CN118216001A - 半导体装置 - Google Patents

半导体装置 Download PDF

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Publication number
CN118216001A
CN118216001A CN202280073505.3A CN202280073505A CN118216001A CN 118216001 A CN118216001 A CN 118216001A CN 202280073505 A CN202280073505 A CN 202280073505A CN 118216001 A CN118216001 A CN 118216001A
Authority
CN
China
Prior art keywords
semiconductor wafer
wiring
semiconductor
semiconductor device
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280073505.3A
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English (en)
Chinese (zh)
Inventor
铃木敬史
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aoi Electronics Co Ltd
Original Assignee
Aoi Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aoi Electronics Co Ltd filed Critical Aoi Electronics Co Ltd
Publication of CN118216001A publication Critical patent/CN118216001A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Semiconductor Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
CN202280073505.3A 2021-11-02 2022-09-05 半导体装置 Pending CN118216001A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021179698A JP7399149B2 (ja) 2021-11-02 2021-11-02 半導体装置
JP2021-179698 2021-11-02
PCT/JP2022/033288 WO2023079825A1 (ja) 2021-11-02 2022-09-05 半導体装置

Publications (1)

Publication Number Publication Date
CN118216001A true CN118216001A (zh) 2024-06-18

Family

ID=86241229

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280073505.3A Pending CN118216001A (zh) 2021-11-02 2022-09-05 半导体装置

Country Status (4)

Country Link
JP (3) JP7399149B2 (https=)
CN (1) CN118216001A (https=)
DE (1) DE112022004701T5 (https=)
WO (1) WO2023079825A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025030704A (ja) * 2023-08-24 2025-03-07 株式会社日立製作所 多層プリント配線基板及びその製造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3879150B2 (ja) * 1996-08-12 2007-02-07 株式会社デンソー 半導体装置
JP4133600B2 (ja) 2003-06-05 2008-08-13 株式会社豊田自動織機 半導体装置
JP2005217072A (ja) * 2004-01-28 2005-08-11 Renesas Technology Corp 半導体装置
JP5191689B2 (ja) * 2006-05-30 2013-05-08 ルネサスエレクトロニクス株式会社 半導体装置
JP2010050286A (ja) 2008-08-21 2010-03-04 Toshiba Corp 半導体装置
JP5381926B2 (ja) 2010-07-27 2014-01-08 株式会社デンソー 半導体装置
JP5558595B2 (ja) 2012-03-14 2014-07-23 株式会社東芝 半導体装置及び半導体装置の製造方法
US9111776B2 (en) * 2012-10-18 2015-08-18 International Rectifier Corporation Power semiconductor package with non-contiguous, multi-section conductive carrier
DE102016225654A1 (de) * 2016-12-20 2018-06-21 Robert Bosch Gmbh Leistungsmodul mit einem in Etagen ausgebildeten Gehäuse
JP7131903B2 (ja) 2017-12-08 2022-09-06 ローム株式会社 半導体パッケージ
KR102048478B1 (ko) * 2018-03-20 2019-11-25 엘지전자 주식회사 양면냉각형 파워 모듈 및 그의 제조 방법
JP7119842B2 (ja) 2018-09-27 2022-08-17 Tdk株式会社 Ｍｏｓトランジスタ内蔵基板及びこれを用いたスイッチング電源装置
JP7359581B2 (ja) 2019-07-10 2023-10-11 株式会社デンソー 半導体装置

Also Published As

Publication number Publication date
WO2023079825A1 (ja) 2023-05-11
JP2023068518A (ja) 2023-05-17
JP2025106571A (ja) 2025-07-15
JP7399149B2 (ja) 2023-12-15
DE112022004701T5 (de) 2024-07-18
JP2024015502A (ja) 2024-02-02

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