WO2018181767A1 - 半導体装置の製造方法及び粘着シート - Google Patents
半導体装置の製造方法及び粘着シート Download PDFInfo
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- WO2018181767A1 WO2018181767A1 PCT/JP2018/013354 JP2018013354W WO2018181767A1 WO 2018181767 A1 WO2018181767 A1 WO 2018181767A1 JP 2018013354 W JP2018013354 W JP 2018013354W WO 2018181767 A1 WO2018181767 A1 WO 2018181767A1
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- pressure
- sensitive adhesive
- adhesive layer
- semiconductor chip
- mass
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 178
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 126
- 239000000853 adhesive Substances 0.000 title claims abstract description 125
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 84
- 239000002245 particle Substances 0.000 claims abstract description 138
- 239000010410 layer Substances 0.000 claims abstract description 122
- 239000012790 adhesive layer Substances 0.000 claims abstract description 65
- 239000003566 sealing material Substances 0.000 claims abstract description 65
- 238000007789 sealing Methods 0.000 claims abstract description 63
- 239000000758 substrate Substances 0.000 claims abstract description 46
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 172
- 238000000034 method Methods 0.000 claims description 128
- 239000000463 material Substances 0.000 claims description 106
- 230000008569 process Effects 0.000 claims description 66
- 238000003860 storage Methods 0.000 claims description 35
- 238000010438 heat treatment Methods 0.000 claims description 29
- 239000000523 sample Substances 0.000 claims description 24
- 239000008393 encapsulating agent Substances 0.000 claims description 15
- 230000015572 biosynthetic process Effects 0.000 abstract description 14
- 238000006073 displacement reaction Methods 0.000 abstract description 3
- 229920005989 resin Polymers 0.000 description 67
- 239000011347 resin Substances 0.000 description 67
- -1 vinyl compound Chemical class 0.000 description 67
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 57
- 239000013256 coordination polymer Substances 0.000 description 50
- 239000011342 resin composition Substances 0.000 description 41
- 239000000178 monomer Substances 0.000 description 40
- 239000000203 mixture Substances 0.000 description 39
- 229920006223 adhesive resin Polymers 0.000 description 38
- 239000004840 adhesive resin Substances 0.000 description 36
- 238000000576 coating method Methods 0.000 description 30
- 239000011248 coating agent Substances 0.000 description 27
- 239000007787 solid Substances 0.000 description 27
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 24
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 22
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 21
- 239000000654 additive Substances 0.000 description 20
- 150000002009 diols Chemical group 0.000 description 20
- 239000000047 product Substances 0.000 description 20
- 125000000217 alkyl group Chemical group 0.000 description 19
- 229920006243 acrylic copolymer Polymers 0.000 description 17
- 239000003431 cross linking reagent Substances 0.000 description 17
- 229920005672 polyolefin resin Polymers 0.000 description 17
- 238000012360 testing method Methods 0.000 description 16
- 239000003795 chemical substances by application Substances 0.000 description 15
- 125000000524 functional group Chemical group 0.000 description 14
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 13
- 229920001187 thermosetting polymer Polymers 0.000 description 13
- 239000004480 active ingredient Substances 0.000 description 12
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 11
- 150000001875 compounds Chemical class 0.000 description 11
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 11
- 239000003999 initiator Substances 0.000 description 11
- 239000012948 isocyanate Substances 0.000 description 11
- 229920000642 polymer Polymers 0.000 description 11
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 10
- 125000002768 hydroxyalkyl group Chemical group 0.000 description 10
- 150000002513 isocyanates Chemical class 0.000 description 10
- 230000002093 peripheral effect Effects 0.000 description 10
- 229920005862 polyol Polymers 0.000 description 10
- 150000003077 polyols Chemical class 0.000 description 10
- 230000000996 additive effect Effects 0.000 description 9
- 150000001336 alkenes Chemical class 0.000 description 9
- 238000006243 chemical reaction Methods 0.000 description 9
- 229920002554 vinyl polymer Polymers 0.000 description 9
- 229920000178 Acrylic resin Polymers 0.000 description 8
- 239000004925 Acrylic resin Substances 0.000 description 8
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 8
- 238000010030 laminating Methods 0.000 description 8
- 238000005259 measurement Methods 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 239000002904 solvent Substances 0.000 description 8
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 8
- 238000012986 modification Methods 0.000 description 7
- 230000004048 modification Effects 0.000 description 7
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 7
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 6
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 6
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 6
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 6
- 229920001577 copolymer Polymers 0.000 description 6
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 6
- 238000009826 distribution Methods 0.000 description 6
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 6
- 229920001721 polyimide Polymers 0.000 description 6
- 239000010935 stainless steel Substances 0.000 description 6
- 229910001220 stainless steel Inorganic materials 0.000 description 6
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 5
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 150000008064 anhydrides Chemical class 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 229920001971 elastomer Polymers 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- 229920000139 polyethylene terephthalate Polymers 0.000 description 5
- 239000005020 polyethylene terephthalate Substances 0.000 description 5
- 230000003014 reinforcing effect Effects 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 4
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 4
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 4
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 4
- 125000004432 carbon atom Chemical group C* 0.000 description 4
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 125000005442 diisocyanate group Chemical group 0.000 description 4
- 238000007865 diluting Methods 0.000 description 4
- 239000001530 fumaric acid Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 230000001771 impaired effect Effects 0.000 description 4
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 4
- 239000011976 maleic acid Substances 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 4
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 4
- 239000005056 polyisocyanate Substances 0.000 description 4
- 229920001228 polyisocyanate Polymers 0.000 description 4
- 229920001296 polysiloxane Polymers 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 3
- SGVYKUFIHHTIFL-UHFFFAOYSA-N 2-methylnonane Chemical compound CCCCCCCC(C)C SGVYKUFIHHTIFL-UHFFFAOYSA-N 0.000 description 3
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 3
- 239000005058 Isophorone diisocyanate Substances 0.000 description 3
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 3
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 3
- 230000001186 cumulative effect Effects 0.000 description 3
- AFABGHUZZDYHJO-UHFFFAOYSA-N dimethyl butane Natural products CCCC(C)C AFABGHUZZDYHJO-UHFFFAOYSA-N 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 239000000806 elastomer Substances 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 238000010559 graft polymerization reaction Methods 0.000 description 3
- DMEGYFMYUHOHGS-UHFFFAOYSA-N heptamethylene Natural products C1CCCCCC1 DMEGYFMYUHOHGS-UHFFFAOYSA-N 0.000 description 3
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 3
- KUVMKLCGXIYSNH-UHFFFAOYSA-N isopentadecane Chemical compound CCCCCCCCCCCCC(C)C KUVMKLCGXIYSNH-UHFFFAOYSA-N 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 3
- 239000012299 nitrogen atmosphere Substances 0.000 description 3
- 239000000123 paper Substances 0.000 description 3
- 239000003208 petroleum Substances 0.000 description 3
- 229920001707 polybutylene terephthalate Polymers 0.000 description 3
- 229920001225 polyester resin Polymers 0.000 description 3
- 239000004645 polyester resin Substances 0.000 description 3
- 239000009719 polyimide resin Substances 0.000 description 3
- 229920002223 polystyrene Polymers 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 3
- 230000002787 reinforcement Effects 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 2
- DNIAPMSPPWPWGF-VKHMYHEASA-N (+)-propylene glycol Chemical compound C[C@H](O)CO DNIAPMSPPWPWGF-VKHMYHEASA-N 0.000 description 2
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 2
- PHONXVMOPDJLEY-UHFFFAOYSA-N (3-hydroxy-3-phenylpropyl) prop-2-enoate Chemical compound C=CC(=O)OCCC(O)C1=CC=CC=C1 PHONXVMOPDJLEY-UHFFFAOYSA-N 0.000 description 2
- YPFDHNVEDLHUCE-UHFFFAOYSA-N 1,3-propanediol Substances OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 2
- PXGZQGDTEZPERC-UHFFFAOYSA-N 1,4-cyclohexanedicarboxylic acid Chemical compound OC(=O)C1CCC(C(O)=O)CC1 PXGZQGDTEZPERC-UHFFFAOYSA-N 0.000 description 2
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 2
- YBYIRNPNPLQARY-UHFFFAOYSA-N 1H-indene Chemical compound C1=CC=C2CC=CC2=C1 YBYIRNPNPLQARY-UHFFFAOYSA-N 0.000 description 2
- 229940043268 2,2,4,4,6,8,8-heptamethylnonane Drugs 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 2
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 2
- BANXPJUEBPWEOT-UHFFFAOYSA-N 2-methyl-Pentadecane Chemical compound CCCCCCCCCCCCCC(C)C BANXPJUEBPWEOT-UHFFFAOYSA-N 0.000 description 2
- RJWUMFHQJJBBOD-UHFFFAOYSA-N 2-methylheptadecane Chemical compound CCCCCCCCCCCCCCCC(C)C RJWUMFHQJJBBOD-UHFFFAOYSA-N 0.000 description 2
- GXDHCNNESPLIKD-UHFFFAOYSA-N 2-methylhexane Natural products CCCCC(C)C GXDHCNNESPLIKD-UHFFFAOYSA-N 0.000 description 2
- QOXOZONBQWIKDA-UHFFFAOYSA-N 3-hydroxypropyl Chemical group [CH2]CCO QOXOZONBQWIKDA-UHFFFAOYSA-N 0.000 description 2
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 2
- SXIFAEWFOJETOA-UHFFFAOYSA-N 4-hydroxy-butyl Chemical group [CH2]CCCO SXIFAEWFOJETOA-UHFFFAOYSA-N 0.000 description 2
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 2
- RGSFGYAAUTVSQA-UHFFFAOYSA-N Cyclopentane Chemical compound C1CCCC1 RGSFGYAAUTVSQA-UHFFFAOYSA-N 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- 229920000219 Ethylene vinyl alcohol Polymers 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 2
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 2
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- ALQSHHUCVQOPAS-UHFFFAOYSA-N Pentane-1,5-diol Chemical compound OCCCCCO ALQSHHUCVQOPAS-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000004372 Polyvinyl alcohol Substances 0.000 description 2
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 2
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 2
- ORILYTVJVMAKLC-UHFFFAOYSA-N adamantane Chemical compound C1C(C2)CC3CC1CC2C3 ORILYTVJVMAKLC-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 125000002947 alkylene group Chemical group 0.000 description 2
- XXROGKLTLUQVRX-UHFFFAOYSA-N allyl alcohol Chemical compound OCC=C XXROGKLTLUQVRX-UHFFFAOYSA-N 0.000 description 2
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 2
- 125000003277 amino group Chemical group 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 229940067597 azelate Drugs 0.000 description 2
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 2
- 229920001400 block copolymer Polymers 0.000 description 2
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- HNEGQIOMVPPMNR-IHWYPQMZSA-N citraconic acid Chemical compound OC(=O)C(/C)=C\C(O)=O HNEGQIOMVPPMNR-IHWYPQMZSA-N 0.000 description 2
- 229940018557 citraconic acid Drugs 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- XBZSBBLNHFMTEB-UHFFFAOYSA-N cyclohexane-1,3-dicarboxylic acid Chemical compound OC(=O)C1CCCC(C(O)=O)C1 XBZSBBLNHFMTEB-UHFFFAOYSA-N 0.000 description 2
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 2
- UEVXKGPJXXDGCX-UHFFFAOYSA-N cyclotridecane Chemical compound C1CCCCCCCCCCCC1 UEVXKGPJXXDGCX-UHFFFAOYSA-N 0.000 description 2
- 150000001991 dicarboxylic acids Chemical class 0.000 description 2
- 238000007607 die coating method Methods 0.000 description 2
- 239000003085 diluting agent Substances 0.000 description 2
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 2
- SNRUBQQJIBEYMU-UHFFFAOYSA-N dodecane Chemical compound CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- FJKIXWOMBXYWOQ-UHFFFAOYSA-N ethenoxyethane Chemical compound CCOC=C FJKIXWOMBXYWOQ-UHFFFAOYSA-N 0.000 description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000004088 foaming agent Substances 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229920000578 graft copolymer Polymers 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- NDJKXXJCMXVBJW-UHFFFAOYSA-N heptadecane Chemical compound CCCCCCCCCCCCCCCCC NDJKXXJCMXVBJW-UHFFFAOYSA-N 0.000 description 2
- DCAYPVUWAIABOU-UHFFFAOYSA-N hexadecane Chemical compound CCCCCCCCCCCCCCCC DCAYPVUWAIABOU-UHFFFAOYSA-N 0.000 description 2
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 2
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 2
- 229920001903 high density polyethylene Polymers 0.000 description 2
- 239000004700 high-density polyethylene Substances 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- NNPPMTNAJDCUHE-UHFFFAOYSA-N isobutane Chemical compound CC(C)C NNPPMTNAJDCUHE-UHFFFAOYSA-N 0.000 description 2
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 2
- FNWWOHKUXFTKGN-UHFFFAOYSA-N isoheptadecane Natural products CCCCCCCCCCCCCCC(C)C FNWWOHKUXFTKGN-UHFFFAOYSA-N 0.000 description 2
- ZUBZATZOEPUUQF-UHFFFAOYSA-N isononane Chemical compound CCCCCCC(C)C ZUBZATZOEPUUQF-UHFFFAOYSA-N 0.000 description 2
- QWTDNUCVQCZILF-UHFFFAOYSA-N isopentane Chemical compound CCC(C)C QWTDNUCVQCZILF-UHFFFAOYSA-N 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- CJBFZKZYIPBBTO-UHFFFAOYSA-N isotetradecane Natural products CCCCCCCCCCCC(C)C CJBFZKZYIPBBTO-UHFFFAOYSA-N 0.000 description 2
- HGEMCUOAMCILCP-UHFFFAOYSA-N isotridecane Natural products CCCCCCCCCCC(C)C HGEMCUOAMCILCP-UHFFFAOYSA-N 0.000 description 2
- 229920001684 low density polyethylene Polymers 0.000 description 2
- 239000004702 low-density polyethylene Substances 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 229920001179 medium density polyethylene Polymers 0.000 description 2
- 239000004701 medium-density polyethylene Substances 0.000 description 2
- CRSOQBOWXPBRES-UHFFFAOYSA-N neopentane Chemical compound CC(C)(C)C CRSOQBOWXPBRES-UHFFFAOYSA-N 0.000 description 2
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- RZJRJXONCZWCBN-UHFFFAOYSA-N octadecane Chemical compound CCCCCCCCCCCCCCCCCC RZJRJXONCZWCBN-UHFFFAOYSA-N 0.000 description 2
- YCOZIPAWZNQLMR-UHFFFAOYSA-N pentadecane Chemical compound CCCCCCCCCCCCCCC YCOZIPAWZNQLMR-UHFFFAOYSA-N 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 2
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 2
- 229920002492 poly(sulfone) Polymers 0.000 description 2
- 229920006122 polyamide resin Polymers 0.000 description 2
- 229920001748 polybutylene Polymers 0.000 description 2
- 239000011112 polyethylene naphthalate Substances 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 230000000379 polymerizing effect Effects 0.000 description 2
- 229920000306 polymethylpentene Polymers 0.000 description 2
- 239000011116 polymethylpentene Substances 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920000166 polytrimethylene carbonate Polymers 0.000 description 2
- 229920002451 polyvinyl alcohol Polymers 0.000 description 2
- 239000005033 polyvinylidene chloride Substances 0.000 description 2
- 150000003254 radicals Chemical class 0.000 description 2
- 229920005604 random copolymer Polymers 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- BGHCVCJVXZWKCC-UHFFFAOYSA-N tetradecane Chemical compound CCCCCCCCCCCCCC BGHCVCJVXZWKCC-UHFFFAOYSA-N 0.000 description 2
- 238000005979 thermal decomposition reaction Methods 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 2
- IIYFAKIEWZDVMP-UHFFFAOYSA-N tridecane Chemical compound CCCCCCCCCCCCC IIYFAKIEWZDVMP-UHFFFAOYSA-N 0.000 description 2
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 1
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 description 1
- PMJHHCWVYXUKFD-SNAWJCMRSA-N (E)-1,3-pentadiene Chemical compound C\C=C\C=C PMJHHCWVYXUKFD-SNAWJCMRSA-N 0.000 description 1
- XVOUMQNXTGKGMA-OWOJBTEDSA-N (E)-glutaconic acid Chemical compound OC(=O)C\C=C\C(O)=O XVOUMQNXTGKGMA-OWOJBTEDSA-N 0.000 description 1
- 239000001124 (E)-prop-1-ene-1,2,3-tricarboxylic acid Substances 0.000 description 1
- QWUWMCYKGHVNAV-UHFFFAOYSA-N 1,2-dihydrostilbene Chemical group C=1C=CC=CC=1CCC1=CC=CC=C1 QWUWMCYKGHVNAV-UHFFFAOYSA-N 0.000 description 1
- QWQFVUQPHUKAMY-UHFFFAOYSA-N 1,2-diphenyl-2-propoxyethanone Chemical compound C=1C=CC=CC=1C(OCCC)C(=O)C1=CC=CC=C1 QWQFVUQPHUKAMY-UHFFFAOYSA-N 0.000 description 1
- BOCJQSFSGAZAPQ-UHFFFAOYSA-N 1-chloroanthracene-9,10-dione Chemical compound O=C1C2=CC=CC=C2C(=O)C2=C1C=CC=C2Cl BOCJQSFSGAZAPQ-UHFFFAOYSA-N 0.000 description 1
- JWYVGKFDLWWQJX-UHFFFAOYSA-N 1-ethenylazepan-2-one Chemical compound C=CN1CCCCCC1=O JWYVGKFDLWWQJX-UHFFFAOYSA-N 0.000 description 1
- PMUPSYZVABJEKC-UHFFFAOYSA-N 1-methylcyclohexane-1,2-dicarboxylic acid Chemical compound OC(=O)C1(C)CCCCC1C(O)=O PMUPSYZVABJEKC-UHFFFAOYSA-N 0.000 description 1
- VCLJODPNBNEBKW-UHFFFAOYSA-N 2,2,4,4,6,8,8-heptamethylnonane Chemical compound CC(C)(C)CC(C)CC(C)(C)CC(C)(C)C VCLJODPNBNEBKW-UHFFFAOYSA-N 0.000 description 1
- MTFZMVUYAILXSB-UHFFFAOYSA-N 2,6,10,10-tetramethylpentadecane Chemical compound CCCCCC(C)(C)CCCC(C)CCCC(C)C MTFZMVUYAILXSB-UHFFFAOYSA-N 0.000 description 1
- GVJRTUUUJYMTNQ-UHFFFAOYSA-N 2-(2,5-dioxofuran-3-yl)acetic acid Chemical compound OC(=O)CC1=CC(=O)OC1=O GVJRTUUUJYMTNQ-UHFFFAOYSA-N 0.000 description 1
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 1
- BLDFSDCBQJUWFG-UHFFFAOYSA-N 2-(methylamino)-1,2-diphenylethanol Chemical compound C=1C=CC=CC=1C(NC)C(O)C1=CC=CC=C1 BLDFSDCBQJUWFG-UHFFFAOYSA-N 0.000 description 1
- 125000000143 2-carboxyethyl group Chemical group [H]OC(=O)C([H])([H])C([H])([H])* 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- DPNXHTDWGGVXID-UHFFFAOYSA-N 2-isocyanatoethyl prop-2-enoate Chemical compound C=CC(=O)OCCN=C=O DPNXHTDWGGVXID-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- GTJOHISYCKPIMT-UHFFFAOYSA-N 2-methylundecane Chemical compound CCCCCCCCCC(C)C GTJOHISYCKPIMT-UHFFFAOYSA-N 0.000 description 1
- SYIUWAVTBADRJG-UHFFFAOYSA-N 2H-pyran-2,6(3H)-dione Chemical compound O=C1CC=CC(=O)O1 SYIUWAVTBADRJG-UHFFFAOYSA-N 0.000 description 1
- BUZICZZQJDLXJN-UHFFFAOYSA-N 3-azaniumyl-4-hydroxybutanoate Chemical compound OCC(N)CC(O)=O BUZICZZQJDLXJN-UHFFFAOYSA-N 0.000 description 1
- AYKYXWQEBUNJCN-UHFFFAOYSA-N 3-methylfuran-2,5-dione Chemical compound CC1=CC(=O)OC1=O AYKYXWQEBUNJCN-UHFFFAOYSA-N 0.000 description 1
- OFNISBHGPNMTMS-UHFFFAOYSA-N 3-methylideneoxolane-2,5-dione Chemical compound C=C1CC(=O)OC1=O OFNISBHGPNMTMS-UHFFFAOYSA-N 0.000 description 1
- XUKLTPZEKXTPBT-UHFFFAOYSA-N 3-oxatricyclo[5.2.1.01,5]dec-5-ene-2,4-dione Chemical compound C1CC2C=C3C(=O)OC(=O)C13C2 XUKLTPZEKXTPBT-UHFFFAOYSA-N 0.000 description 1
- VTDMBRAUHKUOON-UHFFFAOYSA-N 4-[(4-carboxyphenyl)methyl]benzoic acid Chemical compound C1=CC(C(=O)O)=CC=C1CC1=CC=C(C(O)=O)C=C1 VTDMBRAUHKUOON-UHFFFAOYSA-N 0.000 description 1
- MVFNWZHRHUOGKQ-UHFFFAOYSA-N 4-methyl-1,7-dioxacyclotridecane-8,13-dione Chemical compound CC1CCOC(=O)CCCCC(=O)OCC1 MVFNWZHRHUOGKQ-UHFFFAOYSA-N 0.000 description 1
- UZTXSMATBUWDDZ-UHFFFAOYSA-N 4-methyldodecane Chemical compound CCCCCCCCC(C)CCC UZTXSMATBUWDDZ-UHFFFAOYSA-N 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- NOWKCMXCCJGMRR-UHFFFAOYSA-N Aziridine Chemical compound C1CN1 NOWKCMXCCJGMRR-UHFFFAOYSA-N 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- 239000004970 Chain extender Substances 0.000 description 1
- PMPVIKIVABFJJI-UHFFFAOYSA-N Cyclobutane Chemical compound C1CCC1 PMPVIKIVABFJJI-UHFFFAOYSA-N 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- LVZWSLJZHVFIQJ-UHFFFAOYSA-N Cyclopropane Chemical compound C1CC1 LVZWSLJZHVFIQJ-UHFFFAOYSA-N 0.000 description 1
- QSJXEFYPDANLFS-UHFFFAOYSA-N Diacetyl Chemical group CC(=O)C(C)=O QSJXEFYPDANLFS-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- IMROMDMJAWUWLK-UHFFFAOYSA-N Ethenol Chemical compound OC=C IMROMDMJAWUWLK-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 229920000103 Expandable microsphere Polymers 0.000 description 1
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical group CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 1
- NHTMVDHEPJAVLT-UHFFFAOYSA-N Isooctane Chemical compound CC(C)CC(C)(C)C NHTMVDHEPJAVLT-UHFFFAOYSA-N 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 229920002367 Polyisobutene Polymers 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 244000028419 Styrax benzoin Species 0.000 description 1
- 235000000126 Styrax benzoin Nutrition 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- 235000008411 Sumatra benzointree Nutrition 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- 239000004708 Very-low-density polyethylene Substances 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical class C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- QHZLCTYHMCNIMS-UHFFFAOYSA-L [2-ethylhexanoyloxy(dioctyl)stannyl] 2-ethylhexanoate Chemical compound CCCCCCCC[Sn](OC(=O)C(CC)CCCC)(OC(=O)C(CC)CCCC)CCCCCCCC QHZLCTYHMCNIMS-UHFFFAOYSA-L 0.000 description 1
- 229940091181 aconitic acid Drugs 0.000 description 1
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 1
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229960002130 benzoin Drugs 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- GCTPMLUUWLLESL-UHFFFAOYSA-N benzyl prop-2-enoate Chemical compound C=CC(=O)OCC1=CC=CC=C1 GCTPMLUUWLLESL-UHFFFAOYSA-N 0.000 description 1
- LKMCJXXOBRCATQ-UHFFFAOYSA-N benzylsulfanylbenzene Chemical compound C=1C=CC=CC=1CSC1=CC=CC=C1 LKMCJXXOBRCATQ-UHFFFAOYSA-N 0.000 description 1
- 230000001588 bifunctional effect Effects 0.000 description 1
- 239000001273 butane Substances 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000002507 cathodic stripping potentiometry Methods 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- YACLQRRMGMJLJV-UHFFFAOYSA-N chloroprene Chemical compound ClC(=C)C=C YACLQRRMGMJLJV-UHFFFAOYSA-N 0.000 description 1
- GTZCVFVGUGFEME-IWQZZHSRSA-N cis-aconitic acid Chemical compound OC(=O)C\C(C(O)=O)=C\C(O)=O GTZCVFVGUGFEME-IWQZZHSRSA-N 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 description 1
- IFDVQVHZEKPUSC-UHFFFAOYSA-N cyclohex-3-ene-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCC=CC1C(O)=O IFDVQVHZEKPUSC-UHFFFAOYSA-N 0.000 description 1
- QSAWQNUELGIYBC-UHFFFAOYSA-N cyclohexane-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCCCC1C(O)=O QSAWQNUELGIYBC-UHFFFAOYSA-N 0.000 description 1
- WJTCGQSWYFHTAC-UHFFFAOYSA-N cyclooctane Chemical compound C1CCCCCCC1 WJTCGQSWYFHTAC-UHFFFAOYSA-N 0.000 description 1
- 239000004914 cyclooctane Substances 0.000 description 1
- SRONXYPFSAKOGH-UHFFFAOYSA-N cyclopentadecane Chemical compound C1CCCCCCCCCCCCCC1 SRONXYPFSAKOGH-UHFFFAOYSA-N 0.000 description 1
- DIOQZVSQGTUSAI-NJFSPNSNSA-N decane Chemical compound CCCCCCCCC[14CH3] DIOQZVSQGTUSAI-NJFSPNSNSA-N 0.000 description 1
- STWFZICHPLEOIC-UHFFFAOYSA-N decylcyclohexane Chemical compound CCCCCCCCCCC1CCCCC1 STWFZICHPLEOIC-UHFFFAOYSA-N 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 150000001993 dienes Chemical class 0.000 description 1
- JVSWJIKNEAIKJW-UHFFFAOYSA-N dimethyl-hexane Natural products CCCCCC(C)C JVSWJIKNEAIKJW-UHFFFAOYSA-N 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 description 1
- GFJVXXWOPWLRNU-UHFFFAOYSA-N ethenyl formate Chemical compound C=COC=O GFJVXXWOPWLRNU-UHFFFAOYSA-N 0.000 description 1
- UIWXSTHGICQLQT-UHFFFAOYSA-N ethenyl propanoate Chemical compound CCC(=O)OC=C UIWXSTHGICQLQT-UHFFFAOYSA-N 0.000 description 1
- RJLZSKYNYLYCNY-UHFFFAOYSA-N ethyl carbamate;isocyanic acid Chemical group N=C=O.CCOC(N)=O RJLZSKYNYLYCNY-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000004715 ethylene vinyl alcohol Substances 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000011086 glassine Substances 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- 238000007756 gravure coating Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 235000019382 gum benzoic Nutrition 0.000 description 1
- VLHZQNGNJQYAIZ-UHFFFAOYSA-N heptadecylcyclohexane Chemical compound CCCCCCCCCCCCCCCCCC1CCCCC1 VLHZQNGNJQYAIZ-UHFFFAOYSA-N 0.000 description 1
- MSTLSCNJAHAQNU-UHFFFAOYSA-N heptylcyclohexane Chemical compound CCCCCCCC1CCCCC1 MSTLSCNJAHAQNU-UHFFFAOYSA-N 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- NRHBFNBZAZZTAU-UHFFFAOYSA-N hexadecylcyclohexane Chemical compound CCCCCCCCCCCCCCCCC1CCCCC1 NRHBFNBZAZZTAU-UHFFFAOYSA-N 0.000 description 1
- QHWAQXOSHHKCFK-UHFFFAOYSA-N hexylcyclohexane Chemical compound CCCCCCC1CCCCC1 QHWAQXOSHHKCFK-UHFFFAOYSA-N 0.000 description 1
- 229920006130 high-performance polyamide Polymers 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000001282 iso-butane Substances 0.000 description 1
- VKPSKYDESGTTFR-UHFFFAOYSA-N isododecane Natural products CC(C)(C)CC(C)CC(C)(C)C VKPSKYDESGTTFR-UHFFFAOYSA-N 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 229920000092 linear low density polyethylene Polymers 0.000 description 1
- 239000004707 linear low-density polyethylene Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- XJRBAMWJDBPFIM-UHFFFAOYSA-N methyl vinyl ether Chemical compound COC=C XJRBAMWJDBPFIM-UHFFFAOYSA-N 0.000 description 1
- 150000002763 monocarboxylic acids Chemical class 0.000 description 1
- PJUIMOJAAPLTRJ-UHFFFAOYSA-N monothioglycerol Chemical compound OCC(O)CS PJUIMOJAAPLTRJ-UHFFFAOYSA-N 0.000 description 1
- QKQSRIKBWKJGHW-UHFFFAOYSA-N morpholine;prop-2-enoic acid Chemical compound OC(=O)C=C.C1COCCN1 QKQSRIKBWKJGHW-UHFFFAOYSA-N 0.000 description 1
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 description 1
- DIOQZVSQGTUSAI-UHFFFAOYSA-N n-butylhexane Natural products CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 1
- KYTZHLUVELPASH-UHFFFAOYSA-N naphthalene-1,2-dicarboxylic acid Chemical compound C1=CC=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 KYTZHLUVELPASH-UHFFFAOYSA-N 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- ZCYXXKJEDCHMGH-UHFFFAOYSA-N nonane Chemical compound CCCC[CH]CCCC ZCYXXKJEDCHMGH-UHFFFAOYSA-N 0.000 description 1
- CLMFECCMAVQYQA-UHFFFAOYSA-N nonylcyclohexane Chemical compound CCCCCCCCCC1CCCCC1 CLMFECCMAVQYQA-UHFFFAOYSA-N 0.000 description 1
- BKIMMITUMNQMOS-UHFFFAOYSA-N normal nonane Natural products CCCCCCCCC BKIMMITUMNQMOS-UHFFFAOYSA-N 0.000 description 1
- 229940038384 octadecane Drugs 0.000 description 1
- MWWVNZNVTGBKQO-UHFFFAOYSA-N octadecylcyclohexane Chemical compound CCCCCCCCCCCCCCCCCCC1CCCCC1 MWWVNZNVTGBKQO-UHFFFAOYSA-N 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- FBXWCEKQCVOOLT-UHFFFAOYSA-N octylcyclohexane Chemical compound CCCCCCCCC1CCCCC1 FBXWCEKQCVOOLT-UHFFFAOYSA-N 0.000 description 1
- ZNUABQHWFGTOCO-UHFFFAOYSA-N pentadecylcyclohexane Chemical compound CCCCCCCCCCCCCCCC1CCCCC1 ZNUABQHWFGTOCO-UHFFFAOYSA-N 0.000 description 1
- YWAKXRMUMFPDSH-UHFFFAOYSA-N pentene Chemical compound CCCC=C YWAKXRMUMFPDSH-UHFFFAOYSA-N 0.000 description 1
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- MXXWOMGUGJBKIW-YPCIICBESA-N piperine Chemical compound C=1C=C2OCOC2=CC=1/C=C/C=C/C(=O)N1CCCCC1 MXXWOMGUGJBKIW-YPCIICBESA-N 0.000 description 1
- 229940075559 piperine Drugs 0.000 description 1
- WVWHRXVVAYXKDE-UHFFFAOYSA-N piperine Natural products O=C(C=CC=Cc1ccc2OCOc2c1)C3CCCCN3 WVWHRXVVAYXKDE-UHFFFAOYSA-N 0.000 description 1
- 235000019100 piperine Nutrition 0.000 description 1
- PMJHHCWVYXUKFD-UHFFFAOYSA-N piperylene Natural products CC=CC=C PMJHHCWVYXUKFD-UHFFFAOYSA-N 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920002239 polyacrylonitrile Polymers 0.000 description 1
- 229920001515 polyalkylene glycol Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920002577 polybenzoxazole Polymers 0.000 description 1
- 229920001083 polybutene Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000921 polyethylene adipate Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920001955 polyphenylene ether Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 229920001289 polyvinyl ether Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- YOSXAXYCARLZTR-UHFFFAOYSA-N prop-2-enoyl isocyanate Chemical compound C=CC(=O)N=C=O YOSXAXYCARLZTR-UHFFFAOYSA-N 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000012748 slip agent Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000010345 tape casting Methods 0.000 description 1
- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- 229920001897 terpolymer Polymers 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- UFDHBDMSHIXOKF-UHFFFAOYSA-N tetrahydrophthalic acid Natural products OC(=O)C1=C(C(O)=O)CCCC1 UFDHBDMSHIXOKF-UHFFFAOYSA-N 0.000 description 1
- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 1
- GTZCVFVGUGFEME-UHFFFAOYSA-N trans-aconitic acid Natural products OC(=O)CC(C(O)=O)=CC(O)=O GTZCVFVGUGFEME-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229920001862 ultra low molecular weight polyethylene Polymers 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- 229920001866 very low density polyethylene Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000004711 α-olefin Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/89—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using at least one connector not provided for in any of the groups H01L24/81 - H01L24/86
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/525—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/04105—Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/12105—Bump connectors formed on an encapsulation of the semiconductor or solid-state body, e.g. bumps on chip-scale packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/96—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
Definitions
- the present invention relates to a method for manufacturing a semiconductor device and an adhesive sheet.
- CSP Chip Scale Package
- WLP Wafer Level Package
- PLP Pulel Level Package
- WLP and PLP are classified into fan-in type and fan-out type.
- fan-out type WLP hereinafter also referred to as “FOWLP”
- PLP hereinafter also referred to as “FOPPL”
- a semiconductor chip is covered with a sealing material so as to be an area larger than the chip size.
- the rewiring layer and the external electrode are formed not only on the circuit surface of the semiconductor chip but also on the surface region of the sealing material.
- FOWLP and FOPLP are, for example, a mounting step of mounting a plurality of semiconductor chips on an adhesive sheet for temporary fixing (hereinafter also referred to as “temporary fixing sheet”), and a sealing material imparted with fluidity.
- Temporary fixing sheet an adhesive sheet for temporary fixing
- the temporary fixing sheet used in the above-described process does not cause misalignment of the semiconductor chip between the covering process and the curing process (hereinafter also referred to as “sealing process”), and the semiconductor chip Adhesiveness that does not allow the sealing material to enter the adhesive interface between the sheet and the temporary fixing sheet is required, and after the sealing process, peelability that can be easily removed without adhesive residue is required. That is, the temporary fixing sheet used for the manufacture of FOWLP and FOPLP is required to satisfy both the adhesiveness during use and the peelability after use.
- Patent Document 1 in the method for producing FOWLP, a sealing step is performed on a temporary fixing sheet having a base material made of a polyimide film and an adhesive layer made of a silicone-based adhesive provided on the surface of the base material.
- a method of peeling while temporarily bending the temporary fixing sheet is disclosed.
- the process of peeling the temporarily fixing sheet by hand or the like is complicated, and it is required that the temporarily fixing sheet can be peeled with a smaller external force from the viewpoint of improving productivity.
- Patent Document 2 discloses a temporary fixing at the time of cutting an electronic component in which a thermally expandable adhesive layer containing thermally expandable microspheres is provided on at least one side of a substrate.
- a heat-peelable pressure-sensitive adhesive sheet is disclosed.
- FOWLP and FOPLP it is also conceivable to use the heat-peelable pressure-sensitive adhesive sheet described in Patent Document 2.
- JP2015-32646A Japanese Patent No. 3594853
- the present invention has been made in view of the above-described problems, and can suppress the occurrence of misalignment of a semiconductor chip in a manufacturing process of a fan-out type package, has excellent productivity, and is a rewiring layer of a semiconductor device to be obtained. It aims at providing the manufacturing method of the semiconductor device which is excellent in the flatness of a formation surface, and the adhesive sheet used for this manufacturing method.
- the present inventors can solve the above-mentioned problems by using a pressure-sensitive adhesive sheet having a specific layer structure including a non-adhesive base material containing expandable particles in a fan-out type package manufacturing process. I found out. That is, the present invention relates to the following [1] to [11]. [1] A method for producing a semiconductor device using a pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer and a non-adhesive base material containing expandable particles, A method for manufacturing a semiconductor device, comprising the following steps (1) to (4).
- Process (1) The process of sticking the frame member in which the opening part was formed in the adhesion surface of an adhesive layer
- the method for manufacturing a semiconductor device according to [1] further comprising the following step (5).
- Step (5) Step of forming a rewiring layer on the cured sealing body from which the pressure-sensitive adhesive sheet has been peeled
- the expandable particles are thermally expandable particles, and the step (4) is the pressure-sensitive adhesive sheet.
- a method for manufacturing the semiconductor device according to claim 1. Any of [1] to [7] above, wherein the ratio of the thickness of the base material to the thickness of the pressure-sensitive adhesive layer (base material / pressure-sensitive adhesive layer) at 23 ° C. is 0.2 or more.
- a semiconductor device manufacturing method that can suppress the occurrence of positional deviation of a semiconductor chip in a manufacturing process of a fan-out type package, is excellent in productivity, and is excellent in flatness of a rewiring layer forming surface of the obtained semiconductor device. And an adhesive sheet used in the production method.
- FIG. 3 is a cross-sectional view illustrating an example of the manufacturing method according to the present embodiment following FIG. 2.
- FIG. 4 is a cross-sectional view illustrating an example of the manufacturing method according to the present embodiment following FIG. 3.
- the “active ingredient” refers to a component excluding a diluent solvent among components contained in a target composition.
- the mass average molecular weight (Mw) is a value in terms of standard polystyrene measured by a gel permeation chromatography (GPC) method, specifically a value measured based on the method described in the examples.
- (meth) acrylic acid indicates both “acrylic acid” and “methacrylic acid”, and the same applies to other similar terms.
- the lower limit value and upper limit value which were described in steps can be combined independently, respectively. For example, from the description “preferably 10 to 90, more preferably 30 to 60”, “preferable lower limit (10)” and “more preferable upper limit (60)” are combined to obtain “10 to 60”. You can also.
- a manufacturing method of a semiconductor device is a method of manufacturing a semiconductor device using an adhesive sheet having an adhesive layer and a non-adhesive base material including expandable particles, A method for manufacturing a semiconductor device, comprising steps (1) to (4).
- Process (1) The process of sticking the frame member in which the opening part was formed in the adhesion surface of an adhesive layer
- the pressure-sensitive adhesive sheet used in the method for manufacturing a semiconductor device according to this embodiment will be described first, and then each manufacturing step including steps (1) to (4) will be described.
- the pressure-sensitive adhesive sheet according to the present embodiment is particularly limited as long as it has a pressure-sensitive adhesive layer and a non-adhesive base material (hereinafter, also referred to as “expandable base material”) including expandable particles.
- expandable base material a non-adhesive base material
- the shape of the pressure-sensitive adhesive sheet can take any shape such as a sheet shape, a tape shape, and a label shape.
- FIG. 1A is a cross-sectional view of the pressure-sensitive adhesive sheet 10 according to this embodiment.
- the pressure-sensitive adhesive sheet 10 according to this embodiment has a pressure-sensitive adhesive layer 12 on a base material 11.
- the adhesive sheet which concerns on this embodiment is good also as a structure which has the peeling material 13 on the adhesive surface 12a of the adhesive layer 12 like the adhesive sheet 10a shown to FIG. 1 (B).
- the release material 13 is appropriately peeled and removed when the adhesive sheet 10a is used in the method for manufacturing a semiconductor device according to this embodiment.
- the expandable substrate, the pressure-sensitive adhesive layer, and the release material used as necessary, which are included in the pressure-sensitive adhesive sheet according to the present embodiment, will be described in order.
- An expandable substrate is a substrate that includes expandable particles and is non-tacky.
- the heat-expandable pressure-sensitive adhesive layer as the pressure-sensitive adhesive sheet described in Patent Document 2 contains a pressure-sensitive adhesive having a low elastic modulus and sufficiently contains expandable particles. Thickness is required. For this reason, the semiconductor chip is displaced between the mounting process and the sealing process of the semiconductor chip, or the semiconductor chip sinks to the adhesive sheet side, resulting in a problem that the rewiring layer forming surface cannot be flattened. obtain.
- the expandable particles are contained in a non-adhesive resin having a high elastic modulus.
- the degree of freedom of design is improved. This can suppress the occurrence of misalignment of the semiconductor chip, suppress the semiconductor chip from sinking into the double-sided pressure-sensitive adhesive sheet, and form a rewiring layer forming surface with excellent flatness. Furthermore, when using the pressure-sensitive adhesive sheet according to this embodiment, the semiconductor chip is placed on the pressure-sensitive adhesive surface of the pressure-sensitive adhesive layer, so that the expandable base material and the rewiring layer forming surface do not directly contact each other. As a result, the residue derived from the expandable particles and a part of the greatly deformed adhesive layer adhere to the rewiring layer forming surface, or the uneven shape formed on the thermally expandable adhesive layer is transferred to the rewiring layer forming surface. As a result, the reduction in smoothness is suppressed, and a rewiring layer forming surface excellent in cleanliness and smoothness is obtained.
- the thickness of the expandable substrate is preferably 10 to 1000 ⁇ m, more preferably 20 to 500 ⁇ m, still more preferably 25 to 400 ⁇ m, and still more preferably 30 to 300 ⁇ m.
- the thickness of an expansible base material means the value measured by the method as described in an Example.
- the expandable base material which an adhesive sheet has is a non-adhesive base material.
- whether or not the non-adhesive substrate is determined if the probe tack value measured in accordance with JIS Z0237: 1991 is less than 50 mN / 5 mm ⁇ with respect to the surface of the target substrate.
- the said base material is judged as a "non-adhesive base material".
- the probe tack value on the surface of the expandable substrate used in the present embodiment is usually less than 50 mN / 5 mm ⁇ , preferably less than 30 mN / 5 mm ⁇ , more preferably less than 10 mN / 5 mm ⁇ , and even more preferably 5 mN / It is less than 5 mm ⁇ .
- the specific measuring method of the probe tack value on the surface of an expansible base material is based on the method as described in an Example.
- the expansible base material which the adhesive sheet of this embodiment has contains resin and expansive particles, but may contain the additive for base materials in the range which does not impair the effect of this invention as needed.
- an expansible base material can be formed from the resin composition (y) containing resin and expansive particle.
- each component contained in the resin composition (y) which is a forming material of an expansible base material is demonstrated.
- the resin contained in the resin composition (y) is not particularly limited as long as the expandable substrate is a non-adhesive resin, and may be a non-adhesive resin or an adhesive resin. . That is, even if the resin contained in the resin composition (y) is an adhesive resin, the adhesive resin undergoes a polymerization reaction with the polymerizable compound in the process of forming the expandable substrate from the resin composition (y). The obtained resin becomes a non-adhesive resin, and the expandable substrate containing the resin only needs to be non-adhesive.
- the mass average molecular weight (Mw) of the resin contained in the resin composition (y) is preferably 1,000 to 1,000,000, more preferably 1,000 to 700,000, and still more preferably 1,000 to 500,000. Further, when the resin is a copolymer having two or more kinds of structural units, the form of the copolymer is not particularly limited, and any of a block copolymer, a random copolymer, and a graft copolymer It may be.
- the content of the resin is preferably 50 to 99% by mass, more preferably 60 to 95% by mass, and still more preferably 65 to 90% with respect to the total amount (100% by mass) of the active ingredients of the resin composition (y). It is 70% by weight, more preferably 70 to 85% by weight.
- the resin contained in the resin composition (y) preferably contains at least one selected from acrylic urethane resins and olefin resins. Moreover, as said acrylic urethane type resin, the following resin (U1) is preferable.
- urethane prepolymer (UP) serving as the main chain of the acrylic urethane resin (U1) include a reaction product of a polyol and a polyvalent isocyanate.
- the urethane prepolymer (UP) is preferably obtained by further performing a chain extension reaction using a chain extender.
- Examples of the polyol used as a raw material for the urethane prepolymer (UP) include alkylene type polyols, ether type polyols, ester type polyols, ester amide type polyols, ester / ether type polyols, and carbonate type polyols. These polyols may be used independently and may use 2 or more types together.
- the polyol used in this embodiment is preferably a diol, more preferably an ester diol, an alkylene diol, and a carbonate diol, and even more preferably an ester diol and a carbonate diol.
- ester type diols include alkane diols such as 1,3-propanediol, 1,4-butanediol, 1,5-pentanediol, neopentyl glycol, 1,6-hexanediol; ethylene glycol, propylene glycol, One or more selected from diols such as alkylene glycols such as diethylene glycol and dipropylene glycol; phthalic acid, isophthalic acid, terephthalic acid, naphthalenedicarboxylic acid, 4,4-diphenyldicarboxylic acid, diphenylmethane-4 , 4'-dicarboxylic acid, succinic acid, adipic acid, azelaic acid, sebacic acid, het acid, maleic acid, fumaric acid, itaconic acid, cyclohexane-1,3-dicarboxylic acid, cyclohexane-1,4-dicarbox
- alkylene type diol examples include alkane diols such as 1,3-propanediol, 1,4-butanediol, 1,5-pentanediol, neopentyl glycol, 1,6-hexanediol; ethylene glycol, propylene glycol, And alkylene glycols such as diethylene glycol and dipropylene glycol; polyalkylene glycols such as polyethylene glycol, polypropylene glycol, and polybutylene glycol; polyoxyalkylene glycols such as polytetramethylene glycol; and the like.
- alkane diols such as 1,3-propanediol, 1,4-butanediol, 1,5-pentanediol, neopentyl glycol, 1,6-hexanediol
- ethylene glycol, propylene glycol And alkylene glycols such as diethylene glycol and dipropylene glycol
- Examples of the carbonate type diol include 1,4-tetramethylene carbonate diol, 1,5-pentamethylene carbonate diol, 1,6-hexamethylene carbonate diol, 1,2-propylene carbonate diol, and 1,3-propylene carbonate diol. 2,2-dimethylpropylene carbonate diol, 1,7-heptamethylene carbonate diol, 1,8-octamethylene carbonate diol, 1,4-cyclohexane carbonate diol, and the like.
- polyvalent isocyanate used as a raw material for the urethane prepolymer (UP) examples include aromatic polyisocyanates, aliphatic polyisocyanates, and alicyclic polyisocyanates. These polyvalent isocyanates may be used alone or in combination of two or more. These polyisocyanates may be a trimethylolpropane adduct type modified product, a burette type modified product reacted with water, or an isocyanurate type modified product containing an isocyanurate ring.
- diisocyanate is preferable, and 4,4′-diphenylmethane diisocyanate (MDI), 2,4-tolylene diisocyanate (2,4-TDI), 2,6-triisocyanate.
- MDI 4,4′-diphenylmethane diisocyanate
- 2,4-TDI 2,4-tolylene diisocyanate
- 2,6-triisocyanate One or more selected from diisocyanate (2,6-TDI), hexamethylene diisocyanate (HMDI), and alicyclic diisocyanate are more preferable.
- alicyclic diisocyanate examples include 3-isocyanate methyl-3,5,5-trimethylcyclohexyl isocyanate (isophorone diisocyanate, IPDI), 1,3-cyclopentane diisocyanate, 1,3-cyclohexane diisocyanate, 1,4-cyclohexane.
- IPDI isophorone diisocyanate
- Examples include diisocyanate, methyl-2,4-cyclohexane diisocyanate, methyl-2,6-cyclohexane diisocyanate, and isophorone diisocyanate (IPDI) is preferred.
- the urethane prepolymer (UP) serving as the main chain of the acrylic urethane resin (U1) is a reaction product of a diol and a diisocyanate, and is a linear urethane prepolymer having ethylenically unsaturated groups at both ends.
- Polymers are preferred.
- hydroxyalkyl (meth) acrylate examples include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, and 3-hydroxy Examples thereof include butyl (meth) acrylate and 4-hydroxybutyl (meth) acrylate.
- the (meth) acrylic acid ester is preferably one or more selected from alkyl (meth) acrylates and hydroxyalkyl (meth) acrylates, and more preferably used in combination with alkyl (meth) acrylates and hydroxyalkyl (meth) acrylates.
- the proportion of hydroxyalkyl (meth) acrylate to 100 parts by mass of alkyl (meth) acrylate is preferably 0.1 to 100 parts by mass, The amount is preferably 0.5 to 30 parts by mass, more preferably 1.0 to 20 parts by mass, and still more preferably 1.5 to 10 parts by mass.
- the number of carbon atoms in the alkyl group of the alkyl (meth) acrylate is preferably 1 to 24, more preferably 1 to 12, still more preferably 1 to 8, and still more preferably 1 to 3.
- hydroxyalkyl (meth) acrylate the same thing as the hydroxyalkyl (meth) acrylate used in order to introduce
- vinyl compounds other than (meth) acrylic acid esters include aromatic hydrocarbon vinyl compounds such as styrene, ⁇ -methylstyrene, and vinyl toluene; vinyl ethers such as methyl vinyl ether and ethyl vinyl ether; vinyl acetate and vinyl propionate.
- Polar group-containing monomers such as (meth) acrylonitrile, N-vinylpyrrolidone, (meth) acrylic acid, maleic acid, fumaric acid, itaconic acid, and meta (acrylamide). These may be used alone or in combination of two or more.
- the content of the (meth) acrylic acid ester in the vinyl compound is preferably 40 to 100% by mass, more preferably 65 to 100% by mass, and still more preferably based on the total amount (100% by mass) of the vinyl compound. It is 80 to 100% by mass, more preferably 90 to 100% by mass.
- the total content of alkyl (meth) acrylate and hydroxyalkyl (meth) acrylate in the vinyl compound is preferably 40 to 100% by mass, more preferably 65 to 100% by mass with respect to the total amount (100% by mass) of the vinyl compound.
- the amount is 100% by mass, more preferably 80 to 100% by mass, and still more preferably 90 to 100% by mass.
- the acrylic urethane-based resin (U1) used in the present embodiment is obtained by mixing a urethane prepolymer (UP) and a vinyl compound containing a (meth) acrylic acid ester and polymerizing them.
- the polymerization is preferably performed by adding a radical initiator.
- the content ratio of the structural unit (u11) derived from the urethane prepolymer (UP) and the structural unit (u12) derived from the vinyl compound [(u11) / (U12)] is preferably 10/90 to 80/20, more preferably 20/80 to 70/30, still more preferably 30/70 to 60/40, and still more preferably 35/65 by mass ratio. ⁇ 55/45.
- the olefin resin suitable as the resin contained in the resin composition (y) is a polymer having at least a structural unit derived from an olefin monomer.
- the olefin monomer is preferably an ⁇ -olefin having 2 to 8 carbon atoms, and specifically includes ethylene, propylene, butylene, isobutylene, 1-hexene and the like. Among these, ethylene and propylene are preferable.
- olefinic resins for example, ultra low density polyethylene (VLDPE, density: 880 kg / m 3 or more 910 kg / m less than 3), low density polyethylene (LDPE, density: 910 kg / m 3 or more 915 kg / m less than 3 ), Medium density polyethylene (MDPE, density: 915 kg / m 3 or more and less than 942 kg / m 3 ), high density polyethylene (HDPE, density: 942 kg / m 3 or more), linear low density polyethylene, etc .; polypropylene resin (PP); polybutene resin (PB); ethylene-propylene copolymer; olefin elastomer (TPO); poly (4-methyl-1-pentene) (PMP); ethylene-vinyl acetate copolymer (EVA); ethylene -Vinyl alcohol copolymer (EVOH); ethylene-propylene Olefinic terpolymers such as-(5-ethylid)
- the olefin-based resin may be a modified olefin-based resin that is further modified by one or more selected from acid modification, hydroxyl group modification, and acrylic modification.
- an acid-modified olefin resin obtained by subjecting an olefin resin to acid modification a modified polymer obtained by graft polymerization of the above-mentioned unmodified olefin resin with an unsaturated carboxylic acid or its anhydride.
- unsaturated carboxylic acid or anhydride thereof include maleic acid, fumaric acid, itaconic acid, citraconic acid, glutaconic acid, tetrahydrophthalic acid, aconitic acid, (meth) acrylic acid, maleic anhydride, itaconic anhydride.
- Glutaconic anhydride citraconic anhydride, aconitic anhydride, norbornene dicarboxylic anhydride, tetrahydrophthalic anhydride, and the like.
- unsaturated carboxylic acid or its anhydride may be used independently and may use 2 or more types together.
- an acrylic modified olefin resin obtained by subjecting an olefin resin to acrylic modification a modification obtained by graft polymerization of an alkyl (meth) acrylate as a side chain to the above-mentioned unmodified olefin resin as a main chain.
- a polymer is mentioned.
- the number of carbon atoms in the alkyl group of the alkyl (meth) acrylate is preferably 1-20, more preferably 1-16, and still more preferably 1-12.
- said alkyl (meth) acrylate the same thing as the compound which can be selected as a below-mentioned monomer (a1 ') is mentioned, for example.
- Examples of the hydroxyl group-modified olefin resin obtained by subjecting an olefin resin to hydroxyl group modification include a modified polymer obtained by graft polymerization of a hydroxyl group-containing compound to the above-mentioned unmodified olefin resin, which is the main chain.
- Examples of the hydroxyl group-containing compound include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, and 3-hydroxybutyl.
- Examples thereof include hydroxyalkyl (meth) acrylates such as (meth) acrylate and 4-hydroxybutyl (meth) acrylate; unsaturated alcohols such as vinyl alcohol and allyl alcohol.
- the resin composition (y) may contain a resin other than the acrylic urethane resin and the olefin resin as long as the effects of the present invention are not impaired.
- Such resins include vinyl resins such as polyvinyl chloride, polyvinylidene chloride, and polyvinyl alcohol; polyester resins such as polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate; polystyrene; acrylonitrile-butadiene-styrene copolymer Polycarbonate; Polyurethane not applicable to acrylic urethane resin; Polysulfone; Polyetheretherketone; Polyethersulfone; Polyphenylene sulfide; Polyimide resin such as polyetherimide and polyimide; Polyamide resin; Acrylic resin; Fluorine resin etc. are mentioned.
- vinyl resins such as polyvinyl chloride, polyvinylidene chloride, and polyvinyl alcohol
- polyester resins such as polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate
- polystyrene acrylonitrile-butadiene-styren
- the content ratio of the resin other than the acrylic urethane-based resin and the olefin-based resin is preferably less than 30 parts by mass, more preferably 20 parts by mass with respect to 100 parts by mass of the total amount of the resin contained in the resin composition (y). Less than, more preferably less than 10 parts by mass, still more preferably less than 5 parts by mass, and even more preferably less than 1 part by mass.
- the expandable particles are not particularly limited as long as they can expand themselves by an external stimulus to form irregularities in the pressure-sensitive adhesive layer and reduce the adhesive force with the adherend.
- Examples of the expandable particles include thermally expandable particles that expand by heating, energy beam expandable particles that expand by irradiation with energy rays, and the like, from the viewpoint of versatility and handleability, they are thermally expandable particles. It is preferable.
- the thermally expandable particles are preferably particles having an expansion start temperature (t) adjusted to 120 to 250 ° C.
- the expansion start temperature (t) of the thermally expandable particles means a value measured based on the following method.
- Measurement method of expansion start temperature (t) of thermally expandable particles To an aluminum cup having a diameter of 6.0 mm (inner diameter 5.65 mm) and a depth of 4.8 mm, 0.5 mg of thermally expandable particles to be measured is added, and an aluminum lid (diameter 5.6 mm, thickness 0. 1 mm) is prepared.
- the height of the sample is measured from the upper part of the aluminum lid while a force of 0.01 N is applied to the sample by a pressurizer. Then, in a state where a force of 0.01 N is applied by the pressurizer, heating is performed from 20 ° C. to 300 ° C. at a rate of temperature increase of 10 ° C./min, and the amount of displacement of the pressurizer in the vertical direction is measured.
- the displacement start temperature be the expansion start temperature (t).
- the thermally expandable particles are microencapsulated foaming agents composed of an outer shell composed of a thermoplastic resin and an encapsulated component encapsulated in the outer shell and vaporized when heated to a predetermined temperature.
- a thermoplastic resin constituting the outer shell of the microencapsulated foaming agent include vinylidene chloride-acrylonitrile copolymer, polyvinyl alcohol, polyvinyl butyral, polymethyl methacrylate, polyacrylonitrile, polyvinylidene chloride, and polysulfone.
- Examples of the inclusion component contained in the outer shell include propane, butane, pentane, hexane, heptane, octane, nonane, decane, isobutane, isopentane, isohexane, isoheptane, isooctane, isononane, isodecane, cyclopropane, cyclobutane, cyclopentane.
- the volume expansion coefficient when heated to a temperature not lower than the thermal expansion start temperature (t) of the thermally expandable particles used in the present embodiment is preferably 1.5 to 100 times, more preferably 2 to 80 times, still more preferably. Is 2.5 to 60 times, more preferably 3 to 40 times.
- the average particle diameter of the expandable particles before expansion at 23 ° C. used in this embodiment is preferably 3 to 100 ⁇ m, more preferably 4 to 70 ⁇ m, still more preferably 6 to 60 ⁇ m, and still more preferably 10 to 50 ⁇ m. .
- the average particle diameter of the expandable particles before expansion is the volume-median particle diameter (D 50 ), and a laser diffraction particle size distribution measuring device (for example, product name “Mastersizer 3000” manufactured by Malvern) is used.
- D 50 volume-median particle diameter
- a laser diffraction particle size distribution measuring device for example, product name “Mastersizer 3000” manufactured by Malvern
- the particle distribution of the expandable particles before expansion measured by use it means the particle diameter corresponding to 50% of the cumulative volume frequency calculated from the smaller particle diameter of the expandable particles before expansion.
- the 90% particle diameter (D 90 ) of the expandable particles before expansion at 23 ° C. used in this embodiment is preferably 10 to 150 ⁇ m, more preferably 20 to 100 ⁇ m, still more preferably 25 to 90 ⁇ m, and still more preferably. Is 30 to 80 ⁇ m.
- the 90% particle diameter (D 90 ) before expansion of the expandable particles is measured using a laser diffraction particle size distribution measuring apparatus (for example, product name “Mastersizer 3000” manufactured by Malvern), before expansion. Mean particle diameter corresponding to 90% of the cumulative volume frequency calculated from the smaller particle diameter of the expandable particles before expansion.
- the content of the expandable particles is preferably 1 to 40% by mass, more preferably 5 to 35% by mass, and further preferably 10 to 10% by mass with respect to the total amount (100% by mass) of the active ingredients of the resin composition (y). 30% by mass, and still more preferably 15 to 25% by mass.
- the resin composition (y) used in the present embodiment may contain a base material additive contained in a base material of a general pressure-sensitive adhesive sheet as long as the effects of the present invention are not impaired.
- base material additives include ultraviolet absorbers, light stabilizers, antioxidants, antistatic agents, slip agents, antiblocking agents, and colorants. These base material additives may be used alone or in combination of two or more.
- the content of each base material additive is preferably 0.0001 to 20 parts by mass with respect to 100 parts by mass of the resin in the resin composition (y). More preferably, it is 0.001 to 10 parts by mass.
- ⁇ Solvent-free resin composition (y1)> As one aspect of the resin composition (y) used in the present embodiment, an oligomer having an ethylenically unsaturated group having a mass average molecular weight (Mw) of 50000 or less, an energy ray polymerizable monomer, and the above-mentioned expandable particles are blended And a solvent-free resin composition (y1) that does not contain a solvent. In the solventless resin composition (y1), no solvent is blended, but the energy beam polymerizable monomer contributes to the improvement of the plasticity of the oligomer. An expandable base material can be obtained by irradiating an energy ray with respect to the coating film formed from the solventless resin composition (y1).
- the type, shape, and blending amount (content) of the expandable particles blended in the solventless resin composition (y1) are as described above.
- the mass average molecular weight (Mw) of the oligomer contained in the solventless resin composition (y1) is 50000 or less, preferably 1000 to 50000, more preferably 2000 to 40000, and still more preferably 3000 to 35000. More preferably, it is 4000-30000.
- oligomer As said oligomer, what is necessary is just to have an ethylenically unsaturated group whose mass mean molecular weight (Mw) is 50000 or less among resin contained in the above-mentioned resin composition (y). Polymer (UP) is preferred.
- the modified olefin resin etc. which have an ethylenically unsaturated group can also be used.
- the total content of the oligomer and the energy beam polymerizable monomer in the solventless resin composition (y1) is preferably 50 with respect to the total amount (100% by mass) of the solventless resin composition (y1). It is ⁇ 99% by mass, more preferably 60 to 95% by mass, still more preferably 65 to 90% by mass, and still more preferably 70 to 85% by mass.
- Examples of the energy ray polymerizable monomer include isobornyl (meth) acrylate, dicyclopentenyl (meth) acrylate, dicyclopentanyl (meth) acrylate, dicyclopentenyloxy (meth) acrylate, cyclohexyl (meth) acrylate, adamantane ( Cycloaliphatic polymerizable compounds such as (meth) acrylate and tricyclodecane acrylate; Aromatic polymerizable compounds such as phenylhydroxypropyl acrylate, benzyl acrylate and phenol ethylene oxide modified acrylate; Tetrahydrofurfuryl (meth) acrylate, morpholine acrylate, N- And heterocyclic polymerizable compounds such as vinylpyrrolidone and N-vinylcaprolactam. These energy beam polymerizable monomers may be used independently and may use 2 or more types together.
- the content ratio of the oligomer to the energy beam polymerizable monomer is preferably 20/80 to 90 / in mass ratio. 10, more preferably 30/70 to 85/15, still more preferably 35/65 to 80/20.
- the solventless resin composition (y1) is preferably further blended with a photopolymerization initiator.
- a photopolymerization initiator By containing the photopolymerization initiator, the curing reaction can be sufficiently advanced even by irradiation with a relatively low energy beam.
- photopolymerization initiator examples include 1-hydroxy-cyclohexyl-phenyl-ketone, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin propyl ether, benzyl phenyl sulfide, tetramethylthiuram monosulfide, azobisisobutyrol. Nitrile, dibenzyl, diacetyl, 8-chloroanthraquinone and the like can be mentioned. These photoinitiators may be used independently and may use 2 or more types together.
- the blending amount of the photopolymerization initiator is preferably 0.01 to 5 parts by mass, more preferably 0.01 to 4 parts by mass with respect to the total amount (100 parts by mass) of the oligomer and the energy ray polymerizable monomer.
- the amount is preferably 0.02 to 3 parts by mass.
- the storage elastic modulus E ′ (23) at 23 ° C. of the expandable substrate of the pressure-sensitive adhesive sheet of this embodiment is preferably 1.0 ⁇ 10 6 Pa or more, more preferably 5.0 ⁇ 10 6 to 5.0. ⁇ 10 12 Pa, more preferably 1.0 ⁇ 10 7 to 1.0 ⁇ 10 12 Pa, still more preferably 5.0 ⁇ 10 7 to 1.0 ⁇ 10 11 Pa, still more preferably 1.0 ⁇ 10 8 to 1.0 ⁇ 10 10 Pa.
- the semiconductor chip is placed so that its circuit surface is covered with the adhesive surface of the adhesive layer.
- a known device such as a flip chip bonder or a die bonder may be used.
- a force is applied to push the semiconductor chip in the thickness direction of the adhesive sheet.
- a force for moving the semiconductor chip in the horizontal direction of the adhesive sheet is also applied, so the semiconductor chip is positioned in the horizontal direction of the adhesive layer.
- the storage elastic modulus E ′ of the expandable substrate at a predetermined temperature means a value measured by the method described in Examples.
- the storage elastic modulus satisfy
- the storage elastic modulus E '(100) of the said expandable base material in 100 degreeC is 2.0 * 10 ⁇ 5 > Pa or more.
- the storage elastic modulus E ′ (100) of the expandable substrate is more preferably 4.0 ⁇ 10 5 Pa or more, still more preferably 6.0 ⁇ 10 5 Pa or more, and still more preferably 8.0. ⁇ 10 5 Pa or more, still more preferably 1.0 ⁇ 10 6 Pa or more.
- the storage elastic modulus E ′ (100) of the expandable substrate is preferably 1.0 ⁇ 10 12 Pa or less, more preferably It is 1.0 ⁇ 10 11 Pa or less, more preferably 1.0 ⁇ 10 10 Pa or less, and still more preferably 1.0 ⁇ 10 9 Pa or less.
- the expansible base material which the adhesive sheet of this embodiment has contains a thermally expansible particle as an expansible particle it is preferable that the storage elastic modulus satisfy
- the storage elastic modulus E ′ (t) of the expandable substrate at the expansion start temperature (t) of the thermally expandable particles is 1.0 ⁇ 10 7 Pa or less.
- the storage elastic modulus E ′ (t) of the expandable substrate is more preferably 9.0 ⁇ 10 6 Pa or less, still more preferably 8.0 ⁇ 10 6 Pa or less, and still more preferably 6.0. ⁇ 10 6 Pa or less, still more preferably 4.0 ⁇ 10 6 Pa or less.
- the storage elastic modulus of the expandable base material E ′ (t) is preferably 1.0 ⁇ 10 3 Pa or more, more preferably 1.0 ⁇ 10 4 Pa or more, and further preferably 1.0 ⁇ 10 5 Pa or more.
- the pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet of this embodiment may be any layer that contains a pressure-sensitive adhesive resin, and additives for pressure-sensitive adhesives such as a cross-linking agent, a tackifier, a polymerizable compound, and a polymerization initiator as necessary. It may contain.
- an adhesive layer is a non-expandable adhesive layer from a viewpoint which prevents that the mounted semiconductor chip sinks into an adhesive layer by the heating in a sealing process.
- the pressure-sensitive adhesive force of the pressure-sensitive adhesive layer before expansion of the expandable particles at 23 ° C. is preferably 0.1 to 10.0 N / 25 mm, more preferably 0.2 to It is 8.0 N / 25 mm, more preferably 0.4 to 6.0 N / 25 mm, and still more preferably 0.5 to 4.0 N / 25 mm.
- the adhesive force is 0.1 N / 25 mm or more, it can be sufficiently fixed to such an extent that the semiconductor chip can be prevented from being displaced in the sealing step.
- the adhesive strength is 10.0 N / 25 mm or less, it can be easily peeled off with a slight external force when peeling off from the adherend.
- said adhesive force means the value measured by the method as described in an Example.
- the storage shear modulus G ′ (23) of the pressure-sensitive adhesive layer at 23 ° C. is preferably 1.0 ⁇ 10 4 to 1.0 ⁇ 10 8 Pa, more preferably 5. 0 ⁇ 10 4 to 5.0 ⁇ 10 7 Pa, more preferably 1.0 ⁇ 10 5 to 1.0 ⁇ 10 7 Pa.
- the storage shear modulus G ′ (23) of the pressure-sensitive adhesive layer to which the semiconductor chip is attached is preferably within the above range, and the semiconductor chip is more than the expandable substrate.
- the storage shear modulus G ′ (23) of all the pressure-sensitive adhesive layers on the side to which the is attached is within the above range. If the storage shear modulus G ′ (23) of the pressure-sensitive adhesive layer is 1.0 ⁇ 10 4 Pa or more, the semiconductor chip can be prevented from being displaced, and the semiconductor chip can be prevented from sinking into the pressure-sensitive adhesive layer. It can also be prevented. On the other hand, if the storage shear modulus G ′ (23) of the pressure-sensitive adhesive layer is 1.0 ⁇ 10 8 Pa or less, irregularities are formed on the surface of the pressure-sensitive adhesive layer due to expansion of the expandable particles in the expandable substrate. As a result, it can be easily peeled off with a slight force. In addition, in this specification, the storage shear modulus G '(23) of an adhesive layer means the value measured by the method as described in an Example.
- the thickness of the pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet of the present embodiment is uneven on the surface of the pressure-sensitive adhesive layer formed from the viewpoint of developing excellent pressure-sensitive adhesive strength and the expansion of the expandable particles in the expandable substrate. From the viewpoint of facilitating formation of the film, the thickness is preferably 1 to 60 ⁇ m, more preferably 2 to 50 ⁇ m, still more preferably 3 to 40 ⁇ m, and still more preferably 5 to 30 ⁇ m.
- the ratio of the thickness of the expandable base material to the thickness of the pressure-sensitive adhesive layer at 23 ° C. is made flat on the rewiring layer forming surface.
- it is preferably 0.2 or more, more preferably 0.5 or more, still more preferably 1.0 or more, still more preferably 5.0 or more, and peeling.
- it is preferably 1000 or less, more preferably 200 or less, still more preferably 60 or less, and even more preferably 30 or less.
- the thickness of an adhesive layer means the value measured by the method as described in an Example.
- the pressure-sensitive adhesive layer can be formed from a pressure-sensitive adhesive composition containing a pressure-sensitive adhesive resin.
- a pressure-sensitive adhesive composition containing a pressure-sensitive adhesive resin.
- the resin alone is preferably a polymer having adhesiveness and a mass average molecular weight (Mw) of 10,000 or more.
- the mass average molecular weight (Mw) of the adhesive resin used in the present embodiment is preferably 10,000 to 2,000,000, more preferably 20,000 to 1,500,000, and still more preferably 30,000, from the viewpoint of improving adhesive force. ⁇ 1 million.
- the adhesive resin examples include rubber resins such as acrylic resins, urethane resins, and polyisobutylene resins, polyester resins, olefin resins, silicone resins, and polyvinyl ether resins. These adhesive resins may be used independently and may use 2 or more types together. In addition, when these adhesive resins are copolymers having two or more kinds of structural units, the form of the copolymer is not particularly limited, and a block copolymer, a random copolymer, and a graft copolymer are not limited. Any of polymers may be used.
- the adhesive resin used in the present embodiment may be an energy ray curable adhesive resin in which a polymerizable functional group is introduced into the side chain of the above-mentioned adhesive resin.
- the polymerizable functional group include a (meth) acryloyl group and a vinyl group.
- energy rays include ultraviolet rays and electron beams, but ultraviolet rays are preferred.
- the content of the adhesive resin is preferably 30 to 99.99% by mass, more preferably 40 to 99.95% by mass, still more preferably based on the total amount (100% by mass) of the active ingredients of the adhesive composition. It is 50 to 99.90% by mass, more preferably 55 to 99.80% by mass, still more preferably 60 to 99.50% by mass.
- “content of each component relative to the total amount of active ingredients of the pressure-sensitive adhesive composition” means “content of each component in the pressure-sensitive adhesive layer formed from the pressure-sensitive adhesive composition”. Is synonymous with.
- the adhesive resin preferably contains an acrylic resin.
- the content of the acrylic resin in the adhesive resin is preferably 30 to 100% by mass, more preferably 50 to 100% by mass with respect to the total amount (100% by mass) of the adhesive resin contained in the adhesive composition. %, More preferably 70 to 100% by mass, and still more preferably 85 to 100% by mass.
- the acrylic resin that can be used as the adhesive resin has, for example, a polymer containing a structural unit derived from an alkyl (meth) acrylate having a linear or branched alkyl group, or a cyclic structure. Examples thereof include a polymer containing a structural unit derived from (meth) acrylate.
- the mass average molecular weight (Mw) of the acrylic resin is preferably 100,000 to 1,500,000, more preferably 200,000 to 1,300,000, still more preferably 350,000 to 1,200,000, still more preferably 500,000 to 1,100,000.
- acrylic resin examples include a structural unit (a1) derived from an alkyl (meth) acrylate (a1 ′) (hereinafter also referred to as “monomer (a1 ′)”) and a functional group-containing monomer (a2 ′) (hereinafter referred to as “monomer”).
- the acrylic copolymer (A1) having the structural unit (a2) derived from (a2 ′) ” is more preferable.
- the number of carbon atoms of the alkyl group contained in the monomer (a1 ′) is preferably 1 to 24, more preferably 1 to 12, still more preferably 2 to 10, and still more preferably 4 to 8 from the viewpoint of improving adhesive properties. It is.
- the alkyl group contained in the monomer (a1 ′) may be a linear alkyl group or a branched alkyl group.
- Examples of the monomer (a1 ′) include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, lauryl (meth) acrylate, tridecyl ( Examples include meth) acrylate and stearyl (meth) acrylate. These monomers (a1 ′) may be used alone or in combination of two or more. As the monomer (a1 ′), butyl (meth) acrylate and 2-ethylhexyl (meth) acrylate are preferable.
- the content of the structural unit (a1) is preferably 50 to 99.9% by mass, more preferably 60 to 99.0% by mass with respect to the total structural unit (100% by mass) of the acrylic copolymer (A1). %, More preferably 70 to 97.0% by mass, and still more preferably 80 to 95.0% by mass.
- a hydroxyl group, a carboxy group, an amino group, an epoxy group etc. examples include a hydroxyl group-containing monomer, a carboxy group-containing monomer, an amino group-containing monomer, and an epoxy group-containing monomer. These monomers (a2 ′) may be used alone or in combination of two or more. Among these, as the monomer (a2 ′), a hydroxyl group-containing monomer and a carboxy group-containing monomer are preferable.
- Examples of the hydroxyl group-containing monomer include the same ones as the above-mentioned hydroxyl group-containing compound.
- carboxy group-containing monomer examples include ethylenically unsaturated monocarboxylic acids such as (meth) acrylic acid and crotonic acid; ethylenically unsaturated dicarboxylic acids such as fumaric acid, itaconic acid, maleic acid and citraconic acid, and anhydrides thereof.
- ethylenically unsaturated monocarboxylic acids such as (meth) acrylic acid and crotonic acid
- dicarboxylic acids such as fumaric acid, itaconic acid, maleic acid and citraconic acid, and anhydrides thereof.
- the content of the structural unit (a2) is preferably 0.1 to 40% by weight, more preferably 0.5 to 35% by weight with respect to all the structural units (100% by weight) of the acrylic copolymer (A1). %, More preferably 1.0 to 30% by mass, and still more preferably 3.0 to 25% by mass.
- the acrylic copolymer (A1) may further have a structural unit (a3) derived from another monomer (a3 ′) other than the monomers (a1 ′) and (a2 ′).
- the content of the structural units (a1) and (a2) is preferably 70 with respect to the total structural units (100% by mass) of the acrylic copolymer (A1).
- To 100% by mass more preferably 80 to 100% by mass, still more preferably 90 to 100% by mass, and still more preferably 95 to 100% by mass.
- Examples of the monomer (a3 ′) include olefins such as ethylene, propylene, and isobutylene; halogenated olefins such as vinyl chloride and vinylidene chloride; diene monomers such as butadiene, isoprene, and chloroprene; cyclohexyl (meth) acrylate, It has a cyclic structure such as benzyl (meth) acrylate, isobornyl (meth) acrylate, dicyclopentanyl (meth) acrylate, dicyclopentenyl (meth) acrylate, dicyclopentenyloxyethyl (meth) acrylate, imide (meth) acrylate, etc.
- olefins such as ethylene, propylene, and isobutylene
- halogenated olefins such as vinyl chloride and vinylidene chloride
- diene monomers such as butadiene, iso
- the acrylic copolymer (A1) may be an energy ray curable acrylic copolymer having a polymerizable functional group introduced in the side chain.
- the polymerizable functional group and the energy ray are as described above.
- the polymerizable functional group includes an acrylic copolymer having the above structural units (a1) and (a2), and a substituent that can be bonded to the functional group of the structural unit (a2) of the acrylic copolymer. And a compound having a polymerizable functional group can be reacted. Examples of the compound include (meth) acryloyloxyethyl isocyanate, (meth) acryloyl isocyanate, glycidyl (meth) acrylate, and the like.
- the adhesive composition contains an adhesive resin containing a functional group such as the above-mentioned acrylic copolymer (A1), it is preferable that the adhesive composition further contains a crosslinking agent.
- the said crosslinking agent reacts with the adhesive resin which has a functional group, and bridge
- crosslinking agent examples include an isocyanate crosslinking agent, an epoxy crosslinking agent, an aziridine crosslinking agent, and a metal chelate crosslinking agent. These crosslinking agents may be used independently and may use 2 or more types together. Among these crosslinking agents, an isocyanate-based crosslinking agent is preferable from the viewpoints of increasing cohesive force and improving adhesive force, and availability.
- the content of the crosslinking agent is appropriately adjusted depending on the number of functional groups that the adhesive resin has, but is preferably 0.01 to 10 parts by mass with respect to 100 parts by mass of the adhesive resin having a functional group, The amount is more preferably 0.03 to 7 parts by mass, still more preferably 0.05 to 5 parts by mass.
- the pressure-sensitive adhesive composition may further contain a tackifier from the viewpoint of further improving the adhesive strength.
- the “tackifier” is a component that assists in improving the adhesive strength of the above-mentioned adhesive resin, and refers to an oligomer having a mass average molecular weight (Mw) of less than 10,000. It is distinguished from a functional resin.
- the mass average molecular weight (Mw) of the tackifier is preferably 400 to 10000, more preferably 500 to 8000, and still more preferably 800 to 5000.
- Examples of the tackifier are obtained by copolymerizing C5 fractions such as rosin resin, terpene resin, styrene resin, pentene, isoprene, piperine, 1,3-pentadiene generated by thermal decomposition of petroleum naphtha.
- C9 petroleum resin obtained by copolymerizing C9 fractions such as indene generated by thermal decomposition of petroleum naphtha and vinyltoluene, and hydrogenated resins obtained by hydrogenating these.
- the softening point of the tackifier is preferably 60 to 170 ° C, more preferably 65 to 160 ° C, and still more preferably 70 to 150 ° C.
- the “softening point” of the tackifier means a value measured according to JIS K2531.
- a tackifier may be used independently and may use 2 or more types from which a softening point, a structure, etc. differ. And when using 2 or more types of several tackifier, it is preferable that the weighted average of the softening point of these several tackifier belongs to the said range.
- the content of the tackifier is preferably 0.01 to 65% by mass, more preferably 0.05 to 55% by mass, and still more preferably relative to the total amount (100% by mass) of the active ingredients of the adhesive composition. It is 0.1 to 50% by mass, more preferably 0.5 to 45% by mass, still more preferably 1.0 to 40% by mass.
- an adhesive composition contains an energy-beam curable adhesive resin as an adhesive resin
- the adhesive layer formed from the adhesive composition can be irradiated with a relatively low energy energy beam. It is possible to sufficiently advance the curing reaction and adjust the adhesive strength to a desired range.
- a photoinitiator the same thing as what is mix
- the content of the photopolymerization initiator is preferably 0.01 to 10 parts by mass, more preferably 0.03 to 5 parts by mass, and still more preferably 0.001 parts by mass with respect to 100 parts by mass of the energy ray curable adhesive resin. 05 to 2 parts by mass.
- the pressure-sensitive adhesive composition that is a material for forming the pressure-sensitive adhesive layer is an additive for pressure-sensitive adhesives used for general pressure-sensitive adhesives in addition to the above-mentioned additives as long as the effects of the present invention are not impaired.
- An agent may be contained.
- examples of such an adhesive additive include antioxidants, softeners (plasticizers), rust inhibitors, pigments, dyes, retarders, reaction accelerators (catalysts), ultraviolet absorbers, and the like. These pressure-sensitive adhesive additives may be used alone or in combination of two or more.
- each pressure-sensitive adhesive additive is preferably 0.0001 to 20 parts by mass, more preferably 0.001 to 100 parts by mass of the adhesive resin. ⁇ 10 parts by mass.
- the pressure-sensitive adhesive composition that is a material for forming the pressure-sensitive adhesive layer may contain expandable particles as long as the effects of the present invention are not impaired.
- the adhesive layer which the adhesive sheet of this embodiment has is a non-expandable adhesive layer. Therefore, the pressure-sensitive adhesive composition, which is a material for forming the pressure-sensitive adhesive layer, is more preferable as the content of the expandable particles is as small as possible.
- the content of the expandable particles is preferably less than 5% by mass, more preferably less than 1% by mass, and even more preferably less than 0.1% by mass with respect to the total amount (100% by mass) of the active ingredients of the pressure-sensitive adhesive composition. More preferably, it is less than 0.01% by mass, particularly preferably less than 0.001% by mass.
- the adhesive sheet of this embodiment may have a peeling material further on the adhesive surface of an adhesive layer.
- a release sheet that has been subjected to a double-sided release process, a release sheet that has been subjected to a single-sided release process, or the like is used.
- Examples of the base material for the release material include papers such as high-quality paper, glassine paper, and craft paper; polyester resin films such as polyethylene terephthalate resin, polybutylene terephthalate resin, and polyethylene naphthalate resin, polypropylene resin, and polyethylene resin. Examples thereof include plastic films such as olefin resin films.
- release agent examples include silicone-based resins, olefin-based resins, isoprene-based resins, rubber-based elastomers such as butadiene-based resins, long-chain alkyl-based resins, alkyd-based resins, and fluorine-based resins.
- the thickness of the release material is not particularly limited, but is preferably 10 to 200 ⁇ m, more preferably 25 to 170 ⁇ m, and still more preferably 35 to 80 ⁇ m.
- Step (1a) On the release treatment surface of the release material, the resin composition (y), which is a material for forming the expandable substrate, is applied to form a coating film, and the coating film is dried or UV cured. Forming the expandable substrate;
- a production method (b) having the following steps (1b) to (3b) can be mentioned.
- the resin composition (y) and the pressure-sensitive adhesive composition may be further mixed with a diluent solvent to form a solution.
- a diluent solvent examples include spin coating, spray coating, bar coating, knife coating, roll coating, blade coating, die coating, and gravure coating.
- drying or UV irradiation which forms an expansible base material from the coating film of the process (1a) of a manufacturing method (a) and the process (1b) of a manufacturing method (b) is the conditions which an expansible particle does not expand suitably It is preferable to carry out by selecting.
- the drying temperature is preferably less than the expansion start temperature (t) of the thermally expandable particles.
- the method for manufacturing a semiconductor device according to this embodiment is a method for manufacturing a semiconductor device using the pressure-sensitive adhesive sheet, and includes the following steps (1) to (4).
- Process (1) The process of sticking the frame member in which the opening part was formed in the adhesion surface of an adhesive layer
- FIG. 2A is a cross-sectional view illustrating a step (1) for attaching the frame member 20 in which the opening 21 is formed on the pressure-sensitive adhesive surface 12a of the pressure-sensitive adhesive layer 12 of the pressure-sensitive adhesive sheet 10.
- the adhesive sheet 10 has the release material 13
- the release material 13 is peeled beforehand.
- the frame member 20 is formed in a lattice shape and has a plurality of openings 21.
- the frame member 20 is preferably formed of a material having heat resistance.
- the material of the frame member 20 is a metal such as copper, stainless steel, 42 alloy; a resin called engineering plastic such as polyimide resin, polyacetal resin, polyamide resin, polycarbonate resin, modified polyphenylene ether resin, polybutylene terephthalate resin; glass Examples include composite materials such as epoxy resins.
- the thickness t FR of the frame member 20 is, for example, 100 ⁇ m to 3 mm, preferably 100 ⁇ m to 1 mm, and more preferably 100 to 500 ⁇ m.
- the opening 21 is a hole that penetrates the front and back surfaces of the frame member 20.
- the shape of the opening 21 is not particularly limited as long as the semiconductor chip CP can be accommodated in the frame.
- the depth of the hole of the opening 21 is not particularly limited as long as the semiconductor chip CP can be accommodated.
- a frame member 20 having a plurality of openings 21 is used as the frame member 20.
- the frame member 20 is preferably one that can place a plurality of semiconductor chips CP on the adhesive surface 12a in a state of being arranged in a matrix of a plurality of rows and a plurality of columns at regular intervals.
- FIG. 2B is a cross-sectional view illustrating the step (2) of placing the semiconductor chip CP on a part of the adhesive surface 12a of the adhesive layer 12 exposed at the opening 21 of the frame member 20.
- a conventionally known semiconductor chip CP can be used.
- the semiconductor chip CP is formed with an integrated circuit composed of circuit elements such as transistors, resistors, and capacitors on the circuit surface W1.
- the semiconductor chip CP is placed so that the circuit surface W1 is covered with the adhesive surface 12a.
- a known device such as a flip chip bonder or a die bonder can be used. The layout, the number of arrangement, etc.
- the manufacturing method of the semiconductor device according to the present embodiment covers the semiconductor chip CP with a sealing material in an area larger than the chip size, such as FOWLP, FOPLP, etc., and only the circuit surface W1 of the semiconductor chip CP
- the present invention is suitably applied to a package for forming a rewiring layer even in the surface region of the sealing material. Therefore, the semiconductor chip CP is placed on a part of the adhesive surface 12a of the adhesive layer 12 exposed at the opening 21 of the frame member 20, and the semiconductor chip CP is a frame member surrounding the semiconductor chip CP. It is more preferable that the electronic components are placed at a predetermined interval.
- the interval between the semiconductor chip CP and the frame member 20 may be determined as appropriate according to the form of the target package.
- the semiconductor chip CP is placed on a part of the adhesive surface 12a of the adhesive layer 12 exposed at the opening 21 of the frame member 20, so that the semiconductor chip CP of the adhesive surface 12a of the adhesive layer 12 is A peripheral portion 30 is formed.
- the peripheral portion 30 of the semiconductor chip CP is an adhesive surface 12a of the adhesive layer 12 corresponding to the gap between the semiconductor chip CP and the frame member 20.
- FIG. 2 is a cross-sectional view illustrating a step (3) in which the sealing material 40 is cured to obtain a cured sealing body 50 in which the semiconductor chip CP is sealed with the cured sealing material 41.
- covering step the step of covering the semiconductor chip CP, the frame member 20, and the peripheral portion 30 of the semiconductor chip CP in the adhesive surface 12a of the pressure-sensitive adhesive layer 12 with the sealing material 40.
- curing step the step of curing the sealing material 40 to obtain the cured sealing body 50 in which the semiconductor chip CP is sealed with the cured sealing material 41 may be referred to as a “curing step”.
- the semiconductor chip CP, the frame member 20, and the peripheral portion 30 of the semiconductor chip CP among the adhesive surface 12 a of the adhesive layer 12 are encapsulated 40.
- the sealing material 40 fills the gap between the semiconductor chip CP and the frame member 20 while covering the entire exposed surface of the semiconductor chip CP and the frame member 20.
- the sealing material 40 has a function of protecting the semiconductor chip CP and its accompanying elements from the external environment. There is no restriction
- the sealing material 40 has curability from the viewpoint of mechanical strength, heat resistance, insulation, and the like, and examples thereof include a thermosetting resin composition and an energy ray curable resin composition. Hereinafter, in this embodiment, the sealing material 40 is demonstrated as what is a thermosetting resin composition.
- thermosetting resin contained in the thermosetting resin composition that is the sealing material 40 examples include an epoxy resin, a phenol resin, and a cyanate resin. However, mechanical strength, heat resistance, insulation, and moldability are exemplified. From the viewpoint of the above, an epoxy resin is preferable.
- the thermosetting resin composition if necessary, a phenol resin curing agent, a curing agent such as an amine curing agent, a curing accelerator, an inorganic filler such as silica, You may contain additives, such as an elastomer.
- the sealing material 40 may be solid or liquid at room temperature. Moreover, the form of the sealing material 40 which is solid at room temperature is not specifically limited, For example, a granular form, a sheet form, etc. may be sufficient.
- an arbitrary method is appropriately selected from methods conventionally used in the semiconductor sealing process.
- a roll laminating method, a vacuum pressing method, a vacuum laminating method, a spin coating method, a die coating method, a transfer molding method, a compression molding mold method, or the like can be applied.
- the sealing material 40 is heated during coating to impart fluidity.
- the sealing material 40 is cured to obtain a cured sealing body 50 in which the semiconductor chip CP is sealed with the cured sealing material 41.
- the pressure-sensitive adhesive sheet 10 used in the present embodiment contains expandable particles that expand due to heat, energy rays, and the like.
- the expandable particles are By expanding, the adhesive force between the adhesive surface 12 a and the cured sealing body 50 is reduced, and the adhesive sheet 10 is peeled from the cured sealing body 50. Therefore, in the coating step and the curing step, it is preferable that the sealing material 40 is coated and cured by appropriately selecting conditions under which the expandable particles do not expand.
- the heating conditions (heating temperature and heating time) in the coating process and the curing process are such that the pressure-sensitive adhesive sheet 10 is caused by the expansion of the heat-expandable particles.
- Heating conditions in which the rate of increase in thickness is 10% or less are preferable, heating conditions in which the rate of increase is 5% or less are more preferable, and heating conditions in which the rate of increase is 0% (that is, the thermally expandable particles expand). Heating conditions) are more preferred.
- the rate of increase in the thickness of the pressure-sensitive adhesive sheet 10 is, for example, the thickness of the pressure-sensitive adhesive sheet 10 before and after heating under a predetermined condition in accordance with JIS K6783, Z1702, Z1709, a constant-pressure thickness measuring instrument (manufactured by Teclock Co., Ltd.).
- Product name “PG-02”) can be calculated based on the following formula.
- Thickness increase rate (%) (Thickness after heating ⁇ Thickness before heating) ⁇ 100 / Thickness before heating
- the coating process and the curing process may be performed separately. When the sealing material 40 is heated, the sealing material 40 may be cured as it is by the heating. That is, in that case, the covering step and the curing step may be performed simultaneously.
- thermosetting resin composition is used as the sealing material 40 and heat-expandable particles are used as the expandable particles.
- the sealing material 40 is an energy ray curable resin composition
- the expandable particle is an energy ray expandable particle.
- thermosetting resin composition is heated in the coating step
- the temperature at which the thermosetting resin composition is heated in the coating step vary depending on the type of the sealing material 40 used, the type of expandable particles, and the like, but are, for example, 30 to 180 ° C. 170 ° C. is preferable, and 70 to 150 ° C. is more preferable.
- the heating time is, for example, 5 seconds to 60 minutes, preferably 10 seconds to 45 minutes, and more preferably 15 seconds to 30 minutes.
- the pressure-bonding pressure is, for example, 0.1 to 2.0 MPa, more preferably 0.2 to 1.8 MPa, and 0.3 to 1.6 MPa. Is more preferable.
- the pressure is, for example, 0.1 to 5.0 MPa, preferably 0.5 to 4.0 MPa.
- specific examples of the temperature at which the sealing material 40 is cured vary depending on the type of the sealing material 40 used, the type of the expandable particles, and the like, but are, for example, 80 to 240 ° C. ° C is preferred, and 100 to 170 ° C is more preferred.
- the heating time is, for example, 10 to 180 minutes, preferably 20 to 150 minutes, and more preferably 30 to 120 minutes.
- the covering step and the curing step using a sheet-like sealing material (hereinafter also referred to as “sheet-like sealing material”).
- sheet-like sealing material a sheet-like sealing material
- the sheet-like sealing material is placed so as to cover the semiconductor chip CP and its peripheral portion 30 and the frame member 20, so that the semiconductor chip CP and its peripheral portion 30 and the frame member are covered. 20 is covered with a sealing material 40.
- Preferred embodiments of the reduced pressure, heating and pressure bonding conditions are as described above.
- the sheet-like sealing material 40 is heated and cured.
- a preferred embodiment of the curing temperature is as described above.
- the sheet-like sealing material may be a laminated sheet supported by a resin sheet such as polyethylene terephthalate.
- the resin sheet may be peeled off from the sealing material after the laminated sheet is placed so that the sheet-shaped sealing material covers the semiconductor chip CP and its peripheral portion 30 and the frame member 20.
- the semiconductor chip CP and the adhesive sheet 10 covered with the sealing material 40 are sandwiched by plate-like members from both sides, and pressed under conditions of a predetermined temperature, time and pressure.
- the sealing material 40 is easily filled into the gap between the semiconductor chip CP and the frame member 20.
- corrugation of the sealing material layer comprised by the sealing material 40 can also be planarized by implementing a 1st heat press process.
- the plate member for example, a metal plate such as stainless steel can be used.
- the cured sealing body 50 in which the plurality of semiconductor chips CP are embedded in the cured sealing material 41 is obtained.
- steps (4) and (5) which will be described later, after the pressure-sensitive adhesive sheet 10 is peeled from the cured sealing body 50, a step of forming a rewiring layer on the exposed surface is performed.
- the surface of the cured encapsulant 50 that is exposed that is, the surface opposite to the expandable base material
- a member may be attached.
- the reinforcement board excellent in heat resistance such as a glass epoxy resin
- the reinforcing member can be attached via an adhesive layer, for example. Since the reinforcing member is removed after achieving its purpose, the adhesive layer is preferably one that can be fixed and peeled off as necessary.
- the sticking of the reinforcing member is performed by, for example, laminating a thermosetting adhesive layer and a reinforcing plate in this order on the exposed surface of the cured sealing body 50, and further, if necessary, the reinforcing plate side and the pressure-sensitive adhesive sheet It can be carried out by a second hot pressing process in which the sheet is sandwiched from both sides and pressed under conditions of a predetermined temperature, time and pressure. Also in the 2nd heat press process, metal plates, such as stainless steel, can be used as a plate-shaped member, for example.
- FIG. 2E is a cross-sectional view illustrating a step (4) in which the expandable particles are expanded and the pressure-sensitive adhesive sheet 10 is peeled from the cured sealing body 50.
- the expandable particles are expanded by heat, energy rays, or the like according to the type thereof, thereby forming irregularities on the adhesive surface 12a of the adhesive layer 12, thereby forming the adhesive surface 12a and the cured seal.
- the adhesive strength with the stationary body 50 is reduced, and the adhesive sheet 10 is peeled off. It is preferable to implement the process 4 in the state which fixed the surface 11a on the opposite side to the adhesive layer 12 of the base material 11 with the fixing jig.
- the surface 11a of the adhesive sheet 10 is fixed using a suction table 90 having a plurality of suction holes 91 as the fixing jig.
- the suction table 90 has a pressure reducing mechanism such as a vacuum pump, for example, and the target is fixed to the suction surface by sucking the target from the plurality of suction holes 91 by the pressure reducing mechanism.
- corrugation on the surface 11a side of the base material 11 is not limited to said method, Arbitrary methods which can suppress the unevenness
- a method of attaching a hard support to the surface 11a via an arbitrary pressure-sensitive adhesive layer, a double-sided pressure-sensitive adhesive sheet, or the like can be given.
- the material of the hard support may be appropriately determined in consideration of mechanical strength, heat resistance, and the like.
- metal materials such as SUS; non-metallic inorganic materials such as glass and silicon wear; resins such as polyimide and polyamideimide Materials: Composite materials such as glass epoxy resins are listed.
- the thickness of the hard support may be appropriately determined in consideration of mechanical strength, handleability, etc., and is, for example, 100 ⁇ m to 50 mm.
- the pressure-sensitive adhesive layer used for sticking the hard support (hereinafter also referred to as “second pressure-sensitive adhesive layer”) is not particularly limited, but is formed using the pressure-sensitive adhesive composition used for forming the pressure-sensitive adhesive layer 12. Can do. In addition, you may provide the 2nd adhesive layer in the surface 11a side of the base material 11 previously. In that case, the adhesive surface of the second pressure-sensitive adhesive layer may further have a release material.
- the pressure-sensitive adhesive sheet 10 may have a configuration of pressure-sensitive adhesive layer 12 / base material 11 / second pressure-sensitive adhesive layer, and the release material / pressure-sensitive adhesive layer 12 / base material 11 / second pressure-sensitive adhesive layer / peeling. You may have the structure of material.
- the expandable particles are thermally expandable particles, they may be heated to a temperature equal to or higher than the expansion start temperature (t).
- the “temperature higher than the expansion start temperature (t)” is preferably “expansion start temperature (t) + 10 ° C.” or higher and “expansion start temperature (t) + 60 ° C.” or lower. It is more preferable that it is not less than “t) + 15 ° C.” and not more than “expansion start temperature (t) + 40 ° C.”.
- it may be heated and expanded in the range of 120 to 250 ° C.
- the pressure-sensitive adhesive sheet 10 is peeled from the cured sealing body 50. Since the pressure-sensitive adhesive sheet 10 according to the present embodiment has excellent peelability, it can be peeled with an external force smaller than that of a conventional temporary fixing sheet.
- the method to peel is not specifically limited, For example, you may peel using a tape remover.
- the thickness of the cured sealing body 50 is reduced as necessary before or after the pressure-sensitive adhesive sheet 10 is peeled from the cured sealing body 50 in the step (4). Therefore, the process of grinding the surface on the opposite side to the rewiring layer formation surface of the hardening sealing body 50 may be included.
- the manufacturing method which concerns on this embodiment includes the process (5) which forms a rewiring layer in the hardening sealing body 50 which peeled the double-sided adhesive sheet 10.
- FIG. FIG. 3A shows a cross-sectional view of the cured sealing body 50 after the pressure-sensitive adhesive sheet 10 has been peeled off.
- rewirings connected to the circuit W2 of the plurality of exposed semiconductor chips CP are formed on the circuit surface W1 and on the surface 50a of the cured sealing body 50 corresponding to the outside of the region of the semiconductor chip CP. .
- FIG. 3B is a cross-sectional view illustrating a process of forming the first insulating layer 61 on the circuit surface W1 of the semiconductor chip CP and the surface 50a of the cured sealing body 50.
- a first insulating layer 61 containing an insulating resin is formed on the circuit surface W1 and the surface 50a so as to expose the circuit W2 of the semiconductor chip CP or the internal terminal electrode W3 of the circuit W2.
- the insulating resin include polyimide resin, polybenzoxazole resin, and silicone resin.
- the material of the internal terminal electrode W3 is not limited as long as it is a conductive material, and examples thereof include metals such as gold, silver, copper, and aluminum, and alloys containing these metals.
- FIG. 3C is a cross-sectional view illustrating a process of forming the rewiring 70 that is electrically connected to the semiconductor chip CP sealed in the cured sealing body 50.
- the rewiring 70 is formed following the formation of the first insulating layer 61.
- the material of the rewiring 70 is not limited as long as it is a conductive material, and examples thereof include metals such as gold, silver, copper, and aluminum, and alloys containing these metals.
- the rewiring 70 can be formed by a known method such as a subtractive method or a semi-additive method.
- FIG. 4A is a cross-sectional view illustrating a process of forming the second insulating layer 62 that covers the rewiring 70.
- the rewiring 70 has external electrode pads 70A for external terminal electrodes.
- the second insulating layer 62 is provided with an opening or the like to expose the external electrode pad 70A for the external terminal electrode.
- the external electrode pads 70A are inside and outside the region of the semiconductor chip CP of the cured sealing body 50 (a region corresponding to the circuit surface W1) and outside the region (a region corresponding to the surface 50a on the cured sealing body 50). It is exposed to.
- the rewiring 70 is formed on the surface 50a of the cured sealing body 50 so that the external electrode pads 70A are arranged in an array. In the present embodiment, since the external electrode pad 70A is exposed outside the region of the semiconductor chip CP of the cured sealing body 50, FOWLP or FOPLP can be obtained.
- FIG. 4B is a cross-sectional view illustrating a process of connecting the external terminal electrode 80 to the external electrode pad 70A.
- An external terminal electrode 80 such as a solder ball is placed on the external electrode pad 70A exposed from the second insulating layer 62, and the external terminal electrode 80 and the external electrode pad 70A are electrically connected by solder bonding or the like.
- the material of the solder ball is not particularly limited, and examples thereof include lead-containing solder and lead-free solder.
- FIG. 4C is a cross-sectional view illustrating a process of separating the cured sealing body 50 to which the external terminal electrode 80 is connected.
- the cured sealing body 50 is singulated for each semiconductor chip CP.
- the method for dividing the cured sealing body 50 into individual pieces is not particularly limited, and can be performed by a cutting means such as a dicing saw.
- the semiconductor device 100 in units of the semiconductor chip CP is manufactured.
- the semiconductor device 100 in which the external terminal electrode 80 is connected to the external electrode pad 70A fanned out outside the region of the semiconductor chip CP is manufactured as FOWLP, FOPLP, or the like.
- the particle distribution of the thermally expandable particles before expansion at 23 ° C. was measured using a laser diffraction particle size distribution measuring apparatus (for example, product name “Mastersizer 3000” manufactured by Malvern).
- the particle diameters corresponding to 50% and 90% of the cumulative volume frequency calculated from the smaller particle diameter of the particle distribution are expressed as “average particle diameter (D 50 ) of thermally expandable particles” and “thermally expandable particles”, respectively.
- a viscoelasticity measuring device manufactured by Anton Paar, device name “MCR300”
- a torsional shear method under conditions of a test start temperature of 0 ° C., a test end temperature of 300 ° C., a heating rate of 3 ° C./min, and a frequency of 1 Hz was used to measure the storage shear modulus G ′ of the test sample at a given temperature.
- a stainless steel probe having a diameter of 5 mm is brought into contact with the surface of the test sample at a contact load of 0.98 N / cm 2 for 1 second, and then the probe is moved at a speed of 10 mm / sec. The force required to separate from the surface was measured. And the measured value was made into the probe tack value of the test sample.
- Acrylic copolymer (i): having a structural unit derived from a raw material monomer consisting of 2-ethylhexyl acrylate (2EHA) / 2-hydroxyethyl acrylate (HEA) 80.0 / 20.0 (mass ratio), A solution containing an acrylic copolymer having a mass average molecular weight (Mw) of 600,000. Diluting solvent: ethyl acetate, solid content concentration: 40% by mass.
- Acrylic copolymer (ii): n-butyl acrylate (BA) / methyl methacrylate (MMA) / 2-hydroxyethyl acrylate (HEA) / acrylic acid 86.0 / 8.0 / 5.0 / 1.
- Production Example 1 (Formation of pressure-sensitive adhesive layer (X))
- the isocyanate-based crosslinking agent (i) 5.0 parts by mass (solid content ratio) is blended with 100 parts by mass of the solid content of the acrylic copolymer (i), which is an adhesive resin, and diluted with toluene.
- the composition (x-1) having a solid content concentration (active ingredient concentration) of 25% by mass was prepared by stirring uniformly. Then, on the surface of the release agent layer of the above heavy release film, the prepared composition (x-1) was applied to form a coating film, and the coating film was dried at 100 ° C. for 60 seconds to have a thickness of 10 ⁇ m.
- the pressure-sensitive adhesive layer (X) was formed.
- the storage shear modulus G ′ (23) of the pressure-sensitive adhesive layer (X) at 23 ° C. was 2.5 ⁇ 10 5 Pa.
- the product name “Irgacure 184”) 2.0 parts by mass (solid content ratio) and 0.2 parts by mass (solid content ratio) phthalocyanine pigment as an additive were blended to prepare an energy ray curable composition. . And the said heat-expandable particle
- the isocyanate-based crosslinking agent (i) is 6.3 parts by mass with respect to 100 parts by mass of the solid content of the acrylic urethane resin solution obtained in (2) above. (Solid content ratio), 1.4 parts by weight (solid content ratio) of dioctyltin bis (2-ethylhexanoate) as a catalyst, and the above-mentioned thermally expandable particles (i) were mixed, diluted with toluene, and uniformly By stirring, a composition (y-2) having a solid content concentration (active ingredient concentration) of 30% by mass was prepared.
- the content of the heat-expandable particles (i) relative to the total amount (100% by mass) of active ingredients in the obtained composition (y-2) was 20% by mass. Then, on the surface of the release agent layer of the light release film, the prepared composition (y-2) was applied to form a coating film, and the coating film was dried at 100 ° C. for 120 seconds to have a thickness of 50 ⁇ m. An expandable substrate (Y-2) was formed.
- the prepared composition (y-3) was applied to form a coating film, and the coating film was dried at 100 ° C. for 120 seconds to have a thickness of 50 ⁇ m.
- An expandable pressure-sensitive adhesive layer (Y-3) was formed.
- the expandable substrates (Y-1) to (Y-2) formed in Production Examples 2 to 3 and the expandable pressure-sensitive adhesive layer (Y-3) formed in Production Example 4 were used.
- Example 1 The surfaces of the pressure-sensitive adhesive layer (X) formed in Production Example 1 and the expandable substrate (Y-1) formed in Production Example 2 were bonded together to form a light release film / expandable substrate (Y-1 ) / Pressure-sensitive adhesive layer (X) / pressure-sensitive adhesive sheet (1) was prepared by laminating a heavy release film in this order.
- Example 2 Except that the expandable substrate (Y-1) was replaced with the expandable substrate (Y-2) formed in Production Example 3, a light release film / expandable substrate (Y -2) A pressure-sensitive adhesive sheet (2) was prepared by laminating a pressure-sensitive adhesive layer (X) / heavy release film in this order.
- Comparative Example 1 Lightly peelable film / expandable adhesive layer in the same manner as in Example 1 except that the expandable substrate (Y-1) was replaced with the expandable adhesive layer (Y-3) formed in Production Example 4.
- a pressure-sensitive adhesive sheet (3) was prepared by laminating (Y-3) / pressure-sensitive adhesive layer (X) / heavy release film in this order.
- the pressure-sensitive adhesive sheets (1) to (4) are heated for 3 minutes at 240 ° C., which is equal to or higher than the expansion start temperature (208 ° C.) of the thermally expandable particles.
- the stop body was separated, the semiconductor chip on the surface of the separated cured sealing body (rewiring layer forming surface) was observed visually and with a microscope, and the presence or absence of misalignment of the semiconductor chip was confirmed and evaluated according to the following criteria: .
- A A semiconductor chip in which a positional deviation of 25 ⁇ m or more from before sealing was not confirmed.
- F A semiconductor chip in which a positional deviation of 25 ⁇ m or more occurred before sealing was confirmed.
- the semiconductor chip is highly effective in suppressing the sinking of the semiconductor chip during heating during the sealing process.
- the surface of the semiconductor chip after the sealing step was also flat.
- the pressure-sensitive adhesive sheets (1) and (2) have good pressure-sensitive adhesive strength before heating, but the pressure-sensitive adhesive strength is reduced to such an extent that they cannot be measured after heating at or above the expansion start temperature. In some cases, the results proved that they were easily peelable with a slight force.
- the pressure-sensitive adhesive sheet (3) of Comparative Example 1 and the pressure-sensitive adhesive sheet (4) of Comparative Example 2 have an expandable pressure-sensitive adhesive layer instead of an expandable base material.
- the semiconductor chip was displaced, and a step was observed on the surface (rewiring layer forming surface) on the semiconductor chip side after the sealing process. Therefore, for example, it is considered that it is not suitable for use in a sealing process when manufacturing FOWLP and FOPLP.
- Double-sided adhesive sheet 11 Base material 11a Surface 12 Adhesive layer 12a Adhesive surface 13 Release material 20 Frame member 21 Opening part 30 Out of the adhesive surface of an adhesive layer, the peripheral part of a semiconductor chip 40 Sealing material 41 Hardening sealing material 50 Hardened sealing body 50a surface 61 first insulating layer 62 second insulating layer 70 rewiring 70A external electrode pad 80 external terminal electrode 90 suction table 91 suction hole 100 semiconductor device CP semiconductor chip W1 circuit surface W2 circuit W3 internal terminal electrode
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Abstract
Description
半導体チップは、そのサイズに近いパッケージに実装されることがある。このようなパッケージは、CSP(Chip Scale Package)と称されることもある。CSPとしては、ウエハサイズでパッケージ最終工程まで処理して完成させるWLP(Wafer Level Package)、ウエハサイズよりも大きいパネルサイズでパッケージ最終工程まで処理して完成させるPLP(Panel Level Package)等が挙げられる。
上記の工程において用いられる仮固定用シートには、前記被覆工程及び硬化工程(以下、これらを「封止工程」ともいう)の間には、半導体チップの位置ズレが発生せず、かつ半導体チップと仮固定用シートとの接着界面に封止材が進入しない程度の接着性が求められ、封止工程後には、糊残り無く容易に除去し得る剥離性が求められる。すなわち、FOWLP及びFOPLPの製造に使用される仮固定用シートは、使用時の接着性と、使用後の剥離性との両立が要求される。
また、粘着シートを除去する際に、加熱をして熱膨張性粘着層を膨張させても、半導体チップが粘着シート側に沈み込んでしまっていることにより、ある程度の大きさの外力無しでは剥離が困難となることも考えられる。
すなわち、本発明は、下記[1]~[11]に関する。
[1]粘着剤層と、膨張性粒子を含み、非粘着性である基材と、を有する粘着シートを用いて半導体装置を製造する方法であって、
下記工程(1)~(4)を有する、半導体装置の製造方法。
工程(1):粘着剤層の粘着表面に開口部が形成された枠部材を貼付する工程
工程(2):前記枠部材の前記開口部にて露出する前記粘着剤層の粘着表面の一部に半導体チップを載置する工程
工程(3):前記半導体チップと、前記枠部材と、前記粘着剤層の粘着表面のうち、前記半導体チップの周辺部と、を封止材で被覆し、該封止材を硬化させて、前記半導体チップが硬化封止材に封止されてなる硬化封止体を得る工程
工程(4):前記膨張性粒子を膨張させて、前記粘着シートを前記硬化封止体から剥離する工程
[2]さらに、下記工程(5)を有する上記[1]に記載の半導体装置の製造方法。
工程(5):前記粘着シートを剥離した硬化封止体に、再配線層を形成する工程
[3]前記膨張性粒子が、熱膨張性粒子であり、前記工程(4)が、前記粘着シートを加熱することにより、前記熱膨張性粒子を膨張させて、前記粘着シートを前記硬化封止体から剥離する工程である、上記[1]又は[2]に記載の半導体装置の製造方法。
[4]前記熱膨張性粒子の膨張開始温度(t)が、120~250℃である、上記[3]に記載の半導体装置の製造方法。
[5]前記基材が、下記要件(1)~(2)を満たす、上記[4]に記載の半導体装置の製造方法。
・要件(1):100℃における、前記基材の貯蔵弾性率E’(100)が、2.0×105Pa以上である。
・要件(2):前記熱膨張性粒子の膨張開始温度(t)における、前記基材の貯蔵弾性率E’(t)が、1.0×107Pa以下である。
[6]前記膨張性粒子の23℃における膨張前の平均粒子径が、3~100μmである、[1]~[5]のいずれかに記載の粘着シート。
[7]23℃における、前記粘着材層の貯蔵せん断弾性率G’(23)が、1.0×104~1.0×108Paである、上記[1]~[6]のいずれかに記載の半導体装置の製造方法。
[8]23℃における、前記基材の厚さと、前記粘着剤層の厚さとの比(基材/粘着剤層)が0.2以上である、上記[1]~[7]のいずれかに記載の半導体装置の製造方法。
[9]23℃における、前記基材の厚さが10~1000μmであり、前記粘着剤層の厚さが1~60μmである、上記[1]~[8]のいずれかに記載の半導体装置の製造方法。
[10]前記基材の表面におけるプローブタック値が、50mN/5mmφ未満である、上記[1]~[9]のいずれかに記載の半導体装置の製造方法。
[11]上記[1]~[10]のいずれかに記載の半導体装置の製造方法に用いられる粘着シートであって、粘着剤層と、膨張性粒子を含み、非粘着性である基材と、を有する粘着シート。
また、質量平均分子量(Mw)は、ゲルパーミエーションクロマトグラフィー(GPC)法で測定される標準ポリスチレン換算の値であり、具体的には実施例に記載の方法に基づいて測定した値である。
また、好ましい数値範囲(例えば、含有量等の範囲)について、段階的に記載された下限値及び上限値は、それぞれ独立して組み合わせることができる。例えば、「好ましくは10~90、より好ましくは30~60」という記載から、「好ましい下限値(10)」と「より好ましい上限値(60)」とを組み合わせて、「10~60」とすることもできる。
本実施形態に係る半導体装置の製造方法は、粘着剤層と、膨張性粒子を含み、非粘着性である基材と、を有する粘着シートを用いて半導体装置を製造する方法であって、下記工程(1)~(4)を有する、半導体装置の製造方法である。
工程(1):粘着剤層の粘着表面に開口部が形成された枠部材を貼付する工程
工程(2):前記枠部材の前記開口部にて露出する前記粘着剤層の粘着表面の一部に半導体チップを載置する工程
工程(3):前記半導体チップと、前記枠部材と、前記粘着剤層の粘着表面のうち、前記半導体チップの周辺部と、を封止材で被覆し、該封止材を硬化させて、前記半導体チップが硬化封止材に封止されてなる硬化封止体を得る工程
工程(4):前記膨張性粒子を膨張させて、前記粘着シートを前記硬化封止体から剥離する工程
以下、初めに本実施形態に係る半導体装置の製造方法に用いられる粘着シートについて説明し、その後、工程(1)~(4)を含む各製造工程について説明する。
本実施形態に係る粘着シートは、粘着剤層と、膨張性粒子を含み、非粘着性である基材(以下、「膨張性基材」ともいう)と、を有するものであれば、特に限定されない。
粘着シートの形状は、シート状、テープ状、ラベル状等、あらゆる形状を取り得る。
図1(A)は、本実施形態に係る粘着シート10の断面図である。
図1(A)に示すように、本実施形態に係る粘着シート10は、基材11上に、粘着剤層12を有する。
なお、本実施形態に係る粘着シートは、図1(B)に示す粘着シート10aのように、粘着剤層12の粘着表面12a上に、さらに剥離材13を有する構成としてもよい。剥離材13は、粘着シート10aを本実施形態に係る半導体装置の製造方法に用いる際に、適宜剥離除去されるものである。
膨張性基材は、膨張性粒子を含み、非粘着性である基材である。
一般的に、特許文献2に記載の粘着シートが有するような熱膨張性粘着剤層は、弾性率が低い粘着剤を主成分とする上に、膨張性粒子を十分に含ませるため、ある程度の厚さが必要となる。そのため、半導体チップの載置工程及び封止工程の間に半導体チップの位置ズレが発生したり、半導体チップが粘着シート側に沈み込んでしまい、再配線層形成面を平坦にできないという弊害が生じ得る。
一方、本実施形態に係る粘着シートは、膨張性粒子は、弾性率が高い非粘着性樹脂に含まれるため、半導体チップを載置する粘着剤層の厚さの調整、粘着力、粘弾性率等の制御等、設計の自由度が向上する。これによって半導体チップの位置ズレの発生を抑制できると共に、半導体チップが両面粘着シートに沈み込むことを抑制し、平坦性に優れる再配線層形成面を形成することができる。
さらに、本実施形態に係る粘着シートを用いる場合、半導体チップは、粘着剤層の粘着表面に載置されるため、膨張性基材と再配線層形成面とが直に接することがない。これによって、膨張性粒子に由来する残渣及び大きく変形した粘着剤層の一部が再配線層形成面に付着したり、熱膨張性粘着層に形成された凹凸形状が再配線層形成面に転写されてしまい平滑性が低下することが抑制され、清浄性及び平滑性に優れた再配線層形成面が得られる。
なお、本明細書において、膨張性基材の厚さは、実施例に記載の方法により測定された値を意味する。
本発明において、非粘着性の基材か否かの判断は、対象となる基材の表面に対して、JIS Z0237:1991に準拠して測定したプローブタック値が50mN/5mmφ未満であれば、当該基材を「非粘着性の基材」と判断する。
ここで、本実施形態で用いる膨張性基材の表面におけるプローブタック値は、通常は50mN/5mmφ未満であるが、好ましくは30mN/5mmφ未満、より好ましくは10mN/5mmφ未満、更に好ましくは5mN/5mmφ未満である。
なお、本明細書において、膨張性基材の表面におけるプローブタック値の具体的な測定方法は、実施例に記載の方法による。
また、膨張性基材は、樹脂及び膨張性粒子を含む樹脂組成物(y)から形成することができる。
以下、膨張性基材の形成材料である樹脂組成物(y)に含まれる各成分について説明する。
樹脂組成物(y)に含まれる樹脂としては、膨張性基材が非粘着性となる樹脂であれば特に限定されず、非粘着性樹脂であってもよく、粘着性樹脂であってもよい。
つまり、樹脂組成物(y)に含まれる樹脂が粘着性樹脂であっても、樹脂組成物(y)から膨張性基材を形成する過程において、当該粘着性樹脂が重合性化合物と重合反応し、得られる樹脂が非粘着性樹脂となり、当該樹脂を含む膨張性基材が非粘着性となればよい。
また、当該樹脂が2種以上の構成単位を有する共重合体である場合、当該共重合体の形態は、特に限定されず、ブロック共重合体、ランダム共重合体、及びグラフト共重合体のいずれであってもよい。
また、上記アクリルウレタン系樹脂としては、以下の樹脂(U1)が好ましい。
・ウレタンプレポリマー(UP)と、(メタ)アクリル酸エステルを含むビニル化合物とを重合してなるアクリルウレタン系樹脂(U1)。
アクリルウレタン系樹脂(U1)の主鎖となるウレタンプレポリマー(UP)としては、ポリオールと多価イソシアネートとの反応物が挙げられる。
なお、ウレタンプレポリマー(UP)は、更に鎖延長剤を用いた鎖延長反応を施して得られたものであることが好ましい。
これらのポリオールは、単独で用いてもよく、2種以上を併用してもよい。
本実施形態で用いるポリオールとしては、ジオールが好ましく、エステル型ジオール、アルキレン型ジオール及びカーボネート型ジオールがより好ましく、エステル型ジオール、カーボネート型ジオールが更に好ましい。
具体的には、ポリエチレンアジペートジオール、ポリブチレンアジペートジオール、ポリヘキサメチレンアジペートジオール、ポリヘキサメチレンイソフタレートジオール、ポリネオペンチルアジペートジオール、ポリエチレンプロピレンアジペートジオール、ポリエチレンブチレンアジペートジオール、ポリブチレンヘキサメチレンアジペートジオール、ポリジエチレンアジペートジオール、ポリ(ポリテトラメチレンエーテル)アジペートジオール、ポリ(3-メチルペンチレンアジペート)ジオール、ポリエチレンアゼレートジオール、ポリエチレンセバケートジオール、ポリブチレンアゼレートジオール、ポリブチレンセバケートジオール及びポリネオペンチルテレフタレートジオール等が挙げられる。
これらの多価イソシアネートは、単独で用いてもよく、2種以上を併用してもよい。
また、これらの多価イソシアネートは、トリメチロールプロパンアダクト型変性体、水と反応させたビュウレット型変性体、イソシアヌレート環を含有させたイソシアヌレート型変性体であってもよい。
当該直鎖ウレタンプレポリマーの両末端にエチレン性不飽和基を導入する方法としては、ジオールとジイソシアネート化合物とを反応してなる直鎖ウレタンプレポリマーの末端のNCO基と、ヒドロキシアルキル(メタ)アクリレートとを反応させる方法が挙げられる。
(メタ)アクリル酸エステルとしては、アルキル(メタ)アクリレート及びヒドロキシアルキル(メタ)アクリレートから選ばれる1種以上が好ましく、アルキル(メタ)アクリレート及びヒドロキシアルキル(メタ)アクリレートを併用することがより好ましい。
これらは単独で用いてもよく、2種以上を併用してもよい。
当該重合においては、さらにラジカル開始剤を加えて行うことが好ましい。
樹脂組成物(y)に含まれる樹脂として好適な、オレフィン系樹脂としては、オレフィンモノマーに由来の構成単位を少なくとも有する重合体である。
上記オレフィンモノマーとしては、炭素数2~8のα-オレフィンが好ましく、具体的には、エチレン、プロピレン、ブチレン、イソブチレン、1-ヘキセン等が挙げられる。
これらの中でも、エチレン及びプロピレンが好ましい。
上記の不飽和カルボン酸又はその無水物としては、例えば、マレイン酸、フマル酸、イタコン酸、シトラコン酸、グルタコン酸、テトラヒドロフタル酸、アコニット酸、(メタ)アクリル酸、無水マレイン酸、無水イタコン酸、無水グルタコン酸、無水シトラコン酸、無水アコニット酸、ノルボルネンジカルボン酸無水物、テトラヒドロフタル酸無水物等が挙げられる。
なお、不飽和カルボン酸又はその無水物は、単独で用いてもよく、2種以上を併用してもよい。
上記のアルキル(メタ)アクリレートが有するアルキル基の炭素数としては、好ましくは1~20、より好ましくは1~16、更に好ましくは1~12である。
上記のアルキル(メタ)アクリレートとしては、例えば、後述のモノマー(a1’)として選択可能な化合物と同じものが挙げられる。
上記の水酸基含有化合物としては、例えば、2-ヒドロキシエチル(メタ)アクリレート、2-ヒドロキシプロピル(メタ)アクリレート、3-ヒドロキシプロピル(メタ)アクリレート、2-ヒドロキシブチル(メタ)アクリレート、3-ヒドロキシブチル(メタ)アクリレート、4-ヒドロキシブチル(メタ)アクリレート等のヒドロキシアルキル(メタ)アクリレート類;ビニルアルコール、アリルアルコール等の不飽和アルコール類等が挙げられる。
本実施形態において、樹脂組成物(y)には、本発明の効果を損なわない範囲で、アクリルウレタン系樹脂及びオレフィン系樹脂以外の樹脂を含有してもよい。
そのような樹脂としては、例えば、ポリ塩化ビニル、ポリ塩化ビニリデン、ポリビニルアルコール等のビニル系樹脂;ポリエチレンテレフタレート、ポリブチレンテレフタレート、ポリエチレンナフタレート等のポリエステル系樹脂;ポリスチレン;アクリロニトリル-ブタジエン-スチレン共重合体;三酢酸セルロース;ポリカーボネート;アクリルウレタン系樹脂には該当しないポリウレタン;ポリスルホン;ポリエーテルエーテルケトン;ポリエーテルスルホン;ポリフェニレンスルフィド;ポリエーテルイミド、ポリイミド等のポリイミド系樹脂;ポリアミド系樹脂;アクリル樹脂;フッ素系樹脂等が挙げられる。
アクリルウレタン系樹脂及びオレフィン系樹脂以外の樹脂の含有割合としては、樹脂組成物(y)中に含まれる樹脂の全量100質量部に対して、好ましくは30質量部未満、より好ましくは20質量部未満、より好ましくは10質量部未満、更に好ましくは5質量部未満、より更に好ましくは1質量部未満である。
膨張性粒子は、外部刺激によって、それ自体が膨張することで粘着剤層に凹凸を形成し、被着体との接着力を低下させることができるものであれば特に限定されない。
膨張性粒子としては、例えば、加熱によって膨張する熱膨張性粒子、エネルギー線の照射によって膨張するエネルギー線膨張性粒子等が挙げられるが、汎用性及び取り扱い性の観点から、熱膨張性粒子であることが好ましい。
なお、本明細書において、熱膨張性粒子の膨張開始温度(t)は、以下の方法に基づき測定された値を意味する。
[熱膨張性粒子の膨張開始温度(t)の測定法]
直径6.0mm(内径5.65mm)、深さ4.8mmのアルミカップに、測定対象となる熱膨張性粒子0.5mgを加え、その上からアルミ蓋(直径5.6mm、厚さ0.1mm)をのせた試料を作製する。
動的粘弾性測定装置を用いて、その試料にアルミ蓋上部から、加圧子により0.01Nの力を加えた状態で、試料の高さを測定する。そして、加圧子により0.01Nの力を加えた状態で、20℃から300℃まで10℃/minの昇温速度で加熱し、加圧子の垂直方向における変位量を測定し、正方向への変位開始温度を膨張開始温度(t)とする。
マイクロカプセル化発泡剤の外殻を構成する熱可塑性樹脂としては、例えば、塩化ビニリデン-アクリロニトリル共重合体、ポリビニルアルコール、ポリビニルブチラール、ポリメチルメタクリレート、ポリアクリロニトリル、ポリ塩化ビニリデン、ポリスルホン等が挙げられる。
これらの内包成分は、単独で用いてもよく、2種以上を併用してもよい。
熱膨張性粒子の膨張開始温度(t)は、内包成分の種類を適宜選択することで調整可能である。
なお、膨張性粒子の膨張前の平均粒子径とは、体積中位粒子径(D50)であり、レーザ回折式粒度分布測定装置(例えば、Malvern社製、製品名「マスターサイザー3000」)を用いて測定した、膨張前の膨張性粒子の粒子分布において、膨張前の膨張性粒子の粒子径の小さい方から計算した累積体積頻度が50%に相当する粒子径を意味する。
なお、膨張性粒子の膨張前の90%粒子径(D90)とは、レーザ回折式粒度分布測定装置(例えば、Malvern社製、製品名「マスターサイザー3000」)を用いて測定した、膨張前の膨張性粒子の粒子分布において、膨張前の膨張性粒子の粒子径の小さい方から計算した累積体積頻度が90%に相当する粒径を意味する。
本実施形態で用いる樹脂組成物(y)は、本発明の効果を損なわない範囲で、一般的な粘着シートが有する基材に含まれる基材用添加剤を含有してもよい。
そのような基材用添加剤としては、例えば、紫外線吸収剤、光安定剤、酸化防止剤、帯電防止剤、スリップ剤、アンチブロッキング剤、着色剤等が挙げられる。
なお、これらの基材用添加剤は、それぞれ単独で用いてもよく、2種以上を併用してもよい。
これらの基材用添加剤を含有する場合、それぞれの基材用添加剤の含有量は、樹脂組成物(y)中の前記樹脂100質量部に対して、好ましくは0.0001~20質量部、より好ましくは0.001~10質量部である。
本実施形態で用いる樹脂組成物(y)の一態様として、質量平均分子量(Mw)が50000以下のエチレン性不飽和基を有するオリゴマーと、エネルギー線重合性モノマーと、上述の膨張性粒子を配合してなり、溶剤を配合しない、無溶剤型樹脂組成物(y1)が挙げられる。
無溶剤型樹脂組成物(y1)では、溶剤を配合しないが、エネルギー線重合性モノマーが、前記オリゴマーの可塑性の向上に寄与するものである。
無溶剤型樹脂組成物(y1)から形成した塗膜に対して、エネルギー線を照射することで、膨張性基材を得ることができる。
なお、当該オリゴマーとしては、エチレン性不飽和基を有する変性オレフィン系樹脂等も使用し得る。
これらのエネルギー線重合性モノマーは、単独で用いてもよく、2種以上を併用してもよい。
光重合開始剤を含有することで、比較的低エネルギーのエネルギー線の照射によっても、十分に硬化反応を進行させることができる。
これらの光重合開始剤は、単独で用いてもよく、2種以上を併用してもよい。
本実施形態の粘着シートが有する膨張性基材の23℃における貯蔵弾性率E’(23)は、好ましくは1.0×106Pa以上、より好ましくは5.0×106~5.0×1012Pa、更に好ましくは1.0×107~1.0×1012Pa、より更に好ましくは5.0×107~1.0×1011Pa、更になお好ましくは1.0×108~1.0×1010Paである。貯蔵弾性率E’(23)が上記範囲内である膨張性基材を用いることで、半導体チップの位置ズレを防止することができると共に、半導体チップの粘着剤層への沈み込みを防止することもできる。
例えば、半導体チップは、その回路面が、粘着剤層の粘着表面で覆われるように載置される。半導体チップの載置には、フリップチップボンダー、ダイボンダー等の公知の装置が用いられることがある。上記手順のうち、フリップチップボンダー又はダイボンダーを用いて、半導体チップを粘着シートの粘着剤層上に載置する際に、半導体チップを粘着シートの厚み方向に押し込む力が加わるため、半導体チップが粘着剤層の厚み方向側に過度に沈み込む恐れがある。また、フリップチップボンダー又はダイボンダーを用いて、半導体チップを粘着シート上に載置する際に、半導体チップを粘着シートの水平方向に移動させる力も加わるため、半導体チップが粘着剤層の水平方向に位置ズレする恐れもある。しかし、上記貯蔵弾性率E’(23)を満たす膨張性基材を用いることで、これらの問題を解決することもできる。
なお、本明細書において、所定の温度における膨張性基材の貯蔵弾性率E’は、実施例に記載の方法により測定された値を意味する。
・要件(1):100℃における、前記膨張性基材の貯蔵弾性率E’(100)が、2.0×105Pa以上である。
要件(1)を満たす膨張性基材を有することで、FOWLP及びFOPLPの製造過程における封止工程の温度環境においても、膨張性粒子の流動を程よく抑制し得るため、膨張性基材上に設けた粘着剤層の粘着表面が変形し難くなる。その結果、半導体チップの位置ズレを防止することができると共に、半導体チップの粘着剤層への沈み込みを防止することもできる。
また、封止工程において、半導体チップの位置ズレを効果的に抑制する観点から、膨張性基材の貯蔵弾性率E’(100)は、好ましくは1.0×1012Pa以下、より好ましくは1.0×1011Pa以下、更に好ましくは1.0×1010Pa以下、より更に好ましくは1.0×109Pa以下である。
・要件(2):前記熱膨張性粒子の膨張開始温度(t)における、前記膨張性基材の貯蔵弾性率E’(t)が、1.0×107Pa以下である。
要件(2)を満たす膨張性基材を有することで、熱膨張性粒子を膨張させる温度において、膨張性基材が熱膨張性粒子の体積膨張に追随して変形し易くなり、粘着剤層の粘着表面に凹凸を形成し易くなる。これによって、小さい外力によって対象物から剥離することができる。
また、膨張した熱膨張性粒子の流動を抑制し、粘着剤層の粘着表面に形成される凹凸の形状維持性を向上させ、剥離性をより向上させる観点から、膨張性基材の貯蔵弾性率E’(t)は、好ましくは1.0×103Pa以上、より好ましくは1.0×104Pa以上、更に好ましくは1.0×105Pa以上である。
本実施形態の粘着シートが有する粘着剤層は、粘着性樹脂を含むものであればよく、必要に応じて、架橋剤、粘着付与剤、重合性化合物、重合開始剤等の粘着剤用添加剤を含有してもよい。
なお、封止工程での加熱によって、載置した半導体チップが粘着剤層に沈む込むことを防止する観点から、粘着剤層は、非膨張性粘着剤層であることが好ましい。
当該粘着力が0.1N/25mm以上であれば、封止工程における半導体チップの位置ズレを防止し得る程度に、十分に固定することができる。
一方、当該粘着力が10.0N/25mm以下であれば、被着体から剥離する際に、わずかな外力で容易に剥離することができる。
なお、上記の粘着力は、実施例に記載の方法により測定された値を意味する。
複数の粘着剤層を有する粘着シートである場合、半導体チップが貼付される粘着剤層の貯蔵せん断弾性率G’(23)が上記範囲内であることが好ましく、膨張性基材よりも半導体チップが貼付される側の総ての粘着剤層の貯蔵せん断弾性率G’(23)が上記範囲内であることが好ましい。
粘着剤層の貯蔵せん断弾性率G’(23)が1.0×104Pa以上であれば、半導体チップの位置ズレを防止することができると共に、半導体チップの粘着剤層への沈み込みを防止することもできる。
一方、粘着剤層の貯蔵せん断弾性率G’(23)が1.0×108Pa以下であれば、膨張性基材中の膨張性粒子の膨張により、粘着剤層の表面に凹凸が形成され易く、その結果、わずかな力で容易に剥離することができる。
なお、本明細書において、粘着剤層の貯蔵せん断弾性率G’(23)は、実施例に記載の方法により測定された値を意味する。
粘着剤層の厚さは、実施例に記載の方法により測定された値を意味する。
以下、粘着剤層の形成材料である粘着剤組成物に含まれる各成分について説明する。
本実施形態で用いる粘着性樹脂としては、当該樹脂単独で粘着性を有し、質量平均分子量(Mw)が1万以上の重合体であることが好ましい。
本実施形態で用いる粘着性樹脂の質量平均分子量(Mw)としては、粘着力の向上の観点から、より好ましくは1万~200万、更に好ましくは2万~150万、より更に好ましくは3万~100万である。
これらの粘着性樹脂は、単独で用いてもよく、2種以上を併用してもよい。
また、これらの粘着性樹脂が、2種以上の構成単位を有する共重合体である場合、当該共重合体の形態は、特に限定されず、ブロック共重合体、ランダム共重合体、及びグラフト共重合体のいずれであってもよい。
当該重合性官能基としては、(メタ)アクリロイル基、ビニル基等が挙げられる。
また、エネルギー線としては、紫外線、電子線等が挙げられるが、紫外線が好ましい。
なお、本明細書の以下の記載において、「粘着剤組成物の有効成分の全量に対する各成分の含有量」は、「当該粘着剤組成物から形成される粘着剤層中の各成分の含有量」と同義である。
粘着性樹脂中のアクリル系樹脂の含有割合としては、粘着剤組成物に含まれる粘着性樹脂の全量(100質量%)に対して、好ましくは30~100質量%、より好ましくは50~100質量%、更に好ましくは70~100質量%、より更に好ましくは85~100質量%である。
本実施形態において、粘着性樹脂として使用し得る、アクリル系樹脂としては、例えば、直鎖又は分岐鎖のアルキル基を有するアルキル(メタ)アクリレートに由来する構成単位を含む重合体、環状構造を有する(メタ)アクリレートに由来する構成単位を含む重合体等が挙げられる。
なお、モノマー(a1’)が有するアルキル基は、直鎖アルキル基であってもよく、分岐鎖アルキル基であってもよい。
これらのモノマー(a1’)は、単独で用いてもよく、2種以上を併用してもよい。
モノマー(a1’)としては、ブチル(メタ)アクリレート及び2-エチルヘキシル(メタ)アクリレートが好ましい。
つまり、モノマー(a2’)としては、例えば、水酸基含有モノマー、カルボキシ基含有モノマー、アミノ基含有モノマー、エポキシ基含有モノマー等が挙げられる。
これらのモノマー(a2’)は、単独で用いてもよく、2種以上を併用してもよい。
これらの中でも、モノマー(a2’)としては、水酸基含有モノマー及びカルボキシ基含有モノマーが好ましい。
なお、アクリル系共重合体(A1)において、構成単位(a1)及び(a2)の含有量は、アクリル系共重合体(A1)の全構成単位(100質量%)に対して、好ましくは70~100質量%、より好ましくは80~100質量%、更に好ましくは90~100質量%、より更に好ましくは95~100質量%である。
当該重合性官能基及び当該エネルギー線としては、上述のとおりである。
なお、重合性官能基は、上述の構成単位(a1)及び(a2)を有するアクリル系共重合体と、当該アクリル系共重合体の構成単位(a2)が有する官能基と結合可能な置換基と重合性官能基とを有する化合物とを反応させることで導入することができる。
前記化合物としては、例えば、(メタ)アクリロイルオキシエチルイソシアネート、(メタ)アクリロイルイソシアネート、グリシジル(メタ)アクリレート等が挙げられる。
本実施形態において、粘着剤組成物は、上述のアクリル系共重合体(A1)のような官能基を含有する粘着性樹脂を含有する場合、さらに架橋剤を含有することが好ましい。
当該架橋剤は、官能基を有する粘着性樹脂と反応して、当該官能基を架橋起点として、粘着性樹脂同士を架橋するものである。
これらの架橋剤は、単独で用いてもよく、2種以上を併用してもよい。
これらの架橋剤の中でも、凝集力を高めて粘着力を向上させる観点、及び入手し易さ等の観点から、イソシアネート系架橋剤が好ましい。
本実施形態において、粘着剤組成物は、粘着力をより向上させる観点から、さらに粘着付与剤を含有してもよい。
本明細書において、「粘着付与剤」とは、上述の粘着性樹脂の粘着力を補助的に向上させる成分であって、質量平均分子量(Mw)が1万未満のオリゴマーを指し、上述の粘着性樹脂とは区別されるものである。
粘着付与剤の質量平均分子量(Mw)は、好ましくは400~10000、より好ましくは500~8000、更に好ましくは800~5000である。
なお、本明細書において、粘着付与剤の「軟化点」は、JIS K 2531に準拠して測定した値を意味する。
粘着付与剤は、単独で用いてもよく、軟化点、構造等が異なる2種以上を併用してもよい。
そして、2種以上の複数の粘着付与剤を用いる場合、それら複数の粘着付与剤の軟化点の加重平均が、上記範囲に属することが好ましい。
本実施形態において、粘着剤組成物が、粘着性樹脂として、エネルギー線硬化型の粘着性樹脂を含む場合、さらに光重合開始剤を含有することが好ましい。
エネルギー線硬化型の粘着性樹脂及び光重合開始剤を含有する粘着剤組成物とすることで、当該粘着剤組成物から形成される粘着剤層は、比較的低エネルギーのエネルギー線の照射によっても、十分に硬化反応を進行させ、粘着力を所望の範囲に調整することが可能となる。
なお、光重合開始剤としては、上述の無溶剤型樹脂組成物(y1)に配合されるものと同じものが挙げられる。
本実施形態において、粘着剤層の形成材料である粘着剤組成物は、本発明の効果を損なわない範囲で、上述の添加剤以外にも、一般的な粘着剤に使用される粘着剤用添加剤を含有していてもよい。
このような粘着剤用添加剤としては、例えば、酸化防止剤、軟化剤(可塑剤)、防錆剤、顔料、染料、遅延剤、反応促進剤(触媒)、紫外線吸収剤等が挙げられる。
なお、これらの粘着剤用添加剤は、それぞれ単独で用いてもよく、2種以上を併用してもよい。
ただし、上述のとおり、本実施形態の粘着シートが有する粘着剤層は、非膨張性粘着剤層であることが好ましい。そのため、当該粘着剤層の形成材料である粘着剤組成物は、膨張性粒子の含有量が極力少ないほど好ましい。
膨張性粒子の含有量は、粘着剤組成物の有効成分の全量(100質量%)に対して、好ましくは5質量%未満、より好ましくは1質量%未満、更に好ましくは0.1質量%未満、より更に好ましくは0.01質量%未満、特に好ましくは0.001質量%未満である。
図1(B)の粘着シート10aのように、本実施形態の粘着シートは、粘着剤層の粘着表面に、さらに剥離材を有していてもよい。
剥離材としては、両面剥離処理をされた剥離シート、片面剥離処理された剥離シート等が用いられ、剥離材用の基材上に剥離剤を塗布したもの等が挙げられる。
本実施形態に係る粘着シートの製造方法としては、特に制限はなく、下記工程(1a)及び(2a)を有する製造方法(a)が挙げられる。
・工程(1a):剥離材の剥離処理面上に、膨張性基材の形成材料である樹脂組成物(y)を塗布して塗膜を形成し、当該塗膜を乾燥又はUV硬化し、膨張性基材を形成する工程。
・工程(2a):形成した前記膨張性基材の表面上に、粘着剤層の形成材料である粘着剤組成物を塗布して塗膜を形成し、当該塗膜を乾燥し、粘着剤層を形成する工程。
・工程(1b):剥離材の剥離処理面上に、膨張性基材の形成材料である樹脂組成物(y)を塗布して塗膜を形成し、当該塗膜を乾燥又はUV硬化し、膨張性基材を形成する工程。
・工程(2b):剥離材の剥離処理面上に、粘着剤層の形成材料である粘着剤組成物を塗布して塗膜を形成し、当該塗膜を乾燥し、粘着剤層を形成する工程。
・工程(3b):工程(1b)で形成した前記膨張性基材の表面と、工程(2b)で形成した粘着剤層の表面とを貼り合せる工程。
塗布方法としては、例えば、スピンコート法、スプレーコート法、バーコート法、ナイフコート法、ロールコート法、ブレードコート法、ダイコート法、グラビアコート法等が挙げられる。
次に、本実施形態に係る半導体装置の製造方法の各工程について説明をする。
本実施形態に係る半導体装置の製造方法は、前記粘着シートを用いて半導体装置を製造する方法であって、下記工程(1)~(4)を有するものである。
工程(1):粘着剤層の粘着表面に開口部が形成された枠部材を貼付する工程
工程(2):前記枠部材の前記開口部にて露出する前記粘着剤層の粘着表面の一部に半導体チップを載置する工程
工程(3):前記半導体チップと、前記枠部材と、前記粘着剤層の粘着表面のうち、前記半導体チップの周辺部と、を封止材で被覆し、該封止材を硬化させて、前記半導体チップが硬化封止材に封止されてなる硬化封止体を得る工程
工程(4):前記膨張性粒子を膨張させて、前記粘着シートを前記硬化封止体から剥離する工程
以下、図面を参照しながら本実施形態に係る半導体装置の製造方法の各工程を説明する。
図2(A)には、粘着シート10の粘着剤層12の粘着表面12aに開口部21が形成された枠部材20を貼付する工程(1)を説明する断面図が示されている。
なお、粘着シート10が剥離材13を有する場合は、予め剥離材13を剥離する。
枠部材20は、耐熱性を有する材質で形成されていることが好ましい。枠部材20の材質としては、銅、ステンレス、42アロイ等の金属;ポリイミド樹脂、ポリアセタール樹脂、ポリアミド樹脂、ポリカーボネート樹脂、変性ポリフェニレンエーテル樹脂、ポリブチレンテレフタレート樹脂等のエンジニアリングプラスチックと称される樹脂;ガラスエポキシ樹脂等の複合材料等が挙げられる。
枠部材20の厚さtFRは、例えば、100μm~3mmであり、100μm~1mmが好ましく、100~500μmがより好ましい。枠部材20の厚さtFRが100μm以上であれば、比較的広い面積を封止する際にも半導体パッケージの反りを抑制できる。枠部材20の厚さtFRが3mm以下であれば、半導体装置の製造プロセスの生産性低下を防止できる。
開口部21は、枠部材20の表裏面を貫通する孔である。開口部21の形状は、半導体チップCPを枠内に収容可能であれば、特に限定されない。開口部21の孔の深さも、半導体チップCPを収容可能であれば、特に限定されない。なお、本実施形態においては、枠部材20として、複数の開口部21を有するものを用いているが、本発明の目的が達成される場合においては、開口部を1つ有する枠部材を使用してもよい。
枠部材20は、複数の半導体チップCPを、一定の間隔を空けて、複数行かつ複数列のマトリックス状に整列された状態で粘着表面12aに載置できるものであることが好ましい。
図2(B)には、枠部材20の開口部21にて露出する粘着剤層12の粘着表面12aの一部に半導体チップCPを載置する工程(2)を説明する断面図が示されている。
半導体チップCPは、従来公知のものを使用することができる。半導体チップCPは、その回路面W1に、トランジスタ、抵抗、コンデンサー等の回路素子から構成される集積回路が形成されている。
半導体チップCPは、例えば、その回路面W1が、粘着表面12aで覆われるように載置される。半導体チップCPの載置には、フリップチップボンダー、ダイボンダー等の公知の装置を用いることができる。
半導体チップCPの配置のレイアウト、配置数等は、目的とするパッケージの形態、生産数等に応じて適宜決定すればよい。
ここで、本実施形態に係る半導体装置の製造方法は、FOWLP、FOPLP等のように、半導体チップCPをチップサイズよりも大きな領域で封止材で覆って、半導体チップCPの回路面W1だけではなく、封止材の表面領域においても再配線層を形成するパッケージに好適に適用されるものである。そのため、半導体チップCPは、枠部材20の開口部21にて露出する粘着剤層12の粘着表面12aの一部に載置されるものであり、半導体チップCPは、半導体チップCPを囲む枠部材20と、一定の間隔を空けて載置されることがより好ましい。半導体チップCPと枠部材20との間隔は、目的とするパッケージの形態等に応じて適宜決定すればよい。
半導体チップCPが、枠部材20の開口部21にて露出する粘着剤層12の粘着表面12aの一部に載置されることにより、粘着剤層12の粘着表面12aのうち、半導体チップCPの周辺部30が形成される。図2(B)において、半導体チップCPの周辺部30とは、半導体チップCPと枠部材20の間隙に相当する粘着剤層12の粘着表面12aである。
図2(C)及び(D)には、半導体チップCPと、枠部材20と、粘着剤層12の粘着表面12aのうち、半導体チップCPの周辺部30と、を封止材40で被覆し、封止材40を硬化させて、半導体チップCPが硬化封止材41に封止されてなる硬化封止体50を得る工程(3)を説明する断面図が示されている。
なお、以下、半導体チップCPと、枠部材20と、粘着剤層12の粘着表面12aのうち、半導体チップCPの周辺部30と、を封止材40で被覆する工程を「被覆工程」と称する場合があり、該封止材40を硬化させて、半導体チップCPが硬化封止材41に封止されてなる硬化封止体50を得る工程を「硬化工程」と称する場合がある。
封止材40としては特に制限はなく、従来、半導体封止材料として使用されているものの中から、任意のものを適宜選択して用いることができる。
封止材40は、機械的強度、耐熱性、絶縁性等の観点から、硬化性を有するものであり、例えば、熱硬化性樹脂組成物、エネルギー線硬化性樹脂組成物等が挙げられる。
以下、本実施形態においては、封止材40を熱硬化性樹脂組成物であるものとして説明をする。
前記熱硬化性樹脂組成物は、前記熱硬化性樹脂の他にも、必要に応じて、フェノール樹脂系硬化剤、アミン系硬化剤等の硬化剤、硬化促進剤、シリカ等の無機充填材、エラストマー等の添加剤を含有していてもよい。
封止材40は、室温で固形であっても、液状であってもよい。また、室温で固形である封止材40の形態は、特に限定されず、例えば、顆粒状、シート状等であってもよい。
これらの方法においては、通常、封止材40の充填性を高めるために、被覆時に封止材40を加熱して流動性を付与する。
ここで、上記したように、本実施形態に用いられる粘着シート10は、熱、エネルギー線等により膨張する膨張性粒子を含有するものであり、後述する工程(4)において、該膨張性粒子を膨張させることで粘着表面12aと硬化封止体50との粘着力を低下させ、粘着シート10は硬化封止体50から剥離される。したがって、被覆工程及び硬化工程においては、膨張性粒子が膨張しない条件を適宜選択して、封止材40を被覆及び硬化させることが好ましい。
例えば、粘着シート10に含まれる膨張性粒子が熱膨張性粒子である場合、被覆工程及び硬化工程における加熱条件(加熱温度及び加熱時間)は、熱膨張性粒子の膨張に起因する粘着シート10の厚さの増加率が10%以下である加熱条件が好ましく、前記増加率が5%以下である加熱条件がより好ましく、前記増加率が0%である加熱条件(すなわち、熱膨張性粒子が膨張しない加熱条件)がさらに好ましい。なお、粘着シート10の厚さの増加率は、例えば、所定条件での加熱前後の粘着シート10の厚さを、JIS K6783、Z1702、Z1709に準じて、定圧厚さ測定器(株式会社テクロック製、製品名「PG-02」)を用いて測定し、下記式に基づいて計算することができる。
厚さの増加率(%)=(加熱後の厚さ-加熱前の厚さ)×100/加熱前の厚さ
なお、被覆工程と硬化工程は別々に実施してもよいが、被覆工程において封止材40を加熱する場合、当該加熱によって、そのまま封止材40を硬化させてもよい。つまり、その場合、被覆工程と硬化工程とを同時に実施してもよい。
前記被覆工程において熱硬化性樹脂組成物を圧着させる場合、その圧着圧力は、例えば、0.1~2.0MPaであり、0.2~1.8MPaがより好ましく、0.3~1.6MPaがさらに好ましい。
前記被覆工程において減圧させながら熱硬化性樹脂組成物を圧着させる場合、その圧力は、例えば、0.1~5.0MPaであり、0.5~4.0MPaが好ましい。
前記硬化工程において、封止材40を硬化させる温度の具体例は、使用する封止材40の種類、膨張性粒子の種類等によっても異なるが、例えば、80~240℃であり、90~200℃が好ましく、100~170℃がより好ましい。また、加熱時間は、例えば、10~180分間であり、20~150分間が好ましく、30~120分間がより好ましい。
シート状封止材を用いる方法では、シート状封止材を半導体チップCP及びその周辺部30と枠部材20とを覆うように載置することで、半導体チップCP及びその周辺部30と枠部材20とを封止材40によって被覆する。その際、半導体チップCPと枠部材20との間隙に、封止材40が充填されない部分が生じないように、真空ラミネート法等によって、適宜減圧しながら、加熱及び圧着させることが好ましい。減圧、加熱及び圧着条件の好ましい態様は上記の通りである。その後、ラミネートした封止材40を加熱して硬化させる。硬化させる温度の好ましい態様は上記の通りである。
シート状封止材は、ポリエチレンテレフタレート等の樹脂シートに支持された積層シートであってもよい。この場合、シート状封止材が半導体チップCP及びその周辺部30と枠部材20とを覆うように積層シートを載置した後、樹脂シートを封止材から剥離してもよい。
また、シート状封止材を用いる場合、シート状封止材をラミネートした後、熱硬化させる工程の前に、第1加熱プレス工程を実施してもよい。該第1加熱プレス工程においては、封止材40で被覆された半導体チップCP及び粘着シート10を両面から板状部材で挟み込み、所定の温度、時間及び圧力の条件下でプレスする。第1加熱プレス工程を実施することにより、封止材40が半導体チップCPと枠部材20との空隙にも充填され易くなる。また、第1加熱プレス工程を実施することにより、封止材40により構成される封止材層の凹凸を平坦化することもできる。板状部材としては、例えば、ステンレス等の金属板を用いることができる。
なお、後述する工程(4)及び(5)において、硬化封止体50から粘着シート10を剥離した後、露出した表面に再配線層を形成する工程が施される。これらの工程における硬化封止体50の取り扱い性を向上させるため、必要に応じて、硬化封止体50の表出している面(すなわち、膨張性基材とは反対側の面)に、補強部材を貼付してもよい。補強部材としては、特に限定されないが、例えば、ガラスエポキシ樹脂等の耐熱性に優れる補強板が好ましく、補強板を硬化封止体50の表出している面の全面に貼付することが好ましい。補強部材は、例えば、接着層を介して貼付することができる。補強部材はその目的を果たした後に除去されるものであるため、接着層は、必要に応じて固定及び剥離が可能であるものが好ましい。
補強部材の貼付は、例えば、硬化封止体50の表出している面に熱硬化性を有する接着層と補強板とをこの順で積層し、さらに必要に応じて、補強板側及び粘着シート側の両面からそれぞれ板状部材で挟み込み、所定の温度、時間及び圧力の条件下でプレスする第2加熱プレス工程により実施することができる。第2加熱プレス工程においても、板状部材としては、例えば、ステンレス等の金属板を用いることができる。
図2(E)には、膨張性粒子を膨張させて、粘着シート10を硬化封止体50から剥離する工程(4)を説明する断面図が示されている。
具体的には、膨張性粒子を、その種類に応じて、熱、エネルギー線等によって膨張させることにより、粘着剤層12の粘着表面12aに凹凸を形成し、これにより、粘着表面12aと硬化封止体50との粘着力を低下させ、粘着シート10を剥離するものである。
工程4は、基材11の粘着剤層12とは反対側の面11aを固定治具等によって固定した状態で実施することが好ましい。面11aが固定されていることによって、膨張性粒子を膨張させる際に、面11aに側に凹凸が形成されることを抑制し、これにより粘着剤層12の粘着表面12a側に効率的に凹凸を形成することができ、より優れた剥離性が得られる。
図2(E)に示すように、本実施形態では、前記固定治具として、複数の吸引孔91を有する吸引テーブル90を用いて、粘着シート10の面11aを固定している。吸引テーブル90は、例えば真空ポンプ等の減圧機構を有し、該減圧機構によって複数の吸引孔91から対象物を吸引することによって、対象物を吸引面に固定するものである。
硬質支持体の材質は、機械的強度、耐熱性等を考慮して適宜決定すればよく、例えば、SUS等の金属材料;ガラス、シリコンウエア等の非金属無機材料;ポリイミド、ポリアミドイミド等の樹脂材料;ガラスエポキシ樹脂等の複合材料等が挙げられる。硬質支持体の厚さは、機械的強度、取り扱い性等を考慮して適宜決定すればよく、例えば、100μm~50mmである。
硬質支持体の貼付に用いられる粘着剤層(以下、「第2粘着剤層」ともいう)は、特に限定されないが、粘着剤層12の形成に用いた粘着剤組成物を用いて形成することができる。なお、第2粘着剤層は、予め基材11の面11a側に設けておいてもよい。なお、その場合、第2粘着剤層の粘着表面にはさらに剥離材を有していてもよい。すなわち、粘着シート10は、粘着剤層12/基材11/第2粘着剤層という構成を有していてもよく、剥離材/粘着剤層12/基材11/第2粘着剤層/剥離材という構成を有していてもよい。
膨張性粒子が熱膨張性粒子である場合は、膨張開始温度(t)以上の温度に加熱すればよい。ここで、「膨張開始温度(t)以上の温度」としては、「膨張開始温度(t)+10℃」以上「膨張開始温度(t)+60℃」以下であることが好ましく、「膨張開始温度(t)+15℃」以上「膨張開始温度(t)+40℃」以下であることがより好ましい。具体的には、その熱膨張性粒子の種類に応じて、例えば、120~250℃の範囲に加熱して膨張させればよい。
本実施形態に係る製造方法は、両面粘着シート10を剥離した硬化封止体50に再配線層を形成する工程(5)を含むことが好ましい。
図3(A)には、粘着シート10を剥離した後の硬化封止体50の断面図が示されている。
本工程においては、露出した複数の半導体チップCPの回路W2と接続する再配線を、回路面W1の上及び半導体チップCPの領域外に相当する硬化封止体50の面50aの上に形成する。
絶縁性樹脂を含む第1絶縁層61を、回路面W1及び面50aの上に、半導体チップCPの回路W2又は回路W2の内部端子電極W3を露出させるように形成する。絶縁性樹脂としては、ポリイミド樹脂、ポリベンゾオキサゾール樹脂、シリコーン樹脂等が挙げられる。内部端子電極W3の材質は、導電性材料であれば限定されず、金、銀、銅、アルミニウム等の金属、これらの金属を含む合金等が挙げられる。
本実施形態では、第1絶縁層61の形成に続いて再配線70を形成する。再配線70の材質は、導電性材料であれば限定されず、金、銀、銅、アルミニウム等の金属、これらの金属を含む合金等が挙げられる。再配線70は、サブトラクティブ法、セミアディティブ法等の公知の方法により形成できる。
再配線70は、外部端子電極用の外部電極パッド70Aを有する。第2絶縁層62には開口等を設けて、外部端子電極用の外部電極パッド70Aを露出させる。本実施形態では、外部電極パッド70Aは、硬化封止体50の半導体チップCPの領域(回路面W1に対応する領域)内及び領域外(硬化封止体50上の面50aに対応する領域)に露出させている。また、再配線70は、外部電極パッド70Aがアレイ状に配置されるように、硬化封止体50の面50aに形成されている。本実施形態では、硬化封止体50の半導体チップCPの領域外に外部電極パッド70Aを露出させる構造を有するので、FOWLP又はFOPLPを得ることができる。
図4(B)には、外部電極パッド70Aに外部端子電極80を接続させる工程を説明する断面図が示されている。
第2絶縁層62から露出する外部電極パッド70Aに、はんだボール等の外部端子電極80を載置し、はんだ接合などにより、外部端子電極80と外部電極パッド70Aとを電気的に接続させる。はんだボールの材質は、特に限定されず、含鉛はんだ、無鉛はんだ等が挙げられる。
図4(C)には、外部端子電極80が接続された硬化封止体50を個片化させる工程を説明する断面図が示されている。
本工程では、硬化封止体50を半導体チップCP単位で個片化する。硬化封止体50を個片化させる方法は、特に限定されず、ダイシングソー等の切断手段等によって実施することができる。
硬化封止体50を個片化することで、半導体チップCP単位の半導体装置100が製造される。上述のように半導体チップCPの領域外にファンアウトさせた外部電極パッド70Aに外部端子電極80を接続させた半導体装置100は、FOWLP、FOPLP等として製造される。
本実施形態では、個片化された半導体装置100を、プリント配線基板等に実装する工程を含むことも好ましい。
ゲル浸透クロマトグラフ装置(東ソー株式会社製、製品名「HLC-8020」)を用いて、下記の条件下で測定し、標準ポリスチレン換算にて測定した値を用いた。
(測定条件)
・カラム:「TSK guard column HXL-L」「TSK gel G2500HXL」「TSK gel G2000HXL」「TSK gel G1000HXL」(いずれも東ソー株式会社製)を順次連結したもの
・カラム温度:40℃
・展開溶媒:テトラヒドロフラン
・流速:1.0mL/min
株式会社テクロック製の定圧厚さ測定器(型番:「PG-02J」、標準規格:JIS K6783、Z1702、Z1709に準拠)を用いて測定した。
レーザ回折式粒度分布測定装置(例えば、Malvern社製、製品名「マスターサイザー3000」)を用いて、23℃における膨張前の熱膨張性粒子の粒子分布を測定した。
そして、粒子分布の粒子径の小さい方から計算した累積体積頻度が50%及び90%に相当する粒子径を、それぞれ「熱膨張性粒子の平均粒子径(D50)」及び「熱膨張性粒子の90%粒子径(D90)とした。
測定対象が非粘着性の膨張性基材である場合、当該膨張性基材を縦5mm×横30mm×厚さ200μmの大きさとし、剥離材を除去したものを試験サンプルとした。
動的粘弾性測定装置(TAインスツルメント社製、製品名「DMAQ800」)を用いて、試験開始温度0℃、試験終了温度300℃、昇温速度3℃/分、振動数1Hz、振幅20μmの条件で、所定の温度における、当該試験サンプルの貯蔵弾性率E’を測定した。
測定対象が粘着性を有する膨張性粘着剤層及び粘着剤層である場合、当該膨張性粘着剤層及び粘着剤層を直径8mm×厚さ3mmとし、剥離材を除去したものを試験サンプルとした。
粘弾性測定装置(Anton Paar社製、装置名「MCR300」)を用いて、試験開始温度0℃、試験終了温度300℃、昇温速度3℃/分、振動数1Hzの条件で、ねじりせん断法によって、所定の温度における、試験サンプルの貯蔵せん断弾性率G’を測定した。
そして、貯蔵弾性率E’の値は、測定した貯蔵せん断弾性率G’の値を基に、近似式「E’=3G’」から算出した。
測定対象となる膨張性基材又は膨張性粘着剤層を一辺10mmの正方形に切断した後、23℃、50%RH(相対湿度)の環境下で24時間静置し、軽剥離フィルムを除去したものを試験サンプルとした。
前記試験サンプルを、23℃、50%RH(相対湿度)の環境下で、タッキング試験機(日本特殊測器株式会社製、製品名「NTS-4800」)を用いて、軽剥離フィルムを除去して表出した、前記試験サンプルの表面におけるプローブタック値を、JIS Z0237:1991に準拠して測定した。
具体的には、直径5mmのステンレス鋼製のプローブを、1秒間、接触荷重0.98N/cm2で試験サンプルの表面に接触させた後、当該プローブを10mm/秒の速度で、試験サンプルの表面から離すのに必要な力を測定した。そして、その測定した値を、その試験サンプルのプローブタック値とした。
<粘着性樹脂>
・アクリル系共重合体(i):2-エチルヘキシルアクリレート(2EHA)/2-ヒドロキシエチルアクリレート(HEA)=80.0/20.0(質量比)からなる原料モノマーに由来の構成単位を有する、質量平均分子量(Mw)60万のアクリル系共重合体を含む溶液。希釈溶媒:酢酸エチル、固形分濃度:40質量%。
・アクリル系共重合体(ii):n-ブチルアクリレート(BA)/メチルメタクリレート(MMA)/2-ヒドロキシエチルアクリレート(HEA)/アクリル酸=86.0/8.0/5.0/1.0(質量比)からなる原料モノマーに由来の構成単位を有する、質量平均分子量(Mw)60万のアクリル系共重合体を含む溶液。希釈溶媒:酢酸エチル、固形分濃度:40質量%。
<添加剤>
・イソシアネート架橋剤(i):東ソー株式会社製、製品名「コロネートL」、固形分濃度:75質量%。
・光重合開始剤(i):BASF社製、製品名「イルガキュア184」、1-ヒドロキシ-シクロヘキシル-フェニル-ケトン。
<熱膨張性粒子>
・熱膨張性粒子(i):株式会社クレハ製、製品名「S2640」、膨張開始温度(t)=208℃、平均粒子径(D50)=24μm、90%粒子径(D90)=49μm。
<剥離材>
・重剥離フィルム:リンテック株式会社製、製品名「SP-PET382150」、ポリエチレンテレフタレート(PET)フィルムの片面に、シリコーン系剥離剤から形成した剥離剤層を設けたもの、厚さ:38μm。
・軽剥離フィルム:リンテック株式会社製、製品名「SP-PET381031」、PETフィルムの片面に、シリコーン系剥離剤から形成した剥離剤層を設けたもの、厚さ:38μm。
粘着性樹脂である、上記アクリル系共重合体(i)の固形分100質量部に、上記イソシアネート系架橋剤(i)5.0質量部(固形分比)を配合し、トルエンで希釈し、均一に撹拌して、固形分濃度(有効成分濃度)25質量%の組成物(x-1)を調製した。
そして、上記重剥離フィルムの剥離剤層の表面上に、調製した組成物(x-1)を塗布して塗膜を形成し、当該塗膜を100℃で60秒間乾燥して、厚さ10μmの粘着剤層(X)を形成した。
なお、23℃における、粘着剤層(X)の貯蔵せん断弾性率G’(23)は、2.5×105Paであった。
(1)組成物(y-1)の調製
エステル型ジオールと、イソホロンジイソシアネート(IPDI)を反応させて得られた末端イソシアネートウレタンプレポリマーに、2-ヒドロキシエチルアクリレートを反応させて、質量平均分子量(Mw)5000の2官能のアクリルウレタン系オリゴマーを得た。
そして、上記で合成したアクリルウレタン系オリゴマー40質量%(固形分比)に、エネルギー線重合性モノマーとして、イソボルニルアクリレート(IBXA)40質量%(固形分比)、及びフェニルヒドロキシプロピルアクリレート(HPPA)20質量%(固形分比)を配合し、アクリルウレタン系オリゴマー及びエネルギー線重合性モノマーの全量100質量部に対して、さらに光重合開始剤として、1-ヒドロキシシクロヘキシルフェニルケトン(BASF社製、製品名「イルガキュア184」)2.0質量部(固形分比)、及び、添加剤として、フタロシアニン系顔料0.2質量部(固形分比)を配合し、エネルギー線硬化性組成物を調製した。
そして、当該エネルギー線硬化性組成物に、上記熱膨張性粒子(i)を配合し、溶媒を含有しない、無溶剤型の組成物(y-1)を調製した。
なお、組成物(y-1)の全量(100質量%)に対する、熱膨張性粒子(i)の含有量は20質量%であった。
上記軽剥離フィルムの剥離剤層の表面上に、調製した組成物(y-1)を塗布して塗膜を形成した。
そして、紫外線照射装置(アイグラフィクス社製、製品名「ECS-401GX」)及び高圧水銀ランプ(アイグラフィクス社製、製品名「H04-L41」)を用いて、照度160mW/cm2、光量500mJ/cm2の条件で紫外線を照射し、当該塗膜を硬化させ、厚さ50μmの膨張性基材(Y-1)を形成した。なお、紫外線照射時の上記の照度及び光量は、照度・光量計(EIT社製、製品名「UV Power Puck II」)を用いて測定した値である。
(1)ウレタンプレポリマーの合成
窒素雰囲気下の反応容器内に、質量平均分子量(Mw)1,000のカーボネート型ジオール100質量部(固形分比)に対して、イソホロンジイソシアネートを、カーボネート型ジオールの水酸基とイソホロンジイソシアネート(IPDI)のイソシアネート基との当量比が1/1となるように配合し、さらにトルエン160質量部を加え、窒素雰囲気下にて、撹拌しながら、イソシアネート基濃度が理論量に到達するまで、80℃で6時間以上反応させた。
次いで、2-ヒドロキシエチルメタクリレート(2-HEMA)1.44質量部(固形分比)をトルエン30質量部に希釈した溶液を添加して、両末端のイソシアネート基が消滅するまで、更に80℃で6時間反応させ、質量平均分子量(Mw)2.9万のウレタンプレポリマーを得た。
窒素雰囲気下の反応容器内に、上記(1)で得たウレタンプレポリマー100質量部(固形分比)、メチルメタクリレート(MMA)117質量部(固形分比)、2-ヒドロキシエチルメタクリレート(2-HEMA)5.1質量部(固形分比)、1-チオグリセロール1.1質量部(固形分比)、及びトルエン50質量部を加え、撹拌しながら、105℃まで昇温した。
そして、反応容器内に、さらにラジカル開始剤(株式会社日本ファインケム製、製品名「ABN-E」)2.2質量部(固形分比)をトルエン210質量部で希釈した溶液を、105℃に維持したまま4時間かけて滴下した。
滴下終了後、105℃で6時間反応させ、質量平均分子量(Mw)10.5万のアクリルウレタン系樹脂の溶液を得た。
上記(2)で得たアクリルウレタン系樹脂の溶液の固形分100質量部に対して、上記イソシアネート系架橋剤(i)6.3質量部(固形分比)、触媒としてジオクチルスズビス(2-エチルヘキサノエート)1.4質量部(固形分比)、及び上記熱膨張性粒子(i)を配合し、トルエンで希釈し、均一に撹拌して、固形分濃度(有効成分濃度)30質量%の組成物(y-2)を調製した。
なお、得られた組成物(y-2)中の有効成分の全量(100質量%)に対する、熱膨張性粒子(i)の含有量は20質量%であった。
そして、上記軽剥離フィルムの剥離剤層の表面上に、調製した組成物(y-2)を塗布して塗膜を形成し、当該塗膜を100℃で120秒間乾燥して、厚さ50μmの膨張性基材(Y-2)を形成した。
粘着性樹脂である、上記アクリル系共重合体(ii)の固形分100質量部に、上記イソシアネート系架橋剤(i)6.3質量部(固形分比)、及び、上記熱膨張性粒子(i)を配合し、トルエンで希釈し、均一に撹拌して、固形分濃度(有効成分濃度)30質量%の組成物(y-3)を調製した。
なお、得られた組成物(y-3)中の有効成分の全量(100質量%)に対する、熱膨張性粒子(i)の含有量は20質量%であった。
そして、上記軽剥離フィルムの剥離剤層の表面上に、調製した組成物(y-3)を塗布して塗膜を形成し、当該塗膜を100℃で120秒間乾燥して、厚さ50μmの膨張性粘着剤層(Y-3)を形成した。
製造例1で形成した粘着剤層(X)と、製造例2で形成した膨張性基材(Y-1)との表面同士を貼り合わせて、軽剥離フィルム/膨張性基材(Y-1)/粘着剤層(X)/重剥離フィルムをこの順で積層した粘着シート(1)を作製した。
膨張性基材(Y-1)を、製造例3で形成した膨張性基材(Y-2)に置き換えた以外は、実施例1と同様にして、軽剥離フィルム/膨張性基材(Y-2)/粘着剤層(X)/重剥離フィルムをこの順で積層した粘着シート(2)を作製した。
膨張性基材(Y-1)を、製造例4で形成した膨張性粘着剤層(Y-3)に置き換えた以外は、実施例1と同様にして、軽剥離フィルム/膨張性粘着剤層(Y-3)/粘着剤層(X)/重剥離フィルムをこの順で積層した粘着シート(3)を作製した。
製造例4で形成した、軽剥離フィルム/膨張性粘着剤層(Y-3)を、そのまま粘着シート(4)として用いた。
粘着シート(1)~(3)から重剥離フィルムを剥離して、粘着剤層(X)を表出させた。次に、粘着シート(1)~(3)の粘着剤層(X)及び粘着シート(4)の膨張性粘着剤層(Y-3)の粘着表面上に、10mm×10mmの開口部を所定の数有する銅製の枠部材を貼付した。
次いで、粘着シート(1)~(4)から軽剥離フィルムを除去し、表出した膨張性基材又は膨張性粘着剤層を、図2(E)に示すような複数の吸引孔を有する吸引テーブルの吸引面に固定した。
次に、前記複数の開口部にて露出する粘着表面に、半導体チップ(チップサイズ6.4mm×6.4mm、チップ厚み200μm(♯2000))を9個、当該粘着表面と半導体チップの回路面とが接するように、枠部材と必要な間隔をあけて、載置した。
その後、封止用樹脂フィルム(封止材)を、粘着表面、枠部材及び半導体チップの上に積層し、真空加熱加圧ラミネーター(ROHM and HAAS社製の「7024HP5」)を用いて、粘着表面、枠部材及び半導体チップを封止材で被覆すると共に、封止材を硬化させて硬化封止体を作製した。なお、封止条件は、下記の通りである。
・予熱温度:テーブル及びダイアフラムとも100℃
・真空引き:60秒間
・ダイナミックプレスモード:30秒間
・スタティックプレスモード:10秒間
・封止温度:180℃(熱膨張性粒子の膨張開始温度である208℃よりも低い温度)
・封止時間:60分間
・A:封止前より25μm以上の位置ズレが生じた半導体チップは確認されなかった。
・F:封止前より25μm以上の位置ズレが生じた半導体チップが確認された。
粘着シート(1)~(4)を用いて、上述の「封止工程時の半導体チップの位置ズレ評価」と同様の手順で、硬化封止体を作製し、粘着シートから分離した。
作製した硬化封止体のそれぞれの半導体チップ側の表面(再配線層形成面)を、接触式表面粗さ計(ミツトヨ社製「SV3000」)を用いて段差を測定し、以下の基準により評価した。
・A:2μm以上の段差が生じている箇所は確認されなかった。
・F:2μm以上の段差が生じている箇所が確認された。
粘着シート(1)~(3)の重剥離フィルムも除去したものと、粘着シート(4)とを準備し、それぞれ、粘着剤層(X)又は膨張性粘着剤層(Y-3)を、被着体であるステンレス板(SUS304 360番研磨)に貼付し、23℃、50%RH(相対湿度)の環境下で、24時間静置したものを試験サンプルとした。
そして、上記の試験サンプルを用いて、23℃、50%RH(相対湿度)の環境下で、JIS Z0237:2000に基づき、180°引き剥がし法により、引っ張り速度300mm/分にて、23℃における粘着力を測定した。
また、上記の試験サンプルを、ホットプレート上にて、熱膨張性粒子の膨張開始温度(208℃)以上となる240℃で3分間加熱し、標準環境(23℃、50%RH(相対湿度))にて60分間静置した後、JIS Z0237:2000に基づき、180°引き剥がし法により、引っ張り速度300mm/分にて、膨張開始温度以上での加熱後の粘着力も測定した。
なお、被着体であるステンレス鋼板に貼付することができないほどに粘着力の測定が困難である場合には、「測定不能」とし、その粘着力は0(N/25mm)であるとした。
また、粘着シート(1)及び(2)は、加熱前は良好な粘着力を有するものの、膨張開始温度以上での加熱後は測定不能となる程度まで粘着力が低下していることから、剥離時には、わずかな力で容易に剥離可能であることが裏付けられる結果となった。
11 基材
11a 面
12 粘着剤層
12a 粘着表面
13 剥離材
20 枠部材
21 開口部
30 粘着剤層の粘着表面のうち、半導体チップの周辺部
40 封止材
41 硬化封止材
50 硬化封止体
50a 面
61 第1絶縁層
62 第2絶縁層
70 再配線
70A 外部電極パッド
80 外部端子電極
90 吸引テーブル
91 吸引孔
100 半導体装置
CP 半導体チップ
W1 回路面
W2 回路
W3 内部端子電極
Claims (11)
- 粘着剤層と、膨張性粒子を含み、非粘着性である基材と、を有する粘着シートを用いて半導体装置を製造する方法であって、
下記工程(1)~(4)を有する、半導体装置の製造方法。
工程(1):粘着剤層の粘着表面に開口部が形成された枠部材を貼付する工程
工程(2):前記枠部材の前記開口部にて露出する前記粘着剤層の粘着表面の一部に半導体チップを載置する工程
工程(3):前記半導体チップと、前記枠部材と、前記粘着剤層の粘着表面のうち、前記半導体チップの周辺部と、を封止材で被覆し、該封止材を硬化させて、前記半導体チップが硬化封止材に封止されてなる硬化封止体を得る工程
工程(4):前記膨張性粒子を膨張させて、前記粘着シートを前記硬化封止体から剥離する工程 - さらに、下記工程(5)を有する、請求項1に記載の半導体装置の製造方法。
工程(5):前記粘着シートを剥離した硬化封止体に、再配線層を形成する工程 - 前記膨張性粒子が、熱膨張性粒子であり、前記工程(4)が、前記粘着シートを加熱することにより、前記熱膨張性粒子を膨張させて、前記粘着シートを前記硬化封止体から剥離する工程である、請求項1又は2に記載の半導体装置の製造方法。
- 前記熱膨張性粒子の膨張開始温度(t)が、120~250℃である、請求項3に記載の半導体装置の製造方法。
- 前記基材が、下記要件(1)~(2)を満たす、請求項4に記載の半導体装置の製造方法。
・要件(1):100℃における、前記基材の貯蔵弾性率E’(100)が、2.0×105Pa以上である。
・要件(2):前記熱膨張性粒子の膨張開始温度(t)における、前記基材の貯蔵弾性率E’(t)が、1.0×107Pa以下である。 - 前記膨張性粒子の23℃における膨張前の平均粒子径が、3~100μmである、請求項1~5のいずれか1項に記載の粘着シート。
- 23℃における、前記粘着材層の貯蔵せん断弾性率G’(23)が、1.0×104~1.0×108Paである、請求項1~6のいずれか1項に記載の半導体装置の製造方法。
- 23℃における、前記基材の厚さと、前記粘着剤層の厚さとの比(基材/粘着剤層)が0.2以上である、請求項1~7のいずれか1項に記載の半導体装置の製造方法。
- 23℃における、前記基材の厚さが10~1000μmであり、前記粘着剤層の厚さが1~60μmである、請求項1~8のいずれか1項に記載の半導体装置の製造方法。
- 前記基材の表面におけるプローブタック値が、50mN/5mmφ未満である、請求項1~9のいずれか1項に記載の半導体装置の製造方法。
- 請求項1~10のいずれか1項に記載の半導体装置の製造方法に用いられる粘着シートであって、粘着剤層と、膨張性粒子を含み、非粘着性である基材と、を有する粘着シート。
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