JP7398122B2 - 電子部品の製造方法及びペースト塗布装置 - Google Patents

電子部品の製造方法及びペースト塗布装置 Download PDF

Info

Publication number
JP7398122B2
JP7398122B2 JP2021093759A JP2021093759A JP7398122B2 JP 7398122 B2 JP7398122 B2 JP 7398122B2 JP 2021093759 A JP2021093759 A JP 2021093759A JP 2021093759 A JP2021093759 A JP 2021093759A JP 7398122 B2 JP7398122 B2 JP 7398122B2
Authority
JP
Japan
Prior art keywords
dip layer
electronic component
conductive paste
layer forming
paste
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2021093759A
Other languages
English (en)
Japanese (ja)
Other versions
JP2022185865A (ja
Inventor
英児 佐藤
仁志 坂本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Creative Coatings Co Ltd
Original Assignee
Creative Coatings Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Creative Coatings Co Ltd filed Critical Creative Coatings Co Ltd
Priority to JP2021093759A priority Critical patent/JP7398122B2/ja
Priority to KR1020237044732A priority patent/KR20240012567A/ko
Priority to CN202280038502.6A priority patent/CN117412819B/zh
Priority to PCT/JP2022/021105 priority patent/WO2022255143A1/ja
Priority to TW111119980A priority patent/TW202310692A/zh
Publication of JP2022185865A publication Critical patent/JP2022185865A/ja
Application granted granted Critical
Publication of JP7398122B2 publication Critical patent/JP7398122B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
    • H01G13/04—Drying; Impregnating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/13—Energy storage using capacitors

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
JP2021093759A 2021-06-03 2021-06-03 電子部品の製造方法及びペースト塗布装置 Active JP7398122B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2021093759A JP7398122B2 (ja) 2021-06-03 2021-06-03 電子部品の製造方法及びペースト塗布装置
KR1020237044732A KR20240012567A (ko) 2021-06-03 2022-05-23 전자부품의 제조 방법 및 페이스트 도포 장치
CN202280038502.6A CN117412819B (zh) 2021-06-03 2022-05-23 电子部件的制造方法和糊剂涂敷装置
PCT/JP2022/021105 WO2022255143A1 (ja) 2021-06-03 2022-05-23 電子部品の製造方法及びペースト塗布装置
TW111119980A TW202310692A (zh) 2021-06-03 2022-05-30 電子零件之製造方法及糊劑塗佈裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021093759A JP7398122B2 (ja) 2021-06-03 2021-06-03 電子部品の製造方法及びペースト塗布装置

Publications (2)

Publication Number Publication Date
JP2022185865A JP2022185865A (ja) 2022-12-15
JP7398122B2 true JP7398122B2 (ja) 2023-12-14

Family

ID=84323114

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021093759A Active JP7398122B2 (ja) 2021-06-03 2021-06-03 電子部品の製造方法及びペースト塗布装置

Country Status (5)

Country Link
JP (1) JP7398122B2 (zh)
KR (1) KR20240012567A (zh)
CN (1) CN117412819B (zh)
TW (1) TW202310692A (zh)
WO (1) WO2022255143A1 (zh)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007013214A (ja) 2006-10-13 2007-01-18 Murata Mfg Co Ltd 電子部品の製造装置および電子部品の製造方法
JP2021057448A (ja) 2019-09-30 2021-04-08 株式会社クリエイティブコーティングス 電子部品の製造装置及び製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6345813A (ja) 1986-08-13 1988-02-26 株式会社村田製作所 電子部品の電極形成方法
JPH09162084A (ja) * 1995-12-12 1997-06-20 Murata Mfg Co Ltd 電子部品の製造方法
JPH09293650A (ja) * 1996-04-25 1997-11-11 Matsushita Electric Ind Co Ltd チップ部品の電極形成装置
JP4220460B2 (ja) * 2004-11-30 2009-02-04 Ｔｄｋ株式会社 外部電極形成方法
CN101850314B (zh) * 2009-03-31 2012-09-19 研能科技股份有限公司 适用于立体成型机构的维护装置
CN102049364A (zh) * 2009-10-29 2011-05-11 佳能机械株式会社 涂敷装置及涂敷方法
JP6440510B2 (ja) * 2015-01-29 2018-12-19 東レエンジニアリング株式会社 塗布装置及び塗布方法
TW201813724A (zh) * 2016-10-14 2018-04-16 創力艾生股份有限公司 電子零件的製造方法及裝置以及電子零件
US11052422B2 (en) * 2018-07-10 2021-07-06 Creative Coatings Co., Ltd. Electronic component manufacturing method and apparatus

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007013214A (ja) 2006-10-13 2007-01-18 Murata Mfg Co Ltd 電子部品の製造装置および電子部品の製造方法
JP2021057448A (ja) 2019-09-30 2021-04-08 株式会社クリエイティブコーティングス 電子部品の製造装置及び製造方法

Also Published As

Publication number Publication date
WO2022255143A1 (ja) 2022-12-08
KR20240012567A (ko) 2024-01-29
CN117412819B (zh) 2024-08-16
TW202310692A (zh) 2023-03-01
CN117412819A (zh) 2024-01-16
JP2022185865A (ja) 2022-12-15

Similar Documents

Publication Publication Date Title
DE69937153T2 (de) Gedruckte leiterplatte und verfahren zu deren herstellung
EP3598467B1 (en) Electronic component manufacturing method and apparatus
JP5344667B2 (ja) 回路基板およびその製造方法並びに回路モジュール
DE102006024213A1 (de) Verfahren zum Herstellen eines Bausteins mit einer elektrischen Kontaktierung
DE102006042774A1 (de) Verfahren zur Herstellung einer elektrischen Ankontaktierung
DE10240415B4 (de) Halbleiteranordnung mit einem in einem Hohlraum eingebetteten Modul und Verfahren zum Herstellen derselben
DE69723801T2 (de) Herstellungsverfahren einer Kontaktgitter-Halbleiterpackung
JP7398122B2 (ja) 電子部品の製造方法及びペースト塗布装置
US11026335B2 (en) Wiring board manufacturing method and wiring board
DE602005003318T2 (de) Verfahren zur Herstellung eines Halbleitersubstrats
DE19828386A1 (de) Halbleiterbauelement und Verfahren zur Ausbildung von Löterhebungen
DE69530698T2 (de) Verfahren zur herstellung einer leiterplatte
DE102020102376A1 (de) Herstellung eines Durchgangslochs mit geringem Versatz in einem Bauteilträgermaterial
JP7161814B2 (ja) 電子部品の製造方法及び装置
WO2006000291A1 (de) Verfahren zur herstellung einer keramischen leiterplatte
JPH0855766A (ja) チップ電子部品の外部電極形成装置
TWI853154B (zh) 電子零件之製造方法及裝置
DE19854036A1 (de) Verfahren und Vorrichtung zum Aufbringen von pastösen Medien auf einen Träger
JP4352832B2 (ja) 電子部品の製造方法
EP3611761A1 (de) Verfahren und metallsubstrat zum kontaktieren eines leistungshalbleiters durch ein kontaktierungsmittel mit zumindest einem kontaktierungsfreien bereich als belastungsreduzierende struktur
KR101055527B1 (ko) 패턴부의 리페어 구조 및 리페어 방법
JP4341881B2 (ja) 絶縁層の形成方法および圧電セラミック積層体
EP4084061A1 (de) Schaltungsträger sowie verfahren zum herstellen einer elektrischen verbindung mit diesem
JP2003347153A (ja) 電子部品の製造方法
DE102023200119A1 (de) Chip-Package und Verfahren zum Verpacken eines Bauteils

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20230530

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20230530

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20230815

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20231114

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20231127

R150 Certificate of patent or registration of utility model

Ref document number: 7398122

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313113

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350