JP7426592B2 - 伸縮性回路基板 - Google Patents

伸縮性回路基板 Download PDF

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Publication number
JP7426592B2
JP7426592B2 JP2021509582A JP2021509582A JP7426592B2 JP 7426592 B2 JP7426592 B2 JP 7426592B2 JP 2021509582 A JP2021509582 A JP 2021509582A JP 2021509582 A JP2021509582 A JP 2021509582A JP 7426592 B2 JP7426592 B2 JP 7426592B2
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JP
Japan
Prior art keywords
stretchable
conductive
wiring
circuit board
resin
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Active
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JP2021509582A
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English (en)
Japanese (ja)
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JPWO2020196745A1 (https=
Inventor
朋寛 深尾
知昭 澤田
孝寿 阿部
恭佑 道上
真 高城
奨 福島
大介 本田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Intellectual Property Management Co Ltd
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Panasonic Intellectual Property Management Co Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0283—Stretchable printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09263—Meander

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
JP2021509582A 2019-03-27 2020-03-26 伸縮性回路基板 Active JP7426592B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019061651 2019-03-27
JP2019061651 2019-03-27
PCT/JP2020/013644 WO2020196745A1 (ja) 2019-03-27 2020-03-26 伸縮性回路基板

Publications (2)

Publication Number Publication Date
JPWO2020196745A1 JPWO2020196745A1 (https=) 2020-10-01
JP7426592B2 true JP7426592B2 (ja) 2024-02-02

Family

ID=72612044

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021509582A Active JP7426592B2 (ja) 2019-03-27 2020-03-26 伸縮性回路基板

Country Status (4)

Country Link
US (1) US12207397B2 (https=)
JP (1) JP7426592B2 (https=)
CN (1) CN113545173B (https=)
WO (1) WO2020196745A1 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110875533B (zh) 2018-09-04 2022-05-31 申泰公司 超高密度的低矮型边缘卡连接器
US12550249B2 (en) * 2020-11-02 2026-02-10 Samtec, Inc. Flex circuit and electrical communication assemblies related to same
CN115776757A (zh) * 2021-09-07 2023-03-10 鹏鼎控股(深圳)股份有限公司 可伸缩电路板
JPWO2023042491A1 (https=) 2021-09-16 2023-03-23
CN116170935A (zh) * 2021-11-24 2023-05-26 宏启胜精密电子(秦皇岛)有限公司 电路板及其制造方法
US12343150B2 (en) * 2022-02-25 2025-07-01 Murata Manufacturing Co., Ltd. Electrode
EP4525000A1 (en) * 2022-05-09 2025-03-19 Midas H&T Inc. Stretchable anisotropic conductive film, method for manufacturing same, and stretchable electronic device comprising same
WO2024090348A1 (ja) * 2022-10-24 2024-05-02 株式会社村田製作所 伸縮性デバイス

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040192082A1 (en) 2003-03-28 2004-09-30 Sigurd Wagner Stretchable and elastic interconnects
US20120051005A1 (en) 2009-01-30 2012-03-01 Universiteit Gent Stretchable electronic device
US20120052268A1 (en) 2009-01-30 2012-03-01 Universiteit Gent Stretchable electronic device
US20140299362A1 (en) 2013-04-04 2014-10-09 Electronics And Telecommunications Research Institute Stretchable electric device and manufacturing method thereof
JP2015517209A (ja) 2012-03-30 2015-06-18 ノキア コーポレイション 変形可能な装置および方法
JP2016521464A (ja) 2013-05-14 2016-07-21 エムシー１０ インコーポレイテッドＭｃ１０，Ｉｎｃ． 入れ子式蛇状相互配線を含むコンフォーマル電子機器
JP2017118109A (ja) 2015-12-21 2017-06-29 パナソニックＩｐマネジメント株式会社 基板
WO2018123732A1 (ja) 2016-12-26 2018-07-05 日立化成株式会社 配線基板及びその製造方法、並びにストレッチャブルデバイス

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI370714B (en) * 2008-01-09 2012-08-11 Ind Tech Res Inst Circuit structure and menufacturing method thereof
US8207473B2 (en) * 2008-06-24 2012-06-26 Imec Method for manufacturing a stretchable electronic device
US8329493B2 (en) * 2009-03-20 2012-12-11 University Of Utah Research Foundation Stretchable circuit configuration
EP2785792B1 (en) 2011-12-02 2015-08-12 E. I. du Pont de Nemours and Company Conductive metal composition
JP5855979B2 (ja) 2012-03-07 2016-02-09 日本メクトロン株式会社 伸縮性フレキシブル回路基板
JP2015178597A (ja) 2014-02-28 2015-10-08 太陽インキ製造株式会社 導電性組成物および導電体
JP6331130B2 (ja) * 2014-03-31 2018-05-30 パナソニックＩｐマネジメント株式会社 伸縮性フレキシブル基板およびその製造方法
WO2016114278A1 (ja) 2015-01-14 2016-07-21 東洋紡株式会社 導電性膜
KR102320382B1 (ko) * 2015-01-28 2021-11-02 삼성디스플레이 주식회사 전자 장치
JP2016178121A (ja) * 2015-03-18 2016-10-06 タツタ電線株式会社 ストレッチャブルケーブルおよびストレッチャブル回路基板
KR102659601B1 (ko) * 2016-06-28 2024-04-22 삼성디스플레이 주식회사 표시 장치
JP6851035B2 (ja) * 2018-11-09 2021-03-31 パナソニックＩｐマネジメント株式会社 樹脂組成物、並びに、それを用いた樹脂フィルム、樹脂付金属箔、金属張積層板、配線基板及び回路実装品
JP2020088271A (ja) * 2018-11-29 2020-06-04 株式会社ジャパンディスプレイ フレキシブル基板
TWI788740B (zh) * 2020-12-09 2023-01-01 財團法人工業技術研究院 可拉伸電路和可拉伸電路佈局方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040192082A1 (en) 2003-03-28 2004-09-30 Sigurd Wagner Stretchable and elastic interconnects
US20120051005A1 (en) 2009-01-30 2012-03-01 Universiteit Gent Stretchable electronic device
US20120052268A1 (en) 2009-01-30 2012-03-01 Universiteit Gent Stretchable electronic device
JP2015517209A (ja) 2012-03-30 2015-06-18 ノキア コーポレイション 変形可能な装置および方法
US20140299362A1 (en) 2013-04-04 2014-10-09 Electronics And Telecommunications Research Institute Stretchable electric device and manufacturing method thereof
JP2016521464A (ja) 2013-05-14 2016-07-21 エムシー１０ インコーポレイテッドＭｃ１０，Ｉｎｃ． 入れ子式蛇状相互配線を含むコンフォーマル電子機器
JP2017118109A (ja) 2015-12-21 2017-06-29 パナソニックＩｐマネジメント株式会社 基板
WO2018123732A1 (ja) 2016-12-26 2018-07-05 日立化成株式会社 配線基板及びその製造方法、並びにストレッチャブルデバイス

Also Published As

Publication number Publication date
JPWO2020196745A1 (https=) 2020-10-01
US20220167497A1 (en) 2022-05-26
CN113545173A (zh) 2021-10-22
WO2020196745A1 (ja) 2020-10-01
US12207397B2 (en) 2025-01-21
CN113545173B (zh) 2024-09-10

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