JPWO2023042491A1 - - Google Patents
Info
- Publication number
- JPWO2023042491A1 JPWO2023042491A1 JP2023548124A JP2023548124A JPWO2023042491A1 JP WO2023042491 A1 JPWO2023042491 A1 JP WO2023042491A1 JP 2023548124 A JP2023548124 A JP 2023548124A JP 2023548124 A JP2023548124 A JP 2023548124A JP WO2023042491 A1 JPWO2023042491 A1 JP WO2023042491A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/0283—Stretchable printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0212—Resin particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09563—Metal filled via
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021150912 | 2021-09-16 | ||
| PCT/JP2022/022219 WO2023042491A1 (ja) | 2021-09-16 | 2022-05-31 | 伸縮性回路基板の製造方法、金属張積層板、樹脂付き金属箔、伸縮性回路基板及び伸縮性回路実装品 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2023042491A1 true JPWO2023042491A1 (https=) | 2023-03-23 |
Family
ID=85602685
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023548124A Pending JPWO2023042491A1 (https=) | 2021-09-16 | 2022-05-31 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US12477651B2 (https=) |
| JP (1) | JPWO2023042491A1 (https=) |
| CN (1) | CN117981480A (https=) |
| WO (1) | WO2023042491A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE112024001499T5 (de) * | 2023-05-31 | 2026-02-26 | Murata Manufacturing Co., Ltd. | Flexible vorrichtung |
| WO2025249367A1 (ja) * | 2024-05-27 | 2025-12-04 | 株式会社村田製作所 | 伸縮性デバイス |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI455671B (zh) * | 2007-10-23 | 2014-10-01 | Ube Industries | 印刷電路板之製造方法 |
| JP6090655B2 (ja) * | 2013-02-12 | 2017-03-08 | パナソニックＩｐマネジメント株式会社 | 光導波路用ドライフィルム、それを用いた光導波路及び光電気複合配線板、並びに光電気複合配線板の製造方法 |
| WO2014188830A1 (ja) * | 2013-05-22 | 2014-11-27 | 株式会社村田製作所 | フィブリル化液晶ポリマーパウダー、フィブリル化液晶ポリマーパウダーの製造方法、ペースト、樹脂多層基板、および、樹脂多層基板の製造方法 |
| US9557593B2 (en) * | 2015-03-17 | 2017-01-31 | Apple Inc. | Transparent structures filled with electrically active fluid |
| JP2018064063A (ja) | 2016-10-14 | 2018-04-19 | イリソ電子工業株式会社 | 回路基板及び回路装置 |
| JP7124711B2 (ja) * | 2016-12-26 | 2022-08-24 | 昭和電工マテリアルズ株式会社 | 配線基板及びその製造方法、並びにストレッチャブルデバイス |
| JP7492808B2 (ja) * | 2017-03-31 | 2024-05-30 | Ｊｘ金属株式会社 | 表面処理銅箔、樹脂層付き表面処理銅箔、キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法 |
| KR102003644B1 (ko) * | 2018-06-28 | 2019-10-01 | 조현민 | 신축 전도성 연결 기반 신축성 전자 장치 및 그 제조 방법 |
| JP7426592B2 (ja) | 2019-03-27 | 2024-02-02 | パナソニックＩｐマネジメント株式会社 | 伸縮性回路基板 |
| CN212010395U (zh) * | 2020-03-17 | 2020-11-24 | 深圳柔宇显示技术有限公司 | 弹性导线及弹性显示器件 |
| US12096563B2 (en) * | 2020-08-31 | 2024-09-17 | Liquid Wire Inc. | Flexible and stretchable structures |
-
2022
- 2022-05-31 JP JP2023548124A patent/JPWO2023042491A1/ja active Pending
- 2022-05-31 CN CN202280062783.9A patent/CN117981480A/zh active Pending
- 2022-05-31 WO PCT/JP2022/022219 patent/WO2023042491A1/ja not_active Ceased
-
2024
- 2024-01-11 US US18/410,564 patent/US12477651B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| US12477651B2 (en) | 2025-11-18 |
| CN117981480A (zh) | 2024-05-03 |
| WO2023042491A1 (ja) | 2023-03-23 |
| US20240147609A1 (en) | 2024-05-02 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250304 |