CN110491987A - 一种发光装置及其制造方法 - Google Patents

一种发光装置及其制造方法 Download PDF

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Publication number
CN110491987A
CN110491987A CN201910398713.0A CN201910398713A CN110491987A CN 110491987 A CN110491987 A CN 110491987A CN 201910398713 A CN201910398713 A CN 201910398713A CN 110491987 A CN110491987 A CN 110491987A
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CN
China
Prior art keywords
substrate
light emitting
light
emitting element
emitting diode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201910398713.0A
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English (en)
Chinese (zh)
Inventor
谢明勋
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Epistar Corp
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Epistar Corp
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Filing date
Publication date
Application filed by Epistar Corp filed Critical Epistar Corp
Priority to CN202310554915.6A priority Critical patent/CN116682923A/zh
Priority to CN202310554922.6A priority patent/CN116682924A/zh
Publication of CN110491987A publication Critical patent/CN110491987A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0364—Manufacture or treatment of packages of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07202—Connecting or disconnecting of bump connectors using auxiliary members
    • H10W72/07204—Connecting or disconnecting of bump connectors using auxiliary members using temporary auxiliary members, e.g. sacrificial coatings
    • H10W72/07207—Temporary substrates, e.g. removable substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills

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  • Led Device Packages (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Planar Illumination Modules (AREA)
CN201910398713.0A 2018-05-14 2019-05-14 一种发光装置及其制造方法 Pending CN110491987A (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN202310554915.6A CN116682923A (zh) 2018-05-14 2019-05-14 一种发光装置及其制造方法
CN202310554922.6A CN116682924A (zh) 2018-05-14 2019-05-14 一种发光装置及其制造方法

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201862670900P 2018-05-14 2018-05-14
US62/670,900 2018-05-14
US201862697387P 2018-07-12 2018-07-12
US62/697,387 2018-07-12

Related Child Applications (2)

Application Number Title Priority Date Filing Date
CN202310554915.6A Division CN116682923A (zh) 2018-05-14 2019-05-14 一种发光装置及其制造方法
CN202310554922.6A Division CN116682924A (zh) 2018-05-14 2019-05-14 一种发光装置及其制造方法

Publications (1)

Publication Number Publication Date
CN110491987A true CN110491987A (zh) 2019-11-22

Family

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Family Applications (3)

Application Number Title Priority Date Filing Date
CN201910398713.0A Pending CN110491987A (zh) 2018-05-14 2019-05-14 一种发光装置及其制造方法
CN202310554922.6A Pending CN116682924A (zh) 2018-05-14 2019-05-14 一种发光装置及其制造方法
CN202310554915.6A Pending CN116682923A (zh) 2018-05-14 2019-05-14 一种发光装置及其制造方法

Family Applications After (2)

Application Number Title Priority Date Filing Date
CN202310554922.6A Pending CN116682924A (zh) 2018-05-14 2019-05-14 一种发光装置及其制造方法
CN202310554915.6A Pending CN116682923A (zh) 2018-05-14 2019-05-14 一种发光装置及其制造方法

Country Status (6)

Country Link
US (4) US10923641B2 (enExample)
JP (2) JP7441612B2 (enExample)
KR (2) KR102498453B1 (enExample)
CN (3) CN110491987A (enExample)
DE (1) DE102019112546B4 (enExample)
TW (2) TWI878222B (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
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CN114300401A (zh) * 2020-09-30 2022-04-08 广东晶相光电科技有限公司 一种发光二极管及其应用
CN115719750A (zh) * 2022-04-01 2023-02-28 友达光电股份有限公司 显示装置
CN115763351A (zh) * 2022-04-01 2023-03-07 友达光电股份有限公司 发光元件阵列基板及其制造方法

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US10923641B2 (en) * 2018-05-14 2021-02-16 Epistar Corporation Light-emitting device and manufacturing method thereof
KR102786764B1 (ko) * 2018-07-11 2025-03-27 엘지전자 주식회사 반도체 발광 소자를 이용한 디스플레이 장치 및 이의 제조방법
US11424224B2 (en) * 2019-04-24 2022-08-23 Seoul Viosys Co., Ltd. LED display panel, LED display apparatus having the same and method of fabricating the same
JP7321792B2 (ja) * 2019-06-26 2023-08-07 株式会社ジャパンディスプレイ 異方性導電膜及び表示装置
US11011669B2 (en) * 2019-10-14 2021-05-18 Shaoher Pan Integrated active-matrix light emitting pixel arrays based devices
US10847083B1 (en) 2019-10-14 2020-11-24 Shaoher Pan Integrated active-matrix light emitting pixel arrays based devices by laser-assisted bonding
US11901497B2 (en) * 2019-12-24 2024-02-13 Seoul Viosys Co., Ltd. Method of repairing light emitting device, apparatus for repairing light emitting device, and display panel having repaired light emitting device
KR20210106056A (ko) * 2020-02-19 2021-08-30 한국전자통신연구원 레이저를 이용한 전사 및 접합 방법
JP7804461B2 (ja) * 2020-03-09 2026-01-22 積水化学工業株式会社 電子部品の製造方法、及び、表示装置の製造方法
EP3907725A1 (en) * 2020-05-06 2021-11-10 Admesy B.V. Method and setup for performing a series of optical measurements with a 2d imaging system
CN111710745B (zh) * 2020-06-28 2023-03-21 重庆邮电大学 一种锰掺杂纯无机钙钛矿-Au纳米晶异质结及其制备方法和应用
WO2022021003A1 (zh) * 2020-07-27 2022-02-03 重庆康佳光电技术研究院有限公司 转接板、巨量转移方法及Micro-LED显示器
CN112967980B (zh) * 2020-08-13 2021-12-24 重庆康佳光电技术研究院有限公司 芯片转移组件及其制作方法、芯片转移方法
JP7522611B2 (ja) * 2020-08-28 2024-07-25 株式会社ジャパンディスプレイ 表示装置の製造方法
KR102436469B1 (ko) * 2020-11-27 2022-08-26 주식회사 아큐레이저 반도체 소자의 전사 장치 및 전사 방법
KR102899002B1 (ko) * 2020-12-02 2025-12-10 엘지디스플레이 주식회사 발광 소자의 전사 방법 및 이를 이용한 표시 장치의 제조 방법
JP7788849B2 (ja) * 2021-01-28 2025-12-19 東レエンジニアリング株式会社 転写装置および転写基板
CN120595514A (zh) * 2021-07-28 2025-09-05 群创光电股份有限公司 发光装置
US12446374B2 (en) * 2022-03-21 2025-10-14 GM Global Technology Operations LLC Transparent structural composites with encapsulated micro-LEDs
JP7733602B2 (ja) * 2022-03-28 2025-09-03 東レエンジニアリング株式会社 転写装置および転写方法
CN119384888A (zh) * 2022-09-01 2025-01-28 三星电子株式会社 包括连接发光二极管和基板的接合构件的显示模块
CN117476532B (zh) * 2023-03-09 2025-09-02 深圳市华星光电半导体显示技术有限公司 巨量转移方法

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CN103597589A (zh) * 2011-04-11 2014-02-19 北达科他州立大学研究基金会 分立元件的选择性激光辅助的转移
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Publication number Priority date Publication date Assignee Title
CN114300401A (zh) * 2020-09-30 2022-04-08 广东晶相光电科技有限公司 一种发光二极管及其应用
CN115719750A (zh) * 2022-04-01 2023-02-28 友达光电股份有限公司 显示装置
CN115763351A (zh) * 2022-04-01 2023-03-07 友达光电股份有限公司 发光元件阵列基板及其制造方法
CN115763351B (zh) * 2022-04-01 2025-08-26 友达光电股份有限公司 发光元件阵列基板及其制造方法

Also Published As

Publication number Publication date
DE102019112546A1 (de) 2019-11-14
KR102498453B1 (ko) 2023-02-09
TW202508018A (zh) 2025-02-16
US20210159379A1 (en) 2021-05-27
CN116682923A (zh) 2023-09-01
US20230187597A1 (en) 2023-06-15
US11894507B2 (en) 2024-02-06
DE102019112546B4 (de) 2023-09-28
US20190348588A1 (en) 2019-11-14
TWI879686B (zh) 2025-04-01
CN116682924A (zh) 2023-09-01
JP2019201206A (ja) 2019-11-21
JP7441612B2 (ja) 2024-03-01
TW201947737A (zh) 2019-12-16
TWI878222B (zh) 2025-04-01
JP2023181464A (ja) 2023-12-21
US10923641B2 (en) 2021-02-16
US11621384B2 (en) 2023-04-04
US12317664B2 (en) 2025-05-27
KR20190130518A (ko) 2019-11-22
KR102688372B1 (ko) 2024-07-24
KR20230023696A (ko) 2023-02-17
US20240234660A1 (en) 2024-07-11

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