JP7405618B2 - 粘着性積層体、粘着性積層体の使用方法、及び半導体装置の製造方法 - Google Patents

粘着性積層体、粘着性積層体の使用方法、及び半導体装置の製造方法 Download PDF

Info

Publication number
JP7405618B2
JP7405618B2 JP2019558292A JP2019558292A JP7405618B2 JP 7405618 B2 JP7405618 B2 JP 7405618B2 JP 2019558292 A JP2019558292 A JP 2019558292A JP 2019558292 A JP2019558292 A JP 2019558292A JP 7405618 B2 JP7405618 B2 JP 7405618B2
Authority
JP
Japan
Prior art keywords
adhesive
layer
thermally expandable
base material
adhesive layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2019558292A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2019112033A1 (ja
Inventor
武人 中山
直也 岡本
高志 阿久津
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of JPWO2019112033A1 publication Critical patent/JPWO2019112033A1/ja
Application granted granted Critical
Publication of JP7405618B2 publication Critical patent/JP7405618B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection

Landscapes

  • Organic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Dicing (AREA)
  • Die Bonding (AREA)
JP2019558292A 2017-12-07 2018-12-07 粘着性積層体、粘着性積層体の使用方法、及び半導体装置の製造方法 Active JP7405618B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017235366 2017-12-07
JP2017235366 2017-12-07
PCT/JP2018/045056 WO2019112033A1 (ja) 2017-12-07 2018-12-07 粘着性積層体、粘着性積層体の使用方法、及び半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPWO2019112033A1 JPWO2019112033A1 (ja) 2020-12-24
JP7405618B2 true JP7405618B2 (ja) 2023-12-26

Family

ID=66751626

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019558292A Active JP7405618B2 (ja) 2017-12-07 2018-12-07 粘着性積層体、粘着性積層体の使用方法、及び半導体装置の製造方法

Country Status (5)

Country Link
JP (1) JP7405618B2 (zh)
KR (1) KR102609670B1 (zh)
CN (1) CN112203840B (zh)
TW (1) TWI785161B (zh)
WO (1) WO2019112033A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220158793A (ko) * 2020-03-30 2022-12-01 티디케이가부시기가이샤 스탬프 툴 유지 장치, 스탬프 툴 위치 결정 장치, 멀티 요소 이송 장치 및 소자 어레이의 제조 방법
EP4320202A1 (en) * 2021-04-09 2024-02-14 Henkel AG & Co. KGaA Thermally debondable coating compositions and structures made therefrom

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000248240A (ja) 1999-03-01 2000-09-12 Nitto Denko Corp 加熱剥離型粘着シート
JP2003261842A (ja) 2002-03-12 2003-09-19 Lintec Corp 半導体ウエハ加工用粘着シートおよびその使用方法
JP2004300231A (ja) 2003-03-31 2004-10-28 Nitto Denko Corp 熱剥離性両面粘着シート、被着体の加工方法および電子部品
JP2006291137A (ja) 2005-04-14 2006-10-26 Nitto Denko Cs System Kk 粘着テープ類およびその使用方法
JP2012077310A (ja) 2011-12-02 2012-04-19 Nitto Denko Corp 加熱発泡型再剥離性アクリル系粘着テープ又はシートの製造方法
WO2016076131A1 (ja) 2014-11-13 2016-05-19 Dic株式会社 両面粘着テープ、物品及び分離方法
JP2017002190A (ja) 2015-06-10 2017-01-05 リンテック株式会社 加熱剥離性粘着シート

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3594853B2 (ja) * 1999-11-08 2004-12-02 日東電工株式会社 加熱剥離型粘着シート
JP2003020458A (ja) * 2001-07-09 2003-01-24 Sliontec Corp 粘着テープ基材およびそれを用いた粘着テープ
JP2012149182A (ja) * 2011-01-19 2012-08-09 Nitto Denko Corp 両面粘着テープ又はシート、および被着体の加工方法
US20140044957A1 (en) * 2011-07-15 2014-02-13 Nitto Denko Corporation Production method for electronic component and pressure-sensitive adhesive sheet to be used in the production method
JP2013079322A (ja) * 2011-10-04 2013-05-02 Nitto Denko Corp 加熱発泡型再剥離性粘着テープ又はシート、及び剥離方法
JP6482865B2 (ja) * 2014-12-26 2019-03-13 リンテック株式会社 半導体装置の製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000248240A (ja) 1999-03-01 2000-09-12 Nitto Denko Corp 加熱剥離型粘着シート
JP2003261842A (ja) 2002-03-12 2003-09-19 Lintec Corp 半導体ウエハ加工用粘着シートおよびその使用方法
JP2004300231A (ja) 2003-03-31 2004-10-28 Nitto Denko Corp 熱剥離性両面粘着シート、被着体の加工方法および電子部品
JP2006291137A (ja) 2005-04-14 2006-10-26 Nitto Denko Cs System Kk 粘着テープ類およびその使用方法
JP2012077310A (ja) 2011-12-02 2012-04-19 Nitto Denko Corp 加熱発泡型再剥離性アクリル系粘着テープ又はシートの製造方法
WO2016076131A1 (ja) 2014-11-13 2016-05-19 Dic株式会社 両面粘着テープ、物品及び分離方法
JP2017002190A (ja) 2015-06-10 2017-01-05 リンテック株式会社 加熱剥離性粘着シート

Also Published As

Publication number Publication date
WO2019112033A1 (ja) 2019-06-13
CN112203840B (zh) 2023-07-14
JPWO2019112033A1 (ja) 2020-12-24
TWI785161B (zh) 2022-12-01
KR20200092318A (ko) 2020-08-03
KR102609670B1 (ko) 2023-12-04
TW201930515A (zh) 2019-08-01
CN112203840A (zh) 2021-01-08

Similar Documents

Publication Publication Date Title
JP7185638B2 (ja) 半導体装置の製造方法
JP7340457B2 (ja) 粘着性積層体、樹脂膜付き加工対象物の製造方法、及び硬化樹脂膜付き硬化封止体の製造方法
JP7241744B2 (ja) 半導体チップの製造方法
WO2021117695A1 (ja) 粘着シート及び半導体装置の製造方法
JP6764524B2 (ja) 粘着シート
JP6761115B2 (ja) 半導体装置の製造方法及び両面粘着シート
JP6792700B2 (ja) 加工検査対象物の加熱剥離方法
WO2020189568A1 (ja) 粘着シート及び半導体装置の製造方法
JP7273792B2 (ja) 加工品の製造方法及び粘着性積層体
CN115397938A (zh) 双面粘合片及半导体装置的制造方法
JP7340515B2 (ja) 粘着性積層体、粘着性積層体の使用方法、及び硬化樹脂膜付き硬化封止体の製造方法
JP7405618B2 (ja) 粘着性積層体、粘着性積層体の使用方法、及び半導体装置の製造方法
WO2018181770A1 (ja) 粘着シート
WO2018181767A1 (ja) 半導体装置の製造方法及び粘着シート
JP7267272B2 (ja) 硬化封止体の製造方法
JP7188668B2 (ja) 個片化シート
JPWO2019098101A1 (ja) 半導体装置の製造方法

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20211011

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20221115

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230116

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20230418

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230619

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20230801

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230919

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20231128

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20231214

R150 Certificate of patent or registration of utility model

Ref document number: 7405618

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150