CN117981480A - 伸缩性电路基板的制造方法、覆金属箔层压板、带树脂的金属箔、伸缩性电路基板以及伸缩性电路安装品 - Google Patents

伸缩性电路基板的制造方法、覆金属箔层压板、带树脂的金属箔、伸缩性电路基板以及伸缩性电路安装品 Download PDF

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Publication number
CN117981480A
CN117981480A CN202280062783.9A CN202280062783A CN117981480A CN 117981480 A CN117981480 A CN 117981480A CN 202280062783 A CN202280062783 A CN 202280062783A CN 117981480 A CN117981480 A CN 117981480A
Authority
CN
China
Prior art keywords
insulating layer
stretchable
stretchable insulating
metal
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280062783.9A
Other languages
English (en)
Chinese (zh)
Inventor
深尾朋宽
泽田知昭
道上恭佑
李倩莹
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Intellectual Property Management Co Ltd
Original Assignee
Panasonic Intellectual Property Management Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Intellectual Property Management Co Ltd filed Critical Panasonic Intellectual Property Management Co Ltd
Publication of CN117981480A publication Critical patent/CN117981480A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0283—Stretchable printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
CN202280062783.9A 2021-09-16 2022-05-31 伸缩性电路基板的制造方法、覆金属箔层压板、带树脂的金属箔、伸缩性电路基板以及伸缩性电路安装品 Pending CN117981480A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021150912 2021-09-16
JP2021-150912 2021-09-16
PCT/JP2022/022219 WO2023042491A1 (ja) 2021-09-16 2022-05-31 伸縮性回路基板の製造方法、金属張積層板、樹脂付き金属箔、伸縮性回路基板及び伸縮性回路実装品

Publications (1)

Publication Number Publication Date
CN117981480A true CN117981480A (zh) 2024-05-03

Family

ID=85602685

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280062783.9A Pending CN117981480A (zh) 2021-09-16 2022-05-31 伸缩性电路基板的制造方法、覆金属箔层压板、带树脂的金属箔、伸缩性电路基板以及伸缩性电路安装品

Country Status (4)

Country Link
US (1) US12477651B2 (https=)
JP (1) JPWO2023042491A1 (https=)
CN (1) CN117981480A (https=)
WO (1) WO2023042491A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112024001499T5 (de) * 2023-05-31 2026-02-26 Murata Manufacturing Co., Ltd. Flexible vorrichtung
WO2025249367A1 (ja) * 2024-05-27 2025-12-04 株式会社村田製作所 伸縮性デバイス

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI455671B (zh) * 2007-10-23 2014-10-01 Ube Industries 印刷電路板之製造方法
JP6090655B2 (ja) * 2013-02-12 2017-03-08 パナソニックＩｐマネジメント株式会社 光導波路用ドライフィルム、それを用いた光導波路及び光電気複合配線板、並びに光電気複合配線板の製造方法
WO2014188830A1 (ja) * 2013-05-22 2014-11-27 株式会社村田製作所 フィブリル化液晶ポリマーパウダー、フィブリル化液晶ポリマーパウダーの製造方法、ペースト、樹脂多層基板、および、樹脂多層基板の製造方法
US9557593B2 (en) * 2015-03-17 2017-01-31 Apple Inc. Transparent structures filled with electrically active fluid
JP2018064063A (ja) 2016-10-14 2018-04-19 イリソ電子工業株式会社 回路基板及び回路装置
JP7124711B2 (ja) * 2016-12-26 2022-08-24 昭和電工マテリアルズ株式会社 配線基板及びその製造方法、並びにストレッチャブルデバイス
JP7492808B2 (ja) * 2017-03-31 2024-05-30 Ｊｘ金属株式会社 表面処理銅箔、樹脂層付き表面処理銅箔、キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
KR102003644B1 (ko) * 2018-06-28 2019-10-01 조현민 신축 전도성 연결 기반 신축성 전자 장치 및 그 제조 방법
JP7426592B2 (ja) 2019-03-27 2024-02-02 パナソニックＩｐマネジメント株式会社 伸縮性回路基板
CN212010395U (zh) * 2020-03-17 2020-11-24 深圳柔宇显示技术有限公司 弹性导线及弹性显示器件
US12096563B2 (en) * 2020-08-31 2024-09-17 Liquid Wire Inc. Flexible and stretchable structures

Also Published As

Publication number Publication date
JPWO2023042491A1 (https=) 2023-03-23
US12477651B2 (en) 2025-11-18
WO2023042491A1 (ja) 2023-03-23
US20240147609A1 (en) 2024-05-02

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