JPWO2020196745A1 - - Google Patents

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Publication number
JPWO2020196745A1
JPWO2020196745A1 JP2021509582A JP2021509582A JPWO2020196745A1 JP WO2020196745 A1 JPWO2020196745 A1 JP WO2020196745A1 JP 2021509582 A JP2021509582 A JP 2021509582A JP 2021509582 A JP2021509582 A JP 2021509582A JP WO2020196745 A1 JPWO2020196745 A1 JP WO2020196745A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021509582A
Other languages
Japanese (ja)
Other versions
JP7426592B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2020196745A1 publication Critical patent/JPWO2020196745A1/ja
Application granted granted Critical
Publication of JP7426592B2 publication Critical patent/JP7426592B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0283—Stretchable printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09263—Meander

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
JP2021509582A 2019-03-27 2020-03-26 伸縮性回路基板 Active JP7426592B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019061651 2019-03-27
JP2019061651 2019-03-27
PCT/JP2020/013644 WO2020196745A1 (ja) 2019-03-27 2020-03-26 伸縮性回路基板

Publications (2)

Publication Number Publication Date
JPWO2020196745A1 true JPWO2020196745A1 (https=) 2020-10-01
JP7426592B2 JP7426592B2 (ja) 2024-02-02

Family

ID=72612044

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021509582A Active JP7426592B2 (ja) 2019-03-27 2020-03-26 伸縮性回路基板

Country Status (4)

Country Link
US (1) US12207397B2 (https=)
JP (1) JP7426592B2 (https=)
CN (1) CN113545173B (https=)
WO (1) WO2020196745A1 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110875533B (zh) 2018-09-04 2022-05-31 申泰公司 超高密度的低矮型边缘卡连接器
US12550249B2 (en) * 2020-11-02 2026-02-10 Samtec, Inc. Flex circuit and electrical communication assemblies related to same
CN115776757A (zh) * 2021-09-07 2023-03-10 鹏鼎控股(深圳)股份有限公司 可伸缩电路板
JPWO2023042491A1 (https=) 2021-09-16 2023-03-23
CN116170935A (zh) * 2021-11-24 2023-05-26 宏启胜精密电子(秦皇岛)有限公司 电路板及其制造方法
US12343150B2 (en) * 2022-02-25 2025-07-01 Murata Manufacturing Co., Ltd. Electrode
EP4525000A1 (en) * 2022-05-09 2025-03-19 Midas H&T Inc. Stretchable anisotropic conductive film, method for manufacturing same, and stretchable electronic device comprising same
WO2024090348A1 (ja) * 2022-10-24 2024-05-02 株式会社村田製作所 伸縮性デバイス

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040192082A1 (en) * 2003-03-28 2004-09-30 Sigurd Wagner Stretchable and elastic interconnects
US20120051005A1 (en) * 2009-01-30 2012-03-01 Universiteit Gent Stretchable electronic device
US20120052268A1 (en) * 2009-01-30 2012-03-01 Universiteit Gent Stretchable electronic device
US20140299362A1 (en) * 2013-04-04 2014-10-09 Electronics And Telecommunications Research Institute Stretchable electric device and manufacturing method thereof
JP2015517209A (ja) * 2012-03-30 2015-06-18 ノキア コーポレイション 変形可能な装置および方法
JP2016521464A (ja) * 2013-05-14 2016-07-21 エムシー１０ インコーポレイテッドＭｃ１０，Ｉｎｃ． 入れ子式蛇状相互配線を含むコンフォーマル電子機器
JP2017118109A (ja) * 2015-12-21 2017-06-29 パナソニックＩｐマネジメント株式会社 基板
WO2018123732A1 (ja) * 2016-12-26 2018-07-05 日立化成株式会社 配線基板及びその製造方法、並びにストレッチャブルデバイス

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI370714B (en) * 2008-01-09 2012-08-11 Ind Tech Res Inst Circuit structure and menufacturing method thereof
US8207473B2 (en) * 2008-06-24 2012-06-26 Imec Method for manufacturing a stretchable electronic device
US8329493B2 (en) * 2009-03-20 2012-12-11 University Of Utah Research Foundation Stretchable circuit configuration
EP2785792B1 (en) 2011-12-02 2015-08-12 E. I. du Pont de Nemours and Company Conductive metal composition
JP5855979B2 (ja) 2012-03-07 2016-02-09 日本メクトロン株式会社 伸縮性フレキシブル回路基板
JP2015178597A (ja) 2014-02-28 2015-10-08 太陽インキ製造株式会社 導電性組成物および導電体
JP6331130B2 (ja) * 2014-03-31 2018-05-30 パナソニックＩｐマネジメント株式会社 伸縮性フレキシブル基板およびその製造方法
WO2016114278A1 (ja) 2015-01-14 2016-07-21 東洋紡株式会社 導電性膜
KR102320382B1 (ko) * 2015-01-28 2021-11-02 삼성디스플레이 주식회사 전자 장치
JP2016178121A (ja) * 2015-03-18 2016-10-06 タツタ電線株式会社 ストレッチャブルケーブルおよびストレッチャブル回路基板
KR102659601B1 (ko) * 2016-06-28 2024-04-22 삼성디스플레이 주식회사 표시 장치
JP6851035B2 (ja) * 2018-11-09 2021-03-31 パナソニックＩｐマネジメント株式会社 樹脂組成物、並びに、それを用いた樹脂フィルム、樹脂付金属箔、金属張積層板、配線基板及び回路実装品
JP2020088271A (ja) * 2018-11-29 2020-06-04 株式会社ジャパンディスプレイ フレキシブル基板
TWI788740B (zh) * 2020-12-09 2023-01-01 財團法人工業技術研究院 可拉伸電路和可拉伸電路佈局方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040192082A1 (en) * 2003-03-28 2004-09-30 Sigurd Wagner Stretchable and elastic interconnects
US20120051005A1 (en) * 2009-01-30 2012-03-01 Universiteit Gent Stretchable electronic device
US20120052268A1 (en) * 2009-01-30 2012-03-01 Universiteit Gent Stretchable electronic device
JP2015517209A (ja) * 2012-03-30 2015-06-18 ノキア コーポレイション 変形可能な装置および方法
US20140299362A1 (en) * 2013-04-04 2014-10-09 Electronics And Telecommunications Research Institute Stretchable electric device and manufacturing method thereof
JP2016521464A (ja) * 2013-05-14 2016-07-21 エムシー１０ インコーポレイテッドＭｃ１０，Ｉｎｃ． 入れ子式蛇状相互配線を含むコンフォーマル電子機器
JP2017118109A (ja) * 2015-12-21 2017-06-29 パナソニックＩｐマネジメント株式会社 基板
WO2018123732A1 (ja) * 2016-12-26 2018-07-05 日立化成株式会社 配線基板及びその製造方法、並びにストレッチャブルデバイス

Also Published As

Publication number Publication date
US20220167497A1 (en) 2022-05-26
CN113545173A (zh) 2021-10-22
WO2020196745A1 (ja) 2020-10-01
US12207397B2 (en) 2025-01-21
CN113545173B (zh) 2024-09-10
JP7426592B2 (ja) 2024-02-02

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