JP7402255B2 - 高温用途のための着脱可能なバイアス可能な静電チャック - Google Patents
高温用途のための着脱可能なバイアス可能な静電チャック Download PDFInfo
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- 239000000919 ceramic Substances 0.000 claims description 88
- 239000000758 substrate Substances 0.000 claims description 64
- 238000000034 method Methods 0.000 claims description 18
- 238000012545 processing Methods 0.000 claims description 16
- 238000001816 cooling Methods 0.000 claims description 15
- 238000007667 floating Methods 0.000 claims description 12
- 239000002826 coolant Substances 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 6
- 230000008878 coupling Effects 0.000 claims description 3
- 238000010168 coupling process Methods 0.000 claims description 3
- 238000005859 coupling reaction Methods 0.000 claims description 3
- 239000007789 gas Substances 0.000 description 19
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- 229910018487 Ni—Cr Inorganic materials 0.000 description 3
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 229910001092 metal group alloy Inorganic materials 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 238000001311 chemical methods and process Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000013529 heat transfer fluid Substances 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000010297 mechanical methods and process Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 230000003449 preventive effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
- H01J37/32724—Temperature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/002—Cooling arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/334—Etching
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Drying Of Semiconductors (AREA)
Description
Claims (19)
- ベースプレートアセンブリを有する下部アセンブリであって、前記ベースプレートアセンブリが、中央突起部の周りに配置された複数の電気フィードスルーを含む、下部アセンブリと、
前記下部アセンブリ上に配置され、前記ベースプレートアセンブリに取り外し可能に結合されたセラミックパックであって、前記複数の電気フィードスルーのうちの第1の対の電気フィードスルーに電気的に結合された電極が内部に配置された、セラミックパックと、
前記セラミックパックと前記ベースプレートアセンブリの熱膨張の差を許容するように前記セラミックパックと前記複数の電気フィードスルーのそれぞれとの間に配置される螺旋部分を有する可撓性コネクタと、
を備え、
前記セラミックパックが、締め具を介して前記下部アセンブリに結合され、前記締め具のそれぞれが前記セラミックパックの熱膨張を許容するように前記ベースプレートアセンブリ内のフローティングナットに結合されている、基板処理チャンバで使用するための基板支持体。 - 前記締め具のそれぞれが前記ベースプレートアセンブリの前記中央突起部から半径方向外向きに延在するタブ内の開口部を貫いて配置されている、請求項1に記載の基板支持体。
- 前記可撓性コネクタが、前記セラミックパックの下面から延在する端子を受け入れるための開口部を第1の端部に含み、前記複数の電気フィードスルーのうちの1つの導電性コアを受け入れるための開口部を第2の端部に含む、請求項1に記載の基板支持体。
- 前記可撓性コネクタが環状溝を含み、傾斜ばねが前記環状溝と前記端子との間に配置されている、請求項3に記載の基板支持体。
- 前記セラミックパックが前記セラミックパックの下面から延在するインターフェースリングを有し、前記インターフェースリングが、前記ベースプレートアセンブリの前記中央突起部内の開口部に流体結合された、ガスを流すように構成された中央貫通孔を含む、請求項1~4のいずれか1項に記載の基板支持体。
- アイソレータリングが、前記中央突起部の周りに配置され、前記複数の電気フィードスルーのうちの隣接する電気フィードスルー間のアーク放電を防止するために前記複数の電気フィードスルー用の開口部を含む、請求項1~4のいずれか1項に記載の基板支持体。
- 熱電対が、前記ベースプレートアセンブリの前記中央突起部を貫いて配置され、前記セラミックパック内に延在している、請求項1~4のいずれか1項に記載の基板支持体。
- 前記セラミックパックが、その内部に埋め込まれた1つまたは複数の加熱要素を含み、前記1つまたは複数の加熱要素が前記複数の電気フィードスルーに電気的に結合されている、請求項1~4のいずれか1項に記載の基板支持体。
- 前記複数の電気フィードスルーが前記セラミックパックに埋め込まれた第1の抵抗加熱器に結合された第2の対の電気フィードスルーを含み、前記セラミックパックがそれぞれのフローティングナットに結合された締め具を介して前記ベースプレートアセンブリに取り外し可能に結合され、前記セラミックパックが基板を受け取るための第1の側面と、前記第1の側面とは反対側の第2の側面であって、前記第2の側面から延在するインターフェースリングを有する、第2の側面とを有し、結合されると、前記ベースプレートアセンブリと前記セラミックパックが、前記中央突起部と前記インターフェースリングとの間のインターフェースにおいてのみ互いに接触する、請求項1に記載の基板支持体。
- 前記セラミックパックに埋め込まれ、第3の対の電気フィードスルーに電気的に結合された第2の抵抗加熱器をさらに備える、請求項9に記載の基板支持体。
- 前記締め具のそれぞれが、前記中央突起部から延在する上部タブの開口部を貫いて、前記中央突起部から延在する下部タブの開口部内に配置され、各フローティングナットが、前記下部タブの前記開口部に部分的に配置されている、請求項9に記載の基板支持体。
- 前記複数の電気フィードスルーの各電気フィードスルーがセラミックスリーブによって取り囲まれた導電性コアを含む、請求項9に記載の基板支持体。
- 可撓性コネクタが前記セラミックパックと各電気フィードスルーとの間に配置されて、電気的結合を維持しながら前記セラミックパックの熱膨張を可能にする、請求項9~12のいずれか1項に記載の基板支持体。
- チャンバ本体の内部容積内に配置された請求項1~4のいずれか1項に記載の基板支持体を有するチャンバ本体であって、前記基板支持体が、
冷却剤を循環させるように構成された冷却プレートであり、前記ベースプレートアセンブリが前記冷却プレート上に配置され、前記ベースプレートアセンブリが第2の対の電気フィードスルーを含み、前記第2の対の電気フィードスルーが前記セラミックパックに埋め込まれたヒータに電気的に結合されている、冷却プレート、をさらに備える、
チャンバ本体
を備える、プロセスチャンバ。 - 前記可撓性コネクタが環状溝を含み、前記環状溝と前記端子との間に傾斜ばねが配置されている、請求項3に記載のプロセスチャンバ。
- 前記複数の電気フィードスルーが7つの電気フィードスルーを含む、請求項14に記載のプロセスチャンバ。
- ばね部材を有する熱電対が、前記ベースプレートアセンブリの前記中央突起部を貫いて配置され、前記セラミックパック内に延在している、請求項14に記載のプロセスチャンバ。
- 前記セラミックパックの中央貫通孔および前記ベースプレートアセンブリの中央開口部を介して前記セラミックパックの第1の側面に流体結合された裏側ガス供給部をさらに備える、請求項14に記載のプロセスチャンバ。
- 前記ベースプレートアセンブリが中央プレートおよび外側リップを含み、前記冷却プレートが前記中央プレートと前記外側リップとの間に配置されている、請求項14に記載のプロセスチャンバ。
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US201962868246P | 2019-06-28 | 2019-06-28 | |
US62/868,246 | 2019-06-28 | ||
US16/899,750 US11887878B2 (en) | 2019-06-28 | 2020-06-12 | Detachable biasable electrostatic chuck for high temperature applications |
US16/899,750 | 2020-06-12 | ||
PCT/US2020/038538 WO2020263690A1 (en) | 2019-06-28 | 2020-06-18 | Detachable biasable electrostatic chuck for high temperature applications |
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JP2022539392A JP2022539392A (ja) | 2022-09-08 |
JP7402255B2 true JP7402255B2 (ja) | 2023-12-20 |
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US (1) | US11887878B2 (ja) |
JP (1) | JP7402255B2 (ja) |
KR (1) | KR20220025870A (ja) |
CN (1) | CN114080669A (ja) |
TW (1) | TW202129830A (ja) |
WO (1) | WO2020263690A1 (ja) |
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KR20240006671A (ko) * | 2021-05-14 | 2024-01-15 | 어플라이드 머티어리얼스, 인코포레이티드 | 빠른 열 배출 능력을 갖는 고온 서셉터 |
JP2023018347A (ja) * | 2021-07-27 | 2023-02-08 | キオクシア株式会社 | 基板支持装置および基板処理装置 |
US12014906B2 (en) | 2021-11-19 | 2024-06-18 | Applied Materials, Inc. | High temperature detachable very high frequency (VHF) electrostatic chuck (ESC) for PVD chamber |
WO2024100752A1 (ja) | 2022-11-08 | 2024-05-16 | 日本碍子株式会社 | 半導体製造装置用部材 |
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- 2020-06-18 CN CN202080046275.2A patent/CN114080669A/zh active Pending
- 2020-06-18 WO PCT/US2020/038538 patent/WO2020263690A1/en active Application Filing
- 2020-06-18 JP JP2021577999A patent/JP7402255B2/ja active Active
- 2020-06-18 KR KR1020227003011A patent/KR20220025870A/ko active IP Right Grant
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US20200411354A1 (en) | 2020-12-31 |
KR20220025870A (ko) | 2022-03-03 |
US11887878B2 (en) | 2024-01-30 |
WO2020263690A1 (en) | 2020-12-30 |
JP2022539392A (ja) | 2022-09-08 |
TW202129830A (zh) | 2021-08-01 |
CN114080669A (zh) | 2022-02-22 |
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