JP7414593B2 - 基板処理方法及び基板処理装置 - Google Patents
基板処理方法及び基板処理装置 Download PDFInfo
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- 239000000758 substrate Substances 0.000 title claims description 45
- 238000003672 processing method Methods 0.000 title claims description 17
- 238000005530 etching Methods 0.000 claims description 122
- 125000006850 spacer group Chemical group 0.000 claims description 109
- 239000007789 gas Substances 0.000 claims description 78
- 238000000034 method Methods 0.000 claims description 35
- 229910000577 Silicon-germanium Inorganic materials 0.000 claims description 30
- 238000011282 treatment Methods 0.000 claims description 26
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 23
- 229910052710 silicon Inorganic materials 0.000 claims description 23
- 239000010703 silicon Substances 0.000 claims description 23
- 229910052760 oxygen Inorganic materials 0.000 claims description 17
- 239000001301 oxygen Substances 0.000 claims description 17
- 239000002344 surface layer Substances 0.000 claims description 17
- LEVVHYCKPQWKOP-UHFFFAOYSA-N [Si].[Ge] Chemical compound [Si].[Ge] LEVVHYCKPQWKOP-UHFFFAOYSA-N 0.000 claims description 15
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 14
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 8
- 239000010408 film Substances 0.000 description 233
- 239000010410 layer Substances 0.000 description 30
- 230000003647 oxidation Effects 0.000 description 27
- 238000007254 oxidation reaction Methods 0.000 description 27
- 229910052581 Si3N4 Inorganic materials 0.000 description 8
- 238000010586 diagram Methods 0.000 description 8
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 230000007246 mechanism Effects 0.000 description 6
- 238000005192 partition Methods 0.000 description 5
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 4
- 238000010790 dilution Methods 0.000 description 4
- 239000012895 dilution Substances 0.000 description 4
- 229910052736 halogen Inorganic materials 0.000 description 4
- 150000002367 halogens Chemical class 0.000 description 4
- 238000011534 incubation Methods 0.000 description 4
- 229920006395 saturated elastomer Polymers 0.000 description 4
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 3
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- 229910021419 crystalline silicon Inorganic materials 0.000 description 3
- 229910052731 fluorine Inorganic materials 0.000 description 3
- 239000011737 fluorine Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910021529 ammonia Inorganic materials 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000009616 inductively coupled plasma Methods 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000005040 ion trap Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000002135 nanosheet Substances 0.000 description 1
- 239000002070 nanowire Substances 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
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Description
図2のステップT1においては、プラズマ処理部としてのプラズマ処理装置1を用いてスペーサ膜ISを酸化し、スペーサ膜ISの表層、すなわち表面から深さ方向に対して酸化膜Oxを形成する。図4はかかるプラズマ酸化処理を行うためのプラズマ処理装置1の構成の概略を示す縦断面図である。
スペーサ膜ISの表層に酸化膜Oxが形成されると、次に、エッチング処理部としてのエッチング処理装置101を用いて、ステップT1において形成された酸化膜Oxのエッチング除去が行われる。図6はかかるエッチング除去処理を行うためのエッチング処理装置101の構成の概略を示す縦断面図である。
本実施形態にかかるプラズマ酸化処理(ステップT1)及びエッチング除去処理(ステップT2)は、以上のようにして行われる。ここで上述したように、本実施形態にかかる一連のウェハ処理(プラズマ酸化処理及びエッチング除去処理)では、1nm~1.5nm程度の厚みの酸化膜Ox(スペーサ膜IS)のみが除去され、すなわち、一度のウェハ処理のみではSi層の側面を露出させることができない。そこで本実施形態においては、この一連のウェハ処理のサイクル(ステップT1及びステップT2)を繰り返し行うことにより、図5に示したように総エッチング量(酸化量)を増加させる。そしてこれにより、スペーサ膜ISを所望の厚みまで、具体的には、少なくともSi層の側面が露出して露出側面が形成される厚みまでエッチング除去することができる。
本実施形態によれば、従来のSiN膜よりも低誘電率を有し、化学的に安定な材料により形成されるスペーサ膜IS(例えばSiOC膜、SiON膜、又はSiOCN膜)の表層を、リモートプラズマを使用してプラズマ化された酸素含有ガスを用いることにより酸化させ、適切に酸化膜Ox(SiO2膜)を形成できる。そして、形成された酸化膜Oxは、フッ素含有ガス(例えばHFガス)及びアンモニア(NH3)ガスを用いることにより、適切にエッチング除去できる。すなわち本実施形態によれば、絶縁膜としてのスペーサ膜ISの除去を適切に行うことできる。
前記(1)によれば、プラズマ化された酸素含有ガスを使用して低誘電率のスペーサ膜の表層に酸化膜を形成し、さらに、形成された当該酸化膜をエッチング除去することにより、スペーサ膜の除去を行うことができる。低誘電率のスペーサ膜は化学的に安定性を有しており、従来のエッチング手法においてはエッチング除去を行うことが困難であった。しかしながら、このようにプラズマ化された酸素含有ガスを用いることで適切に酸化膜を形成することができ、これにより、形成された酸化膜としてスペーサ膜を適切に除去できる。
また、プラズマ化された酸素含有ガスによるスペーサ膜酸化は基板の面方向、及び高さ方向において等方的に進行するため、すなわち、スペーサ膜のエッチング除去をウェハWの面方向、及び高さ方向に等方的に行うことができる。
前記(7)によれば、スペーサ膜の除去を繰り返し行うことで、所望のエッチング量を適切に得ることができる。特に、前記(3)に記載のように一度のウェハ処理におけるスペーサ膜の酸化量(スペーサ膜のエッチング量)は2nm以下で飽和するため、スペーサ膜の総エッチング量を容易に制御することができる。また、このようにスペーサ膜の酸化量(エッチング量)は2nm以下と微小であるため、スペーサ膜の総エッチング量は更に容易に制御ができる。
Ox 酸化膜
Si シリコン
SiGe シリコンゲルマニウム
W ウェハ
Claims (14)
- シリコン膜とシリコンゲルマニウム膜が交互に積層された基板の処理方法であって、
少なくとも前記シリコン膜及び前記シリコンゲルマニウム膜の側面には低誘電率のスペーサ膜が形成され、
リモートプラズマを使用してラジカル化された酸素含有ガスにより前記スペーサ膜の表層に酸化膜を形成する工程と、
形成された前記酸化膜をエッチング除去する工程と、を含む基板処理方法。 - 前記スペーサ膜は、SiOC、SiON、SiOCN、又はSiBCNのいずれかにより形成される、請求項1に記載の基板処理方法。
- 形成される前記酸化膜の厚みは前記スペーサ膜の表面から2nm以下である、請求項1または2に記載の基板処理方法。
- 形成される前記酸化膜の厚みは、前記酸化膜を形成する工程の処理時間により制御される、請求項1~3のいずれか一項に記載の基板処理方法。
- 前記酸化膜をエッチング除去する工程は、少なくともHFガス及びNH3ガスを含む処理ガスによるエッチングにより行われる、請求項1~4のいずれか一項に記載の基板処理方法。
- 前記酸化膜をエッチング除去する工程は低温低圧の条件下において行われ、
当該エッチング除去が行われる温度条件は、0℃~120℃である、請求項5に記載の基板処理方法。 - 前記酸化膜を形成する工程と、前記酸化膜をエッチング除去する工程と、を含むサイクルを繰り返し行うことで前記スペーサ膜を除去し、少なくとも前記シリコン膜の側面を露出させる、請求項1~6のいずれか一項に記載の基板処理方法。
- シリコン膜とシリコンゲルマニウム膜が交互に積層された基板を処理する基板処理装置であって、
少なくとも前記シリコン膜及び前記シリコンゲルマニウム膜の側面には低誘電率のスペーサ膜が形成され、
リモートプラズマを使用してラジカル化された酸素含有ガスにより前記スペーサ膜の表層に酸化膜を形成するプラズマ処理部と、
形成された前記酸化膜をエッチング除去するエッチング処理部と、
前記プラズマ処理部及び前記エッチング処理部の動作を制御する制御部と、を備える基板処理装置。 - 前記スペーサ膜は、SiOC、SiON、SiOCN、又はSiBCNのいずれかにより形成される、請求項8に記載の基板処理装置。
- 前記制御部は、前記酸化膜を前記スペーサ膜の表面から2nm以下の厚みで形成するように前記プラズマ処理部の動作を制御する、請求項8または9に記載の基板処理装置。
- 前記制御部は、形成される前記酸化膜の厚みを、前記プラズマ処理部における処理時間により制御する、請求項8~10のいずれか一項に記載の基板処理装置。
- 前記制御部は、前記酸化膜のエッチング除去を、少なくともHFガス及びNH3ガスを含む処理ガスによるエッチングにより行うように、前記エッチング処理部の動作を制御する、請求項8~11のいずれか一項に記載の基板処理装置。
- 前記制御部は、前記酸化膜のエッチング除去を低温低圧の条件下において行うように前記エッチング処理部の動作を制御し、
当該エッチング除去が行われる温度条件は、0℃~120℃である、請求項12に記載の基板処理装置。 - 前記制御部は、
前記プラズマ処理部における前記酸化膜を形成と、前記エッチング処理部における前記酸化膜の除去と、を含むサイクル繰り返し行うことで前記スペーサ膜を除去し、
少なくとも前記シリコン膜の側面を露出させるように、前記プラズマ処理部及び前記エッチング処理部の動作を制御する、請求項8~13のいずれか一項に記載の基板処理装置。
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