JP7416969B2 - 転写フィルム、積層体の製造方法、回路配線の製造方法 - Google Patents

転写フィルム、積層体の製造方法、回路配線の製造方法 Download PDF

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Publication number
JP7416969B2
JP7416969B2 JP2022551863A JP2022551863A JP7416969B2 JP 7416969 B2 JP7416969 B2 JP 7416969B2 JP 2022551863 A JP2022551863 A JP 2022551863A JP 2022551863 A JP2022551863 A JP 2022551863A JP 7416969 B2 JP7416969 B2 JP 7416969B2
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layer
photosensitive composition
mass
meth
group
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Japanese (ja)
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JPWO2022065049A5 (https=
JPWO2022065049A1 (https=
Inventor
陽平 有年
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Fujifilm Corp
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Fujifilm Corp
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/023—Optical properties
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Laminated Bodies (AREA)
JP2022551863A 2020-09-28 2021-09-09 転写フィルム、積層体の製造方法、回路配線の製造方法 Active JP7416969B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020162005 2020-09-28
JP2020162005 2020-09-28
PCT/JP2021/033130 WO2022065049A1 (ja) 2020-09-28 2021-09-09 転写フィルム、積層体の製造方法、回路配線の製造方法

Publications (3)

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JPWO2022065049A1 JPWO2022065049A1 (https=) 2022-03-31
JPWO2022065049A5 JPWO2022065049A5 (https=) 2023-06-01
JP7416969B2 true JP7416969B2 (ja) 2024-01-17

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JP2022551863A Active JP7416969B2 (ja) 2020-09-28 2021-09-09 転写フィルム、積層体の製造方法、回路配線の製造方法

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Country Link
JP (1) JP7416969B2 (https=)
CN (1) CN116157264B (https=)
WO (1) WO2022065049A1 (https=)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009046527A (ja) 2007-08-14 2009-03-05 Mitsubishi Plastics Inc 光触媒層の転写用キャリアフィルム
JP2009092818A (ja) 2007-10-05 2009-04-30 Fujifilm Corp 感光性転写材料、カラーフィルタおよびその製造方法
WO2012081680A1 (ja) 2010-12-16 2012-06-21 日立化成工業株式会社 感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
JP2017013387A (ja) 2015-07-02 2017-01-19 三菱樹脂株式会社 基材レス両面粘着シート用離型フィルム
WO2019146380A1 (ja) 2018-01-24 2019-08-01 富士フイルム株式会社 感光性転写材料及びその製造方法、樹脂パターンの製造方法、並びに、回路配線の製造方法
JP2021054055A (ja) 2019-09-27 2021-04-08 東レ株式会社 ドライフィルムレジスト用二軸配向ポリエステルフィルム
JP2022052031A (ja) 2020-09-23 2022-04-04 東レ株式会社 二軸配向ポリエステルフィルム

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09138499A (ja) * 1995-09-12 1997-05-27 Nippon Paint Co Ltd 水現像性フレキソ印刷用印刷板
WO2018061506A1 (ja) * 2016-09-29 2018-04-05 富士フイルム株式会社 タッチパネルの製造方法
JPWO2020158316A1 (ja) * 2019-01-29 2021-12-09 富士フイルム株式会社 感光性転写材料、樹脂パターンの製造方法、回路配線の製造方法、タッチパネルの製造方法、並びに、フィルム及びその製造方法
JP6954502B1 (ja) * 2020-03-26 2021-10-27 東洋紡株式会社 薄膜層転写用積層体

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009046527A (ja) 2007-08-14 2009-03-05 Mitsubishi Plastics Inc 光触媒層の転写用キャリアフィルム
JP2009092818A (ja) 2007-10-05 2009-04-30 Fujifilm Corp 感光性転写材料、カラーフィルタおよびその製造方法
WO2012081680A1 (ja) 2010-12-16 2012-06-21 日立化成工業株式会社 感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
JP2017013387A (ja) 2015-07-02 2017-01-19 三菱樹脂株式会社 基材レス両面粘着シート用離型フィルム
WO2019146380A1 (ja) 2018-01-24 2019-08-01 富士フイルム株式会社 感光性転写材料及びその製造方法、樹脂パターンの製造方法、並びに、回路配線の製造方法
JP2021054055A (ja) 2019-09-27 2021-04-08 東レ株式会社 ドライフィルムレジスト用二軸配向ポリエステルフィルム
JP2022052031A (ja) 2020-09-23 2022-04-04 東レ株式会社 二軸配向ポリエステルフィルム

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WO2022065049A1 (ja) 2022-03-31
CN116157264A (zh) 2023-05-23
JPWO2022065049A1 (https=) 2022-03-31
CN116157264B (zh) 2025-07-04

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