晶异质结及其制备方法和应用
WO2022021003A1 (zh) * 2020-07-27 2022-02-03 重庆康佳光电技术研究院有限公司 转接板、巨量转移方法及Micro-LED显示器
CN112967980B (zh) * 2020-08-13 2021-12-24 重庆康佳光电技术研究院有限公司 芯片转移组件及其制作方法、芯片转移方法
JP7522611B2 (ja) * 2020-08-28 2024-07-25 株式会社ジャパンディスプレイ 表示装置の製造方法
CN216793639U (zh) * 2020-09-30 2022-06-21 广东晶相光电科技有限公司 一种发光二极管及发光二极管显示器
KR102436469B1 (ko) * 2020-11-27 2022-08-26 주식회사 아큐레이저 반도체 소자의 전사 장치 및 전사 방법
KR102899002B1 (ko) * 2020-12-02 2025-12-10 엘지디스플레이 주식회사 발광 소자의 전사 방법 및 이를 이용한 표시 장치의 제조 방법
JP7788849B2 (ja) * 2021-01-28 2025-12-19 東レエンジニアリング株式会社 転写装置および転写基板
CN120595514A (zh) * 2021-07-28 2025-09-05 群创光电股份有限公司 发光装置
US12446374B2 (en) * 2022-03-21 2025-10-14 GM Global Technology Operations LLC Transparent structural composites with encapsulated micro-LEDs
JP7733602B2 (ja) * 2022-03-28 2025-09-03 東レエンジニアリング株式会社 転写装置および転写方法
CN115763351B (zh) * 2022-04-01 2025-08-26 友达光电股份有限公司 发光元件阵列基板及其制造方法
US20230317497A1 (en) * 2022-04-01 2023-10-05 AUO Corporation Display apparatus
CN119384888A (zh) * 2022-09-01 2025-01-28 三星电子株式会社 包括连接发光二极管和基板的接合构件的显示模块
CN117476532B (zh) * 2023-03-09 2025-09-02 深圳市华星光电半导体显示技术有限公司 巨量转移方法

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Publication number Publication date
DE102019112546A1 (de) 2019-11-14
TW202508018A (zh) 2025-02-16
US20210159379A1 (en) 2021-05-27
CN116682923A (zh) 2023-09-01
US20230187597A1 (en) 2023-06-15
US11894507B2 (en) 2024-02-06
DE102019112546B4 (de) 2023-09-28
US20190348588A1 (en) 2019-11-14
TWI879686B (zh) 2025-04-01
CN116682924A (zh) 2023-09-01
JP2019201206A (ja) 2019-11-21
JP7441612B2 (ja) 2024-03-01
CN110491987A (zh) 2019-11-22
TW201947737A (zh) 2019-12-16
TWI878222B (zh) 2025-04-01
JP2023181464A (ja) 2023-12-21
US10923641B2 (en) 2021-02-16
US11621384B2 (en) 2023-04-04
US12317664B2 (en) 2025-05-27
KR20190130518A (ko) 2019-11-22
KR102688372B1 (ko) 2024-07-24
KR20230023696A (ko) 2023-02-17
US20240234660A1 (en) 2024-07-11

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