CN113545173B - 伸缩性电路基板 - Google Patents

伸缩性电路基板 Download PDF

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Publication number
CN113545173B
CN113545173B CN202080020114.6A CN202080020114A CN113545173B CN 113545173 B CN113545173 B CN 113545173B CN 202080020114 A CN202080020114 A CN 202080020114A CN 113545173 B CN113545173 B CN 113545173B
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China
Prior art keywords
wiring
conductive
stretchable
present
resin
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CN202080020114.6A
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English (en)
Chinese (zh)
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CN113545173A (zh
Inventor
深尾朋宽
泽田知昭
阿部孝寿
道上恭佑
高城真
福岛奖
本田大介
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Intellectual Property Management Co Ltd
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Panasonic Intellectual Property Management Co Ltd
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Publication of CN113545173A publication Critical patent/CN113545173A/zh
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0283—Stretchable printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09263—Meander

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
CN202080020114.6A 2019-03-27 2020-03-26 伸缩性电路基板 Active CN113545173B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019-061651 2019-03-27
JP2019061651 2019-03-27
PCT/JP2020/013644 WO2020196745A1 (ja) 2019-03-27 2020-03-26 伸縮性回路基板

Publications (2)

Publication Number Publication Date
CN113545173A CN113545173A (zh) 2021-10-22
CN113545173B true CN113545173B (zh) 2024-09-10

Family

ID=72612044

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080020114.6A Active CN113545173B (zh) 2019-03-27 2020-03-26 伸缩性电路基板

Country Status (4)

Country Link
US (1) US12207397B2 (https=)
JP (1) JP7426592B2 (https=)
CN (1) CN113545173B (https=)
WO (1) WO2020196745A1 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110875533B (zh) 2018-09-04 2022-05-31 申泰公司 超高密度的低矮型边缘卡连接器
US12550249B2 (en) * 2020-11-02 2026-02-10 Samtec, Inc. Flex circuit and electrical communication assemblies related to same
CN115776757A (zh) * 2021-09-07 2023-03-10 鹏鼎控股(深圳)股份有限公司 可伸缩电路板
JPWO2023042491A1 (https=) 2021-09-16 2023-03-23
CN116170935A (zh) * 2021-11-24 2023-05-26 宏启胜精密电子(秦皇岛)有限公司 电路板及其制造方法
US12343150B2 (en) * 2022-02-25 2025-07-01 Murata Manufacturing Co., Ltd. Electrode
EP4525000A1 (en) * 2022-05-09 2025-03-19 Midas H&T Inc. Stretchable anisotropic conductive film, method for manufacturing same, and stretchable electronic device comprising same
WO2024090348A1 (ja) * 2022-10-24 2024-05-02 株式会社村田製作所 伸縮性デバイス

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105826283A (zh) * 2015-01-28 2016-08-03 三星显示有限公司 电子设备
CN107432083A (zh) * 2015-03-18 2017-12-01 拓自达电线株式会社 可伸缩电缆和可伸缩电路板

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US7491892B2 (en) 2003-03-28 2009-02-17 Princeton University Stretchable and elastic interconnects
TWI370714B (en) * 2008-01-09 2012-08-11 Ind Tech Res Inst Circuit structure and menufacturing method thereof
US8207473B2 (en) * 2008-06-24 2012-06-26 Imec Method for manufacturing a stretchable electronic device
WO2010086033A1 (en) 2009-01-30 2010-08-05 Interuniversitair Microelektronica Centrum Vzw Stretchable electronic device
EP2392196B1 (en) 2009-01-30 2018-08-22 IMEC vzw Stretchable electronic device
US8329493B2 (en) * 2009-03-20 2012-12-11 University Of Utah Research Foundation Stretchable circuit configuration
EP2785792B1 (en) 2011-12-02 2015-08-12 E. I. du Pont de Nemours and Company Conductive metal composition
JP5855979B2 (ja) 2012-03-07 2016-02-09 日本メクトロン株式会社 伸縮性フレキシブル回路基板
US8895864B2 (en) 2012-03-30 2014-11-25 Nokia Corporation Deformable apparatus and method
US20140299362A1 (en) 2013-04-04 2014-10-09 Electronics And Telecommunications Research Institute Stretchable electric device and manufacturing method thereof
US9706647B2 (en) 2013-05-14 2017-07-11 Mc10, Inc. Conformal electronics including nested serpentine interconnects
JP2015178597A (ja) 2014-02-28 2015-10-08 太陽インキ製造株式会社 導電性組成物および導電体
JP6331130B2 (ja) * 2014-03-31 2018-05-30 パナソニックＩｐマネジメント株式会社 伸縮性フレキシブル基板およびその製造方法
WO2016114278A1 (ja) 2015-01-14 2016-07-21 東洋紡株式会社 導電性膜
US20170181276A1 (en) * 2015-12-21 2017-06-22 Panasonic Intellectual Property Management Co., Ltd. Substrate including stretchable sheet
KR102659601B1 (ko) * 2016-06-28 2024-04-22 삼성디스플레이 주식회사 표시 장치
JP7124711B2 (ja) 2016-12-26 2022-08-24 昭和電工マテリアルズ株式会社 配線基板及びその製造方法、並びにストレッチャブルデバイス
JP6851035B2 (ja) * 2018-11-09 2021-03-31 パナソニックＩｐマネジメント株式会社 樹脂組成物、並びに、それを用いた樹脂フィルム、樹脂付金属箔、金属張積層板、配線基板及び回路実装品
JP2020088271A (ja) * 2018-11-29 2020-06-04 株式会社ジャパンディスプレイ フレキシブル基板
TWI788740B (zh) * 2020-12-09 2023-01-01 財團法人工業技術研究院 可拉伸電路和可拉伸電路佈局方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105826283A (zh) * 2015-01-28 2016-08-03 三星显示有限公司 电子设备
CN107432083A (zh) * 2015-03-18 2017-12-01 拓自达电线株式会社 可伸缩电缆和可伸缩电路板

Also Published As

Publication number Publication date
JPWO2020196745A1 (https=) 2020-10-01
US20220167497A1 (en) 2022-05-26
CN113545173A (zh) 2021-10-22
WO2020196745A1 (ja) 2020-10-01
US12207397B2 (en) 2025-01-21
JP7426592B2 (ja) 2024-02-02

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