JP7399149B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP7399149B2
JP7399149B2 JP2021179698A JP2021179698A JP7399149B2 JP 7399149 B2 JP7399149 B2 JP 7399149B2 JP 2021179698 A JP2021179698 A JP 2021179698A JP 2021179698 A JP2021179698 A JP 2021179698A JP 7399149 B2 JP7399149 B2 JP 7399149B2
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Japan
Prior art keywords
semiconductor chip
semiconductor
chip
semiconductor device
wiring
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JP2021179698A
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English (en)
Japanese (ja)
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JP2023068518A (ja
JP2023068518A5 (https=
Inventor
敬史 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aoi Electronics Co Ltd
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Aoi Electronics Co Ltd
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Application filed by Aoi Electronics Co Ltd filed Critical Aoi Electronics Co Ltd
Priority to JP2021179698A priority Critical patent/JP7399149B2/ja
Priority to PCT/JP2022/033288 priority patent/WO2023079825A1/ja
Priority to DE112022004701.1T priority patent/DE112022004701T5/de
Priority to CN202280073505.3A priority patent/CN118216001A/zh
Publication of JP2023068518A publication Critical patent/JP2023068518A/ja
Publication of JP2023068518A5 publication Critical patent/JP2023068518A5/ja
Priority to JP2023205532A priority patent/JP2024015502A/ja
Application granted granted Critical
Publication of JP7399149B2 publication Critical patent/JP7399149B2/ja
Priority to JP2025068116A priority patent/JP2025106571A/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

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  • Semiconductor Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2021179698A 2021-11-02 2021-11-02 半導体装置 Active JP7399149B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2021179698A JP7399149B2 (ja) 2021-11-02 2021-11-02 半導体装置
PCT/JP2022/033288 WO2023079825A1 (ja) 2021-11-02 2022-09-05 半導体装置
DE112022004701.1T DE112022004701T5 (de) 2021-11-02 2022-09-05 Halbleitervorrichtung
CN202280073505.3A CN118216001A (zh) 2021-11-02 2022-09-05 半导体装置
JP2023205532A JP2024015502A (ja) 2021-11-02 2023-12-05 半導体装置
JP2025068116A JP2025106571A (ja) 2021-11-02 2025-04-17 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021179698A JP7399149B2 (ja) 2021-11-02 2021-11-02 半導体装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2023205532A Division JP2024015502A (ja) 2021-11-02 2023-12-05 半導体装置

Publications (3)

Publication Number Publication Date
JP2023068518A JP2023068518A (ja) 2023-05-17
JP2023068518A5 JP2023068518A5 (https=) 2023-05-31
JP7399149B2 true JP7399149B2 (ja) 2023-12-15

Family

ID=86241229

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2021179698A Active JP7399149B2 (ja) 2021-11-02 2021-11-02 半導体装置
JP2023205532A Pending JP2024015502A (ja) 2021-11-02 2023-12-05 半導体装置
JP2025068116A Pending JP2025106571A (ja) 2021-11-02 2025-04-17 半導体装置

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2023205532A Pending JP2024015502A (ja) 2021-11-02 2023-12-05 半導体装置
JP2025068116A Pending JP2025106571A (ja) 2021-11-02 2025-04-17 半導体装置

Country Status (4)

Country Link
JP (3) JP7399149B2 (https=)
CN (1) CN118216001A (https=)
DE (1) DE112022004701T5 (https=)
WO (1) WO2023079825A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025030704A (ja) * 2023-08-24 2025-03-07 株式会社日立製作所 多層プリント配線基板及びその製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004363339A (ja) 2003-06-05 2004-12-24 Toyota Industries Corp 半導体装置
JP2012028700A (ja) 2010-07-27 2012-02-09 Denso Corp 半導体装置
JP2020053593A (ja) 2018-09-27 2020-04-02 Tdk株式会社 Ｍｏｓトランジスタ内蔵基板及びこれを用いたスイッチング電源装置
JP2021015856A (ja) 2019-07-10 2021-02-12 株式会社デンソー 半導体装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3879150B2 (ja) * 1996-08-12 2007-02-07 株式会社デンソー 半導体装置
JP2005217072A (ja) * 2004-01-28 2005-08-11 Renesas Technology Corp 半導体装置
JP5191689B2 (ja) * 2006-05-30 2013-05-08 ルネサスエレクトロニクス株式会社 半導体装置
JP2010050286A (ja) 2008-08-21 2010-03-04 Toshiba Corp 半導体装置
JP5558595B2 (ja) 2012-03-14 2014-07-23 株式会社東芝 半導体装置及び半導体装置の製造方法
US9111776B2 (en) * 2012-10-18 2015-08-18 International Rectifier Corporation Power semiconductor package with non-contiguous, multi-section conductive carrier
DE102016225654A1 (de) * 2016-12-20 2018-06-21 Robert Bosch Gmbh Leistungsmodul mit einem in Etagen ausgebildeten Gehäuse
JP7131903B2 (ja) 2017-12-08 2022-09-06 ローム株式会社 半導体パッケージ
KR102048478B1 (ko) * 2018-03-20 2019-11-25 엘지전자 주식회사 양면냉각형 파워 모듈 및 그의 제조 방법

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004363339A (ja) 2003-06-05 2004-12-24 Toyota Industries Corp 半導体装置
JP2012028700A (ja) 2010-07-27 2012-02-09 Denso Corp 半導体装置
JP2020053593A (ja) 2018-09-27 2020-04-02 Tdk株式会社 Ｍｏｓトランジスタ内蔵基板及びこれを用いたスイッチング電源装置
JP2021015856A (ja) 2019-07-10 2021-02-12 株式会社デンソー 半導体装置

Also Published As

Publication number Publication date
WO2023079825A1 (ja) 2023-05-11
JP2023068518A (ja) 2023-05-17
JP2025106571A (ja) 2025-07-15
CN118216001A (zh) 2024-06-18
DE112022004701T5 (de) 2024-07-18
JP2024015502A (ja) 2024-02-02

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